JPH0323945U - - Google Patents
Info
- Publication number
- JPH0323945U JPH0323945U JP8488889U JP8488889U JPH0323945U JP H0323945 U JPH0323945 U JP H0323945U JP 8488889 U JP8488889 U JP 8488889U JP 8488889 U JP8488889 U JP 8488889U JP H0323945 U JPH0323945 U JP H0323945U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- semiconductor device
- substrate
- lead portion
- horizontal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8488889U JPH0323945U (en18) | 1989-07-19 | 1989-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8488889U JPH0323945U (en18) | 1989-07-19 | 1989-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323945U true JPH0323945U (en18) | 1991-03-12 |
Family
ID=31633669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8488889U Pending JPH0323945U (en18) | 1989-07-19 | 1989-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323945U (en18) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104009010A (zh) * | 2013-02-27 | 2014-08-27 | 株式会社电装 | 半导体器件 |
-
1989
- 1989-07-19 JP JP8488889U patent/JPH0323945U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104009010A (zh) * | 2013-02-27 | 2014-08-27 | 株式会社电装 | 半导体器件 |
| JP2014165452A (ja) * | 2013-02-27 | 2014-09-08 | Denso Corp | 半導体装置 |