JPH01163234A - Thermoplastic resin composition - Google Patents

Abstract

PURPOSE:To obtain a thermoplastic resin composition having permanent antistatic properties and excellent impact resistance and molding processability with ply separation, by blending a specific polyether ester amide with a polyolefin polymer modified with carboxyl groups, etc. CONSTITUTION:The aimed composition consisting of (A) 1-40 pts.wt. polyether ester amide, obtained by copolymerizing (i) a salt of a >=6C aminocarboxylic acid, lactam or >=6C diamine with a dicarboxylic acid with (ii) a poly(alkylene oxide) glycol having 200-6000 molecular weight and/or a diol compound expressed by the formula (Ar is 6-20C aromatic group or alicyclic group; R<1> and R<2> are ethylene oxide or propylene oxide; m and n are 1-15) and (iii) a 4-20C dicarboxylic acid and containing 10-90wt.% polyether ester units, (B) 20-98 pts.wt. polyolefin and (C) 0.1-40 pts.wt. modified olefin polymer having carboxyl, epoxy and (substituted) amino groups.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a resin composition that has permanent antistatic properties, has excellent impact resistance and moldability, and is free from layer peeling i4 (thousand peeling). It is related to.

[Prior Art] Polyolefins are used in a wide range of fields due to their excellent properties. If these materials are given antistatic properties in addition to the mechanical strength possessed by the TJ family, their uses can be further expanded. In other words, it is possible to expand the application to copying machines where it is desired to prevent failures due to static electricity, various dustproof parts, etc.

As a method for improving the antistatic properties of polyolefin, there is a method of incorporating antistatic properties into the polyolefin.

Furthermore, JP-A-58-118838 proposes that a resin having antistatic properties can be obtained by mixing polyether ester amide and polyolefin.

[Problems to be Solved by the Invention] However, the method of kneading an antistatic agent into polyolefin has the drawback that the antistatic effect is lost when the surface of the molded product is wiped with a cloth or washed with water, so it is not satisfactory. .

Furthermore, the antistatic resin disclosed in JP-A-58-118838 has extremely poor affinity with polyether ester amide and polyolefin, causing delamination of molded products, making it difficult to obtain a composition that can be put to practical use. I can't. Therefore, an object of the present invention is to provide an antistatic resin composition whose antistatic properties are not impaired by environments such as wiping with a cloth or washing with water, and which does not cause delamination.

[Means for solving the problem] As a result of intensive studies, in order to solve the above problem, a specific polyether ester amide, a polyolefin, and at least one type of carboxyl group, epoxy group, amino group, and substituted amine group are used. The present invention was achieved by discovering that it is important to blend a modified olefin polymer containing a functional group (hereinafter abbreviated as modified olefin polymer).

That is, the present invention provides (A) (a) an aminocarboxylic acid or lactam having 6 or more carbon atoms, or a salt of diamine and dicarboxylic acid having 6 or more carbon atoms; (b) a poly(alkylene) having a number average molecular weight of 200 to 6000; 8% R'-)-0-Ar-0(-R2+-H-=-
---([)m
n (wherein, Ar represents an aromatic group and an alicyclic group having 6 to 20 carbon atoms, R1 and R2 represent an ethylene oxide group or a propylene oxide group, and m and n each represent an integer of 1 to 15. ) and (c) 1 to 40 parts by weight of a polyether ester amide formed by copolymerizing a dicarboxylic acid having 4 to 20 carbon atoms and containing 10 to 90 weight % of polyether ester units, ( B) Polyolefin 20~
98 parts by weight, and (C) 0.1 to 40 parts by weight of a modified olefin polymer containing at least one functional group of a carboxyl group, an epoxy group, an amino group, and a substituted amino group, and (A)' This is a thermoplastic resin composition in which the total amount of + (B) + (C) is 100 parts by weight.

The present invention will be explained in detail below.

In the present invention, (A> component of polyether ester amide (a> aminocarboxylic acid or lactam having 6 or more carbon atoms, or salt of diamine and dicarboxylic acid having 6 or more carbon atoms) includes ω-aminocaproic acid,
Aminocarboxylic acids such as ω-aminoenantoic acid, ω-aminocaprylic acid, ω-aminopergonic acid, ω-aminecapric acid and 11-aminoundecanoic acid, 12-aminododecanoic acid or caprolactam, enantholactam, capryllactam and laurolactam Salts of lactams and diamine dicarboxylic acids such as hexamethylenediamine-adipate, hexamethylenediamine-sebacate and hexamethylenediamine-isophthalate are used, in particular caprolactam, 12-aminododecanoic acid, hexamethylenediamine diamine-adipine k
t,= is preferably used.

