JPH03241812A - Solid electrolytic capacitor - Google Patents
Solid electrolytic capacitorInfo
- Publication number
- JPH03241812A JPH03241812A JP3935790A JP3935790A JPH03241812A JP H03241812 A JPH03241812 A JP H03241812A JP 3935790 A JP3935790 A JP 3935790A JP 3935790 A JP3935790 A JP 3935790A JP H03241812 A JPH03241812 A JP H03241812A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor element
- lead
- solid electrolytic
- anode
- coating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 64
- 239000007787 solid Substances 0.000 title claims description 29
- 239000000463 material Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 11
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 8
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 7
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 5
- 239000010955 niobium Substances 0.000 claims abstract description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 6
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は弁作用金属の焼結体からなるコンデンサ素子を
具備した固体電解コンデンサに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid electrolytic capacitor having a capacitor element made of a sintered body of valve metal.
タンタルやニオブなどの弁作用金属の焼結体からなるコ
ンデンサ素子を具備した固体電解コンデンサとしては、
第１図に示したチップ形固体電解コンデンサｌと第２図
に示したデイツプ形固体電解コンデンサ１０とがよく知
られている。As a solid electrolytic capacitor with a capacitor element made of a sintered body of valve metal such as tantalum or niobium,
A chip type solid electrolytic capacitor 1 shown in FIG. 1 and a dip type solid electrolytic capacitor 10 shown in FIG. 2 are well known.
チップ形固体電解コンデンサ１は、タンタルのような弁
作用金属からなる陽極導出線２を備え、かつ表面に誘電
体性酸化皮覆を形成したタンタルのような弁作用金属の
焼結体からなる陽極体上に二酸化マンガンのような半導
体性金属酸化物層。A chip type solid electrolytic capacitor 1 includes an anode lead wire 2 made of a valve metal such as tantalum, and an anode made of a sintered body of a valve metal such as tantalum with a dielectric oxide coating formed on the surface. A layer of semiconducting metal oxides such as manganese dioxide on the body.
カーボン、銀ペーストからなる陰極層を順次積層形成し
てコンデンサ素子３とし、このコンデンサ素子３に半田
・または導電性接着剤などの導電材料４を介して板状の
陰極端子５を取着し、また陽極導出線２には同導出線２
のコンデンサ素子３からの引出部分を絶縁性の樹脂６で
補強したうえで板状の陽極端子７を溶着し、コンデンサ
素子３を絶縁性の樹脂８によってモールド外装し１両端
子５゜７を外装樹脂８に沿って配置した構造となってい
る。Cathode layers made of carbon and silver paste are sequentially laminated to form a capacitor element 3, and a plate-shaped cathode terminal 5 is attached to this capacitor element 3 via a conductive material 4 such as solder or conductive adhesive. In addition, the anode lead wire 2 has the same lead wire 2.
After reinforcing the lead-out part from the capacitor element 3 with an insulating resin 6, a plate-shaped anode terminal 7 is welded, and the capacitor element 3 is molded and exteriorized with an insulating resin 8, and one terminal 5゜7 is exteriorized. It has a structure in which it is arranged along the resin 8.
デイツプ形固体電解コンデンサ１０は、チップ形固体電
解コンデンサ１の板状の陽極端子７および陰極端子５に
代えて丸棒状の陽極端子７１および陰極端子５１を使用
したものでコンデンサ素子３を絶縁性の樹脂８１によっ
てデイツプ外装した構造となっている。The dip-type solid electrolytic capacitor 10 uses round bar-shaped anode terminals 71 and cathode terminals 51 in place of the plate-shaped anode terminals 7 and cathode terminals 5 of the chip-type solid electrolytic capacitor 1, and the capacitor element 3 is made of an insulating material. It has a structure with a dip exterior covered with resin 81.
いずれの固体電解コンデンサ１および１０においいても
陽極導出線２の根元部分を補強するための樹脂６として
は、エポキシ系またはシリコン系の熱硬化性絶縁樹脂を
使用するのが一般的である。In both solid electrolytic capacitors 1 and 10, as the resin 6 for reinforcing the root portion of the anode lead wire 2, an epoxy-based or silicon-based thermosetting insulating resin is generally used.
