JPH0319256B2 - - Google Patents

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Publication number
JPH0319256B2
JPH0319256B2 JP28566485A JP28566485A JPH0319256B2 JP H0319256 B2 JPH0319256 B2 JP H0319256B2 JP 28566485 A JP28566485 A JP 28566485A JP 28566485 A JP28566485 A JP 28566485A JP H0319256 B2 JPH0319256 B2 JP H0319256B2
Authority
JP
Japan
Prior art keywords
weight
composite material
intermediate material
material according
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP28566485A
Other languages
Japanese (ja)
Other versions
JPS62146927A (en
Inventor
Takashi Tada
Takayuki Izeki
Akira Agata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Rayon Co Ltd
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Priority to JP28566485A priority Critical patent/JPS62146927A/en
Priority to DE8686117763T priority patent/DE3673150D1/en
Priority to EP19860117763 priority patent/EP0230631B2/en
Priority to ES86117763T priority patent/ES2016249T5/en
Publication of JPS62146927A publication Critical patent/JPS62146927A/en
Priority to US07/320,803 priority patent/US5003013A/en
Publication of JPH0319256B2 publication Critical patent/JPH0319256B2/ja
Granted legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)

Description

【発明の詳现な説明】 〔産業䞊の利甚分野〕 本発明は優れた耐熱性、耐氎性及び機械的性質
を䞎える耇合材料甚䞭間材に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an intermediate material for composite materials that provides excellent heat resistance, water resistance and mechanical properties.

〔埓来技術〕[Prior art]

埓来、耇合材料のマトリツクスずしお各皮の暹
脂組成物が䜿甚されおいるが、特に熱硬化性暹脂
の分野においおは、暹脂自身の優れた機械的性質
特に匷床、䌞床に加え補匷材ずの接着性が良
奜であり、補匷材の匷床発珟性が他の熱硬化性暹
脂に比べお優れおいる点から、゚ポキシ暹脂が広
く甚いられおきた。近幎、耇合材料に察する高性
胜化、特に耐熱性、耐氎性及び耐衝撃性の改良が
匷く芁望されおおり、その芁求を満たすためマト
リツクスずしお倚官胜性マレむミド、倚官胜性シ
アン酞゚ステルずそのオリゎマヌ及びこれらの予
備反応物が怜蚎されおいる。その結果、暹脂の剛
性が増し耇合材料の耐熱性及び耐氎性は向したも
のの、䌞びの䜎䞋及び耐衝撃性の䜎䞋が課題であ
぀た。
Conventionally, various resin compositions have been used as matrices for composite materials, but especially in the field of thermosetting resins, in addition to the excellent mechanical properties of the resin itself (particularly strength and elongation), Epoxy resins have been widely used because they have good adhesive properties and the strength development of reinforcing materials is superior to other thermosetting resins. In recent years, there has been a strong demand for higher performance of composite materials, especially improvements in heat resistance, water resistance, and impact resistance. These pre-reactants are being considered. As a result, although the rigidity of the resin increased and the heat resistance and water resistance of the composite material improved, there were problems with a decrease in elongation and a decrease in impact resistance.

〔発明の目的〕[Purpose of the invention]

本発明者らは、高耐熱性、耐氎性及び優れた耐
衝撃性を有する耇合材料甚䞭間材を開発すべく鋭
意怜蚎した結果、本発明に到達した。
The present inventors have arrived at the present invention as a result of intensive studies aimed at developing an intermediate material for composite materials having high heat resistance, water resistance, and excellent impact resistance.

〔発明の構成〕[Structure of the invention]

本発明は、倚官胜性マレむミド及び倚官
胜性シアン酞゚ステル又はそのオリゎマヌ
の混合物あるいはずの予備反応物(A)
の100重量郚、゚ポキシ化合物(B)〜100重量郚及
び䞀般匏 匏䞭Arはプニレン基、R1は䟡の脂肪族
基を瀺すで衚わされるポリ゚ステル化合物(C)
〜50重量郚からなる暹脂組成物を、補匷材に含浞
させた耇合材料甚䞭間材である。
The present invention provides polyfunctional maleimide () and polyfunctional cyanate ester or oligomer thereof ().
mixture of () or pre-reactant of () and () (A)
100 parts by weight, 5 to 100 parts by weight of epoxy compound (B) and general formula (In the formula, Ar is a phenylene group and R 1 is a divalent aliphatic group.) Polyester compound (C)5
This is an intermediate material for composite materials in which a reinforcing material is impregnated with ~50 parts by weight of a resin composition.