(A>Constituent component of polyether ester amide (
b) As poly(alkylene oxide) glycol,
Polyethylene glycol, poly(1,2-propylene oxide) glycol, poly(1,3-propylene oxide) glycol, poly(tetramethylene oxide) glycol, poly(hexamethylene oxide) glycol,
Block or random copolymers of ethylene oxide and propylene oxide and block or random copolymers of ethylene oxide and tetrahydrofuran are used. Among these, polyethylene glycol is particularly preferably used because of its excellent antistatic properties. Poly(
The number average molecular weight of glycol (alkylene oxide) is 20
0 to 6,000, especially 250 to 4,000; if the number average molecular weight is less than 200, the mechanical properties of the resulting polyetheresteramide will be poor; if the number average molecular weight exceeds 6,000, It is unfavorable because it lacks antistatic properties.

In the present invention, the diol compound that is a component of (A>polyetheresteramide) is a compound represented by the general formula (I>).

H(-R”)-0-A r-0+几2+-H・・Song・
・Song ([)m 0(
However, in the formula, Ar represents an aromatic group or alicyclic group having 6 to 20 carbon atoms, R1 and R2 represent an ethylene oxide group or a propylene oxide group, and m and n each represent 1
Indicates an integer between ~15. ) The diol compounds represented by the above general formula (1) include compounds represented by the following formulas (II) to (1v) and their halogen derivatives.

H+PL'廿0Q-Q-Oken2pu・・・・・・・・・
...(I[I)H(-'R cap o0) o÷R2 dry H(■)
(In the formula, R1 and R2 represent an ethylene oxide group or a propylene oxide group, and Y is a covalent bond, an alkylene group having 1 to 6 carbon atoms, an alkylidene group, a cycloalkylidene group, an arylalkylidene group, O, So, SO
2, Co, S, CF2, C (CF: s>2 or NH. m and n each represent an integer of 1 to 15.

) Specific examples include ethylene oxide adduct of bisphenol A, propylene oxide adduct of bisphenol A, ethylene oxide adduct of bisphenol S, propylene oxide adduct of bisphenol S, ethylene oxide adduct of brominated bisphenol A, and brominated bisphenol A. propylene oxide adduct, 4.4'-
Addition of bis(hydroxy)biphenyl with propylene oxide 1Of course, ethylene oxide adduct of bis(4-hydroxyphenyl)sulfide, propylene oxide adduct of bis(4-hydroxyphenyl)sulfide, bis(4-hydroxyphenyl)sulfide
- Ethylene oxide adduct of bis(4-hydroxyphenyl) sulfoxide, propylene oxytoy of bis(4-hydroxyphenyl) sulfoxide, ethylene oxide adduct of bis(4-hydroxyphenyl)methane, propylene of bis(4-hydroxyphenyl)methane Oxide adducts, ethylene oxide adducts of bis(4-hydroxyphenyl) ether, propylene oxide adducts of bis(4-hydroxyphenyl) ether, bis(4-hydroxyphenyl) ether,
-Hydroxyphenyl> Ethylene oxide adduct of amine, propylene oxide adduct of bis(4-hydroxyphenyl)amine, ethylene oxide adduct of 2゜2-bis(4-hydroxyphenyl)ethane, 2,2-bis(4-hydroxy Ethylene oxide of bisphenols such as propylene oxide adduct of phenyl ethane, ethylene oxide adduct of 1.1-bis(4-hydroxyphenyl)cyclohexane, and propylene oxide adduct of 1.1-bis(4-hydroxyphenyl)hexane; / or propylene oxide adduct, ethylene oxide adduct of 4,4′-dihydroxybenzofinone,
4. Propylene oxide adducts of 4'-dihydroxybenzofinone, ethylene oxide and/or propylene oxide adducts of hydroquinone, ethylene oxide and/or propylene oxide adducts of dihydroxynaphthalene, and block (co)polymers thereof. can be mentioned. Preferred diol compounds include ethylene oxide adducts of hydroquinone, ethylene oxide adducts of bisphenol A, ethylene oxide adducts of brominated bisphenol A, ethylene oxide adducts of bisphenol S, ethylene oxide adducts of dihydroxynaphthalene, and block polymers thereof. In particular, ethylene oxide adducts of bisphenol A and block polymers thereof are preferred.

