JPH03257842A - Holding device for electronic component - Google Patents

Abstract

PURPOSE:To prevent the deformation of the electrode of an electronic component by bringing the electrode of the electronic component into contact with the electrode of a supporting base so as to press it and providing a holding means which can move relatively to a pressurizing part in the direction orthogonal to the surface of the supporting base. CONSTITUTION:The main body of an electronic component 19 which is attracted by a vacuum to an attraction edge 54 is brought into contact with an attraction bar 16, the main body is directed to the surface of a supporting base 14 while being sandwiched by a holding axis 51 and the attraction bar 16 and an electronic component electrode 20 is brought into contact with an electrode 15. Then, an electronic component holding part 69 comes closer to the surface of the supporting base 14 and the electronic component electrode 20 receives the reaction force from the electrode 15. The holding axis 51 is pressed into a pressurizing axis 6 by the reaction force, the electronic component electrode 20 is brought into contact with a pressurizing plate 55 and they are pressed into a supporting cylinder 2 being integrated with the pressurizing axis 6. A pressurizing spring 11 is compressed by such action and the contact power between the electrodes is given through a pressurizing plate 55.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a gripping device for electronic components in an apparatus for measuring the electrical characteristics of semiconductor electronic components.

[Prior Art] FIG. 7 is a fragmented cross-sectional view showing a conventional gripping device for electronic components. In FIG. 0, (1) is a movable arm, and (2) is a movable arm
) is fitted and fastened to the support tube, (3) is the movable arm (
1) is a cantilever base fastened to, (4) is a pressure adjustment screw,
The inner cylinder surface is a sliding surface. (5) is a fixing nut,
(6) is a pressurizing shaft, which is provided with a shaft hole (7) for vacuum suction. (8) is a suction end, which is a part that suctions and holds electronic components. (9) is a joint to which a vacuum suction tube (not shown) is attached. (10) is a lateral slip prevention plate which is removably fastened to the outer surface of the pressurizing shaft (6) with the suction end (8) in between. A pressure spring (11) is inserted into the pressure shaft (6) and disposed between the stepped portion of the pressure shaft (6) and the pressure adjustment screw (4). (1
2) is a position adjustment nut, and (13) is a locking nut. The spring stiffness of the pressure spring (11) is such that sufficient contact pressure can be obtained when performing electrical tests on electronic components, and the pressure adjustment screw (4) is used to set the contact pressure. Ru0
The assembly having the configurations (2) to (13) above is named an electronic component gripping section (30).

(14) is a support base, and an electrode (15) is provided on the upper surface of the support base so as to allow slight elastic displacement. (
16) is a suction bar, which is movable by a drive mechanism (not shown).

(17) is a vacuum suction hole, and (18) is a suction end, both of which are provided on the suction bar. (19) is an electronic component, (
20) is an electronic component electrode.

FIG. 8 is a partial side view of the conventional example, taken along line II in FIG. 7.

Next, the operation will be explained.

Electronic components are arranged in an electronic component positioning section (not shown). The electronic component gripping part (30) is moved to that position by the movable arm (1), and the suction end (8) is moved by vacuum suction.
) electronic components are attracted. After that, the electronic component gripping section (30) is moved by the movable arm (1), and the electronic component (19) is moved.
FIG. 9 is a front view illustrating a state in which the electronic component (19) is opposed to the support base (14). From this position, the electronic component gripping section (30
) is moved toward the surface of the support base (14) by the movable arm (1), and the electronic component (19) is moved by the suction bar (16) on the way.
) while holding the electronic component electrode (20) in contact with the electrode (15). At this time, the pressure spring (11) is compressed to generate a contact force between the electrodes, and in this state, an electrical property test of the electronic component (19) is performed. Figure 1 theta is electronic part 8 electricity! (
20> is a front view illustrating a state in which the electrode (15) is in contact with the electrode (15). The T dimension in Figure 10 is the dimension from the tip of the lateral slip prevention plate (lO) to the bottom of the electronic component electrode (20) when the top surface of the electronic component (19) is vacuum-suctioned by the suction end (8). be. In addition, after the electronic component (19) is vacuum-suctioned to the suction end (8), the lateral slip prevention plate (lO) moves when the electronic component (19) is moved by the suction end (8), and the shaft hole (7)
) This is a member to prevent it from coming off. After the electrical property test is completed, the electronic component gripping section (30) is attached to the support stand (14).
Keep the electronic components (19) away from the surface of the suction bar (16).
, and return to the electronic component positioning section. Suction bar (16
The electronic component (19) left in the electronic component (19) is held by another electronic component gripping section (30) and transported to a device for the next process (not shown).

[Problems to be Solved by the Invention] Since the conventional electronic component gripping device is configured as described above, it has the following problems.

FIG. 11 is a side view of the electronic component (19).

The dimension in this figure is the dimension from the bottom of the main body of the electronic component (19) to the bottom of the electronic component electrode (20), and in recent years electronic component users have been required to strictly control the dimensions. ing.

Now, the T dimension shown in Fig. 10 shown earlier should ideally be the same as the wall thickness of the electronic component electrode (20), but the forming of the electronic component electrode (20) can be done by plastic working using a mold. If the T dimension is smaller than the wall thickness of the electronic component electrode (20), the electronic component (19)
A gap is created between the top surface and the suction end (14), and the electronic component (1)
9) cannot be vacuum suctioned. For this reason, electronic component electrodes (
It is normal to make the T dimension larger than the wall thickness of 20). However, if the T dimension is too large than the wall thickness of the electronic component electrode (20), after the electronic component electrode (20) and the electrode (15) come into contact, the electronic component electrode (20) will be deformed due to the contact force, causing the initial There was a problem that the planned dimensions could no longer be obtained.

This invention was made to solve the above-mentioned problems, and aims to improve the quality of electronic components by preventing deformation of electrodes of electronic components due to contact force.

[Means for Solving the Problems] A gripping device for electronic components according to the present invention includes a pressurizing means for moving an electrode of an electronic component to an electrode of a support base, and a pressurizing means attached to the pressurizing means to move an electrode of an electronic component to an electrode of a support base. A gripping means that has a pressure part that contacts and presses the electrode of the support base, and a suction end at a position opposite to the surface of the support base, and is movable relative to the pressure part in a direction perpendicular to the surface of the support base. It is equipped with the following.

[Function] In the electronic component gripping device of the present invention, the suction end that vacuum-chucks the electronic component can move relative to the pressurizing part that pressurizes the electrode of the electronic component, so that the force that presses the electrode is reduced. Do not deform the electrodes of electronic components.

[Embodiments of the invention] The invention will be explained below with reference to the drawings.

FIG. 1 is a fragmented sectional view showing an embodiment of the present invention.
The configurations (1) to (5), (9), and (11) to (20) are the same as those of the conventional example, so their explanations will be omitted.

In the figure, the pressure shaft (6) is the upper shaft (40) and the lower shaft (41).
The upper shaft (40) is screwed into the lower shaft (41) to be integrated. (50) is a through hole provided in the pressurizing shaft (6). (51) is a gripping shaft which can slide within the through hole (5o) and has both ends protruding from the pressurizing shaft (6). Furthermore, the gripping shaft (51) has a flange portion, and this flange portion is directly supported within the through hole (50) by the stepped portion of the lower shaft (41), and is disposed between it and the upper shaft (40). It is loosely restrained by a return spring (52) provided.

(53) is a shaft hole for vacuum suction, and a suction end (54) for suctioning and holding an electronic component is attached to one end of the gripping shaft (51) passing through the gripping shaft (51), and the other The end has a joint (not shown) for a vacuum suction tube (not shown).
9) is connected to the suction end (54) of the zero gripping shaft (51).
) A pressure plate (55) made of an insulator is removably fastened to the outer surface of the pressure shaft (6) with screws. This pressure plate (55) is the conventional lateral slip prevention plate (10
), it not only prevents the electronic component (12) from moving at the suction end (54), but also prevents the contact pressure between the electrodes from moving through this pressure plate (55), as described in the explanation of the operation. A corner portion (56) of this pressure plate (55) that contacts the child component electrode (20) is rounded to prevent scratches on the electronic component electrode (20). In order to prevent the electronic component electrode metal from being transferred to the tip surface of the pressure plate (55) and electrically conducting between the electronic component electrodes, the pressure plate (55) is attached as shown in FIG. 2 shown later. 5
- of the electronic component electrode (20) in the longitudinal direction of the tip surface of 5).
Notch edges (57) are provided at pitch intervals wider than the width of the book and narrower than the width of the electronic component electrodes (20).

The spring stiffness relationship between the return spring (52) and the pressure spring (ll) is that the return spring (52) is smaller, and the electronic component electrode (20) is gripped by the contact force when it comes into contact with the electrode (15). The setting is such that the shaft (51) can be sufficiently pushed into the pressurizing shaft (6).

These (2) to (6), (9), (11) to (I3), (
50) to (56) are placed in the electronic component gripping section (6).
0).

Further, in the above configuration, for example, the gripping shaft (51), the return spring (52), and the joint (9) are connected to the gripping means (100).
), the pressure shaft (6), the pressure plate (55) and the pressure spring (1
1), the position adjustment nut (12), and the locking nut (13) are used as a pressure part (101), and the movable arm (1), the support tube (2), the cantilever base (3), and the pressure adjustment screw ( 4), the fixing nut (5), the gripping means (100), and the pressurizing part (101) are used as a pressurizing means (102).

Next, the operation will be explained.

The electronic component is sucked by the electronic component holding section (60) at the electronic component positioning section (not shown), and the electronic component is placed on the support base (14).
facing the surface.

FIG. 2 is a side view showing the electronic component (19) facing the electrode (15), and FIG. 3 is a front view thereof. From this position, the electronic component gripping section (60) is moved toward the surface of the support base (14) in a direction perpendicular to the surface. The process up to this point is the same as the conventional example. Thereafter, the main body of the electronic component (19) vacuum-suctioned by the suction end (54) first comes into contact with the suction bar (16) and is held between the gripping shaft (51) and the suction bar (16) while the main body of the electronic component (19) ) toward the surface of the electronic component electrode (20). Contact (15). After this, the electronic component gripping part (60) further approaches the surface of the support base (14), and the electronic component electrode (20) receives a reaction force from the electrode (15), and this reaction force causes the grip shaft (51
) is first pushed into the pressure shaft (6) and the electronic component electrode (20
) and the pressure plate (55) come into contact with each other, and are then pushed into the support cylinder (2) together with the pressure shaft (6). This movement compresses the pressure spring (11), and the pressure plate (55)
The contact force between the electrodes is applied through the contact force between the electrodes. FIG. 4 is a side view illustrating a state in which the electronic component electrode (20) is in contact with the electrode (15), and FIG. 5 is a front view thereof.

After the electrical property test, the electronic component gripping section (60) is placed on the support stand (
14), and in the middle of the movement, the gripping shaft (51) is returned by the return spring (52) to the direction in which it projects from the pressing shaft (6). The following operation is similar to the conventional example.

FIG. 6 is a fragmented cross-sectional view showing another embodiment of the present invention, and the configurations (1) to (9) and (11) to (20) are the same as those of the conventional example, so explanations thereof will be omitted.

In FIG. 6, a pressure plate (55) is removably fastened to the outer surface of the pressure shaft (6) in place of the lateral slip prevention plate (lO) fastened to the outer surface of the pressure shaft (6). Also, the pressure shaft (6)
Pressure shaft (6) is applied by contact force to the shaft end on the support stand (14) side.
The gripping means (70) is connected to a gripping means that can be compressed and deformed in the axial direction, for example, a plastic gripping body (70), which is connected to the shaft hole (7) of the pressurizing shaft (6). A shaft hole (71) is provided therein. The shaft end of the pressurizing shaft (6) and the gripping body (70) are connected at the joint surface to prevent vacuum leakage.The rigidity required for the gripping body (70) is determined by the contact force between the electrodes. (70) is deformed, and the grip body (70)
The electronic component electrode (20) of the electronic component (19) vacuum-suctioned to the suction end (72) of the electronic component (19) needs only to be stiff enough to contact the pressure plate (55). The same operation as in the previous embodiment can be easily realized.

Further, in the above embodiment, a testing device for electronic components has been described, but other devices such as a device for correcting the electrode shape of electronic components may be used, and the same effects as in the above embodiments can be obtained.

[Effects of the Invention] The present invention includes a pressurizing section that presses an electrode of an electronic component into contact with an electrode of a support base, and a gripping means that is movable relative to the pressurizing section in a direction perpendicular to the surface of the support base. Since it is configured to have such a structure, deformation of the electrodes of the electronic component is prevented and the quality of the electronic component is improved.

4,

[Brief explanation of drawings]

FIG. 1 is a fragmented cross-sectional view showing one embodiment of the present invention, FIGS. 2 and 3 are side and front views for explaining the opposing relationship between the electronic component and the support base according to the above-mentioned embodiment, and FIG. 4 and 5 are a side view and a front view for explaining the contact state of electronic component electrodes according to the above embodiment, FIG. 6 is a fragmented sectional view showing another embodiment of the present invention, and FIG. 7 is a FIG. 8 is a partial side view of FIG. 7, FIG. 9 is a front view illustrating the opposing relationship between the electronic component and the support base according to the conventional example, and FIG. 1θ is a conventional example. FIG. 11 is a front view for explaining the contact state of the electronic component electrodes, and FIG. 11 is a side view of the electronic component. (14) is a support base, (100) is a gripping means, (101)
is a pressurizing section, and (102) is a pressurizing means. In the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Scope of Claims] A support base for an electronic component comprising a main body made of an insulator and an electrode protruding from the main body, the support base having an electrode on its surface with which the electrode comes into contact; a pressurizing means that is movable in a direction orthogonal thereto and that moves the electrodes of the electronic component to a position facing the electrodes of the support base; a pressurizing part that contacts and presses the electrode of the support base; a suction end that is attached to the pressurizing means and has a vacuum suction hole formed at a position facing the surface of the support base; A gripping device for an electronic component, comprising a gripping means that is movable relative to the surface of the support base in a direction perpendicular to the surface of the support base.