JPH0323970U - - Google Patents
Info
- Publication number
- JPH0323970U JPH0323970U JP1989083052U JP8305289U JPH0323970U JP H0323970 U JPH0323970 U JP H0323970U JP 1989083052 U JP1989083052 U JP 1989083052U JP 8305289 U JP8305289 U JP 8305289U JP H0323970 U JPH0323970 U JP H0323970U
- Authority
- JP
- Japan
- Prior art keywords
- micro
- board
- printed circuit
- multilayer printed
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989083052U JPH0323970U (ko) | 1989-07-17 | 1989-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989083052U JPH0323970U (ko) | 1989-07-17 | 1989-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323970U true JPH0323970U (ko) | 1991-03-12 |
Family
ID=31630401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989083052U Pending JPH0323970U (ko) | 1989-07-17 | 1989-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323970U (ko) |
-
1989
- 1989-07-17 JP JP1989083052U patent/JPH0323970U/ja active Pending