上述した補強用樹脂６は、陽極導出線２の陽極端子７へ
の溶接による固着に先立って、例えばコンデンサ素子３
を構成する陽極体上へのカーボンの形成後に同樹脂６を
陽極導出線２の根元に塗布し、加熱硬化することによっ
て形成する。また、外装樹脂８および８１についてもエ
ポキシ系またはシリコン系の熱硬化性絶縁樹脂が使用さ
れる。特に、補強用樹脂６は陽極導出線２を陽極端子７
へ溶着する際のコンデンサ素子３への機械的なストレス
を緩和もしくは防止するために形成するものであるが、
固体電解コンデンサ１や１０が例えば半田付は時などに
おける熱ストレスを受けたときに外装樹脂８や８１の膨
張収縮のほか、陽極引出線２の根元部分の補強用樹脂６
の膨張収縮もコンデンサ素子３に伝わり、コンデンサと
しての電気的性。The reinforcing resin 6 described above is applied to the capacitor element 3, for example, before the anode lead wire 2 is fixed to the anode terminal 7 by welding.
After carbon is formed on the anode body constituting the anode body, the same resin 6 is applied to the base of the anode lead wire 2 and cured by heating. Also, for the exterior resins 8 and 81, an epoxy or silicone thermosetting insulating resin is used. In particular, the reinforcing resin 6 connects the anode lead wire 2 to the anode terminal 7.
This is formed in order to alleviate or prevent mechanical stress on the capacitor element 3 when welding it to the capacitor element 3.
When the solid electrolytic capacitors 1 and 10 are subjected to heat stress, such as during soldering, the outer resin 8 and 81 expand and contract, and the reinforcing resin 6 at the base of the anode lead wire 2 expands and contracts.
The expansion and contraction of the capacitor element 3 is also transmitted to the capacitor element 3, which increases its electrical properties as a capacitor.
例えば漏れ電流特性が劣化してしまうという問題点があ
った。For example, there was a problem in that leakage current characteristics deteriorated.
しかるに１本発明は上述したような欠点を解決するため
に少なくとも陽極導出線のコンデンサ素子からの導出部
分、好ましくはコンデンサ素子の外周全体を同コンデン
サ素子に皮覆材の膨張収縮による悪影響を与えにくい材
料にて皮覆するようにしたものである。However, in order to solve the above-mentioned drawbacks, the present invention provides at least the part of the anode lead-out wire from the capacitor element, preferably the entire outer periphery of the capacitor element, so that the capacitor element is less likely to be adversely affected by the expansion and contraction of the covering material. It is covered with a material.
この発明に係る皮覆材としては、ビニル基（ＣＨ，＝Ｃ
Ｈ−）を有する単量化合物を重合して得られる熱可塑性
合成樹脂、つまりビニル系樹脂を使用したものである。The covering material according to the present invention has a vinyl group (CH,=C
A thermoplastic synthetic resin obtained by polymerizing a monomer compound having H-), that is, a vinyl resin is used.
ビニル系樹脂としては塩化ビニル樹脂、酢酸ビニル樹脂
、ポリビニルアルコール、ポリメチルビニルエーテルな
どを例示でき、これら樹脂は熱硬化型でも紫外線硬化型
でもよい。Examples of the vinyl resin include vinyl chloride resin, vinyl acetate resin, polyvinyl alcohol, and polymethyl vinyl ether, and these resins may be thermosetting or ultraviolet curing.
このような本発明に係る皮覆材はコンデンサ素子からの
陽極導出線の引出部分のみ、あるいはコンデンサ素子の
外周全体にわたって付着形成され。Such a covering material according to the present invention is deposited only on the part where the anode lead wire is drawn out from the capacitor element, or over the entire outer periphery of the capacitor element.
加熱もしくは紫外線により硬化される。皮覆材を陽極導
出線の引出部分のみに形成する場合には外部端子となる
陽極端子を陽極導出線に固着するに先立って形成するの
がよく、またコンデンサ素子の外周全体にわたって形成
する場合にはコンデンサ素子に対する外部端子となる陽
極端子および陰極端子の取着後であって、外装樹脂の形
成前であることが好ましい。Cured by heating or ultraviolet light. When the covering material is formed only on the lead-out portion of the anode lead-out wire, it is best to form the covering material before fixing the anode terminal, which will serve as an external terminal, to the anode lead-out wire, and when it is formed over the entire outer circumference of the capacitor element. Preferably, this is after the anode terminal and the cathode terminal, which serve as external terminals for the capacitor element, are attached, but before the exterior resin is formed.
