JPH03263461A - Electronic part for surface mounting and molding thereof - Google Patents

Abstract

PURPOSE:To obtain an electronic part for surface mounting and having excellent reflow resistance by compounding a specific amount of polytetramethylene terephthalate to a flame-retarded glass-fiber reinforced nylon 46 resin. CONSTITUTION:The objective electronic part can be produced by mixing (I) pellets composed of a composition produced by compounding (A) 100 pts.wt. of a nylon 46 resin having an intrinsic viscosity of 0.9-1.9 with (B) 2-100 pts.wt. of a brominated polystyrene having a weight-average molecular weight of 5,000-1,000,000, (C) 1-50 pts.wt. of a flame-retarding assistant (e.g. antimony trioxide) and (D) 5-200 pts.wt. of glass fiber and (II) pellets composed of a composition produced by compounding (E) 100 pts.wt. of polytetramethylene terephthalate with 2-100 pts.wt. of the component B, 1-50 pts.wt. of the component C and 0-200 pts.wt. of the component D.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method of molding electronic components for surface mounting, and more specifically, to a method of molding electronic components for surface mounting, and more specifically, molding methods for molding electronic components for surface mounting from flame-retardant glass fiber-reinforced polytetramethylene adipamide (nylon 46) resin. The present invention relates to a surface mounting electronic component exhibiting excellent flow solderability and a method for molding the same.

"Prior art" In the field of electronic components, with the recent miniaturization and higher performance of electrical appliances, and with the aim of improving productivity, the mounting density of components is increasing as a method of mounting various electronic components on boards. The highly efficient surface mount method (SMT method) is becoming widespread.

However, the surface mounting method uses far infrared heating in a beam flow furnace.
The four parts (e.g.) will be partially heated, resulting in harsher temperature conditions than conventional mounting methods. In other words, the resin materials for these electronic parts include polyurethane resins such as Nylene(') resins, Nylo>66 resins, etc.
Conventional materials such as polynisder resins such as Nomid resin, polyethylene prephthalate, and polynysder resin such as polyethylene prephthalate lack heat resistance, so we have developed resin materials for surface mounting that have higher heat resistance. is expected.

Note: Nylon 46 resin is a material that can meet this requirement.]
The 8-Illin 46 resin that is being collected is made up of tetramethyl, diamide, or its functional derivatives, and adipic acid or its functional derivatives. ) It is a resin that can be used as a useful engineering plastic because it has excellent heat resistance, mechanical properties such as tensile strength 7 bending strength, and sliding properties, and is considered to have great value in terms of its use. It is being As a material for electronic parts, including systems reinforced with glass fiber, flame retardance is improved using halogenated compounds and metal oxides.

The use of them in compositions is proposed.
63-5], 45663-118368 63-428
073. 63-139942.63 1610566
3-195907 63195909. 63-223
060. 63-31755264□11158su゛publication, etc.).

However, this Ny17/46 resin has a higher ratio of amide groups than normal polyamide resins such as Di-Iron 6 resin and Nylon 66 resin, so it also has the disadvantage that its water absorption rate is higher than those. . This means that while nylon 46 resin has 1 degree higher heat resistance and 5 mechanical properties than ordinary polyamide resin in the dry soot state immediately after molding, it has a higher water absorption rate than ordinary boamide resin during actual use. Due to the high water absorption rate, the heat resistance and mechanical properties will be lower than those of other resins, and in some cases, the superiority of nylon 46 resin will be lost. The change in condition also increases. Although nylon 46 resin has a smaller dimensional change rate per water absorption than general polyamide resin, its dimensional sheath with high water absorption rate is not necessarily satisfactory and requires high viscosity. Improvements are required before it can be applied to parts. Furthermore, when mounting on a board using the surface-mounting method using the glue flow furnace mentioned above, electronic components made of nylon 46 resin in a dry soot state exhibit their heat resistance, but if they are in a water-absorbed state, the surface of the component may be damaged. Damage called blisters appears,
As parts.