These poly(alkylene oxide) glycols and diol compounds represented by the general formula (I>) can be used alone or in combination of two or more as necessary.

The amount of the diol compound represented by the general formula (I>) is not particularly limited, but it is preferably in the range of 0 to 60% by weight based on the polyether ester unit obtained by copolymerizing with (C).

Further, other diol compounds can be copolymerized within a range that does not impair the effects of the present invention.

Specifically, aliphatic diols such as ethylene glycol, 1,4-butanediol, and 1,6-hexanediol, aromatic diols such as p-xylylene glycol and m-xylylene glycol, and 1°2-cyclohexanediol. , 1.3-cyclohexanediol, 1.4-cyclohexanediol, 1.4-cyclohexane dimetatool, 1°3-cyclohexane dimetatool, and other alicyclic diol compounds can be copolymerized.

(A>Constituent component of polyether ester amide (
c) Dicarboxylic acids having 4 to 20 carbon atoms include terephthalic acid, inphthalic acid, phthalic acid, naphthalene-2,6
-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid,
Aromatic dicarboxylic acids such as diphenyl-4,4'-dicarboxylic acid, diphenoxyethanedicarboxylic acid and sodium 3-sulfoiphthalate, 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid and °dicyclohexyl Examples include alicyclic dicarboxylic acids such as -4,4'-dicarboxylic acid and aliphatic dicarboxylic acids such as succinic acid, oxalic acid, adipic acid, sebacic acid and dodecanedioic acid (decanedicarboxylic acid), in particular terephthalic acid, Isophthalic acid, 1,4-cyclohexanedicarboxylic acid, adipic acid, sebacic acid and dodecanedioic acid are preferably used from the viewpoint of polymerizability, color tone and physical properties.

(b) poly(alkylene oxide) glycol and/or
Alternatively, the diol compound and (C) dicarboxylic acid are reacted at a molar ratio of 1:1, but the charging ratio is usually changed depending on the type of dicarboxylic acid used.

(b) poly(alkylene oxide) glycol and/or diol compound, which is a constituent component of polyether ester; and (C) dicarboxylic acid, which is a constituent unit of polyether ester amide, accounts for 90 to 10 percent of the base. If the amount is more than 90% by weight, the mechanical properties of the polyether ester amide will be poor, and if it is less than 10% by weight, the antistatic properties of the resulting 45% fat will be poor, which is not preferred.

(A> There are no particular limitations on the polymerization method for polyether ester amide. For example, (a) (a) aminocarboxylic acid or lactam and (c) dicarboxylic acid are reacted to form a polyamide prepolymer with carboxylic acid groups at both ends. and (b) reacting it with poly(alkylene oxide) glycol and/or diol compound under vacuum. , a method of producing a carboxylic acid-terminated polyamide prepolymer by carrying out a pressurized reaction at high temperature in the presence or absence of water, and then proceeding with polymerization under normal pressure or reduced pressure, and (c) the method described in (a) above. , (b), (C)
It is possible to use a method such as simultaneously charging the compounds into a reaction tank, melting and mixing them, and then proceeding with polymerization all at once under a high vacuum.

In addition, there are no restrictions on the polymerization solvent; for example, one type of polymerization solvent may be used, such as an antimony catalyst such as antimony dioxide, a tin catalyst such as monobutyltin oxide, a titanium catalyst such as tetrabutyl titanate, or a zirconate catalyst such as tetrabutyl zirconate. Alternatively, two or more types can also be used.

The polyolefin (B) used in the present invention includes polyethylene, polypropylene, ethylene/propylene copolymer, ethylene/propylene/genter polymer,
Examples include ethylene/butene-1 copolymer, ethylene/vinyl acetate copolymer, and mixtures thereof, with polypropylene and ethylene/propylene copolymer being particularly preferably used.

(B) There are no particular limitations on the method for polymerizing the polyolefin; for example, known methods such as contacting with a Ziegler-Natsuta catalyst in a solvent and proceeding with polymerization at room temperature to 80°C and 3 to 10 kg/- may be used. Can be done.

