JPH03237159A - Polyamide composition - Google Patents

Abstract

PURPOSE:To obtain a composition, excellent in heat resistance characteristics, tensile strength, bending strength, impact strength, etc., and useful as engineering plastics, etc., by blending an aromatic polyamide with an aliphatic polyamide and an epoxy resin in specific amounts. CONSTITUTION:A polyamide composition obtained by blending (A) 5-95wt.% aromatic polyamide, composed of (A1) aromatic dicarboxylic acid component units composed of terephthalic acid component units, aromatic dicarboxylic acid component units other than the terephthalic acid component units and/or 4-25C aliphatic dicarboxylic acid component units and (A2) diamine component units composed of aliphatic diamine component units and/or alicyclic diamine component units and having >=0.5dl/g intrinsic viscosity with (B) 5-95wt.% aliphatic polyamide (e.g. nylon-6) and (C) 0.5-10wt.% epoxy resin having diglycidyl ether type terminal groups expressed by the formula.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a polyamide composition, and more particularly to a polyamide composition having excellent mechanical properties such as heat resistance, tensile strength, bending strength, and impact strength.

Technical Background of the Invention The superior properties of aliphatic polyamide and aromatic polyamide, namely, the superior properties such as tensile elongation and impact strength of aliphatic polyamide, and the bending strength and flexural modulus of aromatic polyamide We investigated blend polymers that have both of these excellent properties.

Note that simply making a polymer blend of aliphatic polyamide and aromatic polyamide does not provide a polyamide composition that combines the excellent properties of both.

Purpose of the Invention The present invention aims to solve the problems associated with the prior art as described above, and in particular, it is an object of the present invention to provide a polyamide composition having excellent mechanical properties such as tensile strength, bending strength, and impact strength. The purpose is to provide something.

Summary of the Invention The polyamide composition according to the present invention comprises: aromatic polyamide (A): 5 to 95% by weight, aliphatic polyamide (B): 5 to 95% by weight, and epoxy resin (C): Q, 5 to 95% by weight. 10% by weight [However, (A) + (B)
+ (C) -100% by weight.

In a preferred embodiment of the present invention, the aromatic polyamide (A) comprises terephthalic acid component units, aromatic dicarboxylic acid component units other than terephthalic acid component units, and/or carbon atoms of 4 to 2.
an aromatic dicarboxylic acid component unit (a) consisting of an aliphatic dicarboxylic acid component unit of No. 5, and a diamine component unit (b) consisting of an aliphatic diamine component unit and/or an alicyclic diamine component unit, It is characterized in that the intrinsic viscosity [η] of polyamide (A) measured in concentrated sulfuric acid at 30°C is in the range of 0.5 dl/g or more.

Furthermore, in a preferred embodiment of the present invention, the aromatic dicarboxylic acid component unit (a) constituting the aromatic polyamide (A) in the composition has 30 to 1 terephthalic acid component unit.
00 mol%, aromatic dicarboxylic acid component units other than terephthalic acid component units 0 to 70 mol%, and carbon number 4 to 25
It is composed of 0 to 70 mol% of aliphatic dicarboxylic acid component units.

Since the polyamide composition according to the present invention contains the epoxy resin (C) together with the aromatic polyamide (A) and the aliphatic polyamide (B) as described above, this polyamide composition has particularly high tensile strength. , has outstanding mechanical properties such as bending strength and impact strength.

DETAILED DESCRIPTION OF THE INVENTION The polyamide composition according to the present invention will be specifically described below.

The polyamide composition according to the present invention is made of aromatic polyamide (
A), an aliphatic polyamide (B), and an epoxy resin (C).

The aromatic polyamide (A) contained in such a polyamide composition is composed of, for example, a dicarboxylic acid component unit (0) and a diamine component unit (b) as shown below.

That is, this dicarboxylic acid component unit (a) may consist only of terephthalic acid component units, or may consist of terephthalic acid component units and aromatic dicarboxylic acid component units other than terephthalic acid component units, It may consist of a terephthalic acid component unit and an aliphatic dicarboxylic acid component unit, preferably an aliphatic dicarboxylic acid unit having 4 to 25 carbon atoms, and further, a terephthalic acid component unit and an aromatic dicarboxylic acid component other than terephthalic acid. Unit and aliphatic dicarboxylic acid component unit preferably has 4 to 2 carbon atoms
5 aliphatic dicarboxylic acid units.