Since the value of F is significantly lower by 7, the range of conditions for the surface mounting method becomes narrower.

In other words, electronic components made of nylon 46 resin have poor reflow semi-1-El properties due to the drawbacks of nylon 46 resin's water absorption properties. 7. Take advantage of it” - with a big I
It is causing harm.

[Object of the invention 1 The present invention was made against the background of the above-mentioned circumstances,
Its purpose is to exhibit excellent flow solderability → - Iron 46
The purpose of the present invention is to provide resin surface-mounted electronic components.

[Structure of the Invention] The present inventors have conducted extensive research in order to provide surface-mounted electronic components made of NyC7-46 resin with excellent reflow resistance. l(
: As a result, an electronic component made of a composition containing a flame-retardant glass fiber-reinforced nylon 46 resin and a specific amount of boridetra and methylene prephthalate meets the above L1 criteria, and furthermore, the electronic component is flame-retardant. The inventors have discovered that the present invention can be achieved by mixing separate pellets of glass fiber-reinforced nylon 46 resin and non-flame-retardant polytetramethy-1/nderephthalate at the time of molding, and molding the product in good condition.

That is, the surface mount electronic component of the present invention contains (A) per 100 parts by weight of nylon 46 resin, (B) 5 to .00 parts by weight of polytetramethylene terephthalate, (C) 2 to 100 parts by weight of brominated polystyrene, ( D. A surface mounting electronic component comprising a composition containing 1 to 50 parts by weight of a flame retardant aid, and (B) 5 to 200 parts by weight of glass fiber, and (A) per 100 parts by weight of nylon 46 resin. (C) brominated polystyrene 2 to 100 parts by weight, (D) flame retardant aid 1
and (E) 5 to 200 parts by weight of glass fiber, (B) per 100 parts by weight of polytetramethylene terephthalate, (C) 2 to 100 parts by weight of brominated polystyrene, ( D) A method for molding electronic components for surface mounting, which comprises mixing 1 to 50 parts by weight of a flame retardant aid and (E) Beret II, which is a composition containing 0 to 200 parts by weight of glass fiber, and subjecting the mixture to a molding machine. Regarding.

The present invention will be explained.

The surface-mountable electronic component of the present invention is intended for a surface-mounted electronic component that is soldered onto a board using a surface-mounting method (SMT method). The surface mount method is a method of mounting electronic components on a wiring board by passing the leads of the electronic components through the through holes of the board and directly soldering (flow soldering or wave soldering) to the surface opposite to the surface on which the electronic components are mounted. In contrast to the conventional insertion mounting method (ring), electronic components are placed on top of the solder printed on the wiring board, and the entire board is passed through a heating furnace called a flow type to melt the solder and fix the electronic components. This is the way to do it. This surface mounting method increases packaging density, enables mounting on both the front and back sides, and reduces costs through increased efficiency. Soldering is becoming the mainstream method due to the trend of technology and price reduction, and its application fields include camera-integrated VTRs, calculators, cameras, and watches.

These include consumer electronic equipment such as LCD televisions, electronic games, and handheld computers, industrial electronic equipment such as computers, office computers, workstations, personal computers, peripheral equipment, end equipment, and measuring instruments, and even aerospace equipment.

Methods for heating the board in a reflow oven for surface mounting include the heat conduction method, in which the board is heated by placing it on a heat-resistant belt that moves over a heater, and the latent heat during aggregation of a fluorine-based liquid with a boiling point of approximately 220°C. The VPS method utilizes hot air convection heat transfer method that uses forced air circulation to pass through the board, the far infrared method that uses far infrared rays to heat the board from above or from both sides, and the method that uses hot air and far infrared rays to heat the board. There are methods that use a combination of heating with
For reasons such as running costs, far-infrared rays and hot air convection heat transfer methods are often used. Unlike the conventional insertion mounting method, these heating methods also heat the mounted components to the solder melting temperature, creating extremely harsh conditions for the resin materials used in electronic components.

Specific examples of these surface-mountable electronic components include, but are not limited to, parts made of resin, such as the bodies and cases of parts such as connectors, switches, volumes, capacitors, relays, resistors, and LEDs. The target is a resin electronic part convex metal plate that is not mounted on a board using a surface mount method.

The nylon 46 resin of component (A) constituting the surface mount electronic component of the present invention is produced by a condensation reaction using adipic acid or a functional derivative thereof as an acid component and tetramethylenediamine or a functional derivative thereof as an amine component. Although the resulting polyamide is the main object, it may be possible to replace a part of the adipic acid component or tetramethylene diamine component with other copolymer components.

A preferred embodiment of the Steelon 46 resin is disclosed in Japanese Patent Application Laid-Open No. 56149.
430 and JP-A-56-149431.

The nylon 46 resin used in the present invention has an intrinsic viscosity of 0.90 to 1.90, more preferably 1.10 to 1, when measured at 35°C using m-cresol in electronic components.
．． It is desirable that it be in the range of 50.

When using nylon 46 resin with an intrinsic viscosity exceeding 1.90, the fluidity during molding of electronic parts is poor, and the resulting electronic parts not only lose their glossy appearance but also deteriorate their mechanical and thermal properties. This is not preferable because the variation becomes large.

On the other hand, if the intrinsic viscosity is lower than 0.90, the mechanical strength of the electronic component will be reduced.

The acid component of the polytetramethylene terephthalate (B) component of the surface mount electronic component of the present invention is prephthalic acid, and the diol component is latramethylene glycol. This is Polinisdel. In addition, this de1hesy-medylene-prephthalate L,-t may be partially substituted with a copolymer component. acids, phthalic acid derivatives such as methyl isophthalic acid, 2
．． Naphthalene dicarboxylic acids and derivatives such as 6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, 1,5 naphthalene dicarboxylic acid, 4.4
Diphenylcarboxylic acids and their derivatives such as '-di7ethodicarboxylic acid, 3,4'-diphenyldicarboxylic acid, and 4,4'-diphenoxymethane dicarboxylic acid'>
'acids, aromatic dicarboxylic acids such as 4,4'-diphenoxyethane dicarboxylic acid; succinic acid, adipic acid, sebacyl>
・Acid, Azerai〉・Acid, Deca〉・Aliphatic or alicyclic dicarboxylic acids such as dicarboxylic acid and cyclohexanedicarboxylic acid; Alicyclic diols such as 14-cyclohexane dimetatool; Dihydro such as Hyde 1 coquinone and resorcinol]
1, or Shibe〉・'zen and its derivatives; 2,2 bis(4-human o=4-diphenyl)gW11111? bread,
2.2-bis(4-hydrocarbon) sulfone A
, bisphenol compounds; bisphenol compounds and ethyl non-glycyl compounds; aromatic diols such as diol; ε acid, human 1-7xybenzoic acid,
Examples include oxydicarboxylic acids such as Shidro A-Shedo A-cybenzoic acid.

In addition, branching components such as trifunctional or tetrafunctional acids having Nisdel-forming ability such as I-licarballylic acid, trimesic acid, and trimellitic acid, or glyceryl, tonomethyl 1.0 mol% or more, preferably L< is 5 mol% or more, and more preferably 1.0 mol% or more of an alcohol having a trifunctional or tetrafunctional Nisdell-forming ability such as L'T7-lube IITU bread or pentaerythritol. , < indicates that 0.3 mol% or less is copolymerized, and may be 2.

Polyde-ramethylene derephthalate, which constitutes one part of the surface mounting mold of the present invention, is present in electronic components at 1.2% when measured at 35°C using O-chlorophenol. The intrinsic viscosity is preferably 0.5 or more, more preferably 0.6 or more.

Polydetramethylene derephthalate constituting the surface-mounted electronic component of the present invention can be produced by a conventional production method, such as a melt polycondensation reaction or a method combining this with a solid-phase polycondensation reaction.

For example, prephthalic acid or its Nisdel-forming derivatives (lower alkyl esters such as dimethyl ester, monomethyl ester, etc.) and tetramethyl glycol or its Nisdel-forming derivatives in the presence of a catalyst,
It can be produced by a method in which a glycol ester of prephthalic acid obtained by a heating reaction is polymerized to a predetermined degree of polymerization in the presence of a catalyst.

The following general formula (I) of component (C) constituting the surface mount electronic component of the present invention -3 (-CH2-CH-), 1...<]:
) (in the above formula (I)) is an integer of 1 to 5, ■
-1 does not indicate an integer greater than or equal to 2. Brominated polystyrene represented by ) is produced by polymerizing brominated styrene or by brominating polystyrene. Further, the general formula <I) can be used even if other vinyl compounds are copolymerized. Examples of the vinyl compound in this case include styrene, α-methylstyrene, and the like.

There is no particular restriction on the degree of polymerization of the brominated polystyrene represented by general formula (I), but the weight average molecular weight is 5000 to 10.
00000 is preferably used. -General formula (I)
The brominated polystyrene represented by is the nylon 4 of the present invention.
It is blended in a proportion of 2 to 100 parts by weight per 100 parts by weight of Nine[]46 resin. When the blending amount is 2 weight parts-F, the flame retardant effect of electronic parts is not sufficient, and 100%
If it exceeds 4 parts by weight, it is not preferable because the mechanical properties and thermal properties of the electronic component will be impaired.

The flame retardant auxiliary agent (D) that constitutes the surface mount electronic component of the present invention enhances the flame retardancy of the surface mount electronic component made of nylon 46 resin due to the synergistic effect with the brominated polystyrene component (D). It is something that does work.

Such compounds include compounds of metals in group Va of the periodic table and metal oxides such as boron oxide, zirconium oxide, iron oxide, and zinc oxide.In particular, compounds of metals in group Va of the periodic table include antimony. Compounds are preferred. Examples of the antimony compound include antimony trioxide, antimony pentoxide, and sodium antimonate, and antimony trioxide is particularly preferably used. Further, these flame retardant aids may be used alone or in combination of two or more types.

The appropriate amount of these flame retardant aids to be blended is a ratio of 2 to 5 bromine atoms in the brominated polystyrene component (C) to 1 metal atom such as antimony.

The glass fiber (E) component 5 constituting the surface-mounted electronic component of the present invention is blended for the purpose of increasing the mechanical strength and heat resistance of the electronic component, and is generally used for reinforcing resin. If so, there are no particular limitations. For example, it can be selected from long fiber type (glass roving), short fiber type chopped strand, milled fiber, etc. Glass fiber can also be used as a sizing agent (e.g. polyvinyl acetate).

(polyester sizing agent, etc.), coupling agent (for example, silane compound, boron compound, titanium compound, etc.), or other surface treatment agent.

Usually, long fiber type glass fibers are used by being cut to a desired length before or after blending with a resin, and this mode of use is also useful in the present invention.

The amount of glass fiber blended is preferably 5 to 200 parts by weight per 100 parts by weight of nylon 46 resin. This amount is 5
If the amount is less than 200 parts by weight, the mechanical strength and heat resistance of the electronic component will not be sufficient, and if it exceeds 200 parts by weight, the fluidity during molding of the electronic component will be significantly deteriorated. This is not desirable because parts cannot be obtained and the strength reaches saturation.

The glass fiber length is mainly 0.2 in electronic parts.
Those having a length of mm or more are preferably used.

An electronic component made of a composition containing nylon 46 resin, brominated polystyrene, a flame retardant aid, and glass fiber is an excellent electronic component that has sufficient heat resistance to withstand surface mounting in a dry state. In actual use, nylon 4
Resin 6 absorbs moisture from the atmosphere, and if surface mounting is performed in that state, damage called flakes will often appear on the surface of electronic components even under temperature conditions that would not cause problems in a dry state. However, in electronic parts that further contain polytetramethylene terephthalate as a composition, the water absorbency of the electronic parts is reduced and the bags are less likely to be damaged. It is generally explained that this phenomenon called "floating" occurs when moisture that has entered the inside of an electronic component evaporates internally due to heating, and it is easy to infer that this phenomenon can be suppressed by reducing the water absorption of electronic components. . However, in order to increase the compatibility with other polymers such as nylon 46 resin, it has been found that electronic polymers are made of compositions obtained by blending acid-modified polyphenylene ether and polytetramethylene terephthalate with polyethylene terephthalate, which is the same polyester resin. Although the water absorption of the parts decreased as with polytetramethylene terephthalate, the unexpected result was that the formation of flakes when mounted on the surface could not be suppressed. Do not know that this is a peculiar behavior that can be observed.

The blending amount of polytetramethylene terephthalate, component (B), constituting the surface-mounted electronic component of the present invention is 5 to 100 parts by weight per 100 parts by weight of nylon 46 resin.

If the amount is less than 5 parts by weight, the composition will not have a sufficient effect of suppressing flakes in electronic parts, and if it is more than 100 parts by weight, the mechanical strength of the electronic parts will be greatly reduced.

If necessary, pigments and other compounding agents may be added to the nylon 8-46 resin silk composition constituting the surface-mounted electronic component of the present invention. Such compounding agents include fillers such as aramid fibers, carbon fibers,
Fibrous materials such as steel mu, asbestos, ceramic fiber, potassium titanate scar, boron whisker, etc.
Power, Orin, Ri1/-, wollastonite, talc, mica, calcium carbonate.

Examples include inorganic fillers in the form of powdered particles or plates such as barium sulfate, glass peas, and glass flux.

These fillers are usually used as reinforcement material 1 surface modification material,
Alternatively, it is blended to improve electrical and thermal properties, etc., but it is blended within the minimum amount that produces the effect of blending and within the range that does not lose the original excellent properties and molding advantages of the composition due to excessive blending. Should.

Other flame retardants, such as brominated polyphenylene needles, brominated Ebogishi, brominated bisphenol-A,
- Diglyshijil Leedel, the top and the Oriko.

polycarbonate oligomer, brominated biphenyl compound, and brominated cyphthalimide compound.

Halogen-containing compounds such as dimers of chlorinated hexapentadiene; phosphorus compounds such as red phosphorus and triphenyl phosphate; phosphorus-nitrogen compounds such as phospho-acid amides; melamine, melam, meleno\, melon .

It is also possible to use triazine compounds such as cyanuric acid and melamine cyanurate; metal hydroxides such as aluminum hydroxide, magnesium hydroxide, dawsonite, and two-phase gypsum in combination.

Furthermore, copper compounds such as copper iodide,
It is also possible to add antioxidants or heat stabilizers such as bound phenol compounds, aromatic amine compounds, organic phosphorus compounds, and sulfur compounds. Furthermore, various epoxy compounds, oxazoline compounds, etc. may be added for the purpose of improving melt viscosity stability and hydrolysis resistance. Examples of the cohooxy compound 7 include bisphenol-A obtained by reacting bisphenol-A with shrimp 1 fluhydrin.
A-type epoxy compounds, aliphatic glycidyl ethers obtained from the reaction of various glycols and glycerinyl with Epic 1 fluhydrin, novolac-type epoxy compounds,
Aromatic or aliphatic carbo〉/acid type epoxy compounds, alicyclic compound type epoxy compounds, etc. are preferable, and the oxazoline compound 7 is aromatic or aliphatic bisoxazoline, especially 2,2'-bis〈2-oxazoline), 2
．． 2'-rn~phenylenebis<2-oxazoline> is preferred.

