JPH03258828A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPH03258828A JPH03258828A JP5736690A JP5736690A JPH03258828A JP H03258828 A JPH03258828 A JP H03258828A JP 5736690 A JP5736690 A JP 5736690A JP 5736690 A JP5736690 A JP 5736690A JP H03258828 A JPH03258828 A JP H03258828A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- prepreg
- curing
- bismaleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 47
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229920003192 poly(bis maleimide) Polymers 0.000 claims abstract description 23
- IIWFPIKUKKAYDT-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-3,4-diol Chemical compound C1CC2(O)C(O)=CC1C2 IIWFPIKUKKAYDT-UHFFFAOYSA-N 0.000 claims abstract description 19
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 claims abstract description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- 239000004643 cyanate ester Substances 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 5
- 239000007795 chemical reaction product Substances 0.000 abstract description 16
- -1 cyanic acid ester Chemical class 0.000 abstract description 15
- 239000000203 mixture Substances 0.000 abstract description 14
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 6
- 239000004917 carbon fiber Substances 0.000 abstract description 6
- 239000002131 composite material Substances 0.000 abstract description 5
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 abstract 3
- 238000013329 compounding Methods 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 31
- 150000004985 diamines Chemical class 0.000 description 21
- 239000000835 fiber Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 13
- 229920000728 polyester Polymers 0.000 description 13
- 125000003118 aryl group Chemical group 0.000 description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 125000000962 organic group Chemical group 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 5
- 238000000862 absorption spectrum Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000012783 reinforcing fiber Substances 0.000 description 4
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 4
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical group C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 235000019241 carbon black Nutrition 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 210000004709 eyebrow Anatomy 0.000 description 3
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 3
- 239000012784 inorganic fiber Substances 0.000 description 3
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical group C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical group C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 150000001913 cyanates Chemical class 0.000 description 2
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzyl ether Chemical compound C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000011490 mineral wool Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical group C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- ULZRKSDAMUWQEZ-UHFFFAOYSA-N 1-anilinoethanol Chemical compound CC(O)NC1=CC=CC=C1 ULZRKSDAMUWQEZ-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- GEEGPFGTMRWCID-UHFFFAOYSA-N 1-n,1-n,1-n',1-n'-tetramethylbutane-1,1-diamine Chemical compound CCCC(N(C)C)N(C)C GEEGPFGTMRWCID-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- CBECDWUDYQOTSW-UHFFFAOYSA-N 2-ethylbut-3-enal Chemical compound CCC(C=C)C=O CBECDWUDYQOTSW-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MILSYCKGLDDVLM-UHFFFAOYSA-N 2-phenylpropan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 MILSYCKGLDDVLM-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- XECVXFWNYNXCBN-UHFFFAOYSA-N 4-[(4-aminophenyl)-phenylmethyl]aniline Chemical compound C1=CC(N)=CC=C1C(C=1C=CC(N)=CC=1)C1=CC=CC=C1 XECVXFWNYNXCBN-UHFFFAOYSA-N 0.000 description 1
- ZSQIQUAKDNTQOI-UHFFFAOYSA-N 4-[1-(4-aminophenyl)cyclohexyl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)CCCCC1 ZSQIQUAKDNTQOI-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical class C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 description 1
- ZTKDMNHEQMILPE-UHFFFAOYSA-N 4-methoxy-n,n-dimethylaniline Chemical compound COC1=CC=C(N(C)C)C=C1 ZTKDMNHEQMILPE-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004859 Copal Substances 0.000 description 1
- JJHHIJFTHRNPIK-UHFFFAOYSA-N Diphenyl sulfoxide Chemical compound C=1C=CC=CC=1S(=O)C1=CC=CC=C1 JJHHIJFTHRNPIK-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 241000782205 Guibourtia conjugata Species 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001800 Shellac Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- BDYVWDMHYNGVGE-UHFFFAOYSA-N [2-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCCC1CN BDYVWDMHYNGVGE-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- AUNAPVYQLLNFOI-UHFFFAOYSA-L [Pb++].[Pb++].[Pb++].[O-]S([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Mo]([O-])(=O)=O Chemical compound [Pb++].[Pb++].[Pb++].[O-]S([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Mo]([O-])(=O)=O AUNAPVYQLLNFOI-UHFFFAOYSA-L 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011157 advanced composite material Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- CJOBVZJTOIVNNF-UHFFFAOYSA-N cadmium sulfide Chemical compound [Cd]=S CJOBVZJTOIVNNF-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- QNZRVYCYEMYQMD-UHFFFAOYSA-N copper;pentane-2,4-dione Chemical compound [Cu].CC(=O)CC(C)=O QNZRVYCYEMYQMD-UHFFFAOYSA-N 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- XJOBOFWTZOKMOH-UHFFFAOYSA-N decanoyl decaneperoxoate Chemical compound CCCCCCCCCC(=O)OOC(=O)CCCCCCCCC XJOBOFWTZOKMOH-UHFFFAOYSA-N 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- DGVMNQYBHPSIJS-UHFFFAOYSA-N dimagnesium;2,2,6,6-tetraoxido-1,3,5,7-tetraoxa-2,4,6-trisilaspiro[3.3]heptane;hydrate Chemical compound O.[Mg+2].[Mg+2].O1[Si]([O-])([O-])O[Si]21O[Si]([O-])([O-])O2 DGVMNQYBHPSIJS-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Chemical group C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- DLAPQHBZCAAVPQ-UHFFFAOYSA-N iron;pentane-2,4-dione Chemical compound [Fe].CC(=O)CC(C)=O DLAPQHBZCAAVPQ-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JDEJGVSZUIJWBM-UHFFFAOYSA-N n,n,2-trimethylaniline Chemical compound CN(C)C1=CC=CC=C1C JDEJGVSZUIJWBM-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- JTHNLKXLWOXOQK-UHFFFAOYSA-N n-propyl vinyl ketone Natural products CCCC(=O)C=C JTHNLKXLWOXOQK-UHFFFAOYSA-N 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 1
- 239000008601 oleoresin Substances 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- GGFBICGBDXVAGX-UHFFFAOYSA-N propylaluminum Chemical compound [Al].[CH2]CC GGFBICGBDXVAGX-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 150000003503 terephthalic acid derivatives Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
- 238000005829 trimerization reaction Methods 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、構造材料に用いることのできるプレプレグの
含浸用樹脂組成物として好適な熱硬化性樹脂組成物に関
する。 更に詳しくは、プリプレグの含浸用樹脂組成物
として用いると、適度の粘着性を有し、高強度、高靭性
で耐水性に優れる複合材料を提供する熱硬化性樹脂組成
物に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a thermosetting resin composition suitable as a resin composition for impregnating prepreg that can be used as a structural material. More specifically, the present invention relates to a thermosetting resin composition that, when used as a resin composition for impregnating prepreg, provides a composite material that has appropriate tackiness, high strength, high toughness, and excellent water resistance.
〈従来の技術〉
近年、先端複合材料として、補強繊維にマトリックス樹
脂組成物を含浸させてなる不均一材料、いわゆるプリプ
レグが、各種の構造物に用いられるようになってきた。<Prior Art> In recent years, a so-called prepreg, which is a heterogeneous material made by impregnating reinforcing fibers with a matrix resin composition, has come to be used in various structures as an advanced composite material.
このプリプレグは、前記の如く不均一材料であるため、
その構成成分のひとつである繊維の長軸方向とそれ以外
の方向とでは、強度、耐衝撃性等の物性に大ぎな差があ
る。Since this prepreg is a non-uniform material as mentioned above,
There is a large difference in physical properties such as strength and impact resistance between the long axis direction of the fiber, which is one of its constituent components, and the other directions.
この方向による物性の差をより小さくするために、フィ
ルムを層間に挟む方法、チョツプドファイバーを層間に
配する方法等の各種技術が提案されている。In order to further reduce the difference in physical properties depending on the direction, various techniques have been proposed, such as a method in which a film is sandwiched between layers, a method in which chopped fibers are placed between layers.
フィルムを眉間に挟む方法としては、各種の熱硬化性の
フィルムを挟む方法(米国特許第3.472.731i
号明細書、同4,539,253号明細書等)や各種の
熱可塑性のフィルムを挟む方法(米国特許第4,604
,319号明細書等)がある。 しかしながら、熱硬
化性のフィルムを挟む方法では、耐衝撃性と耐熱性との
両方を満足させるものを得ることができず、一方、熱可
塑性のフィルムを挟む方法では、タックがない、ドレイ
バビリティが無い等の熱可塑性フィルムの特性が強く出
てしまうため、プリプレグとしては使いづらいものとな
ってしまうという問題点があった。As a method of sandwiching a film between the eyebrows, there is a method of sandwiching various thermosetting films (U.S. Patent No. 3.472.731i).
US Pat. No. 4,539,253) and methods of sandwiching various thermoplastic films (US Pat. No. 4,604)
, No. 319 specification, etc.). However, with the method of sandwiching a thermosetting film, it is not possible to obtain a product that satisfies both impact resistance and heat resistance, while on the other hand, with the method of sandwiching a thermoplastic film, there is no tack and the dryability is not achieved. There was a problem in that it was difficult to use as a prepreg because the characteristics of the thermoplastic film, such as the absence of porosity, were strongly exhibited.
また、チョツプドファイバーを眉間に配する方法として
は、短繊維チョップ、チョツプドストランド、ミルドフ
ァイバー等を用いる方法等が提案されている(特開昭5
4−3879号公報、同56−115216号公報、同
6044334号公報等)が、チョツプドファイバーを
用いた場合、眉間が厚くなってしまうという問題点があ
フた。In addition, as a method for placing chopped fibers between the eyebrows, methods using chopped short fibers, chopped strands, milled fibers, etc. have been proposed (Japanese Patent Application Laid-Open No.
No. 4-3879, No. 56-115216, No. 6044334, etc.), when chopped fibers were used, the problem of thickening between the eyebrows was solved.
一゛方、このようなプリプレグの含浸用樹脂組成物とし
ては、主としてエポキシ樹脂組成物が用いられており、
特に耐熱性の高いものを目的とする際には、エポキシ樹
脂としてテトラグリシジルジアミノジフェニルメタン(
TGDDM)を、硬化剤としてジアミノジフェニルスル
ホン(DDS)加えたエポキシ樹脂組成物が多く用いら
れてきた。 このTGDDM/DDS系のエポキシ樹脂
組成物は、優れた初期耐熱性を有し、補強繊維である炭
素繊維等との接着性も良好ではあるが、吸湿により耐熱
性が著しく劣化する、衝撃後の圧縮強度が低い、等の欠
点があフた。On the other hand, epoxy resin compositions are mainly used as resin compositions for impregnating such prepregs.
In particular, when aiming for a product with high heat resistance, tetraglycidyldiaminodiphenylmethane (
Epoxy resin compositions containing diaminodiphenylsulfone (DDS) and diaminodiphenylsulfone (DDS) as a curing agent have been widely used. Although this TGDDM/DDS-based epoxy resin composition has excellent initial heat resistance and good adhesion to reinforcing fibers such as carbon fiber, its heat resistance deteriorates significantly due to moisture absorption and after impact. Shortcomings such as low compressive strength were eliminated.
このように、プリプレグの含浸用樹脂組成物としてエポ
キシ樹脂組成物を用いた場合は、航空機用−次構造材等
の高い耐熱性、耐i撃性が要求される用途には十分対応
できなかフた。In this way, when an epoxy resin composition is used as a resin composition for impregnating prepreg, it cannot be used sufficiently for applications that require high heat resistance and i-impact resistance, such as secondary structural materials for aircraft. Ta.
また、プリプレグの含浸用樹脂組成物として、シアン酸
エステル成分とビスマレイミド成分から構成される樹脂
を主成分とする熱硬化性樹脂組成物も提案されている(
特公昭52−31279号公報、同54−30440号
公報参照)。 このものは、硬化後に優れた耐熱性を示
すものの、耐衝撃性が十分ではなく、やはり航空機用−
次構造材等の高い耐熱性、耐衝撃性が要求される用途に
は十分対応できなかった。In addition, a thermosetting resin composition whose main component is a resin composed of a cyanate ester component and a bismaleimide component has also been proposed as a resin composition for impregnating prepreg (
(See Japanese Patent Publication No. 52-31279 and Japanese Patent Publication No. 54-30440). Although this material exhibits excellent heat resistance after curing, it does not have sufficient impact resistance and is still suitable for aircraft use.
It was not able to adequately respond to applications that require high heat resistance and impact resistance, such as secondary structural materials.
さらに、プリプレグの含浸用樹脂組成物として、前記シ
アン酸エステル成分とビスマレイミド成分から構成され
る樹脂を主成分とする熱硬化性樹脂組成物に、長鎖のビ
スフェノールA型エポキシ樹脂を配合したものも知られ
ている。 しかし、この樹脂組成物は、長鎖のビスフェ
ノールA型エポキシ樹脂の混合が困難であり、均一な樹
脂組成物を得るには、長時間に亘る加熱が必要であるた
め、該樹脂組成物を補強繊維に含浸させてなるプリプレ
グは、十分な粘着性を示さない。Furthermore, as a resin composition for impregnating prepreg, a long-chain bisphenol A type epoxy resin is blended with a thermosetting resin composition whose main component is a resin composed of the cyanate ester component and bismaleimide component. is also known. However, this resin composition is difficult to mix with long-chain bisphenol A type epoxy resin, and heating for a long time is required to obtain a uniform resin composition. Prepregs made by impregnating fibers do not exhibit sufficient adhesion.
〈発明が解決しようとする課題〉
上述の如く、プリプレグの硬化後の諸性質、すなわち、
耐熱性、耐衝撃性、高強度等を同時に満足させるプリプ
レグは知られていない。<Problem to be solved by the invention> As mentioned above, various properties of prepreg after curing, namely,
There is no known prepreg that satisfies heat resistance, impact resistance, high strength, etc. at the same time.
本発明は、プリプレグの硬化後の諸性質の向上を、プリ
プレグの含浸用樹脂組成物の観点から図ろうとするもの
であって、特に、高伸度、中伸性炭素繊維を補強繊維と
するプリプレグの含浸用樹脂組成物として好適であり、
それ自体は適度の粘着性を有し、硬化後には耐熱性、耐
水性、耐衝撃性に優れる複合材料を提供する熱硬化性樹
脂組成物の提供を目的とする。The present invention aims to improve various properties of prepreg after curing from the viewpoint of a resin composition for impregnating prepreg, and in particular, it aims to improve various properties of prepreg after curing from the viewpoint of a resin composition for impregnating prepreg. It is suitable as a resin composition for impregnation of
The object of the present invention is to provide a thermosetting resin composition that has appropriate adhesiveness itself and provides a composite material that has excellent heat resistance, water resistance, and impact resistance after curing.
く課題を解決するための手段〉
本発明は、シアン酸エステル成分とビスマレイミド成分
とから構成される樹脂(A)、エポキシ樹脂(B)、お
よび、下記式!で示されるノルボルネンジオールとテレ
フタル酸クロリドとから合成され、両末端に水酸基を有
し、数平均分子量が200〜20000の反応生成物(
C)とを含有し、(A)+ (B)+ (C)を100
重量%としたとき、(A)の含有量は50〜94重量%
、(B)の含有量は4〜48重量%、(C)の含有量は
2〜30重量%であることを特徴とする熱硬化性樹脂組
成物を提供するものである。Means for Solving the Problems> The present invention provides a resin (A) composed of a cyanate ester component and a bismaleimide component, an epoxy resin (B), and the following formula! A reaction product synthesized from norbornene diol and terephthalic acid chloride shown in
C), containing (A) + (B) + (C) at 100
When expressed as weight%, the content of (A) is 50 to 94% by weight
, the content of (B) is 4 to 48% by weight, and the content of (C) is 2 to 30% by weight.
以下に、本発明の詳細な説明する。The present invention will be explained in detail below.
はじめに、シアン酸エステル成分とビスマレイミド成分
とから構成される樹脂(A)について説明する。First, the resin (A) composed of a cyanate ester component and a bismaleimide component will be explained.
樹脂(A)を構成するシアン酸エステル成分としては、
多官能性シアン酸エステル、シアン酸エステルプレポリ
マー および該シアン酸エステルとジアミンとから構成
されるプレポリマーがあげられる。As the cyanate ester component constituting the resin (A),
Examples include polyfunctional cyanate esters, cyanate ester prepolymers, and prepolymers composed of the cyanate esters and diamines.
