JPH0326277A - Low frequency treatment aid - Google Patents

Abstract

PURPOSE:To prevent a sticky pad from remaining in a conduction housing tool when a conductor is detached from the conduction housing tool by making the area of a surface, to which the sticky pad is sticked, in the conductor housing tool smaller than the area of a surface, to which the sticky pad is sticked, in the main body of the conductor. CONSTITUTION:Since an outer diameter for the apex surface of a circular rib 23 is made smaller than the diameter of a sticky pad 3 for which a sticking position is regulated by an external wall 22 of a housing plate 21, these parts around the outer circumference of the sticky pad 3 are not sticked to the housing plate 21 but positioned to float from a recessed part 24 around this housing plate 21. When a low frequency treatment air is used, a pair of conductor 1 are detached from the housing plate 21. At such a time, since the area of the surface, to which the sticky pad 3 is sticked, in the housing plate 21 is smaller than the area of the surface, to which the sticky pad 3 is sticked, in a main body 2 of the conductor and the adhesion of the sticky pad 3 is made weak to the housing plate 21 rather than to the main body 2 of the conductor, the sticky pad 3 is detached from the housing plater 21 securely together with the main body 2 of the conductor and not in this housing plate 21.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a low-frequency treatment device that performs treatment by applying high-voltage, low-frequency stimulation pulses to the human body, and particularly relates to an adhesive pad. The present invention relates to a conductor storage device for storing a conductor to which is pasted.

(Prior Art) An example of a conventional low frequency treatment device will be explained based on FIG. 7 and FIG. 8.

Reference numeral 1 designates a pair of conductors, each of which consists of a conductor body 2 and a conductive adhesive pad 3 detachably attached to the conductor body 2.

The conductor body 2 also includes a flexible conductor cover 4 formed of insulating rubber or the like into a substantially disk shape.
and an electrode 5 made of conductive rubber or the like covered with the conductor cover 4 except for the bottom surface. That is, a bulging portion 6 bulging toward the back side is formed on the negative side of the conductor cover 4, and the electrode 5 is embedded within this bulging portion 6. The exposed bottom surface of this electrode 5 and the bottom surface of the conductor cover 4 are on the same plane.

Further, an annular Q peripheral wall 7 is formed protruding from the bottom peripheral edge of the conductor cover 4 .

The adhesive pad 3 is formed into a disk shape using an adhesive such as a hydrous acrylic gel having conductivity, and is inserted into the peripheral wall 7 of the conductor cover 4 when the adhesive pad 3 is fitted into the peripheral wall 7 of the conductor cover 4. 4 and the bottom of the electrode 5. The adhesive pad 3 is removably attached to the skin of a human body for treatment. Note that the height of the peripheral wall 7 is smaller than the thickness of the adhesive pad 3.

Furthermore, a connection hole 8 is formed at the bulge 6 from the outer peripheral surface of the conductor cover 4 into the electrode 5 . A pin-shaped plug 9 is detachably inserted into the connection hole 8 and connected thereto. And this plug 9 is this plug 9
This is for electrically connecting the electrode 5 to a low-frequency stimulation pulse generation circuit built into the main body of the low-frequency treatment device (not shown) together with a cord 10 connected to the cord IO. Note that the connecting portion between the plug 9 and the cord 10 is connected to a plug cover 11.
covered by.

Reference numeral 16 denotes a storage plate as a conductor storage device, and this storage plate 16 is formed into a disk shape from synthetic resin or the like. Furthermore, annular outer walls 17 are formed protruding from the peripheral edges of both sides of the storage plate 16, respectively. Note that the height of these outer walls l7 is the same as that of the peripheral wall 7 of the conductor cover 4.
This is smaller than the amount of protrusion of the adhesive pad 3 from the.

As shown in FIG. 8, the adhesive pads 3 of both conductors 1 are removably attached to both sides of the storage plate 16 while being fitted into the respective outer walls 17. It looks like this.

Conventionally, the inner bottom surface of the storage plate 16 to which the adhesive pad 3 is attached is flat, and the diameter of the storage plate 16 is equal to the diameter of the adhesive pad 3.
It was slightly larger than the diameter of.

That is, one side of the adhesive pad 3 was entirely attached to the conductor body 2, and the other side of the adhesive pad 3 was also attached entirely to the storage plate 16.

(Problem to be Solved by the Invention) However, in the above-mentioned conventional structure, since the area to which the adhesive pad 3 is attached is the same for the conductor body 2 and the storage plate 16 as a conductor storage device, the adhesive pad The adhesion force of the adhesive pad 3 to the storage plate 16 is relatively strong compared to the adhesion force of the adhesive pad 3 to the conductor cover 4 and the electrode 5, and depending on the adhesion state, the adhesion force of the latter may be larger. When attempting to remove the conductor 1 from the storage plate 16, there is a problem in that the adhesive pad 3 may not be peeled off from the storage plate 16 together with the conductor body 2 and may remain on the storage plate 16.

By the way, adhesive pad 3 made of hydrous acrylic gel
As the adhesive is used repeatedly, the adhesive strength decreases due to oil and dust adhering to the surface, but by removing dirt from the surface or adding a little water, it can be improved.
It has the property of slightly recovering adhesive strength. Therefore,
Conventionally, dirty adhesive pads 3 were lightly soaked in water or wiped with a wet towel to restore their adhesive strength, but washing them with too much water made the adhesive pads 3 unusable, and the towel There was a problem with using .

The present invention aims to solve the above-mentioned problems, and provides a low-frequency treatment device that does not leave adhesive pads on the conductor housing when the conductor is removed from the conductor housing. Its primary purpose is to

A second object of this low-frequency treatment device is to minimize the amount of dust and the like adhering to the adhesive pad during storage.

Furthermore, a third objective is to provide a low frequency treatment device that can reliably and easily restore the adhesive force of an adhesive pad.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a conductor body having an electrode electrically connected to a low frequency stimulation pulse generation circuit, and a conductor body that is removably attached to the exposed bottom part of the conductor body. In order to achieve the above-mentioned first object, there is provided a low-frequency treatment device equipped with a conductor made of a conductive adhesive pad and a conductor storage device to which the adhesive pad of the conductor is removably attached. , the area of the surface of the conductor storage device to which the adhesive pad is attached is smaller than the area of the surface of the conductor body to which the adhesive pad is attached.

In addition, in the low frequency treatment device according to claim 2, an outer wall having substantially the same external shape as the adhesive pad and surrounding the outer periphery of the adhesive pad is formed on the conductor storage device, and an inner wall of the outer wall is formed. A concave portion is formed along the entire circumference.

In addition, in the low frequency treatment device according to claim 3, in order to further achieve the second object, the conductor storage device is provided with an outer wall surrounding the outer periphery of the conductor main body, and a notch is formed in the outer wall. Further, a cutout part is formed on the surface of the conductor storage tool facing the bottom surface of the adhesive pad, which is continuous with the cutout part.

In addition, in the low frequency treatment device according to claim 4, the adhesive pad is made of hydrous acrylic gel. A protruding annular rib is attached to the part.

(Function) When using the low frequency treatment device of the present invention, the adhesive pad attached to the conductor body is attached to the skin, and the conductor is attached to the human body. Then, high voltage pulses generated by the low frequency stimulation pulse generation circuit are applied to the human body via the electrodes of the conductor body and the adhesive pads attached to the electrodes to perform treatment. When not in use, the conductor is stored by attaching the adhesive pad of the conductor removed from the human body to the conductor storage tool. Furthermore, when using the conductor again, the conductor is removed from the conductor storage tool by holding the conductor body, etc., but at that time, the area of the surface of the conductor body to which the adhesive pad is attached is larger than the area of the conductor storage tool. The surface area to which the adhesive pad is attached is small, and the adhesion force of the adhesive pad is weaker to the conductor storage tool than to the conductor body, so the adhesive pad is attached to the conductor storage tool along with the conductor body. It will not come off and remain in this conductor storage tool.

In addition, in the low frequency treatment device of claim 2, when the adhesive pad is attached to the conductor storage tool in a state where the outer wall having approximately the same external shape as the adhesive pad surrounds the outer periphery of the adhesive pad, the guide Since the child storage device has a concave portion along the entire inner periphery of the outer wall, the peripheral portion of the adhesive pad does not stick to the conductor storage device. As a result, when removing the conductor from the conductor storage tool, no matter where you start removing it from around the conductor, the adhesive pad is not attached to the conductor storage tool at the initial position. The adhesive pad is smoothly removed together with the conductor body, and the adhesive pad is more reliably prevented from remaining in the conductor housing.

In addition, in the low frequency treatment device according to claim 3, when the conductor is stored, the outer wall of the conductor housing surrounds the outer periphery of the conductor body, and the outer wall of the conductor housing surrounds the outer periphery of the conductor main body, and the outer wall of the conductor housing is continuous with the notch of the outer wall. There is a missing part on the surface facing the bottom of the adhesive pad where the adhesive pad is not attached, which increases the area where the adhesive pad is in close contact with the conductor storage tool, which prevents dust from adhering to the adhesive pad. Less is. When removing the conductor from the conductor housing, use the portion of the conductor body facing the notch in the outer wall of the conductor housing as a guide to remove it. In this case, since the adhesive pad is not attached to the conductor storage tool, the adhesive pad can be removed without remaining on the conductor storage tool.

Furthermore, in the low frequency treatment device of claim 4, when the adhesive pad becomes dirty, water is poured into the inner circumferential side of the annular rib of the conductor storage device, and then the adhesive pad of the conductor is pasted on the annular rib. Put it on and close the lid. In this state, water is held liquid-tight between the adhesive pad and the conductor housing. While stored in this state, the retained water removes dirt from the adhesive pad, and water is absorbed into the adhesive pad made of hydrous acrylic gel, reducing the adhesive strength of the adhesive pad. Recover.

(Example) Hereinafter, a first example of the low frequency treatment device of the present invention will be described based on FIGS. 1 and 2.

The structure of a pair of conductors 1 each consisting of a conductor body 2 and a conductive adhesive pad 3 removably attached to the bottom of the conductor body 2 is as shown in FIGS. 7 and 8 described above. Since it is completely similar to the conductor 1 shown in the figure, corresponding parts are given the same reference numerals and detailed explanation thereof will be omitted.

Reference numeral 2l designates a storage plate as a conductor storage device, and this storage plate 21 is made of synthetic resin, such as ABS resin or polypropylene, into a disk shape, and the outer periphery of both sides has markings similar to the conventional storage plate 16. An annular outer wall 22 is formed to protrude from each other. These outer walls 22 have substantially the same planar shape as the external shape of each of the adhesive pads 3, and surround the outer peripheral surfaces of these adhesive pads 3, respectively.

The outer wall 2 is provided on both sides of the storage plate 21.
Annular ribs 23 are located on the inner circumferential side of the outer walls 2 and concentrically formed to protrude from the outer walls 22, respectively. These annular ribs 23 have the peripheral parts of the respective adhesive pads 3 made of hydrous acrylic gel of both conductors 1 removably attached to the top surface thereof. The outer diameter of the top surface of is smaller than the diameter of the disk-shaped adhesive pad 3. Therefore, adhesive pad 3
Since the whole of one surface of the conductor body 2 is removably attached to the conductor body 2, the area of the conductor housing 21 is larger than the area of the surface of the conductor body 2 to which the adhesive pad 3 is attached. The area of the surface to which the adhesive pad 3 is attached is smaller. The annular ribs 23 form peripheral recesses 24 on both sides of the storage plate 21 along the entire inner periphery of each outer wall 22, and the inner periphery of each annular rib 23. A central concave portion 25 is formed on each side.

Next, the operation of the above embodiment will be explained.

When in use, the pair of conductors 1 are attached to desired positions on the human body by attaching the adhesive pad 3 attached to the conductor body 2 to the skin. A high voltage pulse generated by a low frequency stimulation pulse generation circuit built into the main body of the low frequency treatment device (not shown) is transmitted to the cord 10, the plug 9, the electrode 5 to which the plug 9 is connected, and the electrode 5. A low frequency wave is applied to the human body through the bottom surface of the conductor cover 4 and the conductive adhesive pad 3 attached to the bottom surface of the conductor cover 4. This can be used to treat stiff shoulders and muscle pain.

After treatment, the adhesive pad 3 is peeled off from the skin and the pair of conductors 1 are removed from the human body.

When not in use, as shown in FIG.
2, and the annular rib 23 on one side thereof.
Attach it to the top surface of the Similarly, the adhesive pad 3 of the other conductor 1 is attached to the top surface of the annular rib 23 on the opposite surface of the storage plate 21. In this state, since the outer diameter of the top surface of the annular rib 23 is smaller than the diameter of the adhesive pad 3 whose adhesion position is regulated by the outer wall 22, the outer periphery of the adhesive pad 3 is is not attached to the storage plate 21 and is positioned floating from the peripheral recessed portion 24 of the storage plate 21.

By storing and storing the conductors 1 in this manner, it is possible to prevent dust from adhering to the adhesive pads 3 during storage, and it is also possible to prevent these adhesive pads 3 from inadvertently sticking to something. .

Further, when the device is to be used again, the pair of conductors 1 are removed from the storage plate 21 by holding the storage plate 21 with one hand and picking the conductor body 2 or the plug cover 11 with the other hand. At this time, the area of the storage plate 2l is larger than the area of the surface of the conductor body 2 to which the adhesive pad 3 is attached.
The area of the surface to which the adhesive pad 3 is attached is small;
Since the adhesion force of the adhesive pad 3 is weaker on the storage plate 21 than on the conductor body 2, the adhesive pad 3 is reliably removed from the storage plate 21 together with the conductor body 2.
It does not remain on this storage plate 21.

Moreover, generally, the flexible conductor 1 is removed from its periphery by being bent, but since the periphery of the adhesive pad 3 is not attached to the storage plate 21, the periphery of the conductor 1 is removed. No matter from which position the adhesive pad 3 starts to be removed, since the adhesive pad 3 is not attached to the storage plate 21 at the initial position, the adhesive pad 3 smoothly follows the conductor body 2. Therefore, the adhesive pad 3
It is more effectively prevented from remaining on the surface.

FIG. 3 shows a second embodiment of the present invention, and a storage plate 21 of this embodiment has an adhesive pad 3 on the top surface, filling the inner circumferential side of the annular rib 23 in the first embodiment. The ribs to be pasted are circular ribs 31. Of course, the area of the top surface of this circular rib 3l is smaller than that of the corresponding surface of the adhesive pad 3.

If the contact area of the adhesive pad 3 with the storage plate 2l is too small, the adhesiveness may deteriorate and the adhesive pad 3 may be inadvertently peeled off from the storage plate 21 during storage. Like, adhesive pad 3
By increasing the area of contact with the storage plate 21 to some extent, it is possible to prevent the adhesive pad 3 from being accidentally peeled off from the storage plate 21 during storage.

Next, a third embodiment of the present invention will be described based on FIG. 4.

In this embodiment, both inner bottom surfaces of the storage plate 21 are flat without ribs.

Further, the height of the outer wall 22 of the storage plate 2l is greater than at least the amount of protrusion of the adhesive pad 3 from the peripheral wall 7 of the conductor cover 4. Preferably, the conductor cover 4
It is better to set it higher than the height of

At the same time, the inner diameter of the outer wall 22 is slightly larger than the outer diameter of the peripheral wall 7. Therefore, when the conductor 1 is stored in the storage plate 21, the outer peripheral surface of the conductor cover 4 is surrounded by the outer wall 22.

Furthermore, a notch 32 is formed at one location on both outer walls 22 of the storage plate 21, in which each of the plug covers 11 of both the conductors 1 is accommodated. In addition, storage plate 2
The portion of the flat plate-shaped portion 1 that is continuous with the notch 32 is missing at two places, and a pair of missing portions 33 are formed.
It has become. These missing portions 33 extend to a position where the distance from the center of the storage plate 21 is smaller than the diameter of the adhesive pad 3. Therefore, when the conductor 1 is stored in the storage plate 21, the bottom surface of the adhesive pad 3 is It is designed so that it will not be stuck to the storage plate 2l. Furthermore, the position between both the missing parts 33 is the convex part 3
It is now 4.

Then, when storing the pair of conductors 1, the storage plate 2
The adhesive pads 3 of both conductors 1 are placed on both inner bottom surfaces of the storage plate 21 so that the plug cover 11 of the plug 9 connected to the conductor main body 2 comes out from each notch 32 of both outer walls 22 of the conductor 1. Paste.

In this state, the adhesive pad 3 is covered from the outer circumferential side by the outer wall 22 of the storage plate 21 except for the position of the notch 32, and the adhesive pad 3 is stored only in a part of the periphery facing the missing part 33. It is not attached to plate 2l,
Since the contact surface between the adhesive pad 3 and the storage plate 2l is made as wide as possible, adhesion of dust and the like to the adhesive pad 3 can be minimized.

Note that the convex portion 34 between the pair of missing portions 33 is
This is to prevent the adhesive pads 3 from sticking to each other.

When removing the conductor 1 from the storage plate 21,
Plug the plug cover 11 inserted into the notch 32 of the outer wall 22 and lift it away from the storage plate 21. In this way, since the adhesive pad 3 is not stuck to the storage plate 21 at the missing portion 33 near the plug force bar 11, the adhesive pad 3 can be reliably peeled off without remaining on the storage plate 21.

At this time, since the outer wall 22 surrounds the conductor cover 4, there is no clue for removing it other than the plug cover 11 located in the notch 32 of the outer wall 22.

Therefore, it is inevitable that the conductor 1 be removed from the plug cover 11 part.
However, since there is a missing part 33 in this part, make sure that the adhesive pad 3 remains on the storing plate 2l even though this missing part 33 is only in a part of the periphery of the storage plate 21. can be prevented. Moreover, generally, the most natural operation is to pinch the plug force bar 11 and remove the conductor 1.

Note that, as in the fourth embodiment shown in FIG. 5, the missing portions 35 may be formed in the shape of recesses on both sides of the storage plate 21, respectively. In this configuration, the protrusion 34 for preventing adhesion of each adhesive pad 3 is unnecessary.

Next, a fifth embodiment of the present invention will be described based on FIG. 6.

In the storage plate 21 of this embodiment, in the storage plate 21 of the first embodiment, the inner circumferential side of the annular rib 23 on the inner circumferential side of the outer wall 22 is removed to form a through hole 36. It is circular in shape.

Then, adhesive pad 3 made of hydrous acrylic gel
If the adhesive becomes dirty and its adhesive strength decreases, first attach the adhesive pad 3 of one conductor 1 to the annular rib 23 on one side of the storage plate 21, then turn it over and attach the adhesive pad 3 to the annular rib 23 on one side of the storage plate 21. Water is poured from above into the through hole 36 in the center of the tube. Next, the adhesive pad 3 of the other conductor 1 is attached to the annular rib 23 on the opposite side of the storage plate 2l, and the lid is closed. In this state, water is held liquid-tight between the pair of adhesive pads 3 and the annular rib 23 of the storage plate 21.

While being stored in this state, dirt on the adhesive pad 3 may be removed by the retained water, or water may be absorbed into the adhesive pad 3 made of a water-absorbing acrylic gel. As a result, the adhesive strength of the adhesive pad 3 is slightly restored.

Thus, according to the above structure, the adhesive force of the adhesive pad 3 can be easily restored without using a towel or the like. Moreover, since water is poured into the space between the pair of adhesive pads 3 having a constant volume and the annular rib 23 of the storage plate 2l, the amount of water can be regulated to an appropriate amount. There is no risk of overfilling. Therefore, the adhesive pad 3 is not excessively immersed in water, and its adhesive strength can be reliably restored.

Note that the through hole 36 formed in the storage plate 2l is not limited to one large hole as shown in the figure, but may be formed of a plurality of small holes.

Furthermore, even with the storage plate 2l of the first embodiment, which does not have the through-hole 36, the same effect can be obtained by storing water in the central recess 25 on the inner peripheral side of the annular rib 23. As in the fifth embodiment, if there is a through hole 36, 1
By injecting water twice, both adhesive pads 3 are immersed in water.

〔Effect of the invention〕

According to the present invention, the following effects can be obtained.

In the low frequency treatment device according to claim 1, the area of the surface of the conductor storage device to which the adhesive pad is attached is made smaller than the area of the surface of the conductor body to which the adhesive pad is attached, so that the area of the adhesive pad is reduced. Since the adhesive force is weaker on the conductor housing than on the conductor body, when removing the conductor consisting of the conductor body and adhesive pad from the conductor housing, the adhesive pad is securely attached to the conductor. It can be removed together with the main body, and it is possible to prevent the adhesive pad from remaining in the conductor storage device.

Further, in the low frequency treatment device according to claim 2, the conductor housing has an outer wall having substantially the same external shape as the adhesive pad and surrounding the outer periphery of the adhesive pad, and the entire inner periphery of the outer wall. Since the concave part is formed along the , the peripheral part of the adhesive pad will not stick to the conductor storage tool, so when the conductor is removed from the conductor storage tool, the adhesive pad will remain in the conductor storage tool. This can be prevented even more reliably, and this effect is effective no matter where the conductor is removed from the periphery.

Furthermore, in the low frequency treatment device of claim 3, the conductor storage device includes:
An outer wall surrounding the outer periphery of the conductor body is shaped, a notch is formed in this outer wall, and an adhesive pad is attached to the surface of the conductor storage device facing the bottom of the adhesive pad continuously from the notch. By forming a missing part that prevents the conductor from being exposed, it is possible to widen the contact surface between the conductor storage tool and the adhesive pad, thereby minimizing the adhesion of dust to the adhesive pad during storage, and making it possible to prevent the conductor from being guided. When removing the conductor from the conductor storage device, by using the portion of the conductor facing the notch of the conductor storage device as a clue, it is possible to reliably prevent the adhesive pad from remaining in the conductor storage device.

In addition, in the low frequency treatment device according to claim 4, since the conductor storage device has a protruding annular rib that is attached to the adhesive pad made of hydrous acrylic gel, water can be poured into the inner peripheral side of the annular rib. The adhesive strength of the adhesive pad can be easily restored by storing the adhesive pad, and the amount of water for this purpose is regulated, so that the adhesive strength can be restored reliably.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a first embodiment of the low frequency treatment device of the present invention, FIG. 2 is a perspective view of the same conductor storage device, and FIG. 3 is a conductor storage device showing a second embodiment of the present invention. A perspective view of the tool, FIG. 4 is a plan view showing a third embodiment of the present invention, FIG. 5 is a sectional view showing a fourth embodiment of the present invention, and FIG. 6 shows a fifth embodiment of the present invention. 7 is a perspective view showing an example of a conventional low frequency treatment device, and FIG. 8 is a sectional view of the same. 1. Conductor, 2. Conductor body, 3. Adhesive pad, 5.
・Electrode, 21... Storage plate as a conductor storage device, 2
2...Outer wall, 23...Annular rib, 24...Concave part, 32
●・Notch, 33. 35●● Missing part.

Claims (4)

[Claims] (1) A conductor consisting of a conductor body having an electrode electrically connected to a low-frequency stimulation pulse generation circuit and a conductive adhesive pad removably attached to the bottom surface of the conductor body where the electrode is exposed. and a conductor storage device to which the adhesive pad of the conductor is removably attached, and the area of the conductor storage device is larger than the area of the surface of the conductor body to which the adhesive pad is attached. A low-frequency treatment device characterized by a reduced surface area to which an adhesive pad is attached. (2) The conductor storage device is provided with an outer wall that has approximately the same external shape as the adhesive pad and surrounds the outer periphery of the adhesive pad, and a recessed portion is formed along the entire inner periphery of this outer wall. The low frequency treatment device according to claim 1, characterized in that: (3) An outer wall surrounding the outer periphery of the conductor body is formed in the conductor storage device, and a notch is formed in this outer wall, and a cutout portion is continuously formed on the bottom surface of the adhesive pad in the conductor storage device. 2. The low frequency treatment device according to claim 1, further comprising a cutout portion formed on the opposing surface of the device. (4) The adhesive pad is made of hydrous acrylic gel, and the conductor storage device has a protruding annular rib attached to the periphery of the adhesive pad according to claim 1 or 2. low frequency treatment device.