JPH03261203A - Oscillation circuit - Google Patents
Oscillation circuitInfo
- Publication number
- JPH03261203A JPH03261203A JP5916390A JP5916390A JPH03261203A JP H03261203 A JPH03261203 A JP H03261203A JP 5916390 A JP5916390 A JP 5916390A JP 5916390 A JP5916390 A JP 5916390A JP H03261203 A JPH03261203 A JP H03261203A
- Authority
- JP
- Japan
- Prior art keywords
- case
- oscillator
- oscillation circuit
- panel
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000010355 oscillation Effects 0.000 title claims description 19
- 239000000463 material Substances 0.000 claims description 11
- 230000035939 shock Effects 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は発振回路に関し、特に機械的な衝撃や振動によ
り発生する発振回路出力の雑音くマイクロッオニツクノ
イズ)の発生を抑制した発振回路に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an oscillation circuit, and in particular to an oscillation circuit that suppresses the generation of noise (micronic noise) in the oscillation circuit output caused by mechanical shock or vibration. Regarding.
第2図は従来の発振回路の一例を示す模式的断面図、第
3図は第2図の等価回路図である。FIG. 2 is a schematic cross-sectional view showing an example of a conventional oscillation circuit, and FIG. 3 is an equivalent circuit diagram of FIG. 2.
第2図に示すように、従来の発振回路では、発振器ケー
ス1とパネルケース2との間にスポンジ4をクッション
材として敷き、外部から加わる機械的な衝撃や振動を吸
収していた。As shown in FIG. 2, in the conventional oscillation circuit, a sponge 4 is placed between the oscillator case 1 and the panel case 2 as a cushioning material to absorb mechanical shocks and vibrations applied from the outside.
上述した従来の発振回路は、発振器への機械的衝撃や振
動によって発生する発振回路出力の雑音(マイクロッオ
ニツクノイズ)を低減させるため、この振動等を吸収す
るクッション材として絶縁物のスポンジを用いていた。The conventional oscillation circuit described above uses an insulating sponge as a cushioning material to absorb this vibration in order to reduce the noise (micronic noise) in the oscillation circuit output caused by mechanical shock or vibration to the oscillator. I was using it.
しかし、このスポンジは発振回路の接地面と発振器を収
納するパネルの接地面とを高周波的に分離してしまい、
第3図に示すように、発振器ケース面6とパネルケース
面7との間の容量11か負荷10に直列に入るようにな
る。この容量11は機械的衝撃等によって発振器ケース
面6が振動すると、ケース間距離の変動に応じて変化す
る。容量11の変化を発振器5から見ると、発振器5の
負荷変動となり、発振周波数を変動させる雑音、即ちマ
イクロフォニツクノイズを発生させる。However, this sponge separates the ground plane of the oscillation circuit and the ground plane of the panel housing the oscillator at high frequencies.
As shown in FIG. 3, the capacitance 11 between the oscillator case surface 6 and the panel case surface 7 is connected in series to the load 10. When the oscillator case surface 6 vibrates due to mechanical shock or the like, this capacitance 11 changes in accordance with a change in the distance between the cases. When viewed from the perspective of the oscillator 5, changes in the capacitance 11 result in changes in the load on the oscillator 5, generating noise that changes the oscillation frequency, ie, microphonic noise.
つまり、従来の発振回路は機械的衝撃や振動によって発
振素子そのものの変動により発生するマイクロッオニツ
クノイズは低減するが、逆に負荷変動によるマイクロッ
オニツクノイズを発生させるという欠点がある。In other words, although conventional oscillation circuits reduce microphonic noise caused by fluctuations in the oscillation element itself due to mechanical shock or vibration, they have the disadvantage of generating microphonic noise due to load fluctuations.
なお、参考として負荷変動による発振器の周波数変動の
最大値ΔFは次式で示される。For reference, the maximum value ΔF of the frequency fluctuation of the oscillator due to load fluctuation is expressed by the following equation.
ΔF=fo (ρ−(1/ρ))
(QOQL>/4QOQL
ここで f。:発振周波数
Qo :発振器の無負荷Q
QL ;発振器の負荷Q
ρ :負荷の反射係数で
ρ=l (ZL 20 )/
(ZL十Z。)
ZL ;負荷インピータンス
〔課題を解決するための手段〕
本発明の発振回路は、発振器のケースとこの発振器を収
納するパネルのケースとの間に導電性クッション材を入
れたことを特徴とし、前記導電性クッション材は導電性
ゲルであることを特徴とする。ΔF=fo (ρ-(1/ρ)) (QOQL>/4QOQL where f.: Oscillation frequency Qo: No-load Q of the oscillator QL; Load Q of the oscillator ρ: Reflection coefficient of the load and ρ=l (ZL 20 ) / (ZL 10 Z.) ZL ;Load impedance [Means for solving the problem] The oscillation circuit of the present invention includes a conductive cushion material between the oscillator case and the panel case that houses the oscillator. The conductive cushion material is a conductive gel.
次に、本発明について第1図を参照して説明する。 Next, the present invention will be explained with reference to FIG.
第1図は本発明の発振回路の一実施例を示す模式的断面
図である。FIG. 1 is a schematic cross-sectional view showing an embodiment of the oscillation circuit of the present invention.
本実施例の発振回路は、発振器ケース1と発振器を収納
するパネルケース2との間に導電性クッション材の導電
性ゲル3を入れている。このようにすると、導電性ゲル
3は発振器ケース1の機械的衝撃や振動のエネルギーを
吸収して減衰させると共に、発振器ケース1は導電性ゲ
ル3を介してパネルケース2と同電位の地気に接続され
るため、負荷変動の原因となる発振器ケース1とパネル
ケース2間の容量が無くなり、負荷変動が生じなくなり
、それによるマイクロッオニツクノイズも発生しなくな
る。In the oscillation circuit of this embodiment, a conductive gel 3, which is a conductive cushioning material, is inserted between an oscillator case 1 and a panel case 2 that houses the oscillator. In this way, the conductive gel 3 absorbs and attenuates the mechanical shock and vibration energy of the oscillator case 1, and the oscillator case 1 is connected to the earth at the same potential as the panel case 2 via the conductive gel 3. Since they are connected, the capacitance between the oscillator case 1 and the panel case 2, which causes load fluctuations, is eliminated, so that load fluctuations do not occur, and no microphonic noise is generated thereby.
なお、導電性クッション材は導電性スポンジや、導電性
塗料をコーティングしたり・ノション材であっても同様
の効果が得られる。Note that the same effect can be obtained even if the conductive cushion material is a conductive sponge, a conductive paint coated material, or a notion material.
以上説明したように本発明は、発振器ケースとパネルケ
ースとの間にクッション材、特に導電性ゲルを挿入する
ことにより、機械的衝撃や振動のエネルギーを吸収して
発振回路素子自身の変動によるマイクロッオニツクノイ
ズの発生を抑制すると共に、両ケース間の導電性を確保
してケース間の容量を取り除けるので、負荷変動による
マイクロッオニツクノイズの発生も防止できる効果があ
る。As explained above, the present invention inserts a cushioning material, particularly a conductive gel, between the oscillator case and the panel case to absorb the energy of mechanical shock and vibration, and to absorb the energy caused by fluctuations in the oscillation circuit element itself. In addition to suppressing the occurrence of microphonic noise, the capacitance between the cases can be removed by ensuring conductivity between the two cases, which has the effect of preventing the occurrence of microphonic noise due to load fluctuations.
器ケース面、7・・・パネルケース面、8・・・信号線
、9・・・地気線、10・・・負荷、11・・・容量。7... Panel case surface, 8... Signal line, 9... Earth wire, 10... Load, 11... Capacity.
Claims (2)
ースとの間に導電性クッション材を入れたことを特徴と
する発振回路。1. An oscillation circuit characterized in that a conductive cushion material is inserted between an oscillator case and a panel case that houses the oscillator.
特徴とする請求項1記載の発振回路。2. 2. The oscillation circuit according to claim 1, wherein the conductive cushion material is a conductive gel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5916390A JPH03261203A (en) | 1990-03-09 | 1990-03-09 | Oscillation circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5916390A JPH03261203A (en) | 1990-03-09 | 1990-03-09 | Oscillation circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03261203A true JPH03261203A (en) | 1991-11-21 |
Family
ID=13105436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5916390A Pending JPH03261203A (en) | 1990-03-09 | 1990-03-09 | Oscillation circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03261203A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITMI20092050A1 (en) * | 2009-11-23 | 2011-05-24 | Siae Microelettronica Spa | SHOCK ABSORBER DEVICE FOR INTEGRATED MICROWAVE OPERATING CIRCUITS AND RELATED DAMPING CIRCUIT |
-
1990
- 1990-03-09 JP JP5916390A patent/JPH03261203A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITMI20092050A1 (en) * | 2009-11-23 | 2011-05-24 | Siae Microelettronica Spa | SHOCK ABSORBER DEVICE FOR INTEGRATED MICROWAVE OPERATING CIRCUITS AND RELATED DAMPING CIRCUIT |
EP2339619A3 (en) * | 2009-11-23 | 2012-12-05 | SIAE Microelettronica S.p.A. | Microwave integrated circuit provided with damping device for microphonic noise suppression. |
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