Specifically, aromatic dicarboxylic acid component units other than terephthalic acid component units include isophthalic acid,
Examples include component units derived from phthalic acid, 2-methylterephthalic acid, naphthalene dicarboxylic acid, and the like. Among the aromatic dicarboxylic acid component units other than these terephthalic acid component units, component units derived from isophthalic acid or naphthalene dicarboxylic acid are preferred,
Particularly preferred is an isophthalic acid component unit.

Further, the aliphatic dicarboxylic acid component unit is derived from an aliphatic dicarboxylic acid having preferably 4 to 25 carbon atoms, more preferably 6 to 12 carbon atoms, although the number of carbon atoms is not particularly limited. Examples of aliphatic dicarboxylic acids used to derive such aliphatic dicarboxylic acid component units include:
Mention may be made of succinic acid, adipic acid (AA), azelaic acid, sebacic acid, decanedicarboxylic acid, undecanedicarboxylic acid and dodecanedicarboxylic acid.

Among these, adipic acid (AA) is particularly preferred.

In the present invention, the dicarboxylic acid component unit (1) is a terephthalic acid component unit, an aromatic dicarboxylic acid component unit other than the terephthalic acid component unit, and/or an aliphatic dicarboxylic acid component unit, preferably an aliphatic dicarboxylic acid component having 4 to 25 carbon atoms. In the case of terephthalic acid component units, 3 terephthalic acid component units in 100 mol% of dicarboxylic acid component units.
It is contained in an amount of 0 to 100 mol%, preferably 30 to 80 mol%, and aromatic dicarboxylic acid component units other than terephthalic acid component units are 0 to 70 mol%, preferably 0 to 50 mol%, more preferably 0 It is desirable that it is contained in an amount of ~30 mol%. Further, the aliphatic dicarboxylic acid component unit, preferably the aliphatic dicarboxylic acid component unit having 4 to 25 carbon atoms, is 0 to 70 mol%, preferably 10 to 70 mol%.
It is desirable that it be contained in an amount of .

Dicarboxylic acid component units (for example, terephthalic acid component units, aromatic dicarboxylic acid component units other than terephthalic acid component units, and/or aliphatic dicarboxylic acid component units are each contained in the dicarboxylic acid component units in the above amounts. , such dicarboxylic acid component unit (a)
A molded article obtained from a composition containing an aromatic polyamide (A) consisting of a diamine component unit (b) as described below has heat resistance properties such as heat distortion temperature, mechanical properties such as tensile strength and bending strength, It has particularly excellent physical and chemical properties such as chemical resistance and water resistance.

In addition, in the present invention, dicarboxylic acid component units (g)
As, the terephthalic acid component unit as described above and/or
Alternatively, a small amount, for example, about 10 mol % or less, of polyhydric carboxylic acid component units may be included together with aromatic dicarboxylic acid component units other than terephthalic acid component units. Specific examples of such polyhydric carboxylic acid component units include tribasic acids and polybasic acids such as trimellitic acid and pyromellitic acid.

In the present invention, the diamine component unit (b) constituting the aromatic polyamide (A) may consist only of an aliphatic diamine component unit, or may consist of an aliphatic diamine component unit and an alicyclic diamine component unit. It may consist of.

Such an aliphatic diamine component unit may be a linear alkylene diamine component unit or a branched chain alkylene diamine component unit. Among these aliphatic diamine component units, carbon number is 4.
-25 linear alkylene diamine component units are preferred, more preferably linear alkylene diamine component units having 6 to 18 carbon atoms.

Specifically, such aliphatic diamine component units include, for example, 6-diamithexane, 7-diaminohbutane, 8-diaminooctane, 9-diaminononane, 1,10-diaminodecane, 11
Examples include component units derived from linear alkylene diamines such as -diaminoundecane and 12-diaminododecane.

The aromatic polyamide (A) used in the polyamide resin composition of the present invention has an intrinsic viscosity [η] measured in concentrated sulfuric acid at a temperature of 30°C, which is usually 0.5 dl/g or more, preferably 0.6 dl/g. //g or more, more preferably 0.7~
3.0d//g, particularly preferably 0.8-1.5dl/g
Use those within the range.