匏(1)のポリ゚ステル化合物(C)においお眮換基
Arのためのプニレン基ずしおは、−プニ
レン基、−プニレン基、−プニレン基の
いずれでもよく、たたR1のための䟡の脂肪族
基ずしおは、炭玠数〜の盎鎖状又は分岐状の
脂肪族基が奜たしく、䟋えば䞋蚘の基が挙げられ
る。基−CH2−2、−CH2−3、−CH2−CHCH3
−、CH−C2H5、−CH2−4、−CH2−CH
CH3−CH2−、−CH2−5、−CH2−3CH
CH3−、−CH2−2CHCH3−CH2−、−CH2
−2CHC2H5−、−CH2−CH32−CH2−等。
Substituent in polyester compound (C) of formula (1)
The phenylene group for Ar may be any o-phenylene group, m-phenylene group, or p-phenylene group, and the divalent aliphatic group for R 1 may be a straight C2-C6 aliphatic group. A chain or branched aliphatic group is preferred, and examples include the following groups. Group ( -CH2 ) -2 , ( -CH2 ) -3 , -CH2 -CH( CH3 )
−, CH−C 2 H 5 , (−CH 2 )− 4 , −CH 2 −CH
( CH3 ) −CH2− , ( −CH2 ) −5 , ( −CH2 ) −3 CH
(CH 3 )−, (−CH 2 )− 2 CH(CH 3 )−CH 2 −, (−CH 2
) -2CH ( C2H5 )-, -CH2 - C ( CH3 ) 2 - CH2- , etc.

本発明に甚いられる倚官胜性マレむミド
は、マレむミド基を個以䞊有する化合物であ぀
お、䞀般匏 匏䞭R2は䟡の芳銙族基又は脂肪族基を瀺
すで衚わされるビスマレむミドの他、これらビ
スマレむミドずゞアミンから埗られるプリポリマ
ヌを含む。匏(2)のビスマレむミドは無氎マレむン
酞ずゞアミンずを反応させビスマレアミド酞を調
補し、次いで脱氎環化させる公知の方法で補造す
るこずができる。ゞアミンずしおは耐熱性の点か
ら芳銙族ゞアミンが奜たしいが、可撓性等の機胜
を付䞎したい堎合には脂肪族アミンを単独である
いは組み合わせお甚いるこずもできる。ゞアミン
ずしおは䟋えば−プニレンゞアミン、−フ
゚ニレンゞアミン4′−ゞアミノゞプニルス
ルホン、3′−ゞアミノゞプニルスルホン、
4′−ゞアミノゞプニルメタン、4′−ゞ
アミノゞプニル゚ヌテル等が甚いられる。
Polyfunctional maleimide () used in the present invention
is a compound having two or more maleimide groups, and has the general formula In addition to bismaleimide represented by the formula (in which R 2 represents a divalent aromatic group or aliphatic group), it also includes prepolymers obtained from these bismaleimides and diamines. The bismaleimide of formula (2) can be produced by a known method of preparing bismaleamic acid by reacting maleic anhydride with a diamine, and then cyclodehydrating it. As the diamine, aromatic diamines are preferred from the viewpoint of heat resistance, but aliphatic amines may be used alone or in combination if it is desired to impart functions such as flexibility. Examples of diamines include m-phenylenediamine, p-phenylenediamine 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone,
4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, etc. are used.

本発明に甚いられる倚官胜性シアン酞゚ステル
は、個以䞊のシアン酞゚ステル基を有す
る有機化合物及びそのオリゎマヌであり、䞀般匏 R3−−≡o (3) 匏䞭は〜の敎数、R3は芳銙族性の有
機残基を瀺すで衚わされる化合物である。倚官
胜性シアン酞゚ステルずしおは䟋えば−又
は−ゞシアナヌトベンれン、−ゞシ
アナヌトビプニル、ビス−シアナヌトプ
ニルメタン、−ビス−シアナヌトフ
゚ニル゚タン、−ビス−シアナヌト
プニルプロパン、ビス−シアナヌトプ
ニルスルホン等が甚いられる。前蚘の倚官胜性
シアン酞゚ステルはシアナヌトの䞉量化によるト
リアゞンオリゎマヌの他、アミンずの反応による
プレポリマヌの圢でも甚いるこずができ、その目
的に甚いられるアミンずしおは前蚘の倚官胜性マ
レむミドの合成及び倉成に甚いられたものが挙げ
られる。
The polyfunctional cyanate ester () used in the present invention is an organic compound having two or more cyanate ester groups and an oligomer thereof, and has the general formula R 3 (-0-C≡N) o (3) ( In the formula, n is an integer of 2 to 5, and R 3 represents an aromatic organic residue. Examples of polyfunctional cyanate esters include 1,3- or 1,4-dicyanatobenzene, 4,4-dicyanatobiphenyl, bis(4-cyanatophenyl)methane, and 2,2-bis( 4-cyanatophenyl)ethane, 2,2-bis(4-cyanatophenyl)propane, bis(4-cyanatophenyl)sulfone, etc. are used. The polyfunctional cyanate ester described above can be used in the form of a triazine oligomer obtained by trimerizing cyanate, or in the form of a prepolymer obtained by reaction with an amine. and those used for metamorphosis.

本発明では、成分ずしお前蚘の倚官胜性マレ
むミド及び倚官胜性シアン酞゚ステル又は
そのオリゎマヌの混合物、あるいは觊媒の
䞍圚又は存圚においおをを予備反応
させるこずにより埗られる予備反応物が、甚途に
応じお適宜遞択䜿甚される。
In the present invention, as component A, a mixture of the polyfunctional maleimide () and a polyfunctional cyanate ester or its oligomer (), or a mixture obtained by pre-reacting () with () in the absence or presence of a catalyst, is used. Preliminary reactants are appropriately selected and used depending on the purpose.

本発明に甚いられる゚ポキシ化合物(B)ずしお
は、公知の゚ポキシ暹脂でよく、䟋えば䞋蚘の化
合物が挙げられる。ゞプニロヌルプロパン、ゞ
プニロヌル゚タン、ゞプニロヌルメタンなど
のゞプニロヌルアルカンのポリグリシゞル゚ヌ
テル、ノボラツク、クレゟヌル、レゟヌルなどの
倚䟡プノヌルのポリグリシゞル゚ヌテル、シク
ロヘキサン、シクロペンタゞ゚ン、ゞシクロペン
タゞ゚ンなどの脂環匏化合物の゚ポキシ化により
生成される゚ポキシ暹脂䟋えば−゚ポキシ
−−メチル−シクロヘキサン−カルボン酞の
−゚ポキシ−−メチル−シクロヘキサ
ン−メチル゚ステル、゚チレングリコヌル、グ
リセリンなどの脂肪族ポリオキシ化合物のポリ
゚ポキシアルキル゚ヌテル、芳銙族又は脂肪
族カルボン酞のグリシゞル゚ステルなどのカルボ
ン酞の゚ポキシアルキル゚ステルなど。たた䟋え
ば米囜特蚱第3390037号、同第2970983号及び同第
3067170号各明现曞に蚘茉されおいるような゚ポ
キシ暹脂ず硬化剀の予備反応物であ぀おもよく、
単なる混合物であ぀おもよい。これらは単独でも
二皮以䞊配合しお甚いおもよい。奜適な゚ポキシ
化合物ずしおは、䟋えばビスプノヌルのゞグ
リシゞル゚ヌテルもしくはビスプノヌルのゞ
グリシゞル゚ヌテルあるいはそれらの゚ポキシ化
合物ずゞアミノゞプニルスルホンずの゚ポキシ
基NH基比での予備反応物が挙げられ
る。
The epoxy compound (B) used in the present invention may be any known epoxy resin, such as the following compounds. Polyglycidyl ethers of diphenylolalkanes such as diphenylopropane, diphenyloethane, and diphenylomethane; polyglycidyl ethers of polyhydric phenols such as novolac, cresol, and resol; cyclohexane, cyclopentadiene, dicyclopentadiene, etc. Epoxy resins produced by epoxidation of alicyclic compounds, such as (3,4-epoxy-6-methyl-cyclohexane)-methyl ester of 3,4-epoxy-6-methyl-cyclohexane-carboxylic acid, ethylene glycol, glycerin poly(epoxyalkyl)ethers of aliphatic polyoxy compounds such as, epoxyalkyl esters of carboxylic acids such as glycidyl esters of aromatic or aliphatic carboxylic acids, etc. Also, for example, U.S. Patent Nos. 3390037, 2970983, and
It may be a preliminary reaction product of an epoxy resin and a curing agent as described in each specification of No. 3067170,
It may also be a simple mixture. These may be used alone or in combination of two or more. Suitable epoxy compounds include, for example, diglycidyl ether of bisphenol A or diglycidyl ether of bisphenol F, or pre-reacted products of these epoxy compounds and diaminodiphenylsulfone at an epoxy group/NH group ratio of 4/1. Can be mentioned.

本発明に甚いられる匏(1)のポリ゚ステル化合物
(C)は、酞成分が䞻ずしおテレフタル酞、グリコヌ
ル成分が䞻ずしおネオペンチルグリコヌル又ぱ
チレングリコヌルである化合物が奜たしい。本発
明に甚いられるポリ゚ステル化合物は、軟化点が
が100℃以䞋であるこずが必芁であ぀お、70℃以
䞋であるこずが奜たしい。軟化点が100℃を越え
る堎合には倚官胜性マレむミド、倚官胜性シアン
酞゚ステル及び゚ポキシ化合物ずの盞溶性が悪く
なり、均䞀な組成物を埗るこずが困難ずなる。こ
のポリ゚ステル化合物は数平均分子量が500〜
10000、特に500〜3000であるこずが奜たしい。
500未満では粘床が䜎䞋し、たた10000を越えるず
他の成分ずの混合䜜業性に欠けるため適圓でな
い。本発明に甚いられるポリ゚ステル化合物は他
の線状ポリ゚ステルの補造においお甚いられる䞀
般的な方法によ぀お補造できる。
Polyester compound of formula (1) used in the present invention
(C) is preferably a compound whose acid component is mainly terephthalic acid and whose glycol component is mainly neopentyl glycol or ethylene glycol. The polyester compound used in the present invention must have a softening point of 100°C or lower, preferably 70°C or lower. If the softening point exceeds 100°C, the compatibility with polyfunctional maleimide, polyfunctional cyanate ester, and epoxy compound deteriorates, making it difficult to obtain a uniform composition. This polyester compound has a number average molecular weight of 500~
10,000, particularly preferably 500 to 3,000.
If it is less than 500, the viscosity decreases, and if it exceeds 10,000, it is not suitable because it lacks workability in mixing with other components. The polyester compound used in the present invention can be produced by a general method used in the production of other linear polyesters.

本発明に甚いられる暹脂組成物は、成分100
重量郚に察し成分〜100重量郚、成分〜
50重量郚の組成比ずするこずが必芁である。成
分である゚ポキシ化合物の䜿甚量が重量郚未満
の堎合には基材に察する接着性が劣り、100重量
郚を越えるず満足な耐熱性が埗られない。たた
成分であるポリ゚ステル化合物の䜿甚量が重量
郚未満の堎合には充分な耐衝撃性が発揮されず、
50重量郚を越えるず耐熱性及び耐溶剀性が著しく
䜎䞋する。たた成分䞭のの比は
〜1595〜85が奜たしい。倚官胜性マレむミド
の量が15より倚いず耐熱性は向䞊するもの
の高い硬化枩床が必芁であり、たた耐衝撃性が䜎
䞋し、より䜎いず耐衝撃性は向䞊するものの、
耐熱氎性が䜎䞋するため奜たしくない。
The resin composition used in the present invention has an A component of 100%
5 to 100 parts by weight of component B, 5 to 100 parts by weight of component C
It is necessary to set the composition ratio to 50 parts by weight. If the amount of the epoxy compound used as component B is less than 5 parts by weight, the adhesion to the substrate will be poor, and if it exceeds 100 parts by weight, satisfactory heat resistance will not be obtained. Also C
If the amount of the component polyester compound used is less than 5 parts by weight, sufficient impact resistance will not be exhibited.
If it exceeds 50 parts by weight, heat resistance and solvent resistance will be significantly reduced. The ratio of ()/() in component A is preferably 5-15/95-85. If the amount of polyfunctional maleimide () is more than 15, heat resistance will improve, but a high curing temperature will be required, and impact resistance will decrease, and if it is less than 5, impact resistance will improve, but
This is not preferred because hot water resistance decreases.

本発明に甚いられる暹脂組成物には、暹脂硬化
物に所望の特性を付䞎したり、あるいは暹脂の熱
硬化性を調節する目的で觊媒を添加しおもよい。
觊媒ずしおは䟋えば䞉北化硌玠アミン錯化合物の
ような朜圚性硬化觊媒の他、トリ゚チレンゞアミ
ン、−ゞアザビシクロりン
デセン、−ゞメチルベンゞルアミン、−
メチルモルホリン、トリ−−ブチルアミン等の
第アミン、ゞクミルパヌオキサむド、過酞化ベ
ンゟむル、−ブチルヒドロパヌオキサむド等の
有機過酞化物、オクチル酞亜鉛、オクチル酞錫、
ナフテン酞亜鉛、ナフテン酞コバルト等の有機酞
金属塩等が挙げられる。觊媒の䜿甚量は目的に応
じお決定すればよいが、暹脂組成物の安定性の面
から、党暹脂固圢成分に察しお0.2〜重量ず
するこずが奜たしい。
A catalyst may be added to the resin composition used in the present invention for the purpose of imparting desired properties to the cured resin product or adjusting the thermosetting properties of the resin.
Examples of catalysts include latent curing catalysts such as boron trifluoride amine complexes, triethylenediamine, 1,8-diazabicyclo(5,4,0)undecene, N,N-dimethylbenzylamine, N-
Tertiary amines such as methylmorpholine and tri-n-butylamine, organic peroxides such as dicumyl peroxide, benzoyl peroxide, and t-butyl hydroperoxide, zinc octylate, tin octylate,
Examples include organic acid metal salts such as zinc naphthenate and cobalt naphthenate. The amount of catalyst to be used may be determined depending on the purpose, but from the viewpoint of stability of the resin composition, it is preferably 0.2 to 3% by weight based on the total resin solid components.

本発明の耇合材料甚䞭間材の補匷材ずしおは、
ガラス繊維、炭玠繊維、ボロン繊維、シリコンカ
ヌバむド繊維等の無機繊維の他、ポリ−−プ
ニレンテレフタルアミド、ポリ−−ベンズアミ
ド、ポリアミドヒドラゞド等の有機繊維からなる
チペツプ状、ダヌン状、テヌプ状、シヌト状、線
物状、マツト状、玙状物やアスベスト、マむカ、
タルク等、䞊びにこれらの皮以䞊の混合物が甚
いられる。
As the reinforcing material for the intermediate material for composite materials of the present invention,
In addition to inorganic fibers such as glass fiber, carbon fiber, boron fiber, and silicon carbide fiber, chop-shaped, yarn-shaped, and tape-shaped products are made of organic fibers such as poly-p-phenylene terephthalamide, poly-p-benzamide, and polyamide hydrazide. , sheet, knitted, pine, paper, asbestos, mica,
Talc and the like, as well as mixtures of two or more thereof, are used.

たた甚途により酞化珪玠埮粉末などの流れ調敎
剀、顔料、染料、安定剀、可塑剀、滑剀、タヌ
ル、アスフアルトなども単独もしくは他の補匷材
ず䜵甚しお甚いるこずができる。
Depending on the purpose, flow control agents such as fine silicon oxide powder, pigments, dyes, stabilizers, plasticizers, lubricants, tar, asphalt, etc. may also be used alone or in combination with other reinforcing materials.

暹脂組成物を補匷材に含浞させる堎合は、暹脂
組成物を50〜120℃の枩床で予備反応させおプレ
ポリマヌを補造し、このプレポリマヌを溶媒䟋え
ばメチレン゚チルケトンに溶解しお補匷材に含浞
させるこずが奜たしい。耇合材料甚䞭間材䞭の補
匷材の含有率は0.5〜80容量が奜たしい。たた
゚ポキシ暹脂以倖の熱硬化性暹脂や熱可塑性暹脂
を䜵甚するこずができる。
When impregnating a reinforcing material with a resin composition, the resin composition is pre-reacted at a temperature of 50 to 120°C to produce a prepolymer, and this prepolymer is dissolved in a solvent such as methylene ethyl ketone and impregnated into the reinforcing material. It is preferable to let The content of the reinforcing material in the intermediate material for composite material is preferably 0.5 to 80% by volume. Further, thermosetting resins and thermoplastic resins other than epoxy resins can be used in combination.

実斜䟋  ビス−マレむミドプニルメタン、
−ビス−シアナヌトプニルプロパン、
゚ポキシ圓量172の゚ピコヌト807シ゚ル化孊瀟
補及び酞成分ずしおテレフタル酞、グリコヌル
成分ずしおネオペンチルグリコヌルから成る軟化
点25℃のポリ゚ステル(a)の䞋蚘衚に瀺す割合で混
合し、さらに酞化珪玠埮粉末AEROSIL380日本
゚アロゞル瀟補1.25郚及び硬化觊媒ずしおゞク
ミルパヌオキサむド0.2郚を加え、70℃で30分間
予備反応させプレポリマヌを埗た。このプレポリ
マヌを所定の厚さになるようにガラス板に挟み、
180℃で時間硬化し暹脂板を埗た。たたこのプ
レポリマヌをメチル゚チルケトンに溶解し、炭玠
繊維パむロフむル−䞉菱レむペン瀟補に
含浞し぀぀ドラムに巻き぀けたのち也燥し、次い
で切り開くこずにより䞀方向プリプレグ糞目付
145m2、暹脂含有率33重量を埗た。この
プリプレグを〔0゜〕16に積局し、たた〔45゜
0゜−45゜90゜4Sの擬等方性に積局し、180℃
で時間硬化させ耇合材を埗た。そしお暹脂及び
耇合材に぀いお皮々の詊隓を実斜した。その結果
を䞋蚘衚に瀺す。衚䞭のガラス転移点Tgは
レオメトリツクス瀟補ダむナミツクメカニカルス
ペクトルメヌタヌにより枬定したtanÎŽMAX枩床
である。耇合材の耐熱氎性は、0゜16局の積局材コ
ンポゞツトを71℃の氎䞭に14日間攟眮したのち、
ASTMD695に埓぀お121℃で0゜方向の圧瞮詊隓を
実斜するこずにより刀定した。たた耐衝撃性は
NASA RP1092に準拠しお、寞法××0.25ã‚€
ンチの板を×むンチの穎のあいた台䞊に固定
し、その䞭心に1/2むンチのノヌズを぀けた4.9
Kgの分銅を萜䞋させ、板厚むンチ圓り1500lbin
の衝撃を加えたのち、その板を圧瞮詊隓するこず
により求めた。なお、コンポゞツトのデヌタはい
ずれも繊維含有率60換算倀である。
Example 1 Bis(4-maleimidophenyl)methane, 2,
2-bis(4-cyanatophenyl)propane,
Epikote 807 (manufactured by Schiel Kagaku Co., Ltd.) having an epoxy equivalent of 172 and polyester (a) with a softening point of 25°C consisting of terephthalic acid as an acid component and neopentyl glycol as a glycol component are mixed in the proportions shown in the table below, and a fine amount of silicon oxide is added. 1.25 parts of powder AEROSIL 380 (manufactured by Nippon Aerosil Co., Ltd.) and 0.2 parts of dicumyl peroxide as a curing catalyst were added, and a preliminary reaction was carried out at 70°C for 30 minutes to obtain a prepolymer. This prepolymer is sandwiched between glass plates to a predetermined thickness.
A resin plate was obtained by curing at 180°C for 2 hours. In addition, this prepolymer is dissolved in methyl ethyl ketone, impregnated with carbon fiber (Pyrofil T-3 manufactured by Mitsubishi Rayon Co., Ltd.), wound around a drum, dried, and then cut open to create a unidirectional prepreg (thread density).
145 g/m 2 , resin content 33% by weight). This prepreg was laminated to [0°] 16 , and also [+45°/
0゜/-45゜/+90゜) 4S pseudo-isotropically stacked and heated at 180℃
The mixture was cured for 2 hours to obtain a composite material. Various tests were then conducted on resins and composite materials. The results are shown in the table below. The glass transition point (Tg) in the table is the tan Ύ MAX temperature measured with a Dynamik mechanical spectrometer manufactured by Rheometrics. The hot water resistance of the composite material was determined after a 16-layer laminate composite was left in water at 71°C for 14 days.
Judgment was made by performing a compression test in the 0° direction at 121°C in accordance with ASTM D695. In addition, the impact resistance
In accordance with NASA RP1092, a board with dimensions of 4 x 6 x 0.25 inches was fixed on a table with a 3 x 5 inch hole, and a 1/2 inch radius nose was attached in the center.
Dropping a kg weight, 1500lbin per inch of plate thickness
It was determined by applying an impact to the plate and then performing a compression test. All composite data are calculated based on a fiber content of 60%.

実斜䟋  ポリ゚ステル(a)の代わりに酞成分ずしおテレフ
タル酞、グリコヌル成分ずしお゚チレングリコヌ
ルずネオペンチルグリコヌルの重量混
合物から成る軟化点20℃のポリ゚ステル(b)を甚
い、その他は実斜䟋ず同様にしお暹脂板及び耇
合材を埗た。各皮詊隓の結果を䞋蚘衚に瀺す。
Example 2 Polyester (b) with a softening point of 20°C consisting of terephthalic acid as the acid component and a 1:1 (by weight) mixture of ethylene glycol and neopentyl glycol as the glycol component was used instead of polyester (a), and the other conditions were as follows. A resin plate and a composite material were obtained in the same manner as in Example 1. The results of various tests are shown in the table below.

実斜䟋  ゚ポキシ暹脂ずしお、゚ポキシ圓量184〜194の
゚ピコヌト828シ゚ル化孊瀟補を甚い、その他
は実斜䟋ず同様にしお暹脂板及び耇合材を埗
た。詊隓結果を䞋蚘衚に瀺す。
Example 3 A resin plate and a composite material were obtained in the same manner as in Example 1 except that Epikote 828 (manufactured by Ciel Chemical Co., Ltd.) having an epoxy equivalent of 184 to 194 was used as the epoxy resin. The test results are shown in the table below.

実斜䟋、比范䟋及び ポリ゚ステル(a)の䜿甚量を倉え、その他は実斜
䟋ず同様にしお暹脂板ず耇合材を埗た。詊隓結
果を䞋蚘衚に瀺す。
Example 4, Comparative Examples 1 and 2 A resin plate and a composite material were obtained in the same manner as in Example 1 except that the amount of polyester (a) used was changed. The test results are shown in the table below.

実斜䟋、比范䟋及び ゚ピコヌト807の䜿甚量を倉え、その他は実斜
䟋ず同様にしお暹脂板ず耇合材を埗た。
Example 5, Comparative Examples 3 and 4 A resin plate and a composite material were obtained in the same manner as in Example 1 except that the amount of Epicote 807 used was changed.

詊隓結果を䞋蚘衚に瀺す。 The test results are shown in the table below.

実斜䟋及び ビス−マレむミドプニルメタン及び
−ビス−シアナヌトプニルプロパ
ンの䜿甚量を倉え、その他は実斜䟋ず同様にし
お暹脂板ず耇合材を埗た。詊隓結果を䞋蚘衚に瀺
す。
Examples 6 and 7 Resin plates and composite materials were prepared in the same manner as in Example 1 except that the amounts of bis(4-maleimidophenyl)methane and 2,2-bis(4-cyanatophenyl)propane were changed. Obtained. The test results are shown in the table below.

Claims (1)

【特蚱請求の範囲】  倚官胜性マレむミド及び倚官胜性シア
ン酞゚ステル又はそのオリゎマヌの混合物
あるいはずの予備反応物(A)の100重
量郚、゚ポキシ化合物(B)〜100重量郚及び䞀般
匏 匏䞭Arはプニレン基、R1は䟡の脂肪族
基を瀺すで衚わされるポリ゚ステル化合物(C)
〜50重量郚から成る暹脂組成物を、補匷材に含浞
させた耇合材料甚䞭間材。  倚官胜性マレむミドがゞアミノゞプ
ニルメタンのビスマレむミドであるこずを特城ず
する、特蚱請求の範囲第項に蚘茉の耇合材料甚
䞭間材。  倚官胜性シアン酞゚ステルがビスプ
ノヌルのゞシアナヌトであるこずを特城ずす
る、特蚱請求の範囲第項に蚘茉の耇合材料甚䞭
間材。  ゚ポキシ化合物(B)がビスプノヌルのゞグ
リシゞル゚ヌテルもしくはビスプノヌルのゞ
グリシゞル゚ヌテルあるいはそれらの゚ポキシ化
合物ずゞアミノゞプニルスルホンずの゚ポキシ
基NH基比での予備反応物であるこずを
特城ずする、特蚱請求の範囲第項に蚘茉の耇合
材料甚䞭間材。  ポリ゚ステル化合物(C)がテレフタル酞ずネオ
ペンチルグリコヌルからの反応生成物であり、軟
化枩床が100℃以䞋、その平均分子量が500〜
10000であるこずを特城ずする、特蚱請求の範囲
第項に蚘茉の耇合材料甚䞭間材。  酞化珪玠埮粉末を0.2〜重量含有するこ
ずを特城ずする、特蚱請求の範囲第項に蚘茉の
耇合材料甚䞭間材。  成分䞭のの重量比が〜
1595〜85であるこずを特城ずする、特蚱請求の
範囲第項に蚘茉の耇合材料甚䞭間材。  觊媒ずしお䞉北化硌玠モノ゚チルアミン錯
䜓、ゞクミルパヌオキサむド及び又はオクチル
酞亜鉛を0.2〜重量含有するこずを特城ずす
る、特蚱請求の範囲第項に蚘茉の耇合材料甚䞭
間材。
[Scope of Claims] 1. 100 parts by weight of a mixture of polyfunctional maleimide () and polyfunctional cyanate ester or its oligomer () or a preliminary reaction product (A) of () and (), epoxy compound (B) 5-100 parts by weight and general formula (In the formula, Ar is a phenylene group and R 1 is a divalent aliphatic group) Polyester compound (C)5
An intermediate material for composite materials in which a reinforcing material is impregnated with ~50 parts by weight of a resin composition. 2. The intermediate material for a composite material according to claim 1, wherein the polyfunctional maleimide () is bismaleimide of diaminodiphenylmethane. 3. The intermediate material for a composite material according to claim 1, wherein the polyfunctional cyanate ester () is dicyanate of bisphenol A. 4. The epoxy compound (B) is diglycidyl ether of bisphenol A or diglycidyl ether of bisphenol F, or a preliminary reaction product of these epoxy compounds and diaminodiphenylsulfone at an epoxy group/NH group ratio of 4/1. An intermediate material for a composite material according to claim 1, characterized in that: 5 The polyester compound (C) is a reaction product from terephthalic acid and neopentyl glycol, has a softening temperature of 100°C or less, and has an average molecular weight of 500~
10,000, the intermediate material for composite material according to claim 1. 6. The intermediate material for a composite material according to claim 1, which contains 0.2 to 3% by weight of silicon oxide fine powder. 7 The weight ratio of ()/() in component A is 5 to
15/95-85, the intermediate material for composite material according to claim 1. 8. The intermediate material for a composite material according to claim 1, which contains 0.2 to 3% by weight of boron trifluoride monoethylamine complex, dicumyl peroxide and/or zinc octylate as a catalyst. .
JP28566485A 1985-12-20 1985-12-20 Intermediate for composite material Granted JPS62146927A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP28566485A JPS62146927A (en) 1985-12-20 1985-12-20 Intermediate for composite material
DE8686117763T DE3673150D1 (en) 1985-12-20 1986-12-19 INTERMEDIATE PRODUCT FOR COMPOSITE MATERIALS.
EP19860117763 EP0230631B2 (en) 1985-12-20 1986-12-19 Intermediate for composite material
ES86117763T ES2016249T5 (en) 1985-12-20 1986-12-19 PROCEDURE FOR PREPARING AN INTERMEDIATE FOR A COMPOSITE MATERIAL.
US07/320,803 US5003013A (en) 1985-12-20 1989-03-09 Intermediate for composite of polymaleimide, polycyanate, epoxy resin and polyester

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28566485A JPS62146927A (en) 1985-12-20 1985-12-20 Intermediate for composite material

Publications (2)

Publication Number Publication Date
JPS62146927A JPS62146927A (en) 1987-06-30
JPH0319256B2 true JPH0319256B2 (en) 1991-03-14

Family

ID=17694456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28566485A Granted JPS62146927A (en) 1985-12-20 1985-12-20 Intermediate for composite material

Country Status (1)

Country Link
JP (1) JPS62146927A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6330558A (en) * 1986-07-25 1988-02-09 Yokohama Rubber Co Ltd:The Thermosetting resin composition
US6534179B2 (en) 2001-03-27 2003-03-18 International Business Machines Corporation Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use
JP5016998B2 (en) * 2007-07-03 2012-09-05 䞉菱レむペン株匏䌚瀟 Matrix resin and prepreg for fiber reinforced composite materials
JP2012131948A (en) * 2010-12-24 2012-07-12 Sumitomo Bakelite Co Ltd Resin composition, prepreg, laminate plate, resin sheet, printed wiring board, and semiconductor device
CN105542128A (en) * 2015-12-15 2016-05-04 广䞜广山新材料有限公叞 Curing agent for epoxy resin as well as preparation method and application thereof
JP6354884B1 (en) * 2017-03-13 2018-07-11 暪浜ゎム株匏䌚瀟 Cyanate ester resin composition and prepreg
CN110655791B (en) * 2019-09-30 2022-03-01 艟蒙特成郜新材料科技有限公叞 High heat-resistant low-dielectric active ester resin composition and preparation method of laminated board

Also Published As

Publication number Publication date
JPS62146927A (en) 1987-06-30

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