JPH0323939U - - Google Patents

Info

Publication number

JPH0323939U

JPH0323939U JP8548189U JP8548189U JPH0323939U JP H0323939 U JPH0323939 U JP H0323939U JP 8548189 U JP8548189 U JP 8548189U JP 8548189 U JP8548189 U JP 8548189U JP H0323939 U JPH0323939 U JP H0323939U

Authority

JP

Japan

Prior art keywords

chip

semiconductor device

power supply

supply wiring

sealing resin

Prior art date

1989-07-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 4
• 239000011347 resin Substances 0.000 claims description 2
• 229920005989 resin Polymers 0.000 claims description 2
• 238000007789 sealing Methods 0.000 claims description 2
• 238000002161 passivation Methods 0.000 description 3
• 230000002093 peripheral effect Effects 0.000 description 1

Cited By (1)