Such aromatic polyamide (A) can be produced, for example, using a conventionally known method.

For example, Polymer Reyiev@, 10. C
on-densation Palye! 's b71n
jzlicial sad 5ollion Meth
ods (by P, W, MoBan), Inter-t
ci! ncePubli+he+s(+965))
, or in the old +omol, Cbem, 47.93
- As described in IN (+961), polycondensation of a diacid halide of an aromatic dicarboxylic acid capable of deriving the constituent unit of the aromatic polyamide (A) and a diamine by a solution method. Aromatic polyamide (A
) can be obtained. Aromatic polyamide (A) can also be obtained by interfacial polymerization.

Alternatively, an aromatic dicarboxylic acid corresponding to the aromatic dicarboxylic acid component unit and a diamine or a polyamide salt thereof corresponding to the diamine component unit are melted in the presence or absence of a solvent such as water. Aromatic polyamide (A) can be obtained by polycondensation.

Furthermore, the aromatic polyamide (A) can also be obtained by producing an oligomer by using the above-mentioned solution method or the like, and then further polycondensing it by a solid phase polymerization method.

In addition, the diamine component units forming the aromatic polyamide (A) include, in addition to the alkylene diamine component described above,
It may also contain an aromatic diamine component unit. Specifically, such aromatic diamine component units include:
For example, component units derived from aromatic diamines such as o-xylylene diamine and p-xylylene diamine can be mentioned. These aromatic diamines can be used alone or in combination of two or more.

Such aromatic polyamide (A) is excellent in tensile strength, elongation at break, bending strength, bending modulus, impact strength, etc.

The aliphatic polyamide (B) contained in the polyamide resin composition according to the present invention includes nylon 6, nylon 66,
Examples include nylon 12, nylon 46, nylon 610, and nylon 612.

Among these, nylon 6, nylon 66, and nylon 612 are preferably used.

These aliphatic polyamides themselves tend to be excellent in tensile strength, elongation at break, flexural strength, flexural modulus, impact strength, etc. in a well-balanced manner.

In the present invention, aromatic polyamide (A
) and aliphatic polyamide (B) contains an epoxy resin (C) as described below.

In this way, a polyamide composition consisting of an aromatic polyamide (A), an aliphatic polyamide (B), and an epoxy resin (C) has the advantages that the aromatic polyamide (A) and the aliphatic polyamide (B) each have. It has properties such as flexural modulus, impact strength, etc.
It exhibits superior properties such as tensile strength and bending strength, etc.

For example, aromatic polyamide (A) is superior to aliphatic polyamide (B) in terms of tensile strength, bending strength, bending elastic modulus, etc.

However, this composition (A-B) consisting only of aromatic polyamide (A) and aliphatic polyamide (B)
In this case, the properties are better than those of the aliphatic polyamide (B) itself, but are inferior to those of the aromatic polyamide (A).

However, as mentioned above, in addition to aromatic polyamide (A) and aliphatic polyamide (B), epoxy resin (C
The polyamide composition according to the present invention using the polyamide (A) and/or the aliphatic polyamide (B) has properties such as tensile strength and flexural strength that are significantly superior to either the aromatic polyamide (A) and/or the aliphatic polyamide (B). Furthermore, in terms of other properties, such as flexural modulus, the properties of the aromatic polyamide (A), which are superior to the aliphatic polyamide (B), are substantially maintained.

Furthermore, in terms of elongation at break, impact strength, etc., which tend to be better in aliphatic polyamide (B) than in aromatic polyamide (A), aromatic polyamide (A) and aliphatic polyamide (B) In a polyamide composition using an epoxy resin (C) in addition to an aliphatic polyamide (
The above-mentioned excellent properties of B) are exhibited.

In this way, a polyamide composition consisting of an aromatic polyamide (A), an aliphatic polyamide (B), and an epoxy resin (C) can be made from either the aromatic polyamide (A) and/or the aliphatic polyamide (B). It is presumed that the reason why the epoxy resin (C) also has excellent properties such as tensile strength is because the epoxy resin (C) acts as a kind of binder between the aromatic polyamide (A) and the aliphatic polyamide (B).

The epoxy resin (C) contained in the polyamide composition according to the present invention is a highly reactive compound having three or more members.

