JPH03245547A - Image filing system - Google Patents

Abstract

PURPOSE:To facilitate the treatment of wafers and to increase the efficiency of the management of an image filing system by a method wherein a wafer, on which foreign substances observed in a workstation are adhered, is retrieved specifying the photographed date of the wafer and the name of the process of the wafer and accompanying information on the wafer, the form of the wafer and the positions of the foreign substances are displayed. CONSTITUTION:A foreign substance inspecting device 6 is provided with an inspecting robot and a brand name, a date, the name of an operator, a lot number and a wafer number are inputted. A wafer 3 is loaded by the device 6, foreign substances on the wafer 3 are detected and data on an inspection of the foreign substances is transmitted by a workstation 7 and is displayed on a CRT 1. The foreign substances are displayed on a monitoring TV 2 by the device 6 in the order of the inspected foreign substances and a foreign substance mark is displayed on the foreign substances. The TV 2 is observed, the features of the foreign substances are coded and the coded features are inputted in the station 7. Whether any foreign substance to be observed still exists or not is checked by the device 6 and if the foreign substance does not exist, the wafer 3 is released from a state that it is loaded. On the other hand, the station 7 receives the result of the input of the coded features, adds 1 to a counter and registers the value of the counter in a database 8 as an image index.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention provides a method for preventing 9I defects such as foreign objects, defects, or film defects during the manufacture of thin film products such as semiconductor devices, thin film circuit boards, magnetic disks, and thin film transistors. The present invention relates to an inspection method, and particularly to an image filing system for searching for images with poor appearance.

(Prior Art) Inspection of foreign objects or defects during the manufacturing of semiconductor devices, etc. has extremely important meaning in order to reduce product defects and improve yield. Judgment of the type, etc. depended on visual inspection by the operator, but as an automatic foreign matter inspection device that easily visually observes the position where a foreign matter is detected on a wafer, Japanese Patent Application Laid-Open No. 62/75
No. 336 and Japanese Unexamined Patent Publication No. 62-76732. These foreign object inspection devices allow workers to easily detect detected foreign objects using a visual optical system or a system consisting of a television camera receiver! ! It became possible to observe.

However, these automatic foreign matter inspection devices do not have means for registering, storing, or reproducing images taken using a television camera, for example. Therefore, workers can take pictures of foreign objects using a visual optical system, or record foreign object images taken with a television camera using a videotape recorder (hereinafter referred to as VTR).
) was recorded.

(Problems to be Solved by the Invention) Since the above-mentioned prior art does not have a means for collating image information with the data at the time of image recording, the collation is performed based on the operator's memory or memo, and the desired VTR is I searched and played images. For this reason, no consideration has been given to facilitating means for effectively utilizing past images.

An object of the present invention is to manage images recording foreign objects using a workstation, and to simultaneously search previously recorded images and associated data to facilitate processing and improve management efficiency. An object of the present invention is to provide a suitable image filing system.

(Means for solving the problem) The above purpose is to record images detected and photographed by a foreign object inspection device in an image database, and to
A database is created on the workstation to record the image index, the coordinates of the foreign object on the wafer, the photographing date, and associated data such as the wafer processing process. The wafer is confirmed by specifying the sampling process, photographing date, etc., and is displayed on the CRT of the workstation.
By displaying the information associated with the wafer, the shape of the wafer, and the recorded position of the foreign object, and specifying the position of the desired foreign object with the mouse, the workstation sends the image index of the foreign object to the image database and saves the image. This is accomplished by an image filing system configured to retrieve and display.

(Function) With the above configuration, the workstation searches for a wafer to which observed foreign matter is attached by specifying the photographing date and process name, and further specifies the foreign matter desired to be observed at the position on the wafer. Foreign object images can be easily searched and displayed, and information associated with each wafer is displayed, making it possible to determine under what conditions the foreign object was observed.

(Example) Embodiments of the present invention will be described with reference to the drawings.

<Example 1> This example relates to a method of inspecting foreign matter on a semiconductor wafer and observing the foreign matter in parallel with the inspection. The figure shows a monitor television screen showing an image of a foreign object.