多官能性シアン酸エステル成分としては、2個以上のシ
アン酸エステル基を有する任意の有機化合物、特に芳香
族化合物があげられ、なかでも、下記−絞入[II ]
式[II ]
R’%0−CxN)n
(上記式[II ]中、nは2以上、通常は5以下の数
であり、R1は芳香族性の有機基であって、上記シアン
酸エステル基は、この有機基R1の芳香環に結合してい
る。)
で示される化合物が好ましい。Examples of the polyfunctional cyanate ester component include any organic compound having two or more cyanate ester groups, especially aromatic compounds, and among them, the following - narrowing [II] formula [II] R'% 0-CxN)n (In the above formula [II], n is a number of 2 or more and usually 5 or less, R1 is an aromatic organic group, and the cyanate ester group is the organic group R1 is bonded to the aromatic ring of ) are preferred.
ここで、有機基R1は、ベンゼン、ナフタリン、アント
ラセン、ピレンのような炭素数1〜16の芳香族炭化水
素より誘導される基;複数個の芳香環が直接、あるいは
橋絡原子または橋絡基を介して結合した有機基、具体的
には、ビフェニル、ジフェニルメタン、2.2−ジフェ
ニルプロパン、ジフェニルエーテル、ジベンジルエーテ
ル、ジフェニルチオエーテル、ジフェニルケトン、ジフ
ェニルアミン、ジフェニルスルホキシド、ジフェニルス
ルホン、トリフェニルホスファイト、トリフェニルフォ
スフェート等から誘導される基;
ノボラック型フェノール樹脂から誘導される基;
等が好適に例示される。Here, the organic group R1 is a group derived from an aromatic hydrocarbon having 1 to 16 carbon atoms such as benzene, naphthalene, anthracene, and pyrene; Organic groups bonded through biphenyl, diphenylmethane, 2,2-diphenylpropane, diphenyl ether, dibenzyl ether, diphenylthioether, diphenyl ketone, diphenylamine, diphenyl sulfoxide, diphenyl sulfone, triphenyl phosphite, tri- Preferred examples include a group derived from phenyl phosphate and the like; a group derived from a novolac type phenol resin; and the like.
なお、これらの芳香族性の有機基は、その芳香環が反応
に無関係な置換基で置換されていてもよい。Note that the aromatic ring of these aromatic organic groups may be substituted with a substituent unrelated to the reaction.
このような多官能性シアン酸エステル成分は、一般に、
対応する多価フェノールをハロゲン化シアンと反応させ
るそれ自体公知の方法で得ることができるが、特に、ビ
スフェノールA[2,2−ビス(4−ヒドロキシフェニ
ル)プロパン]のような対称性でかつ縮合環を含まない
2価フェノール類とハロゲン化シアンとの反応;
フェノールとホルムアルデヒドとの初期縮合物とハロゲ
ン化シアンとの反応;
等にて得られるシアン酸エステル成分が好ましい。Such polyfunctional cyanate ester components generally include:
The corresponding polyhydric phenols can be obtained in a manner known per se by reacting with cyanogen halides, in particular symmetric and condensed phenols such as bisphenol A [2,2-bis(4-hydroxyphenyl)propane]. Preferred are cyanate ester components obtained by reaction of ring-free dihydric phenols and cyanogen halide; reaction of an initial condensate of phenol and formaldehyde with cyanogen halide; and the like.
シアン酸エステルプレポリマーは、上述した多官能性シ
アン酸エステルを、鉱酸、ルイス酸、炭酸ナトリウムあ
るいは塩化リチウム等の塩類、トリブチルホスフィン等
のリン酸エステル類等の触媒の存在下に重合させて得ら
れる。 これらのプレポリマーは、一般に、前記シアン
酸エステル中のシアノ基が三量化することによフて形成
されるトリアジン環を分子中に有している。 本発明に
おいては、平均分子量400〜6000のプレポリマー
を用いるのが好ましい。Cyanate ester prepolymer is produced by polymerizing the above-mentioned polyfunctional cyanate ester in the presence of a catalyst such as a mineral acid, a Lewis acid, a salt such as sodium carbonate or lithium chloride, or a phosphate ester such as tributylphosphine. can get. These prepolymers generally have a triazine ring in the molecule, which is formed by trimerization of the cyano group in the cyanate ester. In the present invention, it is preferable to use a prepolymer having an average molecular weight of 400 to 6,000.
また、多官能性シアン酸エステルとジアミンとから構成
されるプレポリマーは、多官能性シアン酸エステルと、
下記−絞入[III ]式[m ]
H,N−R2−NH。In addition, a prepolymer composed of a polyfunctional cyanate ester and a diamine is a polyfunctional cyanate ester and a diamine.
Following - Refinement [III] Formula [m] H, N-R2-NH.
(上記式[III ]中、R2は2価の芳香族性または
脂環族性有機基である)
で示されるジアミン類を反応させて得られる。 すなわ
ち、シアン酸エステルとジアミンとを、特に好ましくは
、シアン酸エステル当り0.1〜1当量のアミンをケト
ン等の有機溶媒中で、0〜100℃の温度で、1分間〜
1時間のような比較的短い時間反応させる。(In the above formula [III], R2 is a divalent aromatic or alicyclic organic group.) It is obtained by reacting diamines represented by the following formula. That is, a cyanate ester and a diamine, particularly preferably 0.1 to 1 equivalent of amine per cyanate ester, are mixed in an organic solvent such as a ketone at a temperature of 0 to 100°C for 1 minute to 1 minute.
Allow the reaction to occur for a relatively short period of time, such as one hour.
なお、ジアミン類としては、メタフェニレンジアミン、
メタまたはパラ−キシリレンジアミン、1,4−シクロ
ヘキサンジアミン、ヘキサヒドロキシリレンジアミン、
ビス(4−アミノフェニル)メタン、ビス(4−アミノ
フェニル)スルホン、ビス(4−アミノ−3−メチルフ
ェニル)メタン(MDT)、ビス(4−アミノ−3,5
−ジメチルフェニル)メタン(MDX)、ビス(4−ア
ミノフェニル)シクロヘキサン、ビス(4−アミノフェ
ニル)エーテル、2.2−ビス(4′−アミノフェニル
)プロパン、ビス(4−アミノ−3−メチルフェニル)
メタン、ビス(4−アミノフェニル)フェニルメタン等
があげられ、芳香族ジアミンであることが硬化後の耐熱
性等の点で好ましいが、硬化後の可撓性や柔軟性の観点
から、脂環族ジアミンを単独で、あるいは組合わせて使
用してもよい。 また、ジアミン類は、反応性の観点か
ら、第1級アミンであることが好ましいが、第2級アミ
ンであってもよい。In addition, as diamines, metaphenylenediamine,
meta- or para-xylylenediamine, 1,4-cyclohexanediamine, hexahydroxylylenediamine,
Bis(4-aminophenyl)methane, bis(4-aminophenyl)sulfone, bis(4-amino-3-methylphenyl)methane (MDT), bis(4-amino-3,5
-dimethylphenyl)methane (MDX), bis(4-aminophenyl)cyclohexane, bis(4-aminophenyl)ether, 2,2-bis(4'-aminophenyl)propane, bis(4-amino-3-methyl) phenyl)
Examples include methane, bis(4-aminophenyl)phenylmethane, etc., and aromatic diamines are preferable from the viewpoint of heat resistance after curing, but alicyclic diamines are preferable from the viewpoint of flexibility and pliability after curing. Group diamines may be used alone or in combination. Further, from the viewpoint of reactivity, the diamines are preferably primary amines, but may be secondary amines.
本発明で用いる樹脂(A)の構成成分である上記のシア
ン酸エステル成分は、単独で用いても、あるいは2f!
以上を併用してもよい。The above-mentioned cyanate ester component, which is a component of the resin (A) used in the present invention, may be used alone or 2f!
The above may be used in combination.
樹脂(A)を構成するビスマレイミド成分としては、無
水マレイン酸とジアミンとから誘導されるマレイミド基
を2個有する任意の有機化金物、ビスマレイミドプレポ
リマーおよび該ビスマレイミドとジアミンとから構成さ
れるプレポリマーがあげられる。The bismaleimide component constituting the resin (A) is composed of any organic metal compound having two maleimide groups derived from maleic anhydride and diamine, a bismaleimide prepolymer, and the bismaleimide and diamine. Examples include prepolymers.