以下に１本発明に係る固体電解コンデンサの実施例を比
較例とともに詳述する。An example of a solid electrolytic capacitor according to the present invention will be described in detail below along with a comparative example.
〈実施例１〉
酢酸ビニルからなる皮覆材をタンタルコンデンサ素子の
陽極導出線の根元に付着させ、加熱硬化し、エポキシ樹
脂による外装を施して従来と同様な手法により定格４ｖ
・１０μＦの第１図に示すようなチップ形の固体電解コ
ンデンサを３０個製作した。<Example 1> A covering material made of vinyl acetate was attached to the base of the anode lead wire of a tantalum capacitor element, cured by heating, and covered with epoxy resin, and the rated voltage was increased to 4V using the same method as before.
・We manufactured 30 chip-shaped solid electrolytic capacitors of 10 μF as shown in Figure 1.
く比較例１〉
実施例１の皮覆材に代えてエポキシ樹脂からなる皮覆材
を使用し、実施例１と同定格のチップ形の固体電解コン
デンサを実施例１と同様な手法により３０個製作した。Comparative Example 1> Thirty chip-type solid electrolytic capacitors having the same rating as in Example 1 were manufactured in the same manner as in Example 1, using a covering material made of epoxy resin in place of the covering material in Example 1. Manufactured.
〈実施例２〉
ポリビニルアルコールからなる皮覆材をタンタルコンデ
ンサ素子の陽極導出線の根元に付着させ、加熱硬化し、
エポキシ樹脂による外装を施して従来と同様な手法によ
り定格２５Ｖ・１０μＦの第１図に示すようなチップ形
の固体電解コンデンサを３０個製作した。<Example 2> A covering material made of polyvinyl alcohol was attached to the base of the anode lead wire of a tantalum capacitor element, heated and hardened,
Thirty chip-shaped solid electrolytic capacitors as shown in FIG. 1 with a rating of 25 V and 10 μF were fabricated using the same method as before, with an exterior made of epoxy resin.
〈比較例２〉
実施例２の皮覆材に代えてシリコンワニスからなる皮覆
材を使用し、実施例２と同定格のチップ形の固体電解コ
ンデンサを実施例２と同様な手法により３０個製作した
。<Comparative Example 2> Thirty chip-type solid electrolytic capacitors having the same rating as in Example 2 were manufactured in the same manner as in Example 2, using a covering material made of silicone varnish instead of the covering material in Example 2. Manufactured.
〈実施例３〉
ポリ酢酸ビニルからなる皮覆材をタンタルコンデンサ素
子の外周囲全体に付着させ、加熱硬化し、エポキシ樹脂
による外装を施して従来と同様な手法により定格３５Ｖ
・１μＦの第２図に示すようなデイツプ形の固体電解コ
ンデサンサを３０個製作した。<Example 3> A covering material made of polyvinyl acetate was adhered to the entire outer periphery of a tantalum capacitor element, heated and cured, and covered with epoxy resin, and the rated voltage was increased to 35 V using the same method as before.
・We manufactured 30 dip-shaped solid electrolytic capacitors of 1 μF as shown in Figure 2.
〈比較例３〉
実施例３の皮覆材に代えてシリコンワニスからなる皮覆
材を使用し、実施例３と同定格のデイツプ形の固体電解
コンデンサを実施例３と同様な手法により３０個製作し
た。<Comparative Example 3> Thirty dip-shaped solid electrolytic capacitors having the same rating as in Example 3 were manufactured in the same manner as in Example 3, using a covering material made of silicone varnish instead of the covering material in Example 3. Manufactured.
〈実施例４〉
酢酸ビ、ニルからなる皮覆材を使用し、同友覆材をタン
タルコンデンサ素子の外周囲全体に付着させ、加熱硬化
し、エポキシ樹脂による外装を施して従来と同様な手法
により定格３５Ｖ・４７μＦのデイツプ形の固体電解コ
ンデンサを３０個製作した。<Example 4> Using a covering material made of vinyl acetate, the Douyu covering material was attached to the entire outer periphery of the tantalum capacitor element, heated and cured, and then covered with epoxy resin and processed using the same method as before. We manufactured 30 dip-type solid electrolytic capacitors with a rating of 35V and 47μF.
〈比較例４〉
実施例４の被覆材に代えてエポキシ樹脂からなる被覆材
を使用し、実施例４と同定格のデイツプ形の固体電解コ
ンデンサを３０個製作した。<Comparative Example 4> Thirty dip-shaped solid electrolytic capacitors having the same rating as in Example 4 were manufactured using a covering material made of epoxy resin in place of the covering material in Example 4.
次に１本発明に係る実施例１〜４および比較例１〜４の
固体電解コンデンサの各３０個を３００℃の溶融半田中
に１０秒間浸漬し、その後に漏れ電流を測定した。その
結果を第１表に初期値と共に示す。Next, 30 pieces each of the solid electrolytic capacitors of Examples 1 to 4 according to the present invention and Comparative Examples 1 to 4 were immersed in molten solder at 300°C for 10 seconds, and then the leakage current was measured. The results are shown in Table 1 together with the initial values.
判定値は３０個の平均値である。The judgment value is the average value of 30 values.
第１表 漏れ電流特性
〔効
果〕
第工表の漏れ電流特性から判るように、比較例１〜４の
固体電解コンデンサにおいては初期値に対する半田浸漬
後の値が大幅に変化してしまう。Table 1 Leakage current characteristics [Effects] As can be seen from the leakage current characteristics in Table 1, in the solid electrolytic capacitors of Comparative Examples 1 to 4, the values after solder immersion with respect to the initial values significantly changed.
これに対して実施例１〜４においてはその変化が著しく
小さい。On the other hand, in Examples 1 to 4, the changes are extremely small.
よって、本発明に係る固体電解コンデンサは耐熱性に優
れたものを提供することができる。Therefore, the solid electrolytic capacitor according to the present invention can have excellent heat resistance.
第１図は本発明および従来例を示すチップ形固体電解コ
ンデンサの断面図、第２図は本発明および従来例を示す
デイツプ形固体電解コンデンサの断面図である。
図中、１はチップ形固体電解コンデンサ、２は陽極導出
線、３はコンデンサ素子、４は導電材料。
５．５１は陰極端子、６は補強樹脂、７．７１は陽極端
子、８，８１は外装樹脂、１０はデイツプ形固体電解コ
ンデンサである。
第１図FIG. 1 is a cross-sectional view of a chip-type solid electrolytic capacitor showing the present invention and a conventional example, and FIG. 2 is a cross-sectional view of a dip-type solid electrolytic capacitor showing the present invention and a conventional example. In the figure, 1 is a chip-type solid electrolytic capacitor, 2 is an anode lead wire, 3 is a capacitor element, and 4 is a conductive material. 5.51 is a cathode terminal, 6 is a reinforcing resin, 7.71 is an anode terminal, 8 and 81 are exterior resins, and 10 is a dip type solid electrolytic capacitor. Figure 1
Claims (3)
なるコンデンサ素子の少なくとも陽極導出線の導出部分
に、ビニル系樹脂からなる皮覆材を固着形成したことを
特徴とする固体電解コンデンサ。(1) A solid electrolytic capacitor comprising a capacitor element made of a sintered body of a valve metal such as tantalum or niobium, and a covering material made of vinyl resin fixedly formed on at least the lead-out portion of the anode lead-out wire.
なるコンデンサ素子の周囲に、ビニル系樹脂からなる皮
覆材を固着形成したことを特徴とする固体電解コンデン
サ。(2) A solid electrolytic capacitor characterized in that a covering material made of vinyl resin is fixedly formed around a capacitor element made of a sintered body of a valve metal such as tantalum or niobium.
ブなどの弁作用金属の焼結体からなるコンデンサ素子の
一部分を皮覆することを特徴とした固体電解コンデンサ
。(3) A solid electrolytic capacitor characterized in that a portion of a capacitor element made of a sintered body of a valve metal such as tantalum or niobium is covered with a covering material made of vinyl resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3935790A JPH03241812A (en) | 1990-02-20 | 1990-02-20 | Solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3935790A JPH03241812A (en) | 1990-02-20 | 1990-02-20 | Solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03241812A true JPH03241812A (en) | 1991-10-29 |
Family
ID=12550822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3935790A Pending JPH03241812A (en) | 1990-02-20 | 1990-02-20 | Solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03241812A (en) |
-
1990
- 1990-02-20 JP JP3935790A patent/JPH03241812A/en active Pending
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