JPH03257922A - Both surface processing equipment of substrate - Google Patents

Abstract

PURPOSE:To simultaneously process both surfaces under the same condition, and improve productivity, by constituting a conveying system so as to be able to carry substrates in the parallel direction while they are vertically stood, and arranging treating liquid feeding pipes in parallel with the substrate surface, on both sides in the substrate thickness direction. CONSTITUTION:While a rod belt 13 is rotated, a substrate 2' wherein masking exposure is finished and treatment is not finished is inserted into a substrate retaining tool 14 of the rod belt 13, at a substrate supplying point P1. Etching liquid is supplied in a main pipe 15. Pure water is supplied in a main pipe 16. Each of the feeding pipes 15a, 15b, and 16a, 16b is rocked by a shaft rotating mechanism 7. Then the etching liquid is jetted from nozzles 15c of the etching liquid feeding pipes 15a, 15b. The pure water is jetted from nozzles 16c of the pure water feeding pipes 16a, 16b. Since liquid of the same pressure is sprayed against both surfaces of a substrate in a standing state from the outside of each surface, the substrate 2 is not moved to the substrate retaining tool 14 during process, and both surfaces of the substrate can be processed under the same condition.

Description

[Detailed description of the invention] [Summary] Regarding a surface treatment device for both sides of a substrate such as a semiconductor wafer, the purpose is to improve productivity by processing both sides at the same time and under the same conditions. A double-sided processing device for a substrate that performs a predetermined process on both sides of a substrate that is transported to a substrate, the substrate holder is used to detachably hold the substrate so that at least the processing area on both sides of the substrate is exposed. A conveyance system arranged in a line parallel to the conveyance direction, at least in the area where the substrate is mounted, at positions corresponding to the substrate holder on both sides of the conveyance system in the width direction, parallel to the conveyance direction. and fluid supply pipes fixedly arranged in parallel, and each fluid supply vibrator includes at least a plurality of nozzles directed toward the substrate mounted on the substrate holder.

[Industrial application field]

The present invention relates to a double-sided processing process for substrates such as semiconductor wafers,
In particular, the present invention relates to a double-sided processing apparatus for substrates that improves productivity by processing both sides simultaneously and under the same conditions.

In recent years, in the field of semiconductor device manufacturing, etching and other treatments are often applied to both sides of substrates such as wafers.
Even in such a case, it is necessary to uniformly process a large number of substrates in a short time to improve productivity.

[Conventional technology]

FIG. 2 shows the configuration of an example of a conventional double-sided processing apparatus, and the figure shows an example in which etching processing is performed on both sides of a wafer substrate after masking exposure.

Note that for ease of understanding, the casing housing the double-sided processing apparatus is omitted in the figure.

In the figure, a transport system 1 includes a transport belt 3 having windows 3a of a size sufficient to cover at least an etching area of a wafer substrate to be processed (hereinafter simply referred to as a substrate) 2 at equal intervals along the longitudinal direction. and two drive wheels 4a and 4b that rotate the conveyor belt 3 in the direction a in the figure.

Further, the unprocessed substrates 2°, which are slightly larger than the window 3a, are supplied one by one onto the window 3a of the belt 3 as indicated by the arrow from a supply mechanism (not shown) at the supply side end of the conveyance system l. The processed substrates 2'' are sent from the take-out end of the transport system 1 to a stocker (not shown) as indicated by arrow C.

Further, at corresponding positions on the upper and lower sides sandwiching the conveying system 1 in an area near the supply side end of the conveying system 1, an etching liquid supply pipe is provided with a plurality of nozzles 5c aligned parallel to the conveying belt 3. 5a and 5b are arranged to be connected to the main pipe 5, and in corresponding positions on the upper and lower sides sandwiching the conveyance system 1 in the region near the end of the take-out side of the conveyance system 1, Cleaning pure water supply vibros a and 6b each having a plurality of nozzles 6c arranged in parallel with the belt 3 are connected to the main vibro.

In particular, each of these supply pipes 5a, 5b and 6a, 6b has a shaft rotation mechanism section 7 at the connecting portion with the main pipes 5 and 6.
is interposed therebetween, and the nozzles 5c and 6c are rotated or oscillated by α degrees on both sides of the position facing the conveyor belt 3, that is, by 2α, by the shaft rotation mechanism 7.

Note that the shaft rotation mechanism section 7 is connected to each supply pipe 5a, 5b, and 6a.
, 6b is necessary for uniformly spraying the etching liquid and pure water ejected from the nozzles 5C and 6c onto the substrate surface.