Such an epoxy resin (C) has (-0CH2CH
-'CH2) or linear aliphatic epoxide type epoxy resin containing two or more epoxy groups in the molecular chain other than the molecular terminal, or in the molecular chain having an alicyclic structure. Examples include ring group epoxide type epoxy resins containing two or more epoxy groups, and specifically, the following resins are used.

Glycidyl ether type.

Bisphenol A diglycidyl ether, bisphenol A diβ-methylglycidyl ether, bisphenol F diglycidyl ether, tetrahydroxyphenylmethane tetraglycidyl ether, resorcinol diglycidyl ether halogenated bisphenol A diglycidyl ether, noholac glycidyl ether, polyethylene glycol diglycidyl ether , polyalkylene glycol diglycidyl ether such as polypropylene glycol diglycidyl ether, hydrogenated bisphenol A glycidyl ether, diglycidyl ether of bisphenol A alkylene oxide adduct, epoxy urethane resin, glycerin triglycidyl ether, pentaerythritol diglycidyl ether.

Glycidyl ether/ester type P-Oquine benzoic acid glycidyl ether ◆ester.

Glycidyl ether type phthalic acid diglycidyl ester, tetrahydrophthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester, polyacrylic acid glycidyl ester, dimer acid diglycidyl ester.

Glycidylamine-type glycidiamine, tetraglyline diaminocyphenylmethane, triglyne lysocyanurate.

linear aliphatic epoxy resin epoxidized polybutadiene, Epoxidized Soyura.

Alicyclic epoxy resin 3.4-epoxy-6methylcyclohexynylmethyl, 3
．． 4-epoxy-6methylcyclohexanecarpoquinlate, 3.4-epoxycyclohexinemethyl (3,4-evoquincyclohexane)carboxylate, bis(3,4
-Epoxy-6methylcyclohexylmethyl)adipate, vinylcyclohexene dieboxide, dicyclopentadiene oxide, bis(2,3-epoxycyclopentyl)ether, limonene dioxide.

The above-mentioned epoxy resins, such as phenolic or alcohol-based glycidyl ethers, glycidyl esters, and glycidyl amines, are prepared by reacting the corresponding polyhydric alcohols, polybasic acids, and polyamines with epichlorohydrin and dehydrochlorinating them. can do.

Epoquinated olefins can be prepared by reacting an acid such as peracetic acid with the double bonds of the olefin.

In the present invention, when preparing such an epoxy resin, the following bisphenol compounds can also be used.

Specifically, bisphenol compounds that can be used in the present invention include 1,1-bis-(4-hydroxyphenyl)ethane, i,t-bis-(4-hydroxyphenyl)propane, and 2,2-bis-(4-hydroxyphenyl)propane. -(4-hydroxyphenyl)butane, 2.2-bis-4-hydroxyphenyl)pentane, 2.2-bis-(4-hydroxyphenyl)-3-methylbutane, 2.2-bis-(4-hydroxyphenyl)- phenyl)hexane, 2.2-bis-<4-hydroxyphenyl)-4-methylpentane, 1. l-bis-
(4-hydroquinphenyl)cyclopentane, 1.1-
Bis-(4-hydroxyphenyl)cyclohexane, bis-(4=hydroxy-3-methylphenyl)methane,
1.1-bis-(4-hydroxy-3-methylphenyl)ethane, 2.2-bis=(4-hydroxy-3-methylphenyl)propane, 2.2-bis-(4-hydroxy-3-ethyl) phenyl)propane, 2,2-bis-(
4-hydroxy-3-1s.

propylphenyl)propane, 2,2-bis-(4-hydroxy-3-sec-butylphenyl)propane, bis-(4-hydroquinphenyl)phenylmethane, 1.
1-bis-(4-hydroxyphenyl)-1-phenylethane, l,1-bis-<4-hydroxyphenyl)-
t-phenylpropane, bis-(4-hydroquinphenyl)diphenylmethane, bis-<4-hydroxyphenyl)dihenzylmethane, 4.4°-dihydroxydiphenyl ether, 4,4°-dihydroxydiphenyl sulfone, 4.4°-dihydroxydiphenyl sulfide,
Examples include phenolphthalein.