The modified olefin polymer (C) used in the present invention is an olefin polymer having in its molecule at least one functional group selected from the group consisting of a carboxyl group, an epoxy group, and an amine group or a substituted amine group. The content of these functional groups may be very small, or may be contained in large amounts as long as the performance as a resin is not impaired.

Usually, the effects of the present invention can be efficiently exhibited if the modified olefin polymer contains substantially more than an average number of the above-mentioned functional groups in one molecule.

(C) There are no particular restrictions on the method of introducing carboxyl groups into the modified olefin polymer, but for example, ■ carboxyl groups or carboxyl anhydride groups such as acrylic acid, methacrylic acid, maleic acid, maleic anhydride, phthalic acid, and itaconic acid. A method of copolymerizing a vinyl monomer with a predetermined α-olefin, ■ A method of graft polymerizing the above vinyl monomer having a carboxyl group or anhydrous carboxyl group to a polyolefin, ■ A method of graft polymerizing a vinyl monomer having a carboxyl group or anhydrous carboxyl group to a polyolefin, A method of saponifying a copolymer of a (meth)acrylic acid ester monomer such as butyl and an α-olefin with an alkali can be used.

There are no particular restrictions on the method of introducing the epoxy group, but for example, it is represented by the following formula (V) (wherein R is a hydrogen atom, a lower alkyl group, or a lower alkyl group substituted with a glycidyl ester group), Specifically, glycidyl acrylate, glycidyl methacrylate, glycidyl ethacrylate, glycidyl itaconate, etc. are copolymerized with a predetermined α-olefin, or
Alternatively, a method of graft polymerization to a predetermined polyolefin can be used.

Furthermore, there is no particular restriction on the method of introducing an amine group or a substituted amine group, but for example, the following formula<fs, where R3 represents hydrogen, a methyl group, or an ethyl group, and R4 represents hydrogen or has 1 to 1 carbon atoms. 12 alkyl groups, 2 to 1 carbon atoms
A vinyl monomer having at least one functional group of an amino group or a substituted amine group represented by an alkanoyl group, a phenyl group or a cycloalkyl group having 6 to 12 carbon atoms, or derivatives thereof. Predetermined α−
Copolymerization with an olefin or graft polymerization with a predetermined polyolefin can be used.

Specific examples of vinyl monomers having at least one functional group, such as an amino group or a substituted amino group, include aminoethyl acrylate, propylaminoethyl acrylate,
Alkyl ester derivatives of acrylic acid or methacrylic acid such as dimenalaminoethyl methacrylate, ethylaminopropyl methacrylate, phenylaminoethyl methacrylate and cyclohexylaminoethyl methacrylate, N-vinyldiethylamine and N-acetylvinylamine vinylamine derivatives such as allylamine, allylamine derivatives such as methalylamine and N-methylallylamine, (meth)acrylamide derivatives such as acrylamide, methacrylamide and N-methylacrylamide, and aminostyrenes such as p-aminostyrene. Examples include.

(C) There are no particular restrictions on the α-olefin used in the polymerization of the modified olefin polymer, such as ethylene,
Examples include propylene, butene-1, and mixtures thereof.

There are no particular limitations on the method for producing the modified olefin polymer (C), and known α-olefin polymerization methods can be applied.

The thus obtained polymer contains (A>polyether ester amide 1 to 40 parts by weight, preferably 5 to 30 parts by weight,
(B) 20 to 98 parts by weight of polyolefin, preferably 4 parts by weight
0 to 94 parts by weight and (C) modified olefin polymer 0.
It is blended within the range of 1 to 40 parts by weight, preferably 1 to 30 parts by weight, so that the total amount of (A>+ (B) + (C) is 100 parts by weight).

(A> If the amount of polyether ester amide is less than 1 part by weight, the antistatic properties of the resin composition will be insufficient, and if it exceeds 40 parts by weight, the resin composition will become flexible and have poor mechanical properties, which is not preferable.

If the polyolefin (B) is less than 20 parts by weight, impact resistance will be insufficient, and if it exceeds 98 parts by weight, antistatic properties will be poor, which is not preferable.

Furthermore, if the modified olefin polymer (C) is less than 0.1 part by weight, the resin composition may cause delamination and cannot be used.
If it exceeds the heavy plate portion, molding processability will be significantly deteriorated and the surface of the molded product will become matte, which is not preferable.

There are no particular restrictions on the method for producing the resin composition of the present invention, and for example, (A>polyether ester amide and (B
) A polyolefin and (C) a modified olefin polymer resin mixture is melt-kneaded using a Banbury mixer, roll, extruder, etc. to produce a product.

The resin composition of the present invention may contain other thermoplastic polymers that are compatible with the resin composition of the present invention, such as polyamide, polybutylene terephthalate, polyethylene terephthalate, polycarbonate, vinyl chloride resin, polyglutarimide,
The performance as a molding resin can be improved by mixing elastomers such as hydrogenated and/or non-hydrogenated styrene-butadiene block copolymers.

In addition, metal salts of sulfonic acid, anionic type, cationic type,
It is possible to further improve antistatic properties by adding antistatic agents such as nonionic surfactants, and if necessary, various types of compatibilizers such as oligomers, antioxidants, ultraviolet absorbers, etc. stabilizers, pigments, dyes, lubricants, plasticizers,
Glass fibers, flame retardants, etc. can also be added.

In addition, when using a modified olefin polymer containing an epoxy group as the modified olefin polymer (C), a sulfonic acid salt, a tertiary amine, and a phosphorus compound are added (A> component and (B) are compatible). can also be further improved.

[Examples] In order to explain the present invention more specifically, examples and comparative examples will be given below. In addition, after the finally obtained resin composition was molded by injection molding, various physical properties were measured by the following trial method.

Izot impact strength: ASTM D256-56A flexural modulus + ASTM D790 MFR: ASTM D1238-62T body bond specific resistance: using a 2mmt x 40mmφ disc, at room temperature 2
Measurement was carried out under an atmosphere of 3°C, 1 temperature and 50% RH. For the measurement, a transcendental resistance meter 5M-10 manufactured by Toa Type Wave Industry Co., Ltd. was used.

The delamination prevention property of the molded product was determined by bending the molded product and observing the fracture surface of a tensile test specimen. ◎: Very good, ○: Good, ×: The molded product causes delamination.
was used as the criterion.

In addition, parts and percentages in the examples indicate parts by weight and percentages by weight, respectively.

Reference example <1) (A) Preparation of polyether ester amide A-1
: 50 parts of caprolactam, 44.2 parts of polyethylene glycol with a number average molecular weight of 1000, and 7 parts of terephthalic acid.
, Part 6 is “Irganox”.

1098 (antioxidant) and 0.1 part of antimony trioxide catalyst with 4+ in.
After heating and stirring at 260°C for 60 minutes to obtain a clear homogeneous solution, the mixture was heated to 260°C.
Polymerization was carried out for 4 hours under the following conditions (0.5 mm 1 liter) to obtain a viscous and transparent polymer.

Pelletized polyether ester amide (A-1>) was prepared by discharging the polymer onto a cooling belt and pelletizing it.

(The polycartel ester unit in A-1> was 45 times overlapping.

A-2: 40 parts of nylon 6.6 salt (AH salt), ethylene oxide adduct of bisphenol A, and Eupol BP
E-20, manufactured by Sanyo Chemical Industries ■) 6.3 parts, 41.9 parts of polyethylene glycol with a number average molecular weight of "000", and 14.3 parts of dodecadionic acid were added to "Irganox °" 1098
0.2 part of antimony trioxide and 0.02 part of antimony trioxide were charged into the reaction vessel used for A-1, and the mixture was replaced with nitrogen and heated at 260°C for 60 hours.
After heating and stirring for a minute to make a transparent homogeneous solution, 500 IT
Moisture in the gas phase of the reaction vessel was removed by reducing the pressure to ImHg, and 0.08 part of tetrabutyl zirconate was added.

Then, it was heated for 3 hours at 260°C and 0.5 mmHq or less.
Polymerization was carried out for 0 minutes to obtain a viscous and transparent polymer.

Thereafter, polyether ester amide (
A-2) was prepared. The polyether ester unit in (A-2) was 40% by weight.

A-3: 40 parts of 12-aminododecanoic acid, 60 parts of 1°4-bis(β-hydroxyethoxy)benzene, 44.3 parts of polyethylene glycol with a number average molecular weight of 1000, and 13.2 parts of terephthalic acid. Irganox”
1098 and 0.1 part of antimony dioxide were charged into the reaction vessel used in A-1, and a polyether ester amide (A-3> was prepared in the same manner as in A-1).

(The polyether ester unit in A-3> is 40% by weight
Met.