Therefore, while rotating the conveyor belt 3 in the direction a at a speed of, for example, 20 to 30 mm/sec, the substrate 2° which has not been subjected to the masking exposure method is supplied onto the window 3a of the conveyor belt 3, and the main pipe 5 is A mixed solution of sulfuric acid and hydrogen peroxide is supplied as an etching solution, and pure water is supplied to the main vibro, and each supply pipe 5a, 5b and 6a, 6b is swung by the shaft rotation mechanism 7 for one cycle of about 72 seconds. Then, the upper surface of the substrate 2' is etched by the etching liquid spouted as shown by the arrow d from the nozzle 5c of the etching liquid supply pipe 5a located at the upper part of the transport system 1, and the upper surface of the substrate 2'
The lower surface of the etching liquid is ejected from the nozzle 5c of the etching liquid supply pipe 5b located at the lower part of the conveyance system 1, and the window 3a of the conveyance belt 3 is
It will be etched with the etching solution shown by the arrow d° passing through.

In the cleaning step after a predetermined period of time has elapsed, the upper surface of the substrate 2' is cleaned with pure water jetted from the nozzle 6C of the deionized water supply vibro a as shown by the arrow e, and the lower surface is cleaned by the deionized water supply vibro b.
It will be cleaned with pure water as indicated by the arrow e'' which is ejected from the nozzle 6c.

There, the cleaned substrate is taken out from the take-out side end of the transport system 1 in the direction of arrow C, and the required processed substrate 2 is removed.
Get ′′.

With such a double-sided substrate processing apparatus, double-sided processing can be easily and efficiently performed.

However, the process liquid blown up from the nozzle located below lifts the substrate from the conveyor belt, which may cause the substrate to move, and it also has the drawback that it is difficult to process the area near the contact area of the lower surface of the substrate with the conveyor belt. .

Furthermore, since the upper surface of the substrate is treated with a treatment liquid sprayed from above, and the lower surface is treated with a treatment liquid sprayed from below, the treatment conditions for both sides of the substrate may be different.

[Problem to be solved by the invention]

Conventional double-sided processing equipment has problems in that the processing area fluctuates, it is difficult to process the area near the bottom of the substrate where it contacts the conveyor belt, and it is said that it is difficult to equalize the processing conditions on both sides of the substrate. There was a problem.

[Means to solve the problem]

The above-mentioned problem is a double-sided processing device for substrates that performs predetermined processing on both sides of substrates that are individually transported by a transport system. a transport system in which substrate holders are arranged in a row so that the substrate surfaces are parallel to the transport direction; and fluid supply pipes fixedly arranged parallel to the conveyance direction at corresponding positions across the substrate, each fluid supply pipe having at least a plurality of nozzles directed toward the substrate mounted on the substrate holder. This problem can be solved by a double-sided processing device for substrates.

[For production]

By spraying processing liquid under the same conditions on both sides of a vertically erected substrate, it is possible to easily hold the substrate and to equalize the processing conditions on both sides of the substrate.

In the present invention, the transport system is installed at the bottom of the tank so that the substrate can be moved in a direction parallel to the surface while standing vertically, and processing liquid supply pipes are arranged on both sides of the substrate in the thickness direction. This constitutes a double-sided processing device for substrates.

Therefore, the processing area of the substrate does not vary or the processing conditions on both sides of the substrate do not differ, so that both sides of the substrate can be processed with high productivity.

〔Example〕

FIG. 1 is a diagram showing an example of the configuration of a double-sided substrate processing apparatus according to the present invention.

In the figure, as in FIG. 2, a double-sided etching process is performed on a wafer substrate that has been subjected to masking exposure, and the casing housing the double-sided processing apparatus is omitted.

In the figure, the conveyance system 11 includes a rod belt 13 connected by a chain (not shown) that rotates in one direction, for example, by two drive wheels 12a and 12b, and a plurality of rods that connect the rod bell port 3 to the bottom of the tank. It is composed of a plurality of aligned substrate holders 14 that are mounted between each set of two adjacent rods 13a so as to be able to move following the rotation of the rod belt 13.

In particular, the shape of the rod belt 13 when viewed from the width direction is “ko”.
The substrate holder 14, which is installed in the shape of a square and with its opening facing outward, holds a wafer substrate (hereinafter referred to as a substrate) similar to that shown in FIG.
A V-groove 14a is formed into which the V-groove 2 can be inserted in the width direction.

This means that when the substrate holder 14 is located above the rod belt 13, the opening of the substrate holder 14 faces upward, so the substrate 2 can be attached and detached along the V-groove 14a, and the substrate Both sides of the rod belt 13
This means facing in the width direction.

Therefore, the unprocessed substrate 2° is inserted into the substrate holder 14 as shown by the arrow by a feeding mechanism (not shown) at the substrate feeding position (point 11 in the figure) in the upper area of the rod belt 13, and the predetermined value Behind the W p + point (right side in the figure)
By taking out the substrate 2'' that has been processed at the substrate take-out position (12 points in the figure) in the direction of arrow c using a supply mechanism (not shown), it is possible to transport the substrate 2 for a predetermined distance in an upright state. can.

On the other hand, at positions across the substrate holder 14 on both sides of the rod belt 13 located on the upper side in the area near the substrate supply position of the transport system 11, there are a plurality of rod belts parallel to the rod bell opening 3. Etching liquid supply pipes 15a and 15b equipped with aligned nozzles 15c are connected to the main pipe 15, and the rod bell port 3 located at the upper side of the transport system 11 is connected to the main pipe 15. Pure water supply pipes 16a and 16b each having a plurality of nozzles 16c arranged in parallel with the Rondo belt 13 are connected to the main pipe 16 and arranged at corresponding positions across the substrate holder 14 on both sides in the width direction. It is set up.

Note that each of these supply pipes 15a, 15b and 16a,
As in the case of FIG. 2, 16b has the shaft rotation mechanism section 7 explained in FIG. 2 interposed in the connecting portion with the main pipes 15 and 16.

Therefore, each supply pipe 1 is
5a, 15b and 16a, 16b as well as the nozzle 15c,
16C can be swung vertically to the surface of the substrate 2 inserted into the substrate holder 14 by α degrees, that is, by 2α, both above and below.

Therefore, as in FIG. 2, the rondo belt 13 is
While rotating in the a direction at a speed of 0+nm/sec, mask the exposed and unprocessed substrate 2 at the substrate supply position 1 p + point.
2 into the substrate holder 14 of the Rondhert 13, the main pipe 15 is supplied with the etching solution explained in FIG. When the etching solution 16b is oscillated by the shaft rotation mechanism 7 at a rate of about 1 cycle/2 seconds, the etching solution is ejected from the nozzles 15c of the etching solution supply pipes 15a and 15b as shown by the arrow d, and the pure water supply pipe is Pure water is ejected from the nozzles 16c of the nozzles 16a and 16b as shown by arrow e.

Therefore, since both sides of the substrate 2° are simultaneously etched with the etching solution and both sides are cleaned with pure water in the cleaning process after a predetermined period of time, the substrate can be taken out at 12 substrate removal positions. The required processed substrate 2'' can be easily obtained.

In particular, in such a double-sided substrate processing apparatus, since liquid at the same pressure is sprayed from the outside of each side onto both sides of a standing substrate, the substrate 2 may move relative to the substrate holder 14 during the process. Furthermore, it is easy to process both sides of the substrate under the same conditions.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to provide a double-sided processing apparatus for substrates that processes both sides simultaneously and under the same conditions to improve productivity.

Although the present invention will be explained using a liquid in both the etching process and the cleaning process, the same effect can be obtained even if a gas is used in the drying process after processing. .

Further, although the present invention has been described with reference to the case where an etching liquid supply pipe and a pure water supply pipe are installed, the same effect can be obtained even if the number of these fluid supply pipes is increased or decreased depending on the process.

figure, It is.

In the figure, 2.2', 2'' are wafer substrates (substrates), 7 is a shaft rotation mechanism, 11 is a transport system, 12a, 12b are drive wheels, 13
is a rond belt, 13a is a rond, 14 is a substrate holder, 14a is a groove, 15 and 16 are main pipes, 15a and 15b are etching liquid supply pipes (fluid supply pipes), 16a and 16b are pure water supply pipes (fluid supply pipes). supply pipe)
, 15c and 16c represent nozzles, respectively.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an example of the configuration of a substrate double-sided processing apparatus according to the present invention;

Claims (1)

[Scope of Claims] A double-sided processing device for substrates that performs predetermined processing on both sides of substrates that are individually transported by a transport system, wherein the substrates (2) are processed so that at least processing areas on both sides of the substrates are exposed. A transport system (11) in which removably held board holders (14) are arranged in a line so that the substrate surfaces are parallel to the transport direction; and at least the board (2) of the transport system (11) is mounted. Fluid supply pipes (15a, 15b) fixedly arranged in parallel to the transport direction at corresponding positions across the substrate holder (14) on both sides of the transport system (11) in the width direction of the area where the transport system (11) is transported.
each of the fluid supply pipes (15a, 15b) includes at least a plurality of nozzles (15c) directed toward the substrate (2) mounted on the substrate holder (14). Double-sided processing equipment for printed circuit boards.