本発明において、ビスマレイミド成分としては、無水マ
レイン酸とジアミンとから誘導されるマレイミド基を2
個有する任意の有機化合物は、いずれも適用可能である
が、特に、下記絞入[IV ]
式 [IVコ
(上記式[TVl中、R3は2価の芳香族性または脂環
族性有機基である)
で表わされる化合物が好ましい。In the present invention, the bismaleimide component contains 2 maleimide groups derived from maleic anhydride and diamine.
Any organic compound having the same characteristics can be applied, but in particular, the following narrowing [IV] formula [IVco(in the above formula [TVl], R3 is a divalent aromatic or alicyclic organic group The compound represented by these is preferable.
ここで、有機基R3は、フェニレン基、ナフチレン基、
キシリレン基、シクロヘキシレン基、ヘキサヒドロキシ
リレン基等、炭素数6〜16の芳香族あるいは脂環族炭
化水素;複数個の芳香環が直接、あるいは橋絡原子また
は橋絡基を介して結合した有機基:
等が好適に例示される。Here, the organic group R3 is a phenylene group, a naphthylene group,
Aromatic or alicyclic hydrocarbons having 6 to 16 carbon atoms, such as xylylene groups, cyclohexylene groups, and hexahydroxylylene groups; organics in which multiple aromatic rings are bonded directly or through bridging atoms or bridging groups. Groups: and the like are preferably exemplified.
なお、これらの芳香族性の有機基は、その芳香環が反応
に無関係な置換基で置換されていてもよい。Note that the aromatic ring of these aromatic organic groups may be substituted with a substituent unrelated to the reaction.
このようなビスマレイミドは、無水マレイン酸とジアミ
ン類とを反応させてビスマレアミド酸を調製し、次いで
、このビスマレアミド酸を脱水環化させるそれ自体公知
の方法で得ることがで各る。 なお、用いるジアミン類
の具体例は、多官能性シアン酸エステルとジアミンとの
プレポリマーの項で示した通りである。Such bismaleimide can be obtained by a method known per se, in which bismaleamic acid is prepared by reacting maleic anhydride with diamines, and then this bismaleamic acid is cyclodehydrated. Note that specific examples of the diamines used are as shown in the section of the prepolymer of polyfunctional cyanate ester and diamine.
ビスマレイミドプレポリマーは、上述した無水マレイン
酸とジアミンとから8導されるマレイミド基を2個有す
る任意の有機化合物から、公知の方法によって誘導され
る。The bismaleimide prepolymer is derived from any organic compound having two maleimide groups derived from the above-mentioned maleic anhydride and diamine by a known method.
また、ビスマレイミドとジアミンとから構成されるプレ
ポリマーは、ビスマレイミドを、多官能性シアン酸エス
テルとジアミンとのプレボリマーの項で示したジアミン
類と、下記のように反応させることによって得られる。Further, a prepolymer composed of bismaleimide and diamine can be obtained by reacting bismaleimide with the diamines shown in the section of the prebolymer of polyfunctional cyanate ester and diamine in the following manner.
すなわち、例えばケトン等の適当な溶媒中において、ビ
スマレイミドとジアミン類とを、特に好ましくは、ビス
マレイミド1モル当り1/2〜1モルの量のジアミンを
、例えば40〜250℃程度の温度で、5分間〜5時間
反応させればよい。That is, bismaleimide and diamines, particularly preferably diamine in an amount of 1/2 to 1 mole per mole of bismaleimide, are mixed in a suitable solvent such as a ketone at a temperature of, for example, about 40 to 250°C. , the reaction may be carried out for 5 minutes to 5 hours.
本発明で用いる樹脂(A)の構成成分である上記のビス
マレイミド成分は、単独で用いても、あるいは2f!以
上を併用してもよい。The above-mentioned bismaleimide component, which is a constituent component of the resin (A) used in the present invention, may be used alone or 2f! The above may be used in combination.
樹脂(A)は、前記シアン酸エステル成分と前記ビスマ
レイミド成分とを、1:99〜99:1.好ましくは5
:95〜95:5の重量比で用いて予備反応を行わしめ
たものである。The resin (A) contains the cyanate ester component and the bismaleimide component in a ratio of 1:99 to 99:1. Preferably 5
:95 to 95:5 weight ratio was used to carry out the preliminary reaction.
この量比は、樹脂(A)に求める性質によりて適宜選択
し、例えば、誘電特性等の電気特性や接着性、密着性等
の諸性質を求める場合には、シアン酸エステル成分を多
くし、耐熱性を求める場合には、ビスマレイミド成分を
多くする。This quantitative ratio is appropriately selected depending on the properties desired for the resin (A). For example, when various properties such as electrical properties such as dielectric properties, adhesiveness, and adhesion are desired, the cyanate ester component is increased, If heat resistance is desired, increase the bismaleimide component.
なお、樹脂(A)に相当するものとして、BT樹脂(三
菱瓦斯化学■製)等の各種の市販品があり、これらを使
用してもよい。In addition, there are various commercial products such as BT resin (manufactured by Mitsubishi Gas Chemical Co., Ltd.) that correspond to the resin (A), and these may be used.
また、このようなシアン酸エステル成分とビスマレイミ
ド成分とから構成される樹脂は、特公昭52−3132
79号、同54−30440号の各公報に詳述されてい
る。In addition, a resin composed of such a cyanate ester component and a bismaleimide component is disclosed in Japanese Patent Publication No. 52-3132.
79 and No. 54-30440.
次に、エポキシ樹脂(B)について説明する。Next, the epoxy resin (B) will be explained.
本発明の熱硬化性樹脂組成物には、先に説明したシアン
酸エステル成分とビスマレイミド成分とから構成される
樹脂(A)が含有されているが、該樹脂(A)は、粘着
性が小さいので、本発明の熱硬化性樹脂組成物をプリプ
レグの含浸用樹脂組成物として用いるに際し、プリプレ
グの積層成形上、治具形状にフィツトしにくい場合があ
る。The thermosetting resin composition of the present invention contains the resin (A) composed of the cyanate ester component and bismaleimide component described above, but the resin (A) has no adhesive properties. Since it is small, when the thermosetting resin composition of the present invention is used as a resin composition for impregnating prepreg, it may be difficult to fit it into the shape of a jig for lamination molding of prepreg.
エポキシ樹脂(B)は、前記樹脂(A)中の成分と反応
し、その粘着性を大きくし、また、硬化時間を短縮する
作用を示す。 それ故、本発明の熱硬化性樹脂組成物に
は、エポキシ樹脂(B)も含有させる。The epoxy resin (B) reacts with the components in the resin (A), increases its tackiness, and exhibits the effect of shortening the curing time. Therefore, the thermosetting resin composition of the present invention also contains an epoxy resin (B).
エポキシ樹脂(B)には、ビスフェノールA型エポキシ
樹脂、ビスフェノールF型エポキシ樹脂、ノボラック型
エポキシ樹脂、臭素化エポキシ樹脂等の汎用されている
グリシジルエーテル系エポキシ樹脂のほか、環式脂肪族
エポキシ樹脂、グリシジルエステル系エポキシ樹脂、グ
リシジルアミン系エポキシ樹脂、複素環式エポキシ樹脂
等の特殊なエポキシ樹脂がある。The epoxy resin (B) includes widely used glycidyl ether epoxy resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, novolak epoxy resin, and brominated epoxy resin, as well as cycloaliphatic epoxy resins, There are special epoxy resins such as glycidyl ester epoxy resins, glycidyl amine epoxy resins, and heterocyclic epoxy resins.
また、エポキシ樹脂には、常温で液状を呈するもの、半
固体のもの、固体のものがある。Furthermore, epoxy resins include those that are liquid at room temperature, those that are semi-solid, and those that are solid.
本発明で用いるエポキシ樹脂(B)は、特に限定されず
、エポキシ樹脂であればよいが、好ましくは数平均分子
量500以下、エポキシ当量300以下のエポキシ樹脂
を用いる。 このようなエポキシ樹脂の一例として、以
下に示すビスフェノール型エポキシ樹脂が例示できる。The epoxy resin (B) used in the present invention is not particularly limited and may be any epoxy resin, but preferably an epoxy resin having a number average molecular weight of 500 or less and an epoxy equivalent of 300 or less is used. As an example of such an epoxy resin, the following bisphenol type epoxy resin can be exemplified.
