JPH032649U - - Google Patents
Info
- Publication number
- JPH032649U JPH032649U JP1989062467U JP6246789U JPH032649U JP H032649 U JPH032649 U JP H032649U JP 1989062467 U JP1989062467 U JP 1989062467U JP 6246789 U JP6246789 U JP 6246789U JP H032649 U JPH032649 U JP H032649U
- Authority
- JP
- Japan
- Prior art keywords
- wind frame
- semiconductor
- hermetically sealed
- sealed package
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0711—
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- H10W70/682—
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- H10W72/07141—
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- H10W72/075—
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- H10W72/07521—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/5363—
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- H10W72/5524—
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- H10W72/59—
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- H10W90/753—
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- H10W90/754—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989062467U JPH032649U (enExample) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989062467U JPH032649U (enExample) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032649U true JPH032649U (enExample) | 1991-01-11 |
Family
ID=31591641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989062467U Pending JPH032649U (enExample) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032649U (enExample) |
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1989
- 1989-05-31 JP JP1989062467U patent/JPH032649U/ja active Pending