In the present invention, among the above epoxy resins,
It is preferable to use a glycidyl ether type epoxy resin, and among them, a phenolic epoxy resin is preferable, and it is particularly preferable to use an epoxy resin using bisphenol A as a main raw material.

The epoxy equivalent of such an epoxy resin is usually 17
It is 0-3500.

In the polyamide composition according to the present invention, the aromatic polyamide (A) and the aliphatic polyamide (B) as described above,
Epoxy resin (C) means that aromatic polyamide (A) is present in an amount of 5 to 95% by weight, preferably 50 to 80% by weight, and aliphatic polyamide (B
) in an amount of 5 to 95% by weight, preferably 20 to 50% by weight, and the epoxy resin (C) in an amount of 0.5 to 20% by weight, preferably 1 to 5% by weight, based on 100% by weight of the polyamide composition. used in quantity.

Aromatic polyamide (
When A) and the aliphatic polyamide (B) are used in the above amounts, the elongation and impact strength of the aliphatic polyamide and the flexural strength and flexural modulus of the aromatic polyamide are well balanced. If the epoxy resin (C) is used in an amount exceeding the above range, the composition becomes brittle, which is not preferable.

The polyamide composition according to the present invention has the aromatic polyamide (A), the aliphatic polyamide (B), and the epoxy resin (C) as essential components as described above, or the polyamide composition contains the aromatic polyamide (A), the aliphatic polyamide (B), and the epoxy resin (C) as essential components, or in addition to these essential components. Organic or inorganic fillers, antioxidants, UV absorbers, photoprotectants, heat stabilizers, phosphite stabilizers, peroxide decomposers, basic adjuvants, nucleating agents, plasticizers, depending on the requirements. , a lubricant, an antistatic agent, a flame retardant, a pigment, a dye F4, etc.

These fillers can also be used in combination of two or more. Moreover, these fillers can also be used after being treated with a silane coupling agent, a titanium coupling agent, or the like.

The amount of the organic or inorganic fibrous filler is usually 200 parts by weight or less, preferably 5 to 180 parts by weight, and more preferably 5 to 180 parts by weight, based on 100 parts by weight of the aromatic polyamide (A). Preferably, it is included in the polyamide composition of the present invention in an amount of 5 to 150 parts by weight.

The polyamide composition according to the present invention can be prepared by a method in which a filler is blended while maintaining each component of the polyamide composition in a molten state. On this occasion,
An extruder, kneader, etc. can be used.

The polyamide composition according to the present invention as described above can be molded by a conventional melt molding method, such as a compression molding method, an injection molding method, or an extrusion molding method.

The polyamide composition according to the present invention can be used for various purposes such as engineering plastics by a normal molding method.

Effects of the Invention The polyamide composition according to the present invention contains (A) 5 to 95% by weight of aromatic polyamide and (B) 5 to 9% by weight of aliphatic polyamide.
5% by weight, and (C) epoxy resin is 0.5 to 10% by weight.
Because of this, it has outstanding mechanical properties such as tensile strength, bending strength, and impact strength.

[Example] Next, the polyamide composition according to the present invention will be explained in more detail with reference to Examples, but the present invention is not limited to these Examples in any way.

Comparative Example 1 Consisting of a dicarboxylic acid component consisting of 70 mol% terephthalic acid, 30 mol 96 isophthalic acid, and hexamethylene diamine [77] -0,94 (illifc acid, 30°C
), polyamide (A) having a melting point of 327° C. was used to prepare test pieces by injection molding, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Comparative Example 2 Using Toshi CM 1017 (B): NY6, test pieces were prepared by injection molding, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Comparative Example 3 60% by weight of the polyamide (A) used in Comparative Example 1 and 40% by weight of the polyamide (B) used in Comparative Example 2 were melt-blended using a twin-screw extruder. Test pieces were prepared by injection molding using the obtained polyamide composition, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Example 1 Polyamide (A) 79% by weight used in Comparative Example 1, 20% by weight polyamide (B) used in Comparative Example 2, and bisphenol A type epoxy resin with an epoxy equivalent of 2400 (manufactured by Mitsui Petrochemical Industries Ltd. 1) ?-309) 1% by weight and were melt-blended using a twin-screw extruder. Test pieces were prepared by injection molding using the obtained polyamide composition, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Example 2 A polyamide composition consisting of 58% by weight of the polyamide (A) used in Comparative Example 1, 40% by weight of the polyamide (B) used in Comparative Example 2, and 2% by weight of the epoxy resin used in Example 1. A test piece was prepared by injection molding using the same, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Comparative Example 4 A test piece was made by injection molding using Toshi CM 3001N: N Y 66, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Comparative Example 5 A test piece was prepared by injection molding using a polyamide composition consisting of 60% by weight of the polyamide (A) used in Comparative Example 1 and 40% by weight of the polyamide used in Comparative Example 4. The test described in 1 was conducted.

The results are shown in Table 2.

Example 3 From 79% by weight of the polyamide (A) used in Comparative Example 1, 20% by weight of the polyamide used in Comparative Example 4, and 1% by weight of the epoxy resin (R-309) used in Example 1. A test piece was prepared by injection molding using the polyamide composition, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Example 4 A boria consisting of 48% by weight of the polyamide (A) used in Comparative Example 1, 50% by weight of the polyamide used in Comparative Example 4, and 96% by weight of the epoxy resin (R-309) used in Example 1 A test piece was made by injection molding using the El-composition, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Comparative Example 6 P^612 manufactured by Hyulus: A test piece was prepared by injection molding using NY612, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Comparative Example 7 Using a polyamide composition consisting of 80% by weight of the polyamide (A) used in Comparative Example 1 and 20% by weight of the polyamide (NY612) used in Comparative Example 6, a test piece was made by injection bottom molding. The test described in Table 1 was conducted.

The results are shown in Table 2.

Example 5 79% by weight of the polyamide (A) used in Comparative Example 1, 20% by weight of the polyamide (NY612) used in Comparative Example 6, and 1% by weight of the epoxy resin (R-309) used in Example 1. A test piece was prepared by injection molding using a polyamide composition consisting of the following, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Comparative Example 8 64% by weight of the polyamide (A) used in Comparative Example 1, 16% by weight of the polyamide (Nl12) used in Comparative Example 6,
Using the polyamide composition containing 20% by weight of the epoxy resin (R-309) used in Example 1, test pieces were prepared by creative molding, and the tests listed in Table 1 were conducted.

The results are shown in Table 2.

Claims (6)

[Claims] (1) (A) Aromatic polyamide: 5 to 95% by weight, (B) Aliphatic polyamide: 5 to 95% by weight, (C) Epoxy resin: 0.5 to 10% by weight [However, (A) + (B) + (C) = 100% by weight]. (2) (A) Aromatic polyamide: 5 to 95% by weight, (B) Aliphatic polyamide: 5 to 95% by weight, (C) Epoxy resin: 0.5 to 10% by weight [However, (A) +(B)+(C)=100% by weight], and the polyamide (A) contains terephthalic acid component units, aromatic dicarboxylic acid component units other than terephthalic acid component units, and/or carbon atoms 4 to 2.
an aromatic dicarboxylic acid component unit (a) consisting of an aliphatic dicarboxylic acid component unit of No. 5, and a diamine component unit (b) consisting of an aliphatic diamine component unit and/or an alicyclic diamine component unit, Intrinsic viscosity [η
] is in the range of 0.5 dl/g or more. (3) Aromatic dicarboxylic acid component units (a) include 30 to 100 mol% of terephthalic acid component units, 0 to 70 mol% of aromatic dicarboxylic acid component units other than terephthalic acid component units,
and 0 aliphatic dicarboxylic acid component units having 4 to 25 carbon atoms.
3. The polyamide composition according to claim 2, characterized in that it is comprised of 70 mol%. (4) Aliphatic polyamide (B) is nylon 6, nylon 66, nylon 12, nylon 46, nylon 610
4. The polyamide composition according to claim 1, wherein the polyamide composition is one or more polyamides selected from the group consisting of nylon 612 and nylon 612. (5) The epoxy resin (C) is characterized by being an epoxy resin having a glycidyl ether type terminal group represented by formula (i); The polyamide composition according to any one of claims 1 to 4. (6) Bisphenol A diglycidyl ether whose epoxy resin (C) is represented by formula (i-1): ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼... (i- 1) [However, in formula (i-1), n is an integer of 0 to 25. ] The polyamide composition according to any one of claims 1 to 5, characterized in that: