JPH03247497A - Memory card - Google Patents

Memory card

Info

Publication number
JPH03247497A
JPH03247497A JP2044599A JP4459990A JPH03247497A JP H03247497 A JPH03247497 A JP H03247497A JP 2044599 A JP2044599 A JP 2044599A JP 4459990 A JP4459990 A JP 4459990A JP H03247497 A JPH03247497 A JP H03247497A
Authority
JP
Japan
Prior art keywords
card
printed circuit
circuit board
opening
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2044599A
Other languages
Japanese (ja)
Inventor
Kyoichi Kohama
京一 小浜
Yoshio Imai
今井 吉男
Kimitaka Koseki
小関 公崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP2044599A priority Critical patent/JPH03247497A/en
Publication of JPH03247497A publication Critical patent/JPH03247497A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To effectively prevent the warpage of a card and to prevent the adhesion of dust or oils to the terminal part of a printed circuit board by providing an upper beam part between the upper surface opening and insertion opening of a card substrate and providing a lower beam part in the vicinity of the insertion opening to cover the upper surface opening with a sheet. CONSTITUTION:An upper beam part 11 is formed between upper surface openings 13 and an insertion opening 21, that is, to the upper end edge where the upper surface 16 and side end surfaces 15 of a card substrate 1 are bonded. Further, a lower beam part 12 is formed in the vicinity of the insertion opening 21, that is, at the oblique lower position opposed to the upper beam part 11. A printed circuit board 2 is inserted in the card substrate 1 from the under surface 17 thereof to be fixed to the substrate and a wide sheet 19 is bonded to the upper surface 16 of the card substrate 1 to simultaneously close all of the upper surface openings 13. By providing the upper beam part and the lower beam part in an opposed state, the end part of the card substrate is mechanically reinforced and, since the upper surface openings are covered with the sheet, no dust or oil is bonded and no contact inferiority is generated.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、カード本体に内蔵された半導体素子に情報を
記憶させるメモリカードに関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a memory card that stores information in a semiconductor element built into a card body.

〔従来の技術〕[Conventional technology]

第6図ならびに第7図は、従来のメモリカードを説明す
るための図である。メモリカードは合成樹脂で成形され
たカード基板3と、それの下側から嵌入されるプリント
基板4とから主に構成されている。
FIG. 6 and FIG. 7 are diagrams for explaining a conventional memory card. The memory card is mainly composed of a card substrate 3 made of synthetic resin and a printed circuit board 4 that is inserted from below.

第6図に示すようにカード基板3の端部近くには、それ
の側端面32から上面33にかけて溝状のコンタクトス
ペース31が所定数並設されている。図中の36はコン
タクトスペース31を区切るための側壁、34は台座、
35は透孔である。
As shown in FIG. 6, near the end of the card board 3, a predetermined number of groove-shaped contact spaces 31 are arranged in parallel from the side end surface 32 to the top surface 33 thereof. 36 in the figure is a side wall for dividing the contact space 31, 34 is a pedestal,
35 is a through hole.

一方、プリント基板4の一方の端部近くには所定数の端
子部41が並設されているとともに、半導体素子(図示
せず)が搭載されている。このプリント基板4をカード
基板3の下側から嵌入して組合わせることにより、前記
端子部41がそれぞれ透孔35を介してコンタクトスペ
ース31に臨むようになっている。
On the other hand, a predetermined number of terminal portions 41 are arranged in parallel near one end of the printed circuit board 4, and a semiconductor element (not shown) is mounted thereon. By fitting and assembling the printed board 4 from below the card board 3, the terminal portions 41 each face the contact space 31 through the through hole 35.

第5図はメモリカードをコネクター5に差し込んだ状態
で示しており、メモリカードの先端部をコネクター5の
開口部52に挿入することにより、カンチレバーコネク
ター51がそれぞれ前記コンタクトスペース31に入り
込み、その先端がプリント基板4の端子部41と接触す
るようになっている。
FIG. 5 shows a memory card inserted into the connector 5, and by inserting the tip of the memory card into the opening 52 of the connector 5, the cantilever connectors 51 enter the contact spaces 31, and the tips of the memory cards are inserted into the openings 52 of the connector 5. comes into contact with the terminal portion 41 of the printed circuit board 4.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで従来のメモリカードは第3図に示すように、カ
ード基板3のコンタクトスペース31の部分においては
上面33から側端面32にかけて連続して開口しており
、ちょうど溝状に切り込まれた状態となっている。しか
もこの溝状に切り込まれた状態がカード基板30幅方向
のほぼ全長にわたって続いているから、カード基板3の
幅方向における機械的強度が弱くわん曲しやすい。
By the way, as shown in FIG. 3, in a conventional memory card, the contact space 31 of the card board 3 has a continuous opening from the top surface 33 to the side end surface 32, and is in the form of a groove-shaped cut. It has become. Furthermore, since this groove-shaped cut continues over almost the entire length of the card substrate 30 in the width direction, the mechanical strength of the card substrate 3 in the width direction is weak and easily bends.

メモリカードがわん曲すると、プリント基板の導電パタ
ーンが基板から剥がれたり、半導体素子とプリント基板
との接続が離れたり、甚だしいときには半導体素子の損
傷をきたす。
When a memory card is bent, the conductive pattern on the printed circuit board may be peeled off from the substrate, the semiconductor element and the printed circuit board may become disconnected, and in severe cases, the semiconductor element may be damaged.

また、コンタクトスペース31の上面が開放され、その
結果、端子部41が露呈した状態となっている。そのた
め端子部41にゴミや油類が付着し、端子部での接触不
良を生じる心配がある。
Further, the upper surface of the contact space 31 is opened, and as a result, the terminal portion 41 is exposed. Therefore, there is a fear that dust and oil may adhere to the terminal portion 41, resulting in poor contact at the terminal portion.

本発明の目的は、このような従来技術の欠点を解消し、
動作信顛性の高いメモリカードを提供することにある。
The purpose of the present invention is to eliminate such drawbacks of the prior art,
An object of the present invention is to provide a memory card with high operational reliability.

〔課題を解決するための手段〕[Means to solve the problem]

前記目的を達成するため、本発明は、 半導体素子を搭載し、一方の端部近くに所定数の端子部
を並設したプリント基板と、 下面側に前記プリント基板が嵌入される幅広の凹部を有
し、一方の端部近くにその凹部と連通ずる空洞状のコン
タクトスペースを所定数並設したカード基板とを備え、 そのカード基板の凹部に前記プリント基板を嵌入して、
プリント基板の端子部をカード基板のコンタクトスペー
スにそれぞれ臨ませたメモリカードにおいて、 前記カード基板の上面に前記コンタクトスペースと連通
ずる上面開口を、カード基板の側端面にコンタクトスペ
ースと連通ずる挿入開口を、それぞれ形成し、 その上面開口と挿入開口との間に上梁部を設け、挿入開
口付近に下梁部を設けて、各上面開口をシートで覆った
ことを特徴とするものである。
In order to achieve the above object, the present invention includes: a printed circuit board on which a semiconductor element is mounted and a predetermined number of terminals arranged in parallel near one end; and a wide recess into which the printed circuit board is inserted on the lower surface side. and a card board in which a predetermined number of hollow contact spaces communicating with the recess are arranged in parallel near one end thereof, and the printed circuit board is fitted into the recess of the card board,
In a memory card in which the terminal portions of the printed circuit board face the contact spaces of the card board, the top surface of the card board has a top opening that communicates with the contact space, and the side end surface of the card board has an insertion opening that communicates with the contact space. , respectively, an upper beam portion is provided between the upper surface opening and the insertion opening, a lower beam portion is provided near the insertion opening, and each upper surface opening is covered with a sheet.

〔作用〕[Effect]

本発明は前述のように、カード基板の上面開口と挿入開
口との間、すなわちカード基板の上面と側端面とが接合
する上端縁に上梁部を設け、挿入開口付近、すなわち前
記上梁部と対向する位置に下梁部を設けることにより、
カード基板における端部付近の機械的強度が増し、従来
のようなメモリカードのわん曲を有効に防止することが
できる。
As described above, the present invention provides an upper beam portion between the upper surface opening of the card board and the insertion opening, that is, at the upper edge where the upper surface and the side end surface of the card board join, and near the insertion opening, that is, the upper beam portion. By providing the lower beam at a position facing the
The mechanical strength near the edge of the card substrate is increased, and the conventional bending of the memory card can be effectively prevented.

また、上面開口はシートによって覆われるため、プリン
ト基板の端子部へのゴミや油類などの付着がなく、端子
部での接触不良を改善することができる。
In addition, since the upper surface opening is covered with the sheet, dust, oil, etc. do not adhere to the terminal portion of the printed circuit board, and poor contact at the terminal portion can be improved.

〔実施例〕〔Example〕

次に本発明の実施例を図面とともに説明する。 Next, embodiments of the present invention will be described with reference to the drawings.

第1図ないし第5図は本発明の詳細な説明するためのも
ので、第1図はメモリカードの平面図、第2図はメモリ
カードの断面図、第3図はカード基板の要部斜視図、第
4図はカード基板の断面図、第5図はメモリカードをコ
ネクタに差し込んだ状態を示す要部断面図である。
Figures 1 to 5 are for explaining the present invention in detail. Figure 1 is a plan view of the memory card, Figure 2 is a sectional view of the memory card, and Figure 3 is a perspective view of the main parts of the card board. FIG. 4 is a sectional view of the card board, and FIG. 5 is a sectional view of main parts showing a state in which a memory card is inserted into a connector.

第2図に示すようにメモリカード10は、合成樹脂で成
形されたカード基板1と、プリント基板2と、合成樹脂
シートあるいは金属薄板からなるシート19とから主に
構成されている。
As shown in FIG. 2, the memory card 10 is mainly composed of a card substrate 1 molded from synthetic resin, a printed circuit board 2, and a sheet 19 made of a synthetic resin sheet or a thin metal plate.

カード基板1は第3図および第4図に示すように、それ
の一方の端部近くにはコンタクトスペース14が、プリ
ント基板2の端子部22の数に対応して形成されている
。カード基板1の上面16にはこのコンタクトスペース
14と連通ずる上面開口13が、カード基板1の側端面
15にはコンタクトスペース14と連通ずる挿入開口2
1が、それぞれ形成されている。
As shown in FIGS. 3 and 4, the card board 1 has contact spaces 14 formed near one end thereof corresponding to the number of terminal portions 22 of the printed circuit board 2. As shown in FIGS. The upper surface 16 of the card substrate 1 has an upper opening 13 communicating with the contact space 14, and the side end surface 15 of the card substrate 1 has an insertion opening 2 communicating with the contact space 14.
1 are formed respectively.

前記上面開口13と挿入開口21との間、すなわちカー
ド基板lの上面16と側端面15とが接合する上端縁に
は上梁部11が形成されている。
An upper beam portion 11 is formed between the upper surface opening 13 and the insertion opening 21, that is, at the upper edge where the upper surface 16 and the side end surface 15 of the card board l are joined.

また挿入間口21の付近、すなわち前記上梁部11と対
向する斜め下方位置には下梁部12が形成されている。
Further, a lower beam portion 12 is formed in the vicinity of the insertion opening 21, that is, at a diagonally downward position opposite to the upper beam portion 11.

この下梁部12はカンチレバーコネクター61 (第5
図参照)の挿入をスムースにするために傾斜面122が
形成されている。さらにこの傾斜面122の上端部12
1は第2図ならびに第5図に示すようにプリント基板2
の上面より若干高くなっており、カンチレバーコネクタ
ー61との共働により、メモリカード10をコネクター
6に差し込む際、クリック感を付与している。
This lower beam portion 12 is connected to the cantilever connector 61 (fifth
An inclined surface 122 is formed to allow smooth insertion of the (see figure). Furthermore, the upper end 12 of this inclined surface 122
1 is a printed circuit board 2 as shown in FIGS. 2 and 5.
It is slightly higher than the top surface of the connector 6, and works together with the cantilever connector 61 to provide a click feeling when the memory card 10 is inserted into the connector 6.

第4図に示すように、前記上梁部11と下梁部12とは
上下方向において重ならないように配設されている。こ
れはカード基板1を成形する成形金型を2つの割り型と
して、前記下梁部12を成形する金型部分の逃げ穴とし
て上面開口13を利用するためである。
As shown in FIG. 4, the upper beam portion 11 and the lower beam portion 12 are arranged so as not to overlap in the vertical direction. This is because the molding die for molding the card substrate 1 is divided into two molds, and the upper surface opening 13 is used as an escape hole for the mold portion for molding the lower beam portion 12.

さらに第4図に示すようにカード基板1の下面17には
プリント基板2が嵌入する幅広の凹部24と、プリント
基板2に搭載されている各種半導体素子23を収容する
素子収容部18とが設けられている。第2図に示すよう
にカード基板1の下面17からプリント基板2を嵌入し
て固定するとともに、カード基板1の上面16に幅広の
シート19 (第1図参照)を貼り合わせることにより
、このシート19で前記各上面開口13が同時に閉塞さ
れる。このようにしてプリント基板2をカード基板1内
に装着することにより、プリント基板2の一方の端部近
くに所定数並設されている端子部22が、カード基板1
の各コンタクトスペース14に臨むようになっている。
Further, as shown in FIG. 4, the lower surface 17 of the card board 1 is provided with a wide recess 24 into which the printed circuit board 2 is fitted, and an element housing section 18 which accommodates various semiconductor elements 23 mounted on the printed circuit board 2. It is being As shown in FIG. 2, the printed circuit board 2 is inserted and fixed from the bottom surface 17 of the card board 1, and a wide sheet 19 (see FIG. 1) is bonded to the top surface 16 of the card board 1. At 19, each of the upper surface openings 13 is closed simultaneously. By mounting the printed circuit board 2 into the card board 1 in this manner, a predetermined number of terminal portions 22 arranged in parallel near one end of the printed circuit board 2 are connected to the card board 1.
It faces each contact space 14 of.

第5図に示すように、コネクター6のカンチレバーコネ
クター61は下方から上方に向けて斜めに隆起しており
、その先端部がほぼS字状に折曲されている。メモリカ
ード10の先端部をコネクター6の開口部62に挿入す
ると、カンチレバーコネクター61の先端部は下梁部1
2の傾斜面122に沿って相対的に移動し、それの上端
部121を乗り越えてプリント基板2の端子部22と弾
接するようになっている。
As shown in FIG. 5, the cantilever connector 61 of the connector 6 is obliquely raised from the bottom to the top, and its tip is bent into a substantially S-shape. When the tip of the memory card 10 is inserted into the opening 62 of the connector 6, the tip of the cantilever connector 61 is inserted into the lower beam 1.
It moves relatively along the inclined surface 122 of the printed circuit board 2, climbs over the upper end portion 121, and comes into elastic contact with the terminal portion 22 of the printed circuit board 2.

〔発明の効果〕〔Effect of the invention〕

本発明は前述のような構成になっており、上面開口なら
びに挿入開口の付近に上梁部ならびに下梁部を対向状態
に設けることにより、カード基板の端部が機械的に補強
される。そのためわん曲などの変形を生じる心配がなく
、導電パターンの剥がれ、導電パターンと半導体素子の
接触不良ならびに半導体素子の損傷などを生じることが
ない。
The present invention has the above-described configuration, and by providing an upper beam portion and a lower beam portion facing each other in the vicinity of the upper surface opening and the insertion opening, the end portion of the card board is mechanically reinforced. Therefore, there is no concern that deformation such as curvature will occur, and peeling of the conductive pattern, poor contact between the conductive pattern and the semiconductor element, and damage to the semiconductor element will not occur.

また上面開口はシートで覆われるため、ゴミや油類の付
着がなく、コンタクト不良を生じる心配がない。さらに
上面開口をシートで覆うことにより、静電気を帯びた部
材が上面開口から挿入してプリント基板上の導電パター
ンに接触し、半導体素子に悪影響を及ぼすことが阻止さ
れる。このようなことから動作信軌性の高いメモリカー
ドを提供することができる。
Furthermore, since the top opening is covered with a sheet, there is no possibility of dust or oil adhering to it, and there is no risk of contact failure. Further, by covering the top opening with a sheet, a member charged with static electricity is prevented from being inserted through the top opening and coming into contact with the conductive pattern on the printed circuit board, which would adversely affect the semiconductor element. Because of this, it is possible to provide a memory card with high operational reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第1図ないし第5図は本発明の詳細な説明するためのも
ので、第1図はメモリカードの平面図、第2図はメモリ
カードの断面図、第3図はカード基板の要部斜視図、第
4図はカード基板の断面図、第5図はメモリカードをコ
ネクタに差し込んだ状態を示す要部断面図である。 第6図は従来のメモリカードにおけるカード基板の要部
斜視図、第7図はそのメモリカードをコネクタに差し込
んだ状態を示す要部断面図である。 1・・・カード基板、2・・・プリント基板、10・・
・メモリカード、11・・・上梁部、12・・・下梁部
、13・・・上面開口、14・・・コンタクトスペース
、15・・・側端部、16・・・上面、19・・・シー
ト、21・・・挿入開口、22・・・端子部、23・・
・半導体素子、24・・−凹部。 第 ] 図 ]2 ]21 ]8 コ9 ] ]○ 第 図 第 図 第 図 第 図 第 図
Figures 1 to 5 are for explaining the present invention in detail. Figure 1 is a plan view of the memory card, Figure 2 is a sectional view of the memory card, and Figure 3 is a perspective view of the main parts of the card board. FIG. 4 is a sectional view of the card board, and FIG. 5 is a sectional view of main parts showing a state in which a memory card is inserted into a connector. FIG. 6 is a perspective view of a main part of a card board in a conventional memory card, and FIG. 7 is a sectional view of a main part showing a state in which the memory card is inserted into a connector. 1...Card board, 2...Printed board, 10...
・Memory card, 11... Upper beam part, 12... Lower beam part, 13... Top surface opening, 14... Contact space, 15... Side end part, 16... Top surface, 19. ... Sheet, 21 ... Insertion opening, 22 ... Terminal part, 23 ...
- Semiconductor element, 24... - recess. ] 2 ] 21 ] 8 ko 9 ] ]○

Claims (1)

【特許請求の範囲】  半導体素子を搭載し、一方の端部近くに所定数の端子
部を並設したプリント基板と、 下面側に前記プリント基板が嵌入される幅広の凹部を有
し、一方の端部近くにその凹部と連通する空洞状のコン
タクトスペースを所定数並設したカード基板とを備え、
そのカード基板の凹部に前記プリント基板を嵌入して、
プリント基板の端子部をカード基板のコンタクトスペー
スにそれぞれ臨ませたメモリカードにおいて、 前記カード基板の上面に前記コンタクトスペースと連通
する上面開口を、カード基板の側端面にコンタクトスペ
ースと連通する挿入開口を、それぞれ形成し、 その上面開口と挿入開口との間に上梁部を設け、挿入開
口付近に下梁部を設けて、各上面開口をシートで覆った
ことを特徴とするメモリカード。
[Claims] A printed circuit board on which a semiconductor element is mounted and a predetermined number of terminals arranged in parallel near one end, a wide recess into which the printed circuit board is inserted on the lower surface side, and one of the printed circuit boards has a wide recess into which the printed circuit board is inserted. A card board having a predetermined number of hollow contact spaces arranged in parallel near the end and communicating with the recess,
Inserting the printed circuit board into the recess of the card board,
In a memory card in which the terminal portions of the printed circuit board face the contact spaces of the card board, an upper surface opening that communicates with the contact space is provided on the upper surface of the card board, and an insertion opening that communicates with the contact space is provided on the side end surface of the card board. , respectively, an upper beam portion is provided between the upper surface opening and the insertion opening, a lower beam portion is provided near the insertion opening, and each upper surface opening is covered with a sheet.
JP2044599A 1990-02-27 1990-02-27 Memory card Pending JPH03247497A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2044599A JPH03247497A (en) 1990-02-27 1990-02-27 Memory card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2044599A JPH03247497A (en) 1990-02-27 1990-02-27 Memory card

Publications (1)

Publication Number Publication Date
JPH03247497A true JPH03247497A (en) 1991-11-05

Family

ID=12695921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2044599A Pending JPH03247497A (en) 1990-02-27 1990-02-27 Memory card

Country Status (1)

Country Link
JP (1) JPH03247497A (en)

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