The operator first specifies the wafer 3 by inputting part or all of the product name, process name, equipment name, inspection date, lot number, and wafer number into the workstation 7 . The workstation 7 searches for the image index, feature code 4, and X and Y coordinates on the wafer 3 of the foreign object attached to the wafer 3 that match the specified conditions. The setting of the coordinate system does not need to be limited to the X-Y coordinate system when a fixed system is used continuously.

A characteristic code is a code that codes the characteristics of a foreign object such as its shape, color tone, and material.1For example, a white spherical foreign object is designated as a, a piece of silicon is designated as b, and a black powdery foreign material is designated as C. put. As shown in FIG. 1, on the workstation 7, based on the search results, the shape of the wafer 3 and the position where the foreign matter is distributed on the wafer 3 are recorded using foreign material characteristic codes a, l], and C. It will be displayed as follows. When the operator specifies a desired foreign object, e.g. Then, the foreign object image 5 is reproduced on an image display device (hereinafter referred to as monitor television) 2. This results in
The operator can search for foreign object images without being aware of the image index.

<Embodiment 2> A method for realizing the present invention shown in FIGS. 1 and 2 will be explained with reference to FIG. 3. FIG. 3 is a block diagram showing the basic hardware configuration. Preferably, the foreign matter inspection device 6 is capable of measuring the coordinates of foreign matter detected on the wafer 3, and is capable of recording the process name, date, and type of wafer 3 inspected by the worker. An example of such a foreign matter inspection device 6 is IS-1010 manufactured by Hitachi Electronic Engineering.

The workstation 7 has functions for allowing an operator to instruct data processing contents, processing data, storing data, and displaying processing results. The image database 8 has a function of assigning an index to each image, a function of storing an image in correspondence with an index of the image, and a function of searching and displaying an image corresponding to the index when an index is input. Bye. A communication line 9 is connected between the foreign object inspection device 6 and the workstation 7, a signal line 10 is connected between the foreign object inspection device 6 and the image database 8, and the workstation 7
and the image database 8 are connected through communication lines 11, respectively.

The configuration of the workstation 7 is shown in FIG. 4, which includes a data processing unit (hereinafter referred to as CPU) 12, a CR'TI, a data input unit (hereinafter referred to as /B) 13, and a data storage unit (hereinafter referred to as /B).
Any device may be used as long as it consists of a HD (hereinafter referred to as HD) 14 and a mouse 15, and for example, Hitachi's new model 2050/32 is suitable.

Here, the CPU 12 not only processes data, but also
It also has a memory function to temporarily store data associated with processing.

FIG. 5 is a block diagram showing the configuration of the image database 8. As shown in FIG. The image database 8 is composed of a monitor television 2, an image recording section 16, and a control section 17, such as a new Hitachi VDR, which is housed in the same housing from the outside. You can leave it there. The image recording medium of the present invention does not need to be limited to a special type, but it is preferable to use an optical disk from the viewpoint of search speed. It is advantageous in that the average search time is about 0.5 seconds, which is approximately 20 times faster than a general video tape recorder.

The image recording section 16 receives the image signal from the foreign object inspection device 6 and outputs it to the monitor television 2 as it is. The control unit 17 sends the index of the recorded image to the workstation 7, and sends the index of the image to be searched to the workstation 7.
The image is received from the image recording section 16 and displayed on the monitor television 2.

Next, the flow of work from inspecting the wafer 3 to recording a foreign object image will be described using the flow diagram of FIG.

In step 1001, an inspection lot is set in the foreign matter inspection device 6, and the product name, process name, date, operator name, lot number, and wafer number are input.

In step 1002, one wafer 3 is loaded onto the foreign matter inspection device 6, and foreign matter on the wafer 31 is automatically detected.

When the foreign object detection is completed, the foreign object inspection device 6 transmits the inspection data to the workstation 7 in step 1003, and displays the data list 100 on the CRTI of the workstation 7 in step 1004.

Next step 1. OO5 foreign matter inspection device 6 detects foreign matter,
The images are displayed one screen at a time on the monitor television 2 in the order of inspection. List of data displayed on workstation 7 10
In o, a foreign object mark]01 is displayed at the position of the data related to the displayed foreign object.

Next, in step 1006, the operator observes the foreign object displayed on the monitor television 2.

Based on the observation results, in step 1007, when it is determined that the foreign object requires an image to be recorded, an input is made to the workstation 7 as to whether to record it or not.

At step 1008, the characteristics of the foreign object are encoded and input into the workstation 7.

Next, in step 1009, the foreign object inspection device 6 determines whether or not there are still foreign objects to be observed.

If foreign matter is present, the process returns to step 1005; if no foreign matter is present, the wafer 3 is released from the loaded state in step 1010. If there is no foreign object to be observed next, the foreign object inspection device 6 determines whether there is a next wafer 3. If there is a wafer 3, the process returns to step 1002, and if there is no wafer 3, the operation ends.

Here step 1001.1002.1003.100
9.1010 and 1011 are operations performed by the foreign object inspection device 6, steps 1004 and 1005 are operations performed by the image database 8, and steps +006.1007.1008 are operations performed by the operator.

The configuration of the inspection data transferred in step 1003 is
As shown in the figure. At the beginning of the data, a header indicating the beginning, such as SIO, is displayed, followed by product name, process name, lot number, date, number of wafers, and operator name.

Next, a header of data for each wafer, for example S20, is displayed, followed by the wafer number and the number of detected foreign objects.

Next, a header of data for each foreign object, for example S30, is displayed.

Next, the X coordinate, Y coordinate, and size of the foreign object are displayed, and data for each foreign object is repeatedly displayed as many times as the number of foreign objects detected.

A header indicating the end of the last transferred data, e.g. S4
0 is written. The end of each data is displayed as [:].

Next, FIG. 8 shows a data list 100 displayed on the CRT 1 of the workstation 7.

Data list 100 includes lot number, wafer number, process name,
There is a column at the top that shows the date, and below that there is a column that shows the foreign object's X coordinate, Y
There are columns such as coordinates, size, feature code, display mark, and image index.

In step 1007 of FIG. 6, when it is determined that it is necessary to record an image, an image index is calculated in the following procedure and displayed in the column of the image index.

Further, in step 1008, when the foreign object characteristic code is input, it is displayed in the characteristic code field. If there are too many foreign objects to display on one screen, scroll through the X coordinate, Y coordinate, size, feature code, display mark, and image index columns. For workers, scroll up icon 10
3 or the down scroll icon 104, the screen can be scrolled up and down.

Next, the flowchart in FIG. 9 shows the flow from recording images to managing image indexes in a database.

In the workstation 7, a counter is provided in step 1012, and the initial setting value of the counter is set to zero. 6th
In step l 006 shown in the figure, the operator determines whether it is necessary to save the observed image and inputs the result of the determination into the workstation 7.

In response to the operator's input, the workstation 7 increments the value of the counter by 1 in step 1013 if the image is to be saved in response to the input result in step 1006.

Next, in step 1014, the counter value is registered in the database as an image index.

When the counter exceeds the upper limit of the capacity of the recording medium in step 1015, the counter value is reset to zero in step 1016. If the counter does not exceed the upper limit of the capacity of the storage medium, it is determined in step 1017 whether or not the work has been completed, and if the work has been completed, the work is stopped, and if it has not been completed, the process returns to step 1006.

When an optical disc is used as a recording medium such as the above-mentioned OVDH, the upper limit of the recording medium is 24,000.

In the image database 8, the index of the first image recorded on one recording medium is set to 1. Then, the index of the next image to be recorded is determined by adding 1 to the index of the previously recorded image. With this method, the image index numbered by the image database 8 and the image index numbered by the workstation 7 match.

10, 11, and 12 are diagrams showing the data format inside the HD, and FIG. 10 shows the data retention format in units of lots. This is lot data in a table format and is called a lot data table. This lot data table consists of lot ID, lot number, process name, equipment name, product name, date, and operator name. The lot ID consists of a lot number and a process or date. Therefore, even if the lot number is the same, the lot ID will be different if the inspection process or date is different.

FIG. 11 shows a data retention format for three wafers. This data is in a table format and is referred to as a wafer 3 data table. This wafer 3 data table consists of wafer ID, lot ID, wafer number, and number of foreign objects. The wafer number is a number assigned within the same lot, and different lots have the same wafer number.

The wafer ID assigns a serial number to each wafer 3 in which either the lot ID or the wafer number is different.

FIG. 12 shows the data retention format for each foreign object.

This data is in a table format and is called a foreign matter data table. This foreign matter data table consists of foreign matter ID, wafer ID, X coordinate, X coordinate, size, feature code, and image index. For the foreign matter ID, a serial number is assigned to a foreign matter that differs in either the wafer ID% X coordinate or the X coordinate by one.

In the above embodiment, an example was shown in which the mouse 15 is used as a means for specifying a foreign object, but the present invention is not limited to the mouse 15, and a light pen may be used as long as the position can be specified on the CRTI.

FIG. 13 shows a flowchart from specifying a foreign object with the mouse 15 on the CRTl to displaying the foreign object image 5 on the monitor television 2.

In step 1018, the operator uses the mouse I5 to specify feature code 4 for the foreign object for which the image is desired.

In step 1019, the workstation 7 reads the position on the screen specified by the mouse and recognizes the ID of the foreign object at this position.

Step 1019 can be realized by using the mouse 15 in a boat-like manner, so a detailed explanation will be omitted.

Step ] 020, the workstation 7 identifies the foreign object ID.
Then, the image index of the foreign object is read using the foreign object data table shown in FIG.

In step 1021, the image index is sent to the image database control section 17.

In step 1022, the image database control unit 17 retrieves a recorded image from the image recording unit 16 based on the image index and displays the image on the monitor television 2.

(Effects of the Invention) By carrying out the present invention, it becomes possible to view the information for searching the wafer and the image of the foreign object at the same time, and it is possible to inspect the adhesion state of the foreign object and the shape of the foreign object while comparing them with each other. Since it is not necessary to specify the image index of the foreign object when searching for an image of a foreign object, the effort required for the search can be simplified. Knowing this makes it easier to take effective measures to reduce foreign matter, which has a significant effect on product yield.

[Brief explanation of drawings]

Figure 1 is a diagram showing the C and RT screen of the foreign matter distribution on the wafer;
Figure 2 shows the image of a foreign object on a monitor TV screen;
The figure is a block diagram showing the configuration of the hardware bore that is the basis of the invention, and Figure 4 is a diagram showing the configuration of the workstation.
Fig. 5 is a block diagram showing the internal structure of the image database, Fig. 6 is a flow diagram showing the work flow up to recording a foreign object image, and Fig. 7 shows the structure of inspection data transferred from the foreign object inspection device. Figure 8 shows workstation C.
Figure 9 shows a list of data displayed on the RT, Figure 9 is a flow diagram showing the flow from recording images to managing image indexes in the database, Figure 1○ is a diagram showing the data retention format for each lot, FIG. 11 is a diagram showing a data retention format on a wafer basis, FIG. 12 is a diagram showing a data retention format on a foreign object basis, and FIG. 13 is a flowchart showing the flow from designation of foreign matter to image display.

Claims (1)

[Scope of Claims] 1. In an image filing system that searches for an image to be observed on an inspection sample of a thin film product, the coordinates of the observation target on the sample are compared with an image index corresponding to the image of the observation target. means for storing the coordinates, the image index, and the image; and means for specifying the shape of the sample and the position on the sample of the observation target at which the image was recorded, An image filing system characterized by searching and displaying the stored images of the observation target according to a specification. 2. For each image observation work of the observation target, the observation date, the lot number of the sample, and the sampling process of the sample,
The image filing system according to claim 1, wherein the image is recorded together with the image index. 3. By specifying at least one of the inspection date, the lot number of the sample, and the sampling process of the sample,
The image filing system according to claim 1, wherein inspection data can be searched and displayed. 4. The image filing system according to claim 1, wherein the shape or position of the observation target is displayed with a symbol or color.