JPH03261634A - Glass ceramic substrate - Google Patents
Glass ceramic substrateInfo
- Publication number
- JPH03261634A JPH03261634A JP5988190A JP5988190A JPH03261634A JP H03261634 A JPH03261634 A JP H03261634A JP 5988190 A JP5988190 A JP 5988190A JP 5988190 A JP5988190 A JP 5988190A JP H03261634 A JPH03261634 A JP H03261634A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- dielectric constant
- ceramic substrate
- glass powder
- mechanical strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 21
- 239000002241 glass-ceramic Substances 0.000 title claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000843 powder Substances 0.000 claims abstract description 13
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052863 mullite Inorganic materials 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 239000005388 borosilicate glass Substances 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 abstract description 4
- 239000011230 binding agent Substances 0.000 abstract description 3
- 239000004925 Acrylic resin Substances 0.000 abstract description 2
- 229920000178 Acrylic resin Polymers 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract description 2
- 239000012299 nitrogen atmosphere Substances 0.000 abstract description 2
- 239000004014 plasticizer Substances 0.000 abstract description 2
- 238000002425 crystallisation Methods 0.000 description 7
- 230000008025 crystallization Effects 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 101710097452 4-diphosphocytidyl-2-C-methyl-D-erythritol kinase, chloroplastic Proteins 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Glass Compositions (AREA)
Abstract
Description
ガラスセラミック基板に関し、
比誘電率が低く、かつ機械的強度の高いガラスセラミッ
ク基板を提供することを目的とし、ムライト、石英ガラ
ス、ホウケイ酸ガラスの粉体を含む混合体で形成される
ガラスセラミック基板において、
前記石英ガラスに多孔質粉体を使用して構成すRegarding glass-ceramic substrates, the purpose is to provide glass-ceramic substrates that have a low dielectric constant and high mechanical strength, and are made of a mixture containing powders of mullite, quartz glass, and borosilicate glass. In the above, the quartz glass is constructed using porous powder.
本発明は、ガラスセラミック基板に関するものである。
近年エレクトロニクス機器の配線板として、熱伝導率、
熱放散性が良好で、高密度実装に適している点が着目さ
れてセラミック基板が多用されている。
一方、コンピュータ等の信号の伝播速度が大きく性能に
影響を与える製品に関しては、基板の比誘電率が問題と
なる。The present invention relates to a glass ceramic substrate. In recent years, thermal conductivity,
Ceramic substrates are widely used because they have good heat dissipation properties and are suitable for high-density packaging. On the other hand, for products such as computers where signal propagation speed is high and performance is affected, the dielectric constant of the substrate becomes an issue.
一般にセラミックは樹脂よりも比誘電率が高く、低誘電
率基板として、従来、セラミックに石英ガラスを混合さ
せたガラスセラミック基板が提案されている。Ceramics generally have a higher dielectric constant than resins, and glass-ceramic substrates made by mixing ceramic with quartz glass have been proposed as low-dielectric constant substrates.
しかし、上述したガラスセラミック基板においては、比
誘電率を低下させるべく石英ガラスの比率を多くすると
、ガラスの結晶化が進行するため、機械的強度は向上す
るもののガラスの結晶化が進行し、比誘電率が高くなる
上に、結晶化の制御が円舞なため、焼成過程における収
縮率のコントロールが不可能となるという欠点を有する
ものであった。
一方、上記石英ガラスの結晶化を抑制するために、ガラ
ス材にムライトを添加することも提案されているが、か
かる組成においても、ムライト添加量を減少させると比
誘電率は低減されるものの、機械的強度は低下するとい
う欠点を有するものであった。
本発明は、以上の欠点を解消すべくなされたものであっ
て、比誘電率が低く、かつ機械的強度の高いガラスセラ
ミック基板を提供することを目的とする。However, in the above-mentioned glass-ceramic substrate, when the ratio of quartz glass is increased to lower the dielectric constant, the crystallization of the glass progresses, so although the mechanical strength improves, the crystallization of the glass progresses and the ratio increases. In addition to having a high dielectric constant, it has the drawback that the control of crystallization is uneven, making it impossible to control the shrinkage rate during the firing process. On the other hand, it has been proposed to add mullite to the glass material in order to suppress the crystallization of the silica glass, but even in such compositions, although the dielectric constant is reduced by reducing the amount of mullite added, This had the disadvantage of reduced mechanical strength. The present invention was made in order to eliminate the above-mentioned drawbacks, and an object of the present invention is to provide a glass ceramic substrate having a low dielectric constant and high mechanical strength.
本発明によれば上記目的は、
ムライト、石英ガラス、ホウケイ酸ガラスの粉体を含む
混合体で形成されるガラスセラミック基板において、
前記石英ガラスに多孔質粉体を使用したガラスセラごツ
タ基板を提供することにより達成される。According to the present invention, the above object is to provide a glass-ceramic substrate formed of a mixture containing powders of mullite, quartz glass, and borosilicate glass, in which a porous powder is used for the silica glass. This is achieved by
セラミック材料として多用されるアルミナの比誘電率は
、樹脂材に比較して略倍の９程度と高く、石英ガラスの
比誘電率は、上記ムライトの比誘電率に比べて低いこと
は広く知られており、従来のガラスセラミックは、アル
ミナと石英ガラスとの中間の比誘電率値を目標値として
製造されているものであった。
一方、空気の比誘電率は、石英ガラスの比誘電率よりも
著しく低く、石英ガラスと空気との混合により得られる
ものの比誘電率は、石英ガラスの比誘電率よりもさらに
低い値を示すこととなり、上記従来例における石英ガラ
スに代えて石英ガラスと空気との混合物質を使用するこ
とにより、比誘電率の下限値を更に低下させることがで
きる。
さらに、ムライトは、石英ガラスの結晶化を抑制する効
果が大である上に、針状結晶を有するため強度向上への
寄与も大きいという性質を有する。
本発明は、以上の点に着目してなされたものであって、
アル逅すに代えてムライトを使用することにより石英ガ
ラスの結晶化を効果的に抑制すると同時に機械的強度も
向上させ、さらに石英ガラスの代わりに多孔質石英ガラ
スを使用することにより比誘電率の下限値を低下させる
ものである。
すなわち、本発明によるムライトは、多孔質石英ガラス
の結晶化を抑制する上に全体の機械的強度も向上させ、
軟化点が８００℃と比較的低いホウケイ酸ガラスは、低
温焼成におけるバインダの役割を果たす。It is widely known that the dielectric constant of alumina, which is often used as a ceramic material, is approximately 9 times higher than that of resin materials, and that the dielectric constant of silica glass is lower than that of mullite. Conventional glass ceramics have been manufactured with a target dielectric constant value between that of alumina and quartz glass. On the other hand, the dielectric constant of air is significantly lower than that of silica glass, and the dielectric constant of the mixture of silica glass and air shows an even lower value than that of silica glass. Therefore, by using a mixture of quartz glass and air in place of the quartz glass in the conventional example, the lower limit value of the dielectric constant can be further lowered. Furthermore, mullite has the property of not only being highly effective in suppressing crystallization of silica glass, but also having needle-like crystals, which makes a large contribution to improving strength. The present invention has been made focusing on the above points, and includes:
By using mullite instead of aluminum, we can effectively suppress the crystallization of silica glass and at the same time improve its mechanical strength.Furthermore, by using porous quartz glass instead of silica glass, we can improve the dielectric constant. This lowers the lower limit. That is, the mullite according to the present invention not only suppresses the crystallization of porous quartz glass but also improves the overall mechanical strength,
Borosilicate glass, which has a relatively low softening point of 800° C., plays the role of a binder during low-temperature firing.
以下、本発明によるガラスセラミック基板の製造、およ
び試験結果を説明する。
まず、ムライト、石英ガラス、ホウケイ酸ガラスを重量
比で１：１：１に計量し、これにアクリル樹脂を結合剤
として加え、さらにジブチルフタレートを可塑剤として
溶剤ＣＭＥＫ：メチルエチルケトン）を混合する。上記
石英ガラスは、孔径約４０人程度の孔を多数有する粒径
約２μｍの多孔質粉体が使用されている。この混合物は
、ボールミルにより約２０時間混練してスラリー状とさ
れ、シート状に底型してグリーンシートが形成される。
このグリーンシートに導体パターンとヴイアを形成して
多層化した後、窒素雰囲気で坑底してガラスセラミック
基板が得られる。
以上の工程により形成されたガラスセラミック基板の比
誘電率を測定すると、４．Ｏとなり、６ないし８の比誘
電率を有する従来のガラスセラミック基板より低い値が
得られる上に、曲げ強度は従来のガラスセラミック基板
の略２倍に達した。Hereinafter, the production and test results of the glass ceramic substrate according to the present invention will be explained. First, mullite, quartz glass, and borosilicate glass are weighed in a weight ratio of 1:1:1, an acrylic resin is added as a binder, and a solvent (CMEK: methyl ethyl ketone) is mixed with dibutyl phthalate as a plasticizer. The quartz glass used is a porous powder having a particle size of about 2 μm and having a large number of pores with a pore size of about 40 pores. This mixture is kneaded in a ball mill for about 20 hours to form a slurry, which is then shaped into a bottom mold to form a green sheet. After forming a conductor pattern and vias on this green sheet to form a multilayer structure, the green sheet is drilled to the bottom in a nitrogen atmosphere to obtain a glass ceramic substrate. When measuring the dielectric constant of the glass ceramic substrate formed by the above steps, 4. O, a value lower than that of conventional glass ceramic substrates having a dielectric constant of 6 to 8 was obtained, and the bending strength reached approximately twice that of conventional glass ceramic substrates.
以上の説明から明らかなように、本発明によるガラスセ
ラミック基板によれば、樹脂製基板と同等以下の比誘電
率を得ることができる上に、機械的強度も向上させるこ
とができる。As is clear from the above description, according to the glass ceramic substrate of the present invention, it is possible to obtain a dielectric constant equal to or lower than that of a resin substrate, and also to improve mechanical strength.
Claims (1)
混合体で形成されるガラスセラミック基板において、 前記石英ガラスに多孔質粉体を使用したガラスセラミッ
ク基板。[Scope of Claims] A glass-ceramic substrate formed of a mixture containing powders of mullite, quartz glass, and borosilicate glass, wherein a porous powder is used for the silica glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5988190A JPH03261634A (en) | 1990-03-13 | 1990-03-13 | Glass ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5988190A JPH03261634A (en) | 1990-03-13 | 1990-03-13 | Glass ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03261634A true JPH03261634A (en) | 1991-11-21 |
Family
ID=13125931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5988190A Pending JPH03261634A (en) | 1990-03-13 | 1990-03-13 | Glass ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03261634A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007073728A (en) * | 2005-09-07 | 2007-03-22 | Murata Mfg Co Ltd | Multilayer ceramic substrate, method of manufacturing same, and electronic component |
-
1990
- 1990-03-13 JP JP5988190A patent/JPH03261634A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007073728A (en) * | 2005-09-07 | 2007-03-22 | Murata Mfg Co Ltd | Multilayer ceramic substrate, method of manufacturing same, and electronic component |
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