油化シェルエポキシ社: Epikote 801,8
02.807.808.815,819,827.82
8,834.871゜
ダウケミカル社: D、E、R,3]7.330.33
1.332.333.337.383.824.825
.361.365゜チバガイギー社:^raJdHe
GY 250.250.2BO住友化学工業社: EL
A目5.117.121.127.128、34
また、硬化後の耐熱性を高めるためには、ノボラック型
エポキシ樹脂や含窒素系エポキシ樹脂を用いるとよい。Yuka Shell Epoxy Company: Epikote 801,8
02.807.808.815,819,827.82
8,834.871゜Dow Chemical Company: D, E, R, 3] 7.330.33
1.332.333.337.383.824.825
.. 361.365゜Ciba Geigy: ^raJdHe
GY 250.250.2BO Sumitomo Chemical: EL
Item A 5.117.121.127.128, 34 Furthermore, in order to improve the heat resistance after curing, it is preferable to use a novolac type epoxy resin or a nitrogen-containing epoxy resin.
ノボラック型エポキシ樹脂としては、
Epikote 152.154(油化シェルエポキ
シ社)、ESCN 220シリーズ(住友化学工業社
)等が、また、含窒素系エポキシ樹脂としては、MY
?20、フ21(チバガイギー社)、ELM 43
4.12o(住友化学工業社)等が例示される。Novolac type epoxy resins include Epikote 152.154 (Yuka Shell Epoxy Co., Ltd.), ESCN 220 series (Sumitomo Chemical Industries, Ltd.), and nitrogen-containing epoxy resins include MY.
? 20, Fu21 (Ciba Geigy), ELM 43
4.12o (Sumitomo Chemical Industries, Ltd.) etc. are exemplified.
続いて、ノルボルネンジオールとテレフタル酸クロリド
とから合成される反応生成物(C)について説明する。Next, the reaction product (C) synthesized from norbornenediol and terephthalic acid chloride will be explained.
ノルボルネンジオールとテレフタル酸クロリドとから合
成され、両末端に水酸基を有し、数平均分子量が200
〜20000 の反応生成物(C)とは、ポリエステ
ルの一種である。 なお、ノルボルネンジオールとは、
下記式Iで示される化合物である。It is synthesized from norbornene diol and terephthalic acid chloride, has hydroxyl groups at both ends, and has a number average molecular weight of 200.
The reaction product (C) of ~20,000 is a type of polyester. Furthermore, norbornenediol is
This is a compound represented by the following formula I.
ところで、プリプレグ用樹脂組成物に飽和型のポリエス
テル、例えばバイロン300(東洋紡■製)を配合する
と、硬化後に強靭性が上がるということは公知である。By the way, it is known that when a saturated polyester such as Vylon 300 (manufactured by Toyobo ■) is blended into a resin composition for prepreg, the toughness increases after curing.
しかし、飽和型のポリエステルを配合したのでは、硬
化後の耐水性が悪い。 そこで、本発明では、ポリエス
テルに芳香族基を導入することにより、耐水性の向上を
ねらった。 その、ため、ポリエステルの一方の合成原
料として、テレフタル酸クロリドを用いた。 また、テ
レフタル酸クロリドを用いることにより、反応生成物の
分子量を低く抑えることができると共に、硬化後の耐熱
性が高まる。 さらに、硬化後の可どう性、耐水性を考
慮して、ポリエステルの他方の合成原料として、ノルボ
ルネンジオールを用いた。However, when saturated polyester is blended, water resistance after curing is poor. Therefore, the present invention aims to improve water resistance by introducing an aromatic group into polyester. Therefore, terephthalic acid chloride was used as one of the synthetic raw materials for polyester. Furthermore, by using terephthalic acid chloride, the molecular weight of the reaction product can be kept low and the heat resistance after curing can be increased. Further, considering the flexibility and water resistance after curing, norbornene diol was used as the other synthetic raw material for polyester.
ノルボルネンジオールとテレフタル酸クロリドとから合
成される反応生成物(C)は、本発明で用いる他の樹脂
等と容易に混合できる。The reaction product (C) synthesized from norbornene diol and terephthalic acid chloride can be easily mixed with other resins used in the present invention.
また、この反応生成物(C)を含有せしめることにより
、本発明の熱硬化性樹脂組成物が、適度のタックを有す
るようになる。Moreover, by containing this reaction product (C), the thermosetting resin composition of the present invention comes to have appropriate tack.
ところで、ノルボルネンジオールとテレフタル酸クロリ
ドからのポリエステルの合成は、適当な溶媒を用いるこ
とにより、室温或は高温で速やかに行なえる。 この反
応生成物の両末端に水酸基があることは、赤外吸収スペ
クトルで確記される。 なお、使用する溶媒は、ノルボ
ルネンジオールとテレフタル酸クロリドが溶解するもの
であればいずれでもよいが、例えばクロロホルムのよう
な含塩素系溶剤、N−メチルピロリドン、ジメチルホル
ムアミド、ジメチルスルホキシド等が好ましい。By the way, the synthesis of polyester from norbornene diol and terephthalic acid chloride can be carried out rapidly at room temperature or high temperature by using an appropriate solvent. The presence of hydroxyl groups at both ends of this reaction product is confirmed by the infrared absorption spectrum. The solvent to be used may be any solvent as long as norbornene diol and terephthalic acid chloride can be dissolved therein, but preferred examples include chlorine-containing solvents such as chloroform, N-methylpyrrolidone, dimethylformamide, and dimethylsulfoxide.
本発明では、ノルボルネンジオールとテレフタル酸クロ
リドとから合成される反応生成物(C)は、その数平均
分子量が200〜20000のものを用いる。 20
0未満のものは、ノルボルネンジオールとテレフタル酸
クロリドとの反応生成物というよりも、各千ツマ−の混
合物ということになる。 モノマーの混合物では、ポリ
エステルとしての効果が発現されないので、数平均分子
量が200以上のものを用いる。 一方、20000を
超えるものは、樹脂組成物への溶解性が悪く、溶解後も
系の粘度が高く、また、プリプレグにしたときに適当な
タックが得られない。 そこで、数平均分子量が200
00以下のものを用いる。In the present invention, the reaction product (C) synthesized from norbornene diol and terephthalic acid chloride has a number average molecular weight of 200 to 20,000. 20
Anything less than 0 is a mixture of the two, rather than a reaction product of norbornene diol and terephthalic acid chloride. Since a mixture of monomers does not exhibit the effect of a polyester, a monomer having a number average molecular weight of 200 or more is used. On the other hand, if it exceeds 20,000, the solubility in the resin composition is poor, the viscosity of the system is high even after dissolution, and proper tack cannot be obtained when made into a prepreg. Therefore, the number average molecular weight is 200
Use a value of 00 or less.
本発明の熱硬化性樹脂組成物には、上記の成分が含有さ
れるが、その割合は以下の通りである。The thermosetting resin composition of the present invention contains the above components in the following proportions.
すなわち、シアン酸エステル成分とビスマレイミド成分
とから構成される樹脂(A)、エポキシ樹脂(B)およ
びノルボルネンジオールとテレフタル酸クロリドとから
合成される反応生成物(C)の合計を100重量%とし
たとき、(A)の含有量は50〜94重量%、(B)の
含有量は4〜48重量%、(C)の含有量は2〜30重
量%である。That is, the total of the resin (A) composed of a cyanate ester component and a bismaleimide component, the epoxy resin (B), and the reaction product (C) synthesized from norbornene diol and terephthalic acid chloride is 100% by weight. In this case, the content of (A) is 50 to 94% by weight, the content of (B) is 4 to 48% by weight, and the content of (C) is 2 to 30% by weight.
樹脂(A)が上記範囲未満の場合は、硬化後の耐熱性が
不十分となり、一方、上記範囲超の場合は、脆くなるた
めである。If the resin (A) is less than the above range, the heat resistance after curing will be insufficient, while if it exceeds the above range, it will become brittle.
エポキシ樹脂(B)が上記範囲未満であると、硬化が遅
くなり、上記範囲超であると、硬化後の耐熱性が不十分
となるためである。If the epoxy resin (B) is less than the above range, curing will be slow, and if it is more than the above range, the heat resistance after curing will be insufficient.
また、反応生成物(C)が上記範囲未満の場合は、その
添加効果、すなわち硬化後の強靭性および耐水性の向上
効果が得られず、一方、上記範囲超の場合は、硬化後の
性状が柔らかくなってしまい、複合材料のマトリックス
として好ましくない。In addition, if the reaction product (C) is less than the above range, the effect of its addition, that is, the effect of improving toughness and water resistance after curing, cannot be obtained, while if it exceeds the above range, the properties after curing will not be obtained. becomes soft, making it undesirable as a matrix for composite materials.
本発明の熱硬化性樹脂組成物には、上記必須成分に加え
、通常は硬化剤や硬化触媒を含有させる。 ただし、そ
のような場合、必須成分の含有割合は、必須成分の合計
を100重量%とする。In addition to the above-mentioned essential components, the thermosetting resin composition of the present invention usually contains a curing agent and a curing catalyst. However, in such a case, the content of the essential components is such that the total content of the essential components is 100% by weight.
硬化剤としては、先に、樹脂(A)についての説明の中
でシアン酸エステルとアミンとから得られるプレポリマ
ーの項で例示したジアミン類の他に、トリエチレンジア
ミン、イミダゾール類つまり、2−メチルイミダゾール
、2−ウンデシルイミダゾール、2−ヘプタデシルイミ
ダゾール、2−フェニルイミダゾール、2−エチル−4
−メチルイミダゾール、1−ベンジル−2−メチルイミ
ダゾール、1−プロとルー2−メチルイミダゾール、1
−シアノエチル−2−メチルイミダゾール、1−シアノ
エチル−2−エチル−4−メチルイミダゾール、1−シ
アノエチル−2−ウンデシルイミダゾール、1−シアノ
エチル−2−フェニルイミダゾール、1−グアナミンエ
チル−2−メチルイミダゾール及びこれらのイミダゾー
ル類のトリメリット酸付加体等が例示される。As curing agents, in addition to the diamines exemplified in the section of the prepolymer obtained from cyanate ester and amine in the explanation of resin (A), triethylenediamine, imidazole, 2-methyl Imidazole, 2-undecylimidazole, 2-heptadecyl imidazole, 2-phenylimidazole, 2-ethyl-4
-methylimidazole, 1-benzyl-2-methylimidazole, 1-pro-2-methylimidazole, 1
-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-guanamineethyl-2-methylimidazole and Examples include trimellitic acid adducts of these imidazoles.
硬化触媒としては、有機塩基、例えばN、 N−ジメチ
ルアニリン、N、N−ジメチルトルイジン、N、N−ジ
メチル−p−アニシジン、P−ハロゲノ−N、N−ジメ
チルアニリン、2−N−二チルアニリノエタノール、ト
リーローブチルアミン、ピリジン、キノリン、N−メチ
ルモルホリン、トリエタノールアミン、トリエチレンジ
アミン、N、N−ジメチルベンジルアミン、N、N、N
’ 、N’ −テトラメチルブタンジアミン等の第3級
アミン類:
イミダゾール、ベンツイミダゾール、2−メチルイミダ
ゾール、2−アンデシルイミダゾール、2−フェニルイ
ミダゾール、2−エチル−4−メチルイミダゾール等の
イミダゾール類;フェノール、クレゾール、キシレノー
ル、レゾルシン、フロログルシン等のフェノール類ニジ
クミルパーオキサイド、過酸化ベンゾイル、七−ブチル
ヒドロパーオキサイド、シクロヘキサノンパーオキサイ
ド、デカノイルパーオキサイE1ジイソプロピルパーオ
キシジカーボネート等の有機過酸化物:
有機金属塩、例えばオクチル酸亜鉛、オクチル酸スズ、
ナフテン酸鉛、ステアリン酸鉛、ナフテン酸亜鉛、オー
レイン酸スズ、ジブチルスズマレエート、ナフテン酸マ
ンガン、ナフテン酸コバルト、樹脂酸鉛、アセチルアセ
トン鉄、アセチルアセトン銅、ブチルチタネート、プロ
ピルアルミニウム等や、5nCA4、ZnCA2 A
flCls 、FeCJ12、FeCJZ3等の塩化
物;
鉄、亜鉛等の金属粉等が挙げられる。Curing catalysts include organic bases such as N,N-dimethylaniline, N,N-dimethyltoluidine, N,N-dimethyl-p-anisidine, P-halogeno-N,N-dimethylaniline, 2-N-dityl. Anilinoethanol, trilobylamine, pyridine, quinoline, N-methylmorpholine, triethanolamine, triethylenediamine, N,N-dimethylbenzylamine, N,N,N
',N'-Tetramethylbutanediamine and other tertiary amines: imidazole, benzimidazole, 2-methylimidazole, 2-andecylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole and other imidazoles ; Phenols such as phenol, cresol, xylenol, resorcinol, phloroglucin; Organic peroxides such as dicumyl peroxide, benzoyl peroxide, 7-butyl hydroperoxide, cyclohexanone peroxide, decanoyl peroxide E1 diisopropyl peroxydicarbonate; Materials: Organometallic salts such as zinc octylate, tin octylate,
Lead naphthenate, lead stearate, zinc naphthenate, tin oleate, dibutyltin maleate, manganese naphthenate, cobalt naphthenate, lead resinate, iron acetylacetone, copper acetylacetone, butyl titanate, propyl aluminum, etc., 5nCA4, ZnCA2 A
Examples include chlorides such as flCls, FeCJ12, and FeCJZ3; metal powders such as iron and zinc;
本発明の熱硬化性樹脂組成物には、さらに、諸性質を改
善する目的で、本発明の主旨を損なわない範囲で、以下
に示す成分を含有させてもよい。 ただし、そのような
場合、必須成分の含有割合は、必須成分の合計を100
重量%とする。The thermosetting resin composition of the present invention may further contain the following components for the purpose of improving various properties, within a range that does not impair the gist of the present invention. However, in such a case, the content ratio of essential components shall be determined by adding up the total amount of essential components to 100%.
Weight%.
諸性質を改善するための成分のひとつは、種々の天然、
半合成あるいは合成樹脂類である。One of the ingredients to improve various properties is various natural,
Semi-synthetic or synthetic resins.
このような樹脂としては、乾性油、不乾性油等のオレオ
レジン、ロジン、シェラツク、コーパル、油変性ロジン
、フェノール樹脂、アルキド樹脂、尿素樹脂、メラミン
樹脂、ポリエステル樹脂、ビニルブチラール樹脂、酢酸
ビニル樹脂、塩化ビニル樹脂、アクリル樹脂、シリコー
ン樹脂等を例示でき、1 fiあるいは2種以上を組合
せて用いる。Such resins include oleoresins such as drying oils and non-drying oils, rosins, shellac, copal, oil-modified rosins, phenolic resins, alkyd resins, urea resins, melamine resins, polyester resins, vinyl butyral resins, and vinyl acetate resins. , vinyl chloride resin, acrylic resin, silicone resin, etc., and 1 fi or a combination of two or more types can be used.
また、本発明の熱硬化性樹脂組成物には、さらに、繊維
質あるいは粉末の形の補強剤を含有させることができる
。Furthermore, the thermosetting resin composition of the present invention can further contain a reinforcing agent in the form of fiber or powder.
補強剤としては、各種カーボンブラック、微粉末シリカ
、焼成りレイ、塩基性ケイ酸マグネシウム、ケイソウ土
粉、アルミナ、炭酸カルシウム、炭酸マグネシウム、マ
グネシア、カオリン、セリサイト等の無機粉末や、セラ
ミック繊維、アスベスト、ロックウール、ガラス繊維、
スラグ・ウール、カーボンファイバー等の無機質繊維、
ポリイミド繊維等の各種合成繊維等が挙げられる。As reinforcing agents, inorganic powders such as various carbon blacks, finely powdered silica, fired clay, basic magnesium silicate, diatomaceous earth powder, alumina, calcium carbonate, magnesium carbonate, magnesia, kaolin, sericite, ceramic fibers, asbestos, rock wool, glass fiber,
Inorganic fibers such as slag wool, carbon fiber,
Examples include various synthetic fibers such as polyimide fibers.
さらに、該組成物を着色する目的で、二酸化チタン等の
白色顔料や、黄鉛、カーボンブラック、鉄黒、モリブデ
ン赤、コンジヨウ、グンジョウ、カドミウム黄、カドミ
ウム赤等の着色顔料あるいは各種有機染料を含有させる
ことができる。Furthermore, for the purpose of coloring the composition, it contains white pigments such as titanium dioxide, coloring pigments such as yellow lead, carbon black, iron black, molybdenum red, sulfur, cadmium yellow, cadmium red, etc., or various organic dyes. can be done.
この他、コロイド状シリカ、カーボンブラック等のたれ
止め剤、各種ゴム、ポリチオール、ポリカルボキシル化
合物、ウレタンプレポリマー等の可撓性付与剤、シリカ
、炭酸カルシウム、ウィスカー等の充填剤、三酸化アン
チモン等の難燃剤等、公知の各種添加剤を含有させても
よい。In addition, anti-sag agents such as colloidal silica and carbon black, various rubbers, polythiols, polycarboxyl compounds, flexibility agents such as urethane prepolymers, fillers such as silica, calcium carbonate, and whiskers, antimony trioxide, etc. Various known additives such as flame retardants may also be included.
本発明の熱硬化性樹脂組成物は、上記の通りであるが、
ここで、該組成物を用いたプリプレグの作製について述
べる。The thermosetting resin composition of the present invention is as described above,
Here, the production of prepreg using the composition will be described.
プリプレグは、補強繊維である有機あるいは無機繊維に
、熱硬化性樹脂組成物を含浸させることで得られる。Prepreg is obtained by impregnating organic or inorganic reinforcing fibers with a thermosetting resin composition.
有機あるいは無機繊維とは、プリプレグに一般的に使用
されている繊維を指す。 具体的には、ポリアミド繊維
、ポリエステル繊維、炭素繊維、ガラス繊維、炭化ケイ
素繊維、アルミナ繊維、ポリエチレン繊維、炭化ケイ素
−チタン繊維等がある。 本発明の熱硬化性樹脂組成物
は、特に、高伸度、中伸性炭素繊維と組合せるのが好適
である。Organic or inorganic fibers refer to fibers commonly used in prepregs. Specifically, there are polyamide fibers, polyester fibers, carbon fibers, glass fibers, silicon carbide fibers, alumina fibers, polyethylene fibers, silicon carbide-titanium fibers, and the like. It is particularly suitable for the thermosetting resin composition of the present invention to be combined with high elongation and medium elongation carbon fibers.
また、プリプレグの構成は、有機あるいは無機繊維を3
0〜70重量%とじ、残部を熱硬化性樹脂組成物とする
ことが好ましい。 この範囲外では、プリプレグとして
不適当となる場合がある。In addition, the composition of prepreg consists of 3 organic or inorganic fibers.
It is preferable to bind 0 to 70% by weight and make the remainder a thermosetting resin composition. Outside this range, it may become unsuitable as a prepreg.
プリプレグ中の熱硬化性樹脂組成物を硬化させるための
温度は、硬化剤や触媒の有無、組成成分の種類等によっ
ても変化するが、通常150〜300℃の範囲で選べば
よい。 加熱硬化に際しては、圧力を加えることが好ま
しく、圧力は0.1〜500kg/cm’の範囲で適宜
選べばよい。The temperature for curing the thermosetting resin composition in the prepreg varies depending on the presence or absence of a curing agent and catalyst, the types of composition components, etc., but is usually selected within the range of 150 to 300°C. During heat curing, it is preferable to apply pressure, and the pressure may be appropriately selected within the range of 0.1 to 500 kg/cm'.
〈実施例〉
以下に、実施例および比較例を示し、本発明を具体的に
説明する。<Example> The present invention will be specifically explained below by showing Examples and Comparative Examples.
はじめに、ノルボルネンジオールとテレフタル酸クロリ
ドとから合成される反応生成物(C)の合成について述
べる。First, the synthesis of the reaction product (C) synthesized from norbornene diol and terephthalic acid chloride will be described.
(合成例1)
ノルボルネンジオール60.0gとテレフタル酸クロリ
ド79.0gを、容量が2リツトルの3日フラスコに入
れ、そこにクロロホルム100100Oを加えて溶解さ
せた。 この混合物を70℃まで昇温しで反応させた
。 発生する塩化水素ガスは、水酸化ナトリム水溶液中
に導入して中和させた。 10時間後、反応混合溶液
をメタノール中に流し込み、生成したポリマーを沈殿、
乾燥させて回収した(収量94、 0g) 。(Synthesis Example 1) 60.0 g of norbornene diol and 79.0 g of terephthalic acid chloride were placed in a 3-day flask with a capacity of 2 liters, and 100,100 O of chloroform was added thereto and dissolved. This mixture was heated to 70°C and reacted. The generated hydrogen chloride gas was neutralized by introducing it into an aqueous sodium hydroxide solution. After 10 hours, the reaction mixture solution was poured into methanol to precipitate the produced polymer.
It was dried and collected (yield: 94, 0 g).
このポリマーの赤外吸収スペクトルを第1図に、また、
’H−N M Rスペクトルを第2図に示した。
なお、 ’H−N M Rは、27℃、CD Cfl
3中で測定した。 両スペクトルから明らかなように、
両末端に水酸基を有するポリエステルが合成された。
GPCによる測定の結果、その数平均分子量は3000
であった。The infrared absorption spectrum of this polymer is shown in Figure 1, and
The 'H-NMR spectrum is shown in FIG.
In addition, 'H-NMR is 27℃, CD Cfl
Measured in 3. As is clear from both spectra,
A polyester having hydroxyl groups at both ends was synthesized.
As a result of GPC measurement, its number average molecular weight is 3000.
Met.
(合成例2)
ノルボルネンジオール60.0gとテレフタル酸りロリ
ぎ79.0gを、容量が2リツトルの30フラスコに入
れ、そこにN−メチルピロリドン250mJ2を加えて
溶解させた。 この混合物に40gのピリジンを滴下
しながら室温で反応させた。 100時間後、反応混
合溶液をメタノール中に流し込み、生成したポリマーを
沈殿、乾燥させて回収した(収量96.0g)。(Synthesis Example 2) 60.0 g of norbornene diol and 79.0 g of terephthalic acid salt were placed in a 30 flask with a capacity of 2 liters, and 250 mJ2 of N-methylpyrrolidone was added thereto and dissolved. 40 g of pyridine was added dropwise to this mixture and reacted at room temperature. After 100 hours, the reaction mixture solution was poured into methanol, and the produced polymer was precipitated, dried, and collected (yield: 96.0 g).
このポリマーの赤外吸収スペクトルおよびNMRスペク
トルは、合成例1で得たポリマーの各スペクトルと同様
であった。 また、GPCによる測定の結果、その数
平均分子量は3500であった。The infrared absorption spectrum and NMR spectrum of this polymer were similar to each spectrum of the polymer obtained in Synthesis Example 1. Further, as a result of measurement by GPC, the number average molecular weight was 3,500.
(合成例3)
ノルボルネンジオール60gとテレフタル酸クロリド7
9gを、容量が2リツトルの3日フラスコに入れ、そこ
にDMSOを250mJZ加えて溶解させた。 この混
合物を180℃で反応させた。 10時間後、反応混
合溶液をメタノール中に流し込み、生成したポリマーを
沈殿、乾燥させて回収した(収量80g)。 このポリ
マーを、再度、250℃にて10時間処理した。(Synthesis example 3) 60 g of norbornene diol and 7 g of terephthalic acid chloride
9 g was placed in a 3-day flask with a capacity of 2 liters, and 250 mJZ of DMSO was added thereto to dissolve it. This mixture was reacted at 180°C. After 10 hours, the reaction mixture solution was poured into methanol, and the produced polymer was precipitated, dried, and collected (yield: 80 g). This polymer was treated again at 250°C for 10 hours.
このポリマーの赤外吸収スペクトルおよびNMRスペク
トルは、合成例1で得たポリマーの各スペクトルと同様
であフた。 また、GPCによる測定の結果、その数平
均分子量は40000であった。The infrared absorption spectrum and NMR spectrum of this polymer were similar to each spectrum of the polymer obtained in Synthesis Example 1. Further, as a result of measurement by GPC, the number average molecular weight was 40,000.
(実施例1〜3、比較例1〜3)
表1に示す配合量(重量%)で、熱硬化性樹脂組成物を
調製した。(Examples 1 to 3, Comparative Examples 1 to 3) Thermosetting resin compositions were prepared with the blending amounts (% by weight) shown in Table 1.
これについて、ガラス転移温度(Tg)を熱機械装置に
よって測定し、結果は表1に示した。 なお、WETは
、沸とう水に48時間浸漬後に測定されたデータである
。Regarding this, the glass transition temperature (Tg) was measured using a thermomechanical device, and the results are shown in Table 1. Note that WET is data measured after immersion in boiling water for 48 hours.
また、各熱硬化性樹脂組成物をフィルムに塗工した後、
一方向の炭素繊維に含浸させてプリプレグを得た。In addition, after coating each thermosetting resin composition on a film,
A prepreg was obtained by impregnating unidirectional carbon fibers.
これらのプリプレグについて、タックと取扱い易さにつ
いπ評価を行い、表1に良い(0)か悪い(×)で示し
た。These prepregs were evaluated for tack and ease of handling, and are shown in Table 1 as good (0) or bad (×).
さらに、このプリプレグを積層し、オートクレーブ中で
、177℃で2時間かけて硬化させた。 このラミネー
トの特性を下記の方法で測定し、結果を表1に示した。Furthermore, this prepreg was laminated and cured in an autoclave at 177° C. for 2 hours. The properties of this laminate were measured by the following method, and the results are shown in Table 1.
(試験方法)
■0°圧縮強度および弾性率: ASTM D 341
0に準じて測定した。(Test method) ■0° compressive strength and elastic modulus: ASTM D 341
Measured according to 0.
■層間剪断強度: ASTM D 2344に準じて測
定した。■Interlaminar shear strength: Measured according to ASTM D 2344.
■衝撃後の圧縮強度:厚み1インチのサンプルに、15
00ボンドの荷重を1インチ上から落下させ(1500
1b−in/in) その衝撃後、圧縮強度を測定し
た。 圧縮強度の測定は、JIS K 6911に準じ
た。■ Compressive strength after impact: 15
A load of 00 bond is dropped from 1 inch above (1500
1b-in/in) After the impact, the compressive strength was measured. Compressive strength was measured in accordance with JIS K 6911.
表1から明らかなように、実施例はいずれも、熱硬化性
樹脂組成物のガラス転移温度は約200℃近辺であり、
調製されたプリプレグは適度のタックを有して取扱い易
かったので、そのプリプレグの積層は容易に行うことが
できた。 また、硬化後のラミネートは、圧縮強度およ
び衝撃強度に優れたものであった。As is clear from Table 1, in all Examples, the glass transition temperature of the thermosetting resin composition was around 200°C,
Since the prepared prepreg had a suitable tack and was easy to handle, the prepreg could be easily laminated. Moreover, the laminate after curing had excellent compressive strength and impact strength.
熱硬化性樹脂組成物にポリエステルを欠く比較例1は、
樹脂組成物のガラス転移温度(DRY)は209℃であ
ったが、調製されたプリプレグのタックはとても強く、
取扱いにくかった。 また、硬化後のラミネートは、
衝撃後の圧縮強度が低かった。Comparative Example 1, in which the thermosetting resin composition lacks polyester,
The glass transition temperature (DRY) of the resin composition was 209°C, but the tack of the prepared prepreg was very strong.
It was difficult to handle. In addition, the laminate after curing is
Compressive strength after impact was low.
分子量の大きすぎるポリエステルを用いた比較例2は、
樹脂組成物のガラス転移温度は高かったが、樹脂組成物
が固く、うまく塗工できなかった。、 そして、調製さ
れたプリプレグにタックは全くなく、取扱いに<<、従
ってプリプレグを積層できず、硬化後のラミネートの物
性測定は行えなかった。Comparative Example 2 using a polyester with too large a molecular weight,
Although the glass transition temperature of the resin composition was high, the resin composition was hard and could not be coated successfully. The prepared prepreg had no tack at all and was difficult to handle, so the prepreg could not be laminated and the physical properties of the laminate after curing could not be measured.
飽和型ポリエステルを用いた比較例3は、樹脂組成物の
ガラス転移温度(DRY)は180℃であり、調製され
たプリプレグのタックはおよび取扱い易さは良好であっ
たが、WETのガラス転移温度が140℃であったこと
からも明らかなように、特に、硬化後のラミネートの耐
水性が悪かフた。In Comparative Example 3 using saturated polyester, the glass transition temperature (DRY) of the resin composition was 180°C, and the prepared prepreg had good tack and ease of handling. As is clear from the fact that the temperature was 140°C, the water resistance of the laminate after curing was particularly poor.
〈発明の効果〉
本発明により、プリプレグの含浸用樹脂組成物として好
適であり、それ自体は適度の粘着性を有し、硬化後には
補強繊維と共に高強度、高靭性で、耐熱性、耐水性、耐
衝撃性に優れた複合材料を提供する熱硬化性樹脂組成物
が提供される。<Effects of the Invention> According to the present invention, it is suitable as a resin composition for impregnating prepreg, and it has moderate adhesiveness itself, and after curing, it has high strength, high toughness, heat resistance, and water resistance together with reinforcing fibers. , a thermosetting resin composition that provides a composite material with excellent impact resistance is provided.
本発明の熱硬化性樹脂組成物を用いたプリプレグは、そ
の硬化後の特性が航空機関連分野などにおける要求特性
をも満足するものであるので、プリプレグの用途が広が
る。The properties of the prepreg using the thermosetting resin composition of the present invention after curing satisfy the properties required in the aircraft-related field, so the uses of the prepreg are widened.
第1図は、実施例にて用いたノルボルネンジオールとテ
レフタル酸クロリドとから合成された反応生成物の赤外
吸収スペクトルである。
第2図は、実施例にて用いたノルボルネンジオールとテ
レフタル酸クロリドとから合成された反応生成物の ’
H−N HRスペクトルである。FIG. 1 is an infrared absorption spectrum of a reaction product synthesized from norbornene diol and terephthalic acid chloride used in Examples. Figure 2 shows the reaction product synthesized from norbornene diol and terephthalic acid chloride used in the examples.
This is an H-N HR spectrum.
Claims (1)
ら構成される樹脂(A)、エポキシ樹脂(B)、および
、下記式 I で示されるノルボルネンジオールとテレフ
タル酸クロリドとから合成され、両末端に水酸基を有し
、数平均分子量が200〜20000の反応生成物(C
)とを含有し、(A)+(B)+(C)を100重量%
としたとき、(A)の含有量は50〜94重量%、(B
)の含有量は4〜48重量%、(C)の含有量は2〜3
0重量%であることを特徴とする熱硬化性樹脂組成物。 ▲数式、化学式、表等があります▼・・・ I(1) Synthesized from a resin (A) composed of a cyanate ester component and a bismaleimide component, an epoxy resin (B), and norbornene diol and terephthalic acid chloride represented by the following formula I, with hydroxyl groups at both ends. and a number average molecular weight of 200 to 20,000 (C
) and 100% by weight of (A) + (B) + (C)
When, the content of (A) is 50 to 94% by weight, (B
) content is 4 to 48% by weight, (C) content is 2 to 3
A thermosetting resin composition characterized in that the content is 0% by weight. ▲There are mathematical formulas, chemical formulas, tables, etc.▼... I
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5736690A JPH03258828A (en) | 1990-03-08 | 1990-03-08 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5736690A JPH03258828A (en) | 1990-03-08 | 1990-03-08 | Thermosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03258828A true JPH03258828A (en) | 1991-11-19 |
Family
ID=13053589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5736690A Pending JPH03258828A (en) | 1990-03-08 | 1990-03-08 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03258828A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1320060C (en) * | 2004-04-01 | 2007-06-06 | 中国科学院化学研究所 | Short-fiber reinforced polyimide composite material, and its preparing method and use |
-
1990
- 1990-03-08 JP JP5736690A patent/JPH03258828A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1320060C (en) * | 2004-04-01 | 2007-06-06 | 中国科学院化学研究所 | Short-fiber reinforced polyimide composite material, and its preparing method and use |
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