<2> (B) Preparation of polyolefin B-1: Polypropylene (M measured by ASTM D1238-62
I 4g/10 minutes) (Mitsui Noblen B J HH-G manufactured by Mitsui Toatsu Chemical Co., Ltd.) was used.

B-2: Polypropylene (ASTM D1238-6
2) (Mitsui Toatsu Chemical 1)
Mitsui Noblen JHH-791) was used.

<3> (C) Modified olefin polymer C-1: copolymer of ethylene and butene-1 (weight ratio 90
/10) with 2 mol% of maleic anhydride grafted onto it (M measured by ASTM D1238-62)
I 2.5g/10min) (Mitsui Petrochemical (Tai Seibu N-
Do not use Tafmar MA8510).

C-2: 100 parts of an ethylene/propylene copolymer (Tafmer P, type P-0280, manufactured by Mitsui Petrochemicals (1)) consisting of 80 mol% ethylene and 20 mol% propylene was dissolved in a small amount of acetone. After adding 0.1 part of di-t-butyl peroxide and 2 parts of acrylic acid,
An acrylic acid-grafted ethylene/propylene copolymer (C-2) was prepared by mixing and pelletizing at 200°C using a 40 mmφ extruder.

C-3: For 100 parts of the ethylene/propylene copolymer used in C-2, di-t dissolved in acetone at sunset
- After adding 0.1 part of butyl peroxide and 1.0 part of glycidyl methacrylate, ethylene/glycidyl methacrylate was grafted by the same method as C-2.
A propylene copolymer (C-3) was prepared.

Examples 1 to 8 Prepared in reference example (A>polyether ester amide,
(B) Polyolefin and (C) modified olefin polymer were mixed at the compounding ratio shown in Table 1, and a vented 40mmφ
Pellets were produced by melt-kneading and extruding at a resin temperature of 230'C using an extruder.

Next, a test piece was molded using an injection molding machine at a cylinder temperature of 230°C and a mold temperature of 60°C, and each physical property was measured.

The volume resistivity value was measured using an injection molded disk with a thickness of 2 mm under the following conditions.

(1) Immediately after molding, wash with an aqueous solution of the detergent Pamama Lemon °' (manufactured by Lion Oil (3)), then thoroughly wash with distilled water to remove surface moisture, and then wash at 50% RH1.
The humidity was controlled at 32°C for 24 hours and measured.

(2) After molding, leave it in a 50% RH 123℃ for 200 days, wash it with a detergent "Mama Lemon'° aqueous solution, then thoroughly wash it with distilled water to remove surface moisture.
The humidity was controlled at 0% RH and 123°C for 24 hours and then measured.

The measurement results are shown in Table 1.

Comparative Examples 1 to 7 The (A) polyether ester amide, (B) polyolefin, and (C) modified olefin polymer prepared in the reference examples were melt-kneaded and extruded in the same manner as in the examples at the blending ratio shown in Table 1. , and each physical property was measured.

The measurement results are shown in Table 1.

The following is clear from the results shown in Margin Table 1 below. The resin compositions of the present invention (Examples 1 to 8) all have balanced and excellent mechanical properties represented by impact strength and flexural modulus, and moldability, and have low volume resistivity values. There is. Moreover, the resistance value hardly changes even after surface cleaning or changes over time, and it exhibits excellent permanent antistatic properties.

That is, the resin composition of the present invention has excellent mechanical properties, moldability, delamination prevention properties, and permanent antistatic properties.

On the other hand, the blending amount of polyether ester amide (A>
If it is less than part by weight (Comparative Example 1), antistatic property (resistance value)
When the polyether ester amide (A> exceeds 40 parts by weight (Comparative Example 2.6)), the flexural modulus is poor.

When the blending amount of polyolefin (B) was less than 20 parts by weight (Comparative Example 3), the flexural modulus was poor2, and the polyolefin (
When B) exceeds 98 parts by weight (Comparative Example 7), antistatic properties are poor.

When the amount of the modified olefin polymer (C) is less than 0.1 part by weight (Comparative Example 4), the impact resistance is poor and the molded product causes delamination, and when it exceeds 40 parts by weight (Comparative Example 4) Example 5
) is unfavorable due to its poor bending modulus.

[Effects of the Invention] Since the thermoplastic resin composition of the present invention contains specific amounts of specific (A), (B), and (C), it has permanