JPH03263452A - Resin composition for shielding electromagnetic wave - Google Patents
Resin composition for shielding electromagnetic waveInfo
- Publication number
- JPH03263452A JPH03263452A JP6213090A JP6213090A JPH03263452A JP H03263452 A JPH03263452 A JP H03263452A JP 6213090 A JP6213090 A JP 6213090A JP 6213090 A JP6213090 A JP 6213090A JP H03263452 A JPH03263452 A JP H03263452A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- aromatic vinyl
- compound
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 30
- -1 aromatic vinyl compound Chemical class 0.000 claims abstract description 40
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 35
- 239000003063 flame retardant Substances 0.000 claims abstract description 34
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000011231 conductive filler Substances 0.000 claims abstract description 27
- 239000000178 monomer Substances 0.000 claims abstract description 27
- 229920001971 elastomer Polymers 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 17
- 239000004417 polycarbonate Substances 0.000 claims abstract description 17
- 229920000642 polymer Polymers 0.000 claims abstract description 14
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 10
- 150000001463 antimony compounds Chemical class 0.000 claims abstract description 9
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims description 16
- 239000005060 rubber Substances 0.000 claims description 11
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 5
- 239000000203 mixture Substances 0.000 abstract description 10
- 238000013329 compounding Methods 0.000 abstract description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 24
- 239000000835 fiber Substances 0.000 description 21
- 150000003440 styrenes Chemical class 0.000 description 20
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 4
- 150000002366 halogen compounds Chemical class 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- HUWSZNZAROKDRZ-RRLWZMAJSA-N (3r,4r)-3-azaniumyl-5-[[(2s,3r)-1-[(2s)-2,3-dicarboxypyrrolidin-1-yl]-3-methyl-1-oxopentan-2-yl]amino]-5-oxo-4-sulfanylpentane-1-sulfonate Chemical compound OS(=O)(=O)CC[C@@H](N)[C@@H](S)C(=O)N[C@@H]([C@H](C)CC)C(=O)N1CCC(C(O)=O)[C@H]1C(O)=O HUWSZNZAROKDRZ-RRLWZMAJSA-N 0.000 description 2
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 2
- JHJUYGMZIWDHMO-UHFFFAOYSA-N 2,6-dibromo-4-(3,5-dibromo-4-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(Br)C(O)=C(Br)C=C1S(=O)(=O)C1=CC(Br)=C(O)C(Br)=C1 JHJUYGMZIWDHMO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 2
- 229920003244 diene elastomer Polymers 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- LJDGJCNHVGGOFW-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-(2-bromophenoxy)benzene Chemical compound BrC1=CC=CC=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br LJDGJCNHVGGOFW-UHFFFAOYSA-N 0.000 description 1
- ORYGKUIDIMIRNN-UHFFFAOYSA-N 1,2,3,4-tetrabromo-5-(2,3,4,5-tetrabromophenoxy)benzene Chemical compound BrC1=C(Br)C(Br)=CC(OC=2C(=C(Br)C(Br)=C(Br)C=2)Br)=C1Br ORYGKUIDIMIRNN-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- AHBGXHAWSHTPOM-UHFFFAOYSA-N 1,3,2$l^{4},4$l^{4}-dioxadistibetane 2,4-dioxide Chemical compound O=[Sb]O[Sb](=O)=O AHBGXHAWSHTPOM-UHFFFAOYSA-N 0.000 description 1
- YATIGPZCMOYEGE-UHFFFAOYSA-N 1,3,5-tribromo-2-[2-(2,4,6-tribromophenoxy)ethoxy]benzene Chemical compound BrC1=CC(Br)=CC(Br)=C1OCCOC1=C(Br)C=C(Br)C=C1Br YATIGPZCMOYEGE-UHFFFAOYSA-N 0.000 description 1
- LXIZRZRTWSDLKK-UHFFFAOYSA-N 1,3-dibromo-5-[2-[3,5-dibromo-4-(2,3-dibromopropoxy)phenyl]propan-2-yl]-2-(2,3-dibromopropoxy)benzene Chemical compound C=1C(Br)=C(OCC(Br)CBr)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OCC(Br)CBr)C(Br)=C1 LXIZRZRTWSDLKK-UHFFFAOYSA-N 0.000 description 1
- KCFXNGDHQPMIAQ-UHFFFAOYSA-N 1-(4-methylphenyl)pyrrole-2,5-dione Chemical compound C1=CC(C)=CC=C1N1C(=O)C=CC1=O KCFXNGDHQPMIAQ-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- CYLVUSZHVURAOY-UHFFFAOYSA-N 2,2-dibromoethenylbenzene Chemical compound BrC(Br)=CC1=CC=CC=C1 CYLVUSZHVURAOY-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- AACBVWDCZOZKLK-UHFFFAOYSA-N 2-(3,3-dibromopropyl)phenol Chemical compound OC1=CC=CC=C1CCC(Br)Br AACBVWDCZOZKLK-UHFFFAOYSA-N 0.000 description 1
- IXDMCRDIEUXFAU-UHFFFAOYSA-N 2-(tribromomethyl)phenol Chemical compound OC1=CC=CC=C1C(Br)(Br)Br IXDMCRDIEUXFAU-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- YMOONIIMQBGTDU-UHFFFAOYSA-N 2-bromoethenylbenzene Chemical compound BrC=CC1=CC=CC=C1 YMOONIIMQBGTDU-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- KBKNKFIRGXQLDB-UHFFFAOYSA-N 2-fluoroethenylbenzene Chemical compound FC=CC1=CC=CC=C1 KBKNKFIRGXQLDB-UHFFFAOYSA-N 0.000 description 1
- FAVWXKQADKRESO-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-1-ene Chemical compound CC=C.CC(=C)C(O)=O FAVWXKQADKRESO-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 description 1
- 241000283690 Bos taurus Species 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 241001479611 Iris ensata Species 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 229910000411 antimony tetroxide Inorganic materials 0.000 description 1
- KIQKNTIOWITBBA-UHFFFAOYSA-K antimony(3+);phosphate Chemical compound [Sb+3].[O-]P([O-])([O-])=O KIQKNTIOWITBBA-UHFFFAOYSA-K 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- WXCZUWHSJWOTRV-UHFFFAOYSA-N but-1-ene;ethene Chemical compound C=C.CCC=C WXCZUWHSJWOTRV-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229940125773 compound 10 Drugs 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- MGNCLNQXLYJVJD-UHFFFAOYSA-N cyanuric chloride Chemical compound ClC1=NC(Cl)=NC(Cl)=N1 MGNCLNQXLYJVJD-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 229910000830 fernico Inorganic materials 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 239000000543 intermediate Substances 0.000 description 1
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- SVHOVVJFOWGYJO-UHFFFAOYSA-N pentabromophenol Chemical compound OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br SVHOVVJFOWGYJO-UHFFFAOYSA-N 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- QVKOLZOAOSNSHQ-UHFFFAOYSA-N prop-1-ene;prop-2-enoic acid Chemical compound CC=C.OC(=O)C=C QVKOLZOAOSNSHQ-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業I−7の利用分野1
本発明は、耐衝撃性、成形加]′、性、耐熱性1.優れ
た電磁波遮蔽用樹脂組成物、ならびに耐衝撃性、成形加
f性、耐熱性か−)難燃性に優れた難燃性電磁波遮蔽用
樹脂組成物に関する。Detailed Description of the Invention [Field of Application of Industry I-7 1 The present invention is applicable to impact resistance, molding process]', hardness, heat resistance 1. The present invention relates to an excellent electromagnetic wave shielding resin composition, and a flame retardant electromagnetic wave shielding resin composition having excellent impact resistance, moldability, heat resistance, and flame retardancy.
「従来の技術」
近年、電子機器、(’) A 事務機器、家電機器など
のハウジング分野e゛は製品の合成樹脂化が進行し。``Conventional technology'' In recent years, the housing field for electronic equipment, (') A office equipment, home appliances, etc. has been increasingly made of synthetic resin.
ている。しか(、なから、合成樹脂は電子機器などから
放出される電磁波を透過するために、ノイズの発生、素
子などの誤動作など電磁波障害が発生し、てくる。ing. However, because synthetic resins transmit electromagnetic waves emitted from electronic devices, electromagnetic interference such as noise and malfunction of elements can occur.
この電磁波障害を防止4″る方法と[2て、旧料である
樹脂中に導電性繊維などを配合することにより、導電性
を備えた樹脂組成物を形成し、この導電性樹脂組成物で
ハウジングを作ることが知られごいる。A method for preventing this electromagnetic interference [2] is to form a resin composition with conductivity by blending conductive fibers etc. into the old resin, and to use this conductive resin composition. It is well known to make housings.
L本発明が解決[2よ・うとりる課題]これらの導電性
樹脂1111成物の用途は、人型成II品あるいは複卸
な形状の成形品な、Jコの成形+A M”I 、、’し
、ζ用いられることが多く、そのj、めには(憂第1)
、7成形加1財!LL、耐衝撃性、耐熱性4有すること
か必要である。。Solved by the present invention [Problems to be solved by the present invention] These conductive resin 1111 products are used for humanoid molded products or multi-shaped molded products. , 'shi, ζ is often used, and its j, me (Ui 1st)
, 7 molded products and 1 item! It is necessary to have LL, impact resistance, and heat resistance of 4. .
そこで、耐衝撃性の優れノ1、電磁波遮蔽用樹脂組成物
を得るために、ゴj、強化熱可塑性樹脂に導電性充填剤
などを配合した樹脂組成物が知らオl′Cいる。し7か
し、導電性充填剤が金属の粉体あるいは繊維であること
から、成形加工性、MiJ衝撃慴に八尾するものが得ら
れない。Therefore, in order to obtain a resin composition for electromagnetic shielding with excellent impact resistance, a resin composition is known in which a conductive filler and the like are blended with a reinforced thermoplastic resin. However, since the conductive filler is a metal powder or fiber, it is not possible to obtain a material that has good moldability and MiJ impact resistance.
本発明は、ゴム強化樹脂と導電性充填剤からなる組成物
において、成形加−1゛性および耐衝撃性が低下すると
いう欠点を改良し、成形加工性と耐衝撃性の物性バラン
スに優れ、かパ)耐熱性の優れ六。The present invention improves the disadvantages of poor moldability and impact resistance in a composition consisting of a rubber reinforced resin and a conductive filler, and provides an excellent balance of physical properties between moldability and impact resistance. (6) Excellent heat resistance.
電磁波遮蔽用樹脂組成物ならび1.′、さらに難燃性を
有する難燃性電磁波遮蔽用樹脂組成物る目的とする。Electromagnetic wave shielding resin composition and 1. ', and further aims to provide a flame-retardant electromagnetic wave shielding resin composition having flame retardant properties.
[課題を解決するための手段」
すなわち本発明は、
(1)下記の(A)/ (B)/ (C) −10〜9
910〜70/1〜90重量%からなる熱り塑性樹脂(
I)、]、OO重量部に対し、導電性充填剤(II)1
〜20重量部を含有することを特徴とする電磁波遮蔽用
樹脂組成物。[Means for Solving the Problems] That is, the present invention includes (1) the following (A)/(B)/(C) -10 to 9
Thermoplastic resin consisting of 910-70/1-90% by weight (
I), ], 1 part by weight of conductive filler (II)
A resin composition for shielding electromagnetic waves, characterized in that it contains 20 parts by weight.
(A)ゴム状重合体(a)5〜70重量部のイf在下、
芳香族ビニル化合物/その他の単量体−・10〜100
10〜90重量%からなる単量体化合物(b)30〜9
5重量部(a + b = 1. OO重量部)を重合
1.r得られるゴム強化樹脂。(A) rubbery polymer (a) in the presence of 5 to 70 parts by weight,
Aromatic vinyl compound/other monomer-・10-100
Monomer compound (b) 30-9 consisting of 10-90% by weight
5 parts by weight (a + b = 1.0 parts by weight) were polymerized 1. rResulting rubber reinforced resin.
(B)芳香族ビニル化合物/その他の単量体=10〜1
OO10〜90重量%を重合して得られる重合体。(B) Aromatic vinyl compound/other monomer = 10-1
A polymer obtained by polymerizing 10 to 90% by weight of OO.
(C)ポリカーボネート
(2)請求項(1)記載の(I)/請求項(])記載の
(II)/難燃剤/アンヂモン化合物−100/1〜2
0/]〜・20/1〜・10重量部を含有することを特
徴とする難燃性電磁波遮蔽用樹脂組成物。(C) Polycarbonate (2) (I) according to claim (1) / (II) according to claim (]) / Flame retardant / Andimon compound-100/1-2
A flame-retardant electromagnetic wave shielding resin composition characterized by containing 0/] to 20/1 to 10 parts by weight.
(3)F記の(A)/ (B)/ (C)=10〜99
10〜70/1〜90重量%からなり、かつ(A)およ
び/または(B)中のハロゲン化スヂレン含有量が5〜
50重量%である熱可塑性樹脂(]II)]、、 O0
重量部に対し、導電性充填剤(II)1〜・20重量部
、難燃剤0〜20重量部およびアンチモン化合物O〜・
10市量部を含有することを特徴とする難燃性電磁波遮
蔽用樹脂組成物。(3) (A)/(B)/(C) in F: 10-99
10 to 70/1 to 90% by weight, and the content of halogenated styrene in (A) and/or (B) is 5 to 70/1 to 90% by weight.
50% by weight of thermoplastic resin (]II)],, O0
1 to 20 parts by weight of conductive filler (II), 0 to 20 parts by weight of flame retardant, and O to 20 parts by weight of antimony compound, based on parts by weight.
A flame-retardant electromagnetic wave shielding resin composition containing 10 parts by weight.
(A)ゴム状重合体(a)5〜70重量部の存在ド、ハ
ロゲン化スチレンおよび/またはハロゲン化スヂレン以
外の芳香族ビニル化合物/その他の単量体−10〜10
010〜90重量%からなる単量体化合物(b)30〜
95屯量部(a十り= 100重量部)を重合して得ら
れるゴム強化樹脂。(A) Rubbery polymer (a) Presence of 5 to 70 parts by weight, halogenated styrene and/or aromatic vinyl compound/other monomer other than halogenated styrene -10 to 10
Monomer compound (b) consisting of 010 to 90% by weight 30 to
A rubber-reinforced resin obtained by polymerizing 95 parts by weight (a = 100 parts by weight).
(B)ハロゲン化スチレンおよび/またはハロゲン化ス
ヂレン以外の芳香族ビニル化合物/その他の単量体=1
0〜10010〜90重量%を重合して得られる重合体
。(B) Halogenated styrene and/or aromatic vinyl compound other than halogenated styrene/other monomer = 1
A polymer obtained by polymerizing 0 to 100 to 90% by weight.
(C)ボリカーボネート を提供するものである。(C) Polycarbonate It provides:
以下、本発明について詳細に説明する。The present invention will be explained in detail below.
(1)請求項(1)、(2)、(3)の(A)成分のゴ
ム強化樹脂
請求項(1)、(2)の(A)成分のゴム強化樹脂は、
ゴム状重合体(a)5〜70重量部の存在下に、芳香族
ビニル化合物/その他の単量体=10〜10010〜9
0重量%からなる単量体化合物(b)30〜95重量部
(a+b=100重量部)を含有して得られる。(1) Rubber-reinforced resin as component (A) in claims (1), (2), and (3) The rubber-reinforced resin as component (A) in claims (1) and (2) is:
In the presence of 5 to 70 parts by weight of rubbery polymer (a), aromatic vinyl compound/other monomer = 10 to 10010 to 9
It is obtained by containing 30 to 95 parts by weight (a+b=100 parts by weight) of monomer compound (b) consisting of 0% by weight.
請求項(3)の(A)成分のゴム強化樹脂は、ゴム状重
合体(a)5〜70重量部の存在下に、ハロゲン化スチ
レンおよび/またはハロゲン化スチレン以外の芳香族ビ
ニル化合物/その他の単量体=10〜10010〜90
重量%からなる単量体化合物(b)30〜95重量部(
a+b=100重量部)を重合して得られる。なお、上
記ハロゲン化スチレンの使用量は、(A)成分および/
または後述の(B)成分中のハロゲン化スチレン含有量
が5〜50重量%になるように選ぶ。The rubber-reinforced resin as component (A) of claim (3) contains halogenated styrene and/or an aromatic vinyl compound other than halogenated styrene/other in the presence of 5 to 70 parts by weight of the rubbery polymer (a). Monomer = 10-10010-90
30 to 95 parts by weight of monomeric compound (b) consisting of % by weight (
a+b=100 parts by weight). Note that the amount of the halogenated styrene used is for component (A) and/or
Alternatively, the content of halogenated styrene in component (B) described below is selected to be 5 to 50% by weight.
」二記のゴム状重合体(a)としては、例えばポリブタ
ジェン系ゴム、スチレン−ブタジェン系ゴム、アクリロ
ニトリル−ブタジェン系ゴムなどのジエンゴム系、該ジ
エン系ゴムの水素添加物、EPMSEPDM、エチレン
−ブテン系共重合体などのオレフィン系ゴム、アクリル
系ゴム、芳香族ビニル(好ましくはスチレン)−共役ジ
エン(好ましくはブタジェン)ブロック共重合体(好ま
しい共役ジエン含有量は50〜90重量%)、該ブロッ
ク共重合体の水素添加物などが挙げられる。Examples of the rubbery polymer (a) mentioned above include diene rubbers such as polybutadiene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, hydrogenated products of the diene rubbers, EPMSEPDM, and ethylene-butene rubbers. Olefin rubber such as copolymer, acrylic rubber, aromatic vinyl (preferably styrene)-conjugated diene (preferably butadiene) block copolymer (preferably conjugated diene content is 50 to 90% by weight), the block copolymer Examples include hydrogenated products of polymers.
」二記芳香族ビニル化合物としては、スチレン、α−メ
チルスチレン、メチルスチレン、p−メチルスチレンな
どの非ハロゲン化スチレン、モノクロルスチレン、ジク
ロルスチレン、モノブロモスチレン、ジプロモスチレン
、フルオロスチレンなどのハロゲン化スチレンが挙げら
れる。Examples of aromatic vinyl compounds include styrene, non-halogenated styrene such as α-methylstyrene, methylstyrene, p-methylstyrene, monochlorostyrene, dichlorostyrene, monobromostyrene, dipromostyrene, fluorostyrene, etc. Examples include halogenated styrene.
請求項(1)、(2)、(3)の芳香族ビニル化合物と
して、好ましくはスチレン、α−メチルスチレンである
。The aromatic vinyl compound according to claims (1), (2), and (3) is preferably styrene or α-methylstyrene.
請求項(3)のハロゲン化スチレンとしては、好ましく
はブロモスチレン、ジプロモスチレンである。The halogenated styrene according to claim (3) is preferably bromostyrene or dipromostyrene.
上記のその他の単量体としては、例えばメチルアクリレ
ート、エチルアクリレート、プロピレンアクリレート、
ブチルアクリレート、アミルアクリレート、ヘキシルア
クリレート、オクチルアクリレート、2−エチルへキシ
ルアクリレート、シクロへキシルアクリレート、ドデシ
ルアクリレート、オクタデシルアクリレート、フェニル
アクリレート、ベンジルアクリレートなどのアクリル酸
アルキルエステル:メチルメタクリレート、エチルメタ
クリレート、プロピレンメタクリレート、ブチルメタク
リレート、アミルメタクリレート、ヘキシルメタクリレ
ート、オクチルメタクリレート、2−エチルへキシルメ
タクリレート、シクロへキシルメタクリレート、ドデシ
ルメタクリレート、オクタデシルメタクリレート、フェ
ニルメタクリレート、ベンジルメタクリレートなどのメ
タクリル酸アルキルエステル、アクリロニトリル、メタ
クリレートリルなどのシアン化ビニル化合物、無水マレ
イン酸、無水イタコン酸、無水シトラコン酸などの不飽
和酸無水物、アクリル酸、メタクリル酸などの不飽和酸
、マレイミド、N−メチルマレイミド、N−ブチルマレ
イミド、N−(p−メチルフェニル)マレイミド、N−
フェニルマレイミド、N−シクロヘキシルマレイミドな
どのα−またはβ−不飽和ジカルボン酸のイミド化合物
などが挙げられ、これらは(難燃)電磁波遮蔽用樹脂組
成物の品質改良を目的に、支障のない範囲で1種または
2種以上で使用される。Examples of the other monomers mentioned above include methyl acrylate, ethyl acrylate, propylene acrylate,
Acrylic acid alkyl esters such as butyl acrylate, amyl acrylate, hexyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, dodecyl acrylate, octadecyl acrylate, phenyl acrylate, benzyl acrylate: methyl methacrylate, ethyl methacrylate, propylene methacrylate , methacrylic acid alkyl esters such as butyl methacrylate, amyl methacrylate, hexyl methacrylate, octyl methacrylate, 2-ethylhexyl methacrylate, cyclohexyl methacrylate, dodecyl methacrylate, octadecyl methacrylate, phenyl methacrylate, benzyl methacrylate, cyanogens such as acrylonitrile, methacrylate trile, etc. unsaturated acid anhydrides such as maleic anhydride, itaconic anhydride, citraconic anhydride, unsaturated acids such as acrylic acid and methacrylic acid, maleimide, N-methylmaleimide, N-butylmaleimide, N-(p -methylphenyl)maleimide, N-
Examples include imide compounds of α- or β-unsaturated dicarboxylic acids such as phenylmaleimide and N-cyclohexylmaleimide. Used alone or in combination of two or more.
上記の単量体化合物(b)の芳香族ビニル化合物(請求
項(3)では、ハロゲン化スチレンおよび/またはハロ
ゲン化スチレン以外の芳香族ビニル化合物)/その他の
単量体の組成割合は、10〜10010〜90重量%、
好ましくは40〜10010〜60重量%である。芳香
族ビニル化合物が10重量%未満であると、成形加工性
が劣り好ましくない。The composition ratio of the aromatic vinyl compound (in claim (3), halogenated styrene and/or aromatic vinyl compound other than halogenated styrene)/other monomer of the monomer compound (b) is 10 ~10010~90% by weight,
Preferably it is 40-10010-60% by weight. If the amount of the aromatic vinyl compound is less than 10% by weight, the molding processability will be poor, which is not preferable.
好ましい単量体化合物(b)を以下に列挙する。Preferred monomer compounds (b) are listed below.
なお、請求項(3)の「ハロゲン化スチレンおよび/ま
たはハロゲン化スチレン以外の芳香族ビニル化合物」の
表現を、以下単にr (H−8T)芳香族ビニル化合物
」と表現Jる。Note that the expression "halogenated styrene and/or aromatic vinyl compound other than halogenated styrene" in claim (3) is hereinafter simply expressed as "r(H-8T) aromatic vinyl compound".
O請求項(1)、(2)の好まし、い単量体化合物(L
))■ 芳香族じ一−ル化合物/シアン化ビ、−ル化合
物−・40〜9515〜・60@量%
■ 芳香族ビニル化合物/(メタ)アクリル酸アルキル
ニス1ル/シアン化ビニル化合物−10〜90/10〜
9010〜60重量%0請求項(3)の好まシ1.い即
、量体化合物(b)■ (H−8T)芳香族ビニル化合
物/シアン化ビニル化合物−40〜9515〜60重量
%
■ (H−8T)芳香族ビニル化合物/(メタ)アクリ
ル酸アルギルエステル/シアン化ビニル−10〜・90
/10〜9010〜60重量%
請求項(3)でハロゲン化スチレンを用いることで、難
燃性を(・t−Ljすることができる。The preferred monomer compound (L) of claims (1) and (2)
))■ Aromatic vinyl compound/vinyl cyanide compound-・40~9515~・60@% by weight ■Aromatic vinyl compound/(meth)alkyl acrylate 1 l/vinyl cyanide compound-10 ~90/10~
9010 to 60% by weight 0 Preferably according to claim (3) 1. Immediately, mer compound (b) ■ (H-8T) Aromatic vinyl compound/vinyl cyanide compound -40-9515-60% by weight ■ (H-8T) Aromatic vinyl compound/argyl (meth)acrylate Ester/vinyl cyanide-10~・90
/10-9010-60% by weight By using halogenated styrene in claim (3), flame retardancy can be reduced to (·t-Lj).
請求項(1)、(2)、(3)の(A)成分のゴム強化
樹脂は、ゴム状重合体(a)5〜70重量部、好まし2
くは10〜70市量部の存在Fに即量体化合物(b)3
0〜・95重量部、好まし、くは′30〜90重量部を
重合して得られる。(a)が5重量部未満であると1−
分な耐衝撃′性が得ら4′1ず、 ・カフ0重旬゛部を
超えると成形加]性が劣り好まI、<ない4、(A)成
分の(a、 )のグラ°ノド率は、好まし2くは5〜1
50市量%、さらに好ま(2くは10〜・120市量%
であり、この範囲において、耐衝撃性、成形品の表面外
観、耐薬品性の一段と優イまたものが得られる。The rubber-reinforced resin as component (A) of claims (1), (2), and (3) contains 5 to 70 parts by weight of a rubbery polymer (a), preferably 2 parts by weight.
Preferably, 10 to 70 parts by weight of immediate mer compound (b) 3 are present in F.
It is obtained by polymerizing 0 to 95 parts by weight, preferably 30 to 90 parts by weight. If (a) is less than 5 parts by weight, 1-
4.If the cuff exceeds the 0th point, the moldability is poor. The ratio is preferably 2 or 5 to 1.
50% market weight, more preferable (2 or 10-120% market weight)
Within this range, even better impact resistance, surface appearance of the molded product, and chemical resistance can be obtained.
(A)成分の製造方法と[2ては、乳化重合法、ザスペ
ンション屯合法、溶液重合法、バルク重合法、およびこ
れらの重合法を糾み合わせた重合法が挙げられる。Methods for producing component (A) and [2] include emulsion polymerization, suspension polymerization, solution polymerization, bulk polymerization, and polymerization methods that combine these polymerization methods.
(2)請求項(1)、(2)、(3)の(B)成分の重
合体の説明
請求項(1)、(2)の(B)成分は、芳香族ビニル化
合物/〈の他の単量体−10・〜10c110〜90重
量%、好ましくは40〜10010〜60重量%からな
る重合体である。(2) Description of the polymer of component (B) in claims (1), (2), and (3) Component (B) in claims (1) and (2) is an aromatic vinyl compound/ It is a polymer consisting of monomers -10.~10c110 to 90% by weight, preferably 40 to 100 to 10 to 60% by weight.
請求項(′3)の(B)成分は、(H−8,T )芳香
族1]2
ビニル化合物/その他の単量体−10〜10010〜9
0重量%、好ましくは40〜10010〜・60重量%
である。Component (B) of claim ('3) is (H-8,T) aromatic 1]2 vinyl compound/other monomer-10-10010-9
0% by weight, preferably 40-10010-60% by weight
It is.
−1−記の芳香族ビニル化合物ならびに(H−S T)
芳香族ビニル化合物が10重量%未満であると、成形加
−L性に劣る。-1- aromatic vinyl compound and (H-ST)
If the aromatic vinyl compound content is less than 10% by weight, the moldability is poor.
請求項(3)の(H−8T)芳香族ビニル化合物で使用
されるハロゲン化スチレンの使用量は、(A)成分およ
び/または(B)成分中のハロゲン含有量が5〜50重
量%になるように選ぶ。The amount of halogenated styrene used in the aromatic vinyl compound (H-8T) of claim (3) is such that the halogen content in component (A) and/or component (B) is 5 to 50% by weight. Choose as you wish.
上記の芳香族ビール化合物、ハロゲン化スチレンおよび
その他の中量体は、前記の牛量体化合物(b)で示した
ものと同じである。芳香族ビニル化合物としては好まし
くはスヂーレン、α−メヂルスヂレン、ハロゲン化スチ
レンとしては好まシ、<はブDモス′f−lノン、特に
好まし2くはジブロモスチレン、その他の単量体として
はアクリロニトリル、メタクリル酸メチルなどが挙げら
れる。The above-mentioned aromatic beer compound, halogenated styrene and other intermediates are the same as those shown for the above-mentioned bovine polymer compound (b). The aromatic vinyl compound is preferably styrene, α-medylstyrene, the halogenated styrene is preferably styrene, < is buDmos'f-lnon, particularly preferably dibromostyrene, and the other monomer is acrylonitrile. , methyl methacrylate and the like.
0請求項(1)、(2)の(B)成分の好まし2い、1
11量体成分
2
■ 芳香族ビニル化合物/シアン化ビニル化合物−40
〜9515〜・60重刊1%
■ 芳香族ビニル化合物/(メタ)アクリル酸アルキル
エステル/シアン化ビニル化合物−1−0〜・90/1
0〜9010〜60重量%O請求項(3)の(B)成分
の好まI〜い単量体成分■ (H−8T)芳香族ビニル
化合物/シアン化ビ、−ル化合物−40〜9515〜6
0市量%
■ (H−8T)芳香族ビニル化合物/(メタ)アクリ
ル酸アル碑ルエスアル/シアン化ビ;−ルー10〜90
/1.0〜・9010〜60重量%
(B)成分で用いる単量体は、(A)成分の単量体化合
物(b)と同じ種類の11量体を用いると、−段と優れ
た本発明のLj的とするものが得られる。0 Preferable components (B) in claims (1) and (2) 2, 1
11-mer component 2 ■ Aromatic vinyl compound/vinyl cyanide compound-40
~9515~・60 reprint 1% ■ Aromatic vinyl compound/(meth)acrylic acid alkyl ester/vinyl cyanide compound-1-0~・90/1
0 to 9010 to 60% by weight O Preferred monomer component of component (B) in claim (3) ■ (H-8T) Aromatic vinyl compound/vinyl cyanide compound -40 to 9515 to 6
0% market weight ■ (H-8T) Aromatic vinyl compound/(meth)alcoholic acid salt/vinyl cyanide; -Ru 10-90
/1.0~・9010~60% by weight When the monomer used in component (B) is a 11-mer of the same type as the monomer compound (b) of component (A), the result is - much better. The Lj objective of the present invention is obtained.
(3)請求項(1)、(2)、(3)の(C)成分のポ
リカーボネートの説明
(C)成分のポリカーボネ−1・とし、では、芳香族ポ
リカーボネート、脂肪族ポリカーボネー ト、脂肪族−
芳香族ポリカーボネートなどを挙げることができる。一
般には、2,2−ビス(4−オキシフェニル)アルカン
系、ビス(4−オキシフェニル)エーテル系、ビス(4
−オキシフェニル)スルホンスルフィドまたはスルホキ
サイド系などのビスフェノール類からなる重合体もしく
は共重合体であり、目的に応じてハロゲンで置換された
ビスフェノール類を用いた重合体である。ポリカーボネ
ートの種類、製造法などにつぃは、日刊工業新聞社発行
(昭和44年9月30日発行)の“ポリカーボネート樹
脂”に詳しく記載されている。(3) Explanation of polycarbonate as component (C) in claims (1), (2), and (3) Polycarbonate as component (C) 1. In this case, aromatic polycarbonate, aliphatic polycarbonate, aliphatic −
Examples include aromatic polycarbonate. In general, 2,2-bis(4-oxyphenyl)alkanes, bis(4-oxyphenyl)ethers, bis(4-oxyphenyl)
-oxyphenyl) sulfone A polymer or copolymer made of bisphenols such as sulfide or sulfoxide, and is a polymer using bisphenols substituted with halogen depending on the purpose. Types of polycarbonate, manufacturing methods, etc. are described in detail in "Polycarbonate Resin" published by Nikkan Kogyo Shimbun (September 30, 1962).
(4)請求項(1)、(2)、(3)の導電性充填剤(
II)の説明
導電性充填剤としては、繊維状、フレーク状、粉末状な
どが挙げられるが、繊維状が好ましい。(4) The conductive filler of claims (1), (2), and (3) (
Explanation of II) The conductive filler may be in the form of fibers, flakes, powders, etc., but the filler is preferably in the form of fibers.
繊維状のものとしては、ステンレス繊維、アルミニウム
繊維、銅繊維、普通鋼繊維、黄銅繊維、金属塗布グラス
ファイバーまたはカーボンファイバー、ニッケル繊維、
ケイ素繊維、すず青銅繊維、フエルニコ繊維、パーマロ
イ繊維、炭素繊維などがあり、これらの繊維状の中でス
テンレス繊維が好ましい。Fibrous fibers include stainless steel fiber, aluminum fiber, copper fiber, common steel fiber, brass fiber, metal-coated glass fiber or carbon fiber, nickel fiber,
There are silicon fibers, tin bronze fibers, Fernico fibers, permalloy fibers, carbon fibers, etc. Among these fibers, stainless steel fibers are preferred.
フレーク状とものとしては、アルミフレークがある。Aluminum flakes are available as flakes.
粉末状のものとしては、アルミニウム(合金)粉末、導
電性カーボンブラック、ニッケル粉末、スズ粉末、亜鉛
粉末、グラファイト、銅粉末、フェライト粉末が挙げら
れる。Examples of the powder include aluminum (alloy) powder, conductive carbon black, nickel powder, tin powder, zinc powder, graphite, copper powder, and ferrite powder.
」二記の繊維、フレーク状、粉末状の導電性充填剤は、
各種シランカップリング剤、各種重合体などで表面処理
、表面被覆、繊維にあっては収束したものであってもよ
い。The fiber, flake, and powder conductive fillers mentioned in ``2.
Surface treatment, surface coating, and fiber convergence with various silane coupling agents, various polymers, etc. may be used.
(5)請求項(2)、(3)の難燃剤の説明難燃剤とし
ては、−酸ゴム、樹脂などのポリマーに使用される難燃
剤を使用することができる。(5) Description of the flame retardant in claims (2) and (3) As the flame retardant, flame retardants used in polymers such as -acid rubbers and resins can be used.
難燃剤としては、ハロゲン倉荷化合物、リン含有化合物
、窒素含有化合物、ケイ素含有化合物などが挙げられる
。これらの難燃剤について、例えば以下に列挙する。Examples of flame retardants include halogen compounds, phosphorus-containing compounds, nitrogen-containing compounds, silicon-containing compounds, and the like. Examples of these flame retardants are listed below.
5
テトラブロモビスフェノールAあるいはテトラブロモビ
スフェノールA−ビス(2−ヒドロキシエチルエーテル
)、テトラブロモビスフェノールA−ビス(2,3−ジ
ブロモプロピルエーテル)などのテトラブロモビスフェ
ノールA誘導体、ヘキサブロモジフェニルエーテル、オ
クタブロモジフェニルエーテル、デカブロモジフェニル
エーテル、ビス(トリブロモフェノキシ)エタン、ヘキ
サブロモシクロドデカンなどが使用できる。5 Tetrabromobisphenol A or tetrabromobisphenol A derivatives such as tetrabromobisphenol A-bis(2-hydroxyethyl ether), tetrabromobisphenol A-bis(2,3-dibromopropyl ether), hexabromodiphenyl ether, octabromodiphenyl ether , decabromodiphenyl ether, bis(tribromophenoxy)ethane, hexabromocyclododecane, etc. can be used.
さらに、例えばモノブロモフェノール、トリブロモフェ
ノール、ペンタブロモフェノール、トリブロモクレゾー
ル、ジブロモプロピルフェノール、テトラブロモビスフ
ェノールS1塩化シアヌルなどを重合により、あるいは
これらと上記ハロゲン化合物の群から選ばれた1種以上
のハロゲン化合物との共重合により得られたオリゴマー
型ハロゲン化合物が使用できる。Furthermore, for example, monobromophenol, tribromophenol, pentabromophenol, tribromocresol, dibromopropylphenol, tetrabromobisphenol S1 cyanuric chloride, etc. can be polymerized, or these and one or more selected from the group of the above halogen compounds can be added. Oligomeric halogen compounds obtained by copolymerization with halogen compounds can be used.
また、テトラブロモビスフェノールAのポリカーボネー
トオリゴマー、テトラブロモビスフェノールAとビスフ
ェノールAとのポリカーボネート6
オリゴマー、テトラブロモビスフェノールSのポリカー
ボネートオリゴマー、テトラブロモビスフェノールSと
ビスフェノールSとのポリカーボネートオリゴマーがあ
る。Further, there are polycarbonate oligomers of tetrabromobisphenol A, polycarbonate 6 oligomers of tetrabromobisphenol A and bisphenol A, polycarbonate oligomers of tetrabromobisphenol S, and polycarbonate oligomers of tetrabromobisphenol S and bisphenol S.
H6
〔式中、nは平均重合度で1〜100であり、Xは独立
に水素、塩素または臭素を示し、i、j、kおよびρは
それぞれ1〜4の整数であり、RおよびR′はそれぞれ
独立に水素、メチル基、エポ(ただし、mは0.1.2
または3を示す)である。〕
のハロゲン化、〕′、ボキシ4゛リゴマーなどが使用で
きる。H6 [wherein n is an average degree of polymerization of 1 to 100, X independently represents hydrogen, chlorine or bromine, i, j, k and ρ are each an integer of 1 to 4, R and R' are each independently hydrogen, methyl group, and epo (where m is 0.1.2
or 3). ] halogenation, ]′, boxy 4′ oligomer, etc. can be used.
難燃助剤(と17では、酸化鉄、はう砂、メタホウ酸バ
リウム、酸化ジル′:′jニウムなど苓1種または2種
以上、用いることができる。In 17, one or more flame retardant aids such as iron oxide, sand, barium metaborate, and nium oxide may be used.
(6)請求項(2)、(3)のノ′“ンヂセン化合物の
説明アンチモン化合物とI、では、例えば−酸化アンチ
モン、四酸化アンチモン、五酸化アンチモン、アンヂモ
ン酸ノ」・リウム、リン酸アンチモンなどが挙げられ、
好まし7くは7二酸化アンチモン、アンチモン酸すトリ
ウムである。(6) Description of antimony compounds in claims (2) and (3) Antimony compounds and I include, for example, antimony oxide, antimony tetroxide, antimony pentoxide, andium oxide, and antimony phosphate. etc. are mentioned,
Preferably, it is 7-antimony dioxide or sthorium antimonate.
次に、請求項(1)、(2)、(3)の(難燃性)電磁
波遮蔽用樹脂組成物に−)いて説明−1る。Next, the (flame-retardant) electromagnetic wave shielding resin composition of claims (1), (2), and (3) will be explained.
(1)請求項(1)の電磁波遮蔽用樹脂組成物請求項(
1)の電磁波遮蔽用樹脂組成物は、前記の(A)/ (
B)/ (C)=10〜9910〜70/1〜90重量
%、好ましくは20〜=8O10−・5 O/ 5〜・
80中量%、さらに好まし、くけ25〜75/1〜45
/ 1 O〜60車量%からなる熱可塑性樹脂(I)
100山量部に対j5、前記の導電性充填剤1〜2(]
重量部、好ま1.<は1.・・10中量部含有する組成
物(・・ある。(1) The electromagnetic wave shielding resin composition claimed in claim (1) (
The electromagnetic wave shielding resin composition of 1) has the above-mentioned (A)/(
B)/(C)=10-9910-70/1-90% by weight, preferably 20-=8O10-.5 O/5-.
80% by weight, more preferably 25-75/1-45
/ Thermoplastic resin (I) consisting of 1 O to 60% by weight
j5 per 100 parts by weight, the above-mentioned conductive filler 1 to 2 (]
Parts by weight, preferably 1. < is 1. A composition containing 10 medium parts (...).
(A)成分か10重量%体満であると十分な耐衝撃性、
成形加工性が得られ4゛、−・b’、99重Ju%を超
λると(C)成分が範囲未満となり、下記の理由(Jよ
り好ま1.<ない。(A) Component (10% by weight) has sufficient impact resistance.
When moldability is obtained and λ exceeds 4゛, -·b', 99 weight Ju%, the component (C) becomes less than the range, and the following reasons (preferable than J: 1.<no).
(B)成分が7〔〕重量%を超オると、耐衝撃性、耐熱
性が低1ぐする。If component (B) exceeds 7% by weight, the impact resistance and heat resistance will be low.
(C)成分は、導電性充填剤による耐衝撃性、成形加]
−件の低Fを押え、その結果、耐衝撃性と成形加工性の
物性バランスを向上させるとい・)、従来の知見から余
<−T想のできない効果なイ(jす、するものであり、
1重量%未1rtQあると耐衝撃性、成形加−L性の物
性バランスが低下I71、さらに耐熱性も低ドする。一
方、90重量%を超えると耐薬品性、成形加工性が劣る
。(C) component is impact resistance due to conductive filler, molding process]
- It is said that it suppresses the low F of the case and, as a result, improves the physical property balance between impact resistance and moldability. ,
If the amount is less than 1% by weight, the balance of physical properties between impact resistance and moldability deteriorates (I71), and heat resistance also decreases. On the other hand, if it exceeds 90% by weight, chemical resistance and moldability will be poor.
導電性充填剤の使用量が1−重量部未満である2゜十分
な電磁波遮蔽性が得られず、−力、20重量部を超える
と耐衝撃性、成形加工性が劣る。If the amount of conductive filler used is less than 1 part by weight, sufficient electromagnetic wave shielding properties cannot be obtained, and if it exceeds 20 parts by weight, impact resistance and moldability are poor.
(2)請求項(2)の難燃性電磁波遮蔽用樹脂組成物請
求項(2)の難燃性電磁波遮蔽用樹脂組成物は、前記の
(A)/ (B)/ (C)=10〜・9910〜70
/1〜90市量%、好まし7くは20〜8010〜50
/ 5へ8〔−戸■(量%、さらに好ましくは25〜
75/1〜45/10〜・60重量%からなる熱可塑性
樹脂(I)100市量部に対(2、niJ記の導電性充
填剤1−〜2020中量好まI、くは1・〜1(巨(重
量部、前記の難燃剤−1・・−20重量部、好:1、し
くは1〜15市量部、前記のアンチモン化合物1−〜・
10重量部、好まし、 <は1〜・8重量部を告白′し
、てなる組成物である。(2) Flame-retardant electromagnetic wave shielding resin composition according to claim (2) The flame-retardant electromagnetic wave shielding resin composition according to claim (2) has the above-mentioned (A)/(B)/(C)=10 ~・9910~70
/1-90% by market weight, preferably 7-8010-50
/ 5 to 8 [-house■ (amount%, more preferably 25 to
75/1 to 45/10 to 60 wt. 1 (parts by weight, the above-mentioned flame retardant -1...-20 parts by weight, preferably: 1, or 1 to 15 parts by weight, the above-mentioned antimony compound 1--20 parts by weight)
10 parts by weight, preferably 1 to 8 parts by weight.
−1、記の(A)、(B)7、((])および導電性充
填剤の谷成分の数値限定理由は、前記の請求項(1)の
ぞイ]吉同じζ°ある。。-1, (A), (B) 7, ((]) and the reason for limiting the numerical value of the valley component of the conductive filler are the same ζ° as in the above-mentioned claim (1).
難燃剤が1重量部未満であると1−分な難燃性がiMら
才1ず、−力゛、2〔〕市鎚゛部を超えると成形加工性
、耐衝撃性が低下するので好まし5くない3、アンy−
モン化合物か1市量部未満であるとl−e’3な難燃性
が得らi、 1”、=一方、10中量部を超ノ1−イ、
と耐衝撃(’t 、成形加工性が低−1する。If the amount of the flame retardant is less than 1 part by weight, the flame retardance will not be as good as 1 part by weight, and if it exceeds 2 parts by weight, the moldability and impact resistance will deteriorate, so it is preferable. Better 5 Not 3, Ann y-
If the amount of the compound is less than 1 part by mass, excellent flame retardancy can be obtained.
and impact resistance ('t), moldability is low -1.
(3)請求項(3)の難燃性電磁波遮蔽用樹脂組成物請
求項(3)の難燃性電磁波遮蔽用樹脂組成物は、前記の
(A)/ (B)/ (C)=10〜・9910〜70
// ]−〜・90重量%、好ましくは20〜8010
〜50 / 5 □〜・8〔〕重量%、さらに好まし7
くは25〜・75/1〜・45/10〜60巾量%がら
なり、か一つ(A)および/または(C)成分中のハロ
ゲン化スヂ1/ンの含有預か5〜50市量%、好ま1.
<は5〜・40重量%である熱可塑性樹脂100重昂部
に対(1、導電性充填剤3.−2ONtff1部、好ま
り、、、 < ii 1〜・10重量部、前記の難燃剤
o−20重量部、なfましくは0〜1.5重ff1部、
さらに好まシ、<は1〜15重量部、アンチモン化合物
0・〜〕0小量部置部ま(、くは0〜8i1?#i′部
、さら(J−好まt、 < ii 1−8Φ]量部であ
る。(3) Flame-retardant electromagnetic wave shielding resin composition according to claim (3) The flame-retardant electromagnetic wave shielding resin composition according to claim (3) has the above-mentioned (A)/(B)/(C)=10 ~・9910~70
//]--90% by weight, preferably 20-8010
~50/5 □~・8 []% by weight, more preferably 7
25~, 75/1~, 45/10~60% by width, and 5~50% of halogenated sulphate in one component (A) and/or (C). Amount %, preferably 1.
< is 5 to 40% by weight per 100 parts by weight of thermoplastic resin (1, conductive filler 3.-2ONtff 1 part, preferably,... < ii 1 to 10 parts by weight, the above flame retardant o -20 parts by weight, preferably 0 to 1.5 parts by weight,
More preferably, < is 1 to 15 parts by weight, and the antimony compound is 0 to 0 small parts (, or 0 to 8i1? #i' parts, and (J-preferably, < ii 1-8Φ ]This is the quantity part.
■−1記の(A)、CB )、(C)導電性充填剤の各
成分の数値限定理由は、前記の請求項(1)のぞ第1と
同じある。The reasons for limiting the numerical values of each component of (A), CB), and (C) conductive filler in (1)-1 are the same as those in claim (1) above.
(A)および/″または(H)中のl\ロゲン化スチ1
.・ンの菖イ1mが5重量%未にζである。1jト分な
難燃性が得られず、一方、50重量%を超えると成形加
工性、耐衝撃性が劣る。l\styrene 1 in (A) and/'' or (H)
..・One meter of Japanese irises contains less than 5% by weight. On the other hand, if it exceeds 50% by weight, moldability and impact resistance will be poor.
」二記の難燃剤、アンチモン化合物の上限の数値限定理
由は、前記の請求項(2)のそれと同じである。The reason for limiting the upper limit of the flame retardant and antimony compound in item 2 is the same as that in claim (2) above.
本発明の請求項(1)、(2)、(3)の(難燃性)電
磁波遮蔽用樹脂組成物中のゴム状重合体(a)の含有量
は、好ましくは5〜40重量%、さらに好ましくは5〜
30重量%である。The content of the rubbery polymer (a) in the (flame-retardant) electromagnetic wave shielding resin composition of claims (1), (2), and (3) of the present invention is preferably 5 to 40% by weight, More preferably 5~
It is 30% by weight.
本発明の電磁波遮蔽用樹脂組成物ならびに難燃性電磁波
遮蔽用樹脂組成物の製造方法に関しては、特に制限はな
く、通常の公知の方法を採用することができる。例えば
、該組成物の全成分を混合機で混合し、それを成形材料
として供する方法、あるいは導電性充填剤成分以外の成
分を予め混合した混合物、あるいは該混合物のペレット
化物に導電性充填剤を添加したものを成形材料として供
する方法がある。There are no particular limitations on the method for producing the electromagnetic wave shielding resin composition and the flame-retardant electromagnetic wave shielding resin composition of the present invention, and conventional known methods can be employed. For example, all the components of the composition are mixed in a mixer and used as a molding material, or a mixture in which components other than the conductive filler component are mixed in advance, or a conductive filler is added to pelletized mixture. There is a method of using the added material as a molding material.
また、目的に応じて顔料、染料、熱安定剤、酸化防止剤
、紫外線吸収剤、光安定剤、滑剤、可塑剤、帯電防止剤
および難燃剤などを添加することができる。Furthermore, pigments, dyes, heat stabilizers, antioxidants, ultraviolet absorbers, light stabilizers, lubricants, plasticizers, antistatic agents, flame retardants, and the like may be added depending on the purpose.
[実 施 例]
本発明をさらに具体的に説明するために、以下実施例お
よび比較例を挙げて説明する。なお、最終的に得られた
樹脂組成物は射出成形法によって成形した後、次の試験
法により諸物性を測定した。[Examples] In order to explain the present invention more specifically, examples and comparative examples will be given below. The resin composition finally obtained was molded by injection molding, and then various physical properties were measured using the following test methods.
耐衝撃性の評価として、1/2’アイゾツト衝撃強さを
ASTM D−256に従って測定した。As an evaluation of impact resistance, 1/2' Izot impact strength was measured according to ASTM D-256.
成形加工性の評価として、メルトフローレートをJIS
K−7210に従って評価した。As an evaluation of molding processability, the melt flow rate was measured according to JIS
Evaluation was made according to K-7210.
電磁波遮蔽性評価として、体積抵抗率をデジタルマルチ
メーターTR6824(■アトパンテスト社製)を用い
て測定した。As an evaluation of electromagnetic shielding properties, volume resistivity was measured using a digital multimeter TR6824 (manufactured by Atopan Test Co., Ltd.).
成形品の表面外観の評価は、試験片の表面を目視により
評価した。The surface appearance of the molded product was evaluated by visually observing the surface of the test piece.
◎ : 光沢が均一で、かつ表面が平滑である。◎: Uniform gloss and smooth surface.
○ : 光沢があり、やや平滑である。○: Glossy and somewhat smooth.
× : 光沢ムラがあり、平滑にかける。×: There is uneven gloss, and it is applied smoothly.
難燃性の評価は、UL−94(テストピース厚1/16
’)に従って測定した。Flame retardancy evaluation is based on UL-94 (test piece thickness 1/16
').
3
4
0表−1で用いられる各配合成分の説明A成分
A−1=ポリブタジ工ン20%、スチレン60%、アク
リロニトリル20%からなるゴム強化樹脂。グラフト率
45%。3 4 0 Description of each compounding component used in Table-1 A component A-1 = Rubber reinforced resin consisting of 20% polybutadiene, 60% styrene, and 20% acrylonitrile. Graft rate: 45%.
A−2=ポリブタジ工ン60%、スチレン30%、アク
リロニドクル10%からなるゴム強化樹脂。グラフト率
35%。A-2=Rubber reinforced resin consisting of 60% polybutadiene, 30% styrene, and 10% acrylonide. Graft rate: 35%.
A−3:ポリブタジェン20%、ジプロモスチレン20
%、スチレン40%、アクリロニトリル20%からなる
ゴム強化樹脂。グラフト率40%。A-3: 20% polybutadiene, 20% dipromostyrene
%, 40% styrene, and 20% acrylonitrile. Graft rate: 40%.
B成分
B−1=スチレン70%、アクリロニトリル30%から
なる共重合体。Component B-1 = copolymer consisting of 70% styrene and 30% acrylonitrile.
B−2:スチレン5%、α−メチルスチレン70%、ア
クリロニトリル25%からなる共重合体。B-2: Copolymer consisting of 5% styrene, 70% α-methylstyrene, and 25% acrylonitrile.
B−3=スチレン50%、ジプロモスチレン30%、ア
クリロニトリル20%からなる共重合体。B-3 = Copolymer consisting of 50% styrene, 30% dipromostyrene, and 20% acrylonitrile.
C成分
C−1:ポリカーボネート
(タフロンA2200、出光石油化学■製)導電性充填
剤
D−1ニステンレス繊維
(ベキシールド、ベカルト社製)
D−2ニステンレス繊維
(ナスロン、日本精練■製)
難燃剤
E−1ニブロム化エポキシオリゴマー
(EC−20、大日本インキ■製)
E−2:デカブロモジフエンルエーテルE−3:テトラ
ブロモビスフェノールAオリゴマー
実施例1〜9、比較例1〜4
表−1の導電性充填剤以外の成分を予めヘンシェルミキ
サーで混合し、240℃の温度条件の押出機でペレット
を作製した。次いで、該ペレットと導電性充填剤を混合
し、この混合物を用いて射出成形機で各種の試験ノー1
を成形した3、実施例1〜・1)は、本発明の範囲(難
燃す)1)の電磁波遮蔽用組成物であり、本発明の[]
的とする効宋が得ら才する。C component C-1: Polycarbonate (Taflon A2200, manufactured by Idemitsu Petrochemical ■) Conductive filler D-1 stainless steel fiber (Bexield, manufactured by Bekaert) D-2 stainless steel fiber (Naslon, manufactured by Nippon Seiren ■) Flame retardant E-1 Nibrominated epoxy oligomer (EC-20, manufactured by Dainippon Ink ■) E-2: Decabromodiphenyl ether E-3: Tetrabromobisphenol A oligomer Examples 1 to 9, Comparative Examples 1 to 4 Table-1 Components other than the conductive filler were mixed in advance using a Henschel mixer, and pellets were produced using an extruder at a temperature of 240°C. Next, the pellets and a conductive filler are mixed, and this mixture is used in various test No. 1 injection molding machines.
3, Examples 1 to 1) are electromagnetic wave shielding compositions within the scope of the present invention (flame retardant) 1), and the []
The targeted effect was achieved by the Song Dynasty.
比較例1は、C成分が本発明の範囲未満であり、成形加
工性、耐衝撃性の物性バランスが劣る。In Comparative Example 1, the C component was less than the range of the present invention, and the physical property balance of moldability and impact resistance was poor.
比較例2は、導電性充填剤が本発明の範囲未満の例であ
り、電磁波遮蔽性に劣る。Comparative Example 2 is an example in which the conductive filler is less than the range of the present invention, and the electromagnetic wave shielding property is poor.
比較例3は、導電性充填剤が本発明の範囲を超えた例で
あり、成形加工性、耐衝撃性、成形品の外観性が劣る。Comparative Example 3 is an example in which the conductive filler exceeds the scope of the present invention, and the molding processability, impact resistance, and appearance of the molded product are poor.
比較例4は、難燃剤が本発明の範囲を超えた例であり、
成形加工性、耐衝撃性に劣る。Comparative Example 4 is an example in which the flame retardant exceeds the scope of the present invention,
Poor moldability and impact resistance.
以下余白
7
「発明の効果」
従来、耐衝撃性、成形加L1−1性の優れた7ゴム強化
樹脂に導電性充填剤を添加すると、耐衝撃性、成形加工
性が大幅に低下し7、耐衝撃性、成形加工性の優れた電
磁波遮蔽用樹脂組成物が得られなかったが、本発明はゴ
ム強化樹脂に導電性充填剤を添加し、さらにポリカーボ
ネートを添加することで、耐衝撃性の低下が少なく、そ
の結果、耐衝撃性に余裕ができたことから、成形加1−
性のより優れたゴム強化樹脂を用いることもできるので
、耐衝撃性、成形加工性の物性バランスに優れ、かつ耐
熱性の優れた電磁波遮蔽用樹脂組成物ならびに、さらに
優れた難燃性をffする難燃性電磁波遮蔽用樹脂組成物
である。Margin below 7 "Effects of the Invention" Conventionally, when a conductive filler is added to a 7 rubber reinforced resin that has excellent impact resistance and moldability L1-1, the impact resistance and moldability are significantly reduced. Although it has not been possible to obtain an electromagnetic wave shielding resin composition with excellent impact resistance and moldability, the present invention has improved impact resistance by adding a conductive filler to a rubber reinforced resin and further adding polycarbonate. There was little deterioration, and as a result, there was a margin in impact resistance, so molding process 1-
It is also possible to use rubber-reinforced resins with better properties, so it is possible to create electromagnetic shielding resin compositions with an excellent balance of physical properties such as impact resistance and moldability, as well as excellent heat resistance, as well as even better flame retardancy. This is a flame-retardant electromagnetic wave shielding resin composition.
Claims (3)
〜70/1〜90重量%からなる熱可塑性樹脂( I )
100重量部に対し、導電性充填剤(II)1〜20重量
部を含有することを特徴とする電磁波遮蔽用樹脂組成物
。 (A)ゴム状重合体(a)5〜70重量部の存在下、芳
香族ビニル化合物/その他の単量体=10〜100/0
〜90重量%からなる単量体化合物(b)30〜95重
量部(a+b=100重量部)を重合して得られるゴム
強化樹脂。 (B)芳香族ビニル化合物/その他の単量体=10〜1
00/0〜90重量%を重合して得られる重合体。 (C)ポリカーボネート(1) The following (A)/(B)/(C) = 10-99/0
Thermoplastic resin (I) consisting of ~70/1 to 90% by weight
A resin composition for shielding electromagnetic waves, comprising 1 to 20 parts by weight of a conductive filler (II) per 100 parts by weight. (A) In the presence of 5 to 70 parts by weight of rubbery polymer (a), aromatic vinyl compound/other monomer = 10 to 100/0
A rubber reinforced resin obtained by polymerizing 30 to 95 parts by weight (a+b=100 parts by weight) of monomer compound (b) consisting of 90% by weight. (B) Aromatic vinyl compound/other monomer = 10-1
A polymer obtained by polymerizing 00/0 to 90% by weight. (C) Polycarbonate
の(II)/難燃剤/アンチモン化合物=100/1〜2
0/1〜20/1〜10重量部を含有することを特徴と
する難燃性電磁波遮蔽用樹脂組成物。(2) (I) according to claim (1) / (II) according to claim (1) / flame retardant / antimony compound = 100/1-2
A flame-retardant electromagnetic wave shielding resin composition containing 0/1 to 20/1 to 10 parts by weight.
〜70/1〜90重量%からなり、かつ(A)および/
または(B)中のハロゲン化スチレン含有量が5〜50
重量%である熱可塑性樹脂(III)100重量部に対し
、導電性充填剤(II)1〜20重量部、難燃剤0〜20
重量部およびアンチモン化合物0〜10重量部を含有す
ることを特徴とする難燃性電磁波遮蔽用樹脂組成物。 (A)ゴム状重合体(a)5〜70重量部の存在下、ハ
ロゲン化スチレンおよび/またはハロゲン化スチレン以
外の芳香族ビニル化合物/その他の単量体=10〜10
0/0〜90重量%からなる単量体化合物(b)30〜
95重量部(a+b=100重量部)を重合して得られ
るゴム強化樹脂。 (B)ハロゲン化スチレンおよび/またはハロゲン化ス
チレン以外の芳香族ビニル化合物/その他の単量体=1
0〜100/0〜90重量%を重合して得られる重合体
。 (C)ポリカーボネート(3) The following (A)/(B)/(C) = 10-99/0
~70/1~90% by weight, and (A) and/
Or the halogenated styrene content in (B) is 5 to 50
1 to 20 parts by weight of conductive filler (II) and 0 to 20 parts by weight of flame retardant per 100 parts by weight of thermoplastic resin (III) (% by weight)
1. A flame-retardant electromagnetic wave shielding resin composition comprising 0 to 10 parts by weight of an antimony compound. (A) In the presence of 5 to 70 parts by weight of rubbery polymer (a), halogenated styrene and/or aromatic vinyl compound other than halogenated styrene/other monomer = 10 to 10
Monomer compound (b) consisting of 0/0 to 90% by weight 30 to
A rubber reinforced resin obtained by polymerizing 95 parts by weight (a+b=100 parts by weight). (B) Halogenated styrene and/or aromatic vinyl compound other than halogenated styrene/other monomer = 1
A polymer obtained by polymerizing 0 to 100/0 to 90% by weight. (C) Polycarbonate
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6213090A JPH03263452A (en) | 1990-03-13 | 1990-03-13 | Resin composition for shielding electromagnetic wave |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6213090A JPH03263452A (en) | 1990-03-13 | 1990-03-13 | Resin composition for shielding electromagnetic wave |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03263452A true JPH03263452A (en) | 1991-11-22 |
Family
ID=13191187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6213090A Pending JPH03263452A (en) | 1990-03-13 | 1990-03-13 | Resin composition for shielding electromagnetic wave |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03263452A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010138401A (en) * | 2010-01-19 | 2010-06-24 | Mitsubishi Engineering Plastics Corp | Electromagnetic wave-inhibiting resin composition and molded article |
-
1990
- 1990-03-13 JP JP6213090A patent/JPH03263452A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010138401A (en) * | 2010-01-19 | 2010-06-24 | Mitsubishi Engineering Plastics Corp | Electromagnetic wave-inhibiting resin composition and molded article |
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