Its low stabilizer 7 colorants, lubricants, ultraviolet absorbers.

Antistatic agents can also be added.

In addition, in small proportions other thermoplastic resins, such as other polyamide resins, other polyester resins.

Bolihuene, Rusulfide l#j resin, Polyferene resin, Polycarbonate resin, Phenoxy resin, Polyethylene and its copolymer, Bolibutyrene and its copolymer, Boristyrene and its copolymer, Acrylic resin and Acrylic type Copolymers, polyamide resins, polymers, polyester elastomers, etc.; heat-curable resins, such as phenolic resins9. Melamine resin, unsaturated polynisdel 1 resin, silicone resin, etc. may be blended.

Nylon for molding surface mount electronic components of the present invention>
・In order to obtain the 46 resin composition, it is also possible to create pellets containing all the compositions constituting the electronic component and mold them, but it is possible to obtain the 46 resin composition using flame-retardant glass fiber reinforced nylon 46 resin composition. It is effective to prepare pellets of 1 and flame-retardant polytetramethylene derephthalate resin composition separately and mix them at the time of molding in terms of pellet shape and molding stability.

Normally, it is preferable to disperse the ingredients contained in each pellet more uniformly, and the ingredients that have been triblended in advance are melt-kneaded in a heated extruder, homogenized, and then wire-shaped. It can be produced by extrusion 7, followed by cutting to a desired length and granulating it. If an attempt is made to create a pellet containing all the formulations constituting the electronic component of the present invention, it is very difficult to mold pellets with a good shape using this method, and it is difficult to mold pellets with a good shape. This is not preferable because the stability of the molding will be impaired during subsequent injection molding. However, in the method of mixing and molding pellets of a flame-retardant glass fiber reinforced nylon 46 resin composition and pellets of a flame-retardant polytetramethylene terephthalate resin composition, each pellet is created in a good shape. It was found that there were no problems with the lick moldability, and that the appearance and properties of the resulting molded product were not inferior at all compared to when pellets containing all the ingredients were molded.

The electronic component of the present invention can be molded by a conventional method using a general injection molding machine for thermoplastic resin. In this case, it is preferable to mold the molded product in a mold preheated to 100'C or higher because a molded product with higher heat resistance can be obtained. Each pellet for molding produced by the above-mentioned method is normally kept in a sufficiently dry state, and then put into a molding machine hopper and subjected to molding.

[Example] The present invention will be explained in detail with reference to Examples below.

3 Nylon 46 resin with an intrinsic viscosity of 1.42 (rSTANY
Polytetramethylene terephthalate (manufactured by Teijin Corporation) with an intrinsic viscosity of 1.10 dried with hot air at 130°C for 5 hours, and brominated polystyrene (manufactured by Pyrocheck 68-PBJ Nissan Ferro Organic Chemicals Ltd.) , antimony trioxide (“Patox C” manufactured by Nippon Shinko Co., Ltd.) and chopped glass fiber strands manufactured by Nippon Electric Glass Co., Ltd.
After uniformly mixing C1 in the proportions shown in Table 1 in a tumbler, the cylinder temperature was 32°C while being evacuated using a vented twin-screw extruder with screw diameters of 44mm.
0℃, screw rotation speed 150 rpm, discharge amount 40 kg
Melt and knead at /h, cool and cut the thread discharged from the die to obtain pellets for molding.

The pellets were then used in an injection molding machine with an injection capacity of 1 ounce at a cylinder temperature of 300°C, a mold temperature of 120°C,
Dimensions 14 x 7
(mm), mold a 6-hole box-type connector with an average wall thickness of approximately 5 mm.

Humidify these connectors at 80°C and 595% relative humidity for one hour to promote water absorption and obtain water-absorbed connectors.

Instead of using the above-mentioned polytetramethylene terephthalate, polyethylene terephthalate (manufactured by Banjin Co., Ltd.) or acid-modified polyphenylene ether was used in the proportions shown in Table 1, but the method was the same as that for polytetramethylene terephthalate. I created a connector with the same shape.

Preparation of polyphenylene ether 3.8 g of anhydrous cuprous chloride and 54 g of di-n-butylamine.
A toluene solution of 2.11% of 55% by weight 2,6-xylenol was added to a polymerization tank containing 500 ml of a toluene solution containing 5 g of 2,6-xylenol dissolved in it, and oxidation was carried out by expanding sales while blowing oxygen into this mixed solution kept at 30°C. Polymerization was carried out. After polymerization, add acetic acid aqueous solution to deactivate the catalyst and stop the reaction. This reaction solution was concentrated and methanol was added to precipitate the polymer. The precipitated polymer was filtered, washed, and dried to produce polyphenylene ether. The intrinsic viscosity was 0.49.

Production of acid-modified polyphenylene ether 100 parts by weight of the above polyphenylene ether resin dried at 130°C for 5 hours, 0.6 parts by weight of maleic anhydride and 0.1 part by weight of 2,3-dimethyl-2,3-diphenylbutane.
The weight parts were melt-kneaded at 280°C using a vented twin-screw extruder with a screw diameter of 44 mm, and then pelletized.

Reflow soldering resistance of connector molded products) The reflow soldering resistance test of various connector molded products obtained by the above method was conducted using a tabletop simple reflow oven (manufactured by Toyodenso Co., Ltd.).The heating temperature pattern was 150°C. After preheating for 50 seconds, the board was heated for 15 seconds at a desired temperature, and the temperature for reflow soldering was determined by measuring the surface temperature of the board with an infrared sensing thermometer.

Reflow soldering resistance was evaluated based on the frequency of blisters occurring on the surface of the connector molded product after heating in a reflow oven.

6 The results are shown in Table 1. The flame-retardant nylon 46 resin reinforced with 4° glass fiber exhibits excellent heat resistance in the dry state. There was no change in Comparative Example 1). However, over time, nylon 46 resin absorbs moisture from the atmosphere, and after passing through a flow furnace, surface damage called blistering occurs, which can be seen on almost all connectors at 265°. Comparative examples 2, 3)
. However, flame-retardant nylon 4 reinforced with glass fiber
6 Resin? ) with a composition containing polytetramethylene terephthalate, the amount of water absorbed after humidity conditioning under the same conditions is lower than when the connector is not blended with polytetramethylene terephthalate, and no blistering occurs at all after passing through a reflow oven up to 265℃. (Example 1-3). It can be seen from this that the reflow resistance of the connector made of the composition containing polytetramethylene ethylene terephthalate 1- is significantly improved.

Furthermore, when a similar test was performed using polyethylene prephthalate or acid-modified polyphenylene ether instead of polytetramethylene prephthalate, it was found that the same composition as in the case of polytetramethylene prephthalate was obtained. Although the water absorption rate of the connector is reduced, the occurrence of blisters after passing through the rift furnace cannot be suppressed, and in the case of polyethylene prephthalate, it tends to increase. Example 4~・
9). In other words, the suppression of the blistering phenomenon is a phenomenon that occurs specifically in connectors made of compositions containing boritetoshimethylene and prephthalate, and the effect of improving the blistering resistance is achieved only by the combination of these compositions. appear.

Molding of connector molded product (2) Nylon 46 resin (rSTA) with an intrinsic viscosity of 1°42 dried under reduced pressure of 110 Torr for 12 hours.
NYLJ (Netherlands I) manufactured by SM), brominated polystyrene ([Pyrocheck 68-PB, + B manufactured by Fuetsuko Organic Chemical Company), antimony trioxide and "Batox C"
JB Honsho Shisha Co., Ltd.) and glass fiber chopped strands (L-1 Hon Electric Glass Co., Ltd.) were mixed uniformly in a tumbler in advance in the proportions shown in Table 2, and then mixed with screws of various diameters. Using a 44ra vented twin-screw extruder, the cylinder temperature was 320°C and the screw rotation speed was 1 while drawing a vacuum.
Melt and knead at 50 rpm+ and a discharge rate of 40 kg/h, and cool and cut the thread discharged from the die to obtain pellets for molding.

In addition, Bolide I Ramedile Dereftale-1 (manufactured by Banjin ■) with an intrinsic viscosity of 1.10 was dried at 130°C for 5 hours,
Brominated polystyrene 1 Pyrocheck 68-PB.

1” ferroorganic chemicals (manufactured by 11 companies), antimony trioxide>
・'("BatoxC" manufactured by Nippon Seiko Shisha) and glass fiber chopped straw (manufactured by Nippon Electric Glass Co., Ltd.) in the proportions shown in Table 2 are uniformly mixed in advance in a tumbler.
Mixing [-1 after screw diameter each 44mxn pen 1-
The mixture was evacuated using a twin-screw extruder with a cylinder, and the mixture was melt-kneaded at a cylinder temperature of 260'C, screw rotation speed of 15 rpm, and a discharge rate of 40 hours.1.The thread discharged from the die was cooled and cut. Pellet for molding I~■ were obtained.

The shape of the previous '::7 nectar molding <I> when the entire composition was extruded in a package of 7 was due to a lot of shattering when cutting with a cutter. On the other hand, Su() Pellet 1-I Pellet ■ was obtained as a good pellet cut into a normal shape.

Next, these pellets were mixed in the proportions shown in Table 2 and placed in an injection molding machine with an injection capacity of 1 ounce at a cylinder temperature of 3.
00℃, mold temperature 120℃, injection pressure 1000kg/
cA, a cooling time of 5 seconds, and a total molding cycle of 20 seconds, a 6-hole box-shaped connector with dimensions 14 x 7 x 4 (mm>) and an average wall thickness of approximately 5 mm was molded. The composition of the connector is also shown in Table 2. Shape. It can be seen that the mixture of pellets T and pellets (2), which had good properties, had a short and stable metering time for the resin during molding, and did not exhibit good moldability (Example 4-7).

Reflow resistance of molded connectors (2) After molding, the connectors are conditioned for one hour at 80°C and 95% relative humidity to promote water absorption and obtain water-absorbed connectors. Table 2 shows the blistering properties during adhesive flow. As in Examples 1 to 3, it absorbs water and exhibits excellent riff 17-half[]11 properties even in the 2-S state.

0 [-宕--T-”’-’-’-1 Unexamined Publication Hei 3 26346] (10)

Claims (1)

[Claims] 1. (A) per 100 parts by weight of nylon 46 resin, (B)
A composition containing 5 to 100 parts by weight of polytetramethylene terephthalate, (C) 2 to 100 parts by weight of brominated polystyrene, (D) 1 to 50 parts by weight of a flame retardant aid, and (E) 5 to 200 parts by weight of glass fiber. Surface-mounted electronic components made of objects. 2. When molding the electronic component of claim 1, (A) per 100 parts by weight of nylon 46 resin, (C) 2 to 100 parts by weight of brominated polystyrene, and (D) 1 to 50 parts by weight of flame retardant aid. and (E) pellets I consisting of a composition containing 5 to 200 parts by weight of glass fiber, (B) per 100 parts by weight of polytetramethylene terephthalate, (C) 2 to 100 parts by weight of brominated polystyrene, (D) A method for molding an electronic component for surface mounting, which comprises mixing pellets II made of a composition containing 1 to 50 parts by weight of a flame retardant aid and (E) 0 to 200 parts by weight of glass fibers and subjecting the mixture to a molding machine.