JPH03242918A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To make it possible to recognize identification marks even after element division grooves are made in a semiconductor substrate by making the identification marks in the semiconductor substrate and an element region in a metallic film formed on the semiconductor substrate. CONSTITUTION:A first identification mark 2A is made in an element region 5 in a semiconductor substrate 1. A metallic film 3 is deposited on to the semiconductor substrate 1, a second identification mark 2B is made into the same form, in the same position in the metallic film 3, and by the same method as the first identification mark 2A, and a final protection film 4 is made on the upper face. Thereby the identification marks 2 can be clearly confirmed during the whole process of manufacture of a semiconductor device, are not scratched by making element division grooves, and can be read until the final process.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, which includes a step of stamping an identification symbol on the semiconductor device for controlling the product or process.

Prior Art FIGS. 3(a) and 3(b) show a plan view and a cross-sectional view of a semiconductor substrate stamped by a conventional semiconductor device manufacturing method. In the figures, 1 is a semiconductor substrate, and 2 is a An identification symbol engraved on the semiconductor substrate 1, 3 is a metal film deposited on the semiconductor substrate 1, 4 is a final protective film provided on the metal film 3, and 5 is a semiconductor formed on the semiconductor substrate 1. This is the formation area of the element (hereinafter abbreviated as element). Fig. 4 is an enlarged view of the vicinity of the position of identification symbol 2 in Fig. 3, and 6 is a dividing line for dividing the element into individual parts. It is.

The method for manufacturing this semiconductor device (including these four methods) will be described below.

In order to mark the identification symbol 2 on the semiconductor substrate 1, the identification symbol 2 is placed in a row near the notch for indicating the orientation of the semiconductor substrate 1.
is engraved using photo printing/printing technology. Thereafter, a metal film 3 is deposited on the upper surface of the semiconductor substrate 1, and then a final protective film 4 is formed. After the diffusion process, the semiconductor substrate 1 is cut into nine parts along the dividing line 6 into nine parts.

Problems to be Solved by the Invention However, in the conventional semiconductor device manufacturing method described above, since the metal film 3 is deposited on the identification symbol 2 during the manufacturing process, the identification symbol 2 becomes unclear and the identification symbol 2 becomes unclear. Symbol 2 becomes difficult to identify. Further, after forming semiconductor elements such as ICs on the semiconductor substrate 1, when cutting grooves along the dividing line 6 when cutting each element into two parts, as shown in FIG. There was a problem in that the top of the symbol 2 was cut off, making it impossible to read the identification symbol 2 in subsequent steps.

The present invention is intended to solve the above-mentioned conventional problems, and it is an object of the present invention to propose a method for manufacturing a semiconductor device that allows identification symbols to be recognized even after grooves for dividing elements are cut in a semiconductor substrate.

Means for Solving the Problems In order to achieve the above-mentioned objects, the present invention has an object of the present invention, in which, in the manufacturing process of a semiconductor device, a semiconductor substrate is coated once or more in one element region on a semiconductor substrate and a metal film provided on the semiconductor substrate. It is stamped with an identification symbol.

Therefore, according to the present invention, since the identification symbol is engraved on the semiconductor substrate and within one element region on the metal film provided thereon, the identification symbol can be printed during the manufacturing process of the semiconductor device. , can be clearly confirmed, there is no risk of damage even if grooves are cut for element division, and the identification symbol can be read up to the final process.

Embodiment Hereinafter, regarding an embodiment of the present invention, parts that are the same as those in FIGS. 1 and 2, as well as in FIGS. 3 and 4 will be given the same numbers and explanations will be omitted, and differences will be omitted. I will only explain.

That is, in the present invention, the first identification symbol 2A is marked in one element region in the element formation region 5 formed on the semiconductor substrate 1, and the second identification symbol 2A is further marked on the metal film 3.
B is marked as such.

FIG. 2 shows an enlarged view of the vicinity of the positions of the identification symbols 2A and 2B, which are engraved within one element area and are not damaged by the dividing line 6. I understand that.

Next, the manufacturing method (including these four methods) will be explained. A first identification symbol 2A is engraved within one element region on the semiconductor substrate 1 using photo printing technology. After marking, a metal film 3 is deposited on the semiconductor substrate 1. Furthermore, a second identification mark 2B having the same shape as the first identification mark 2A is stamped on the metal film 3 in the same position as the first identification mark 2A in the same manner as the first identification mark 2A, and then a final protective film 4 is engraved on the upper surface. will be established. After completing the diffusion process, the semiconductor substrate 1 is cut and divided into element units along the dividing line 6. Note that the engraving after the second identification mark is performed every time a metal film is provided in the manufacturing process of the semiconductor device, and the position of the identification mark is different from the position of the identification mark in the previous stage in another element region. It may be within.

As described above, according to this embodiment, the identification number can be confirmed on the middle plate during the process, and the second identification symbol 2B is also engraved on the final deposited metal film 3, and the final protection 1114 is transparent. Therefore, it can be clearly recognized even after the diffusion process is completed. In addition, since the identification symbols 2A and 2B are both engraved within one element area, the identification symbols will not be damaged even after grooves are cut to divide them into individual elements. Confirmation is easy.

Effects of the Invention As is clear from the above embodiments, the present invention imprints an identification symbol on a semiconductor substrate and in one element region on a metal film provided on the semiconductor substrate in each step, In the manufacturing process of semiconductor devices, the identification symbol can be easily confirmed at all times, so that products in each process can be effectively managed.

[Brief explanation of drawings]

FIGS. 1(a) and (b) are a plan view and a sectional view of a semiconductor substrate in a method of manufacturing a semiconductor device according to an embodiment of the present invention, and FIG. 2 is an enlarged plan view of the vicinity of the position of an identification symbol on the same semiconductor substrate. , FIGS. 3(a) and 3(b) are a plan view and a sectional view of a semiconductor substrate in a conventional method of manufacturing a semiconductor device, and FIG. 4 is an enlarged plan view of the vicinity of the identification symbol position on the same semiconductor substrate. 1...Semiconductor substrate, 2A, 2B...Identification symbol, 3...Metal film, 5...Element formation region.

Claims (1)

[Claims] A step of stamping an identification symbol at least once in each element region in an element formation region formed on a semiconductor substrate and in the same element region on a metal film provided on the upper surface of the semiconductor substrate. A method for manufacturing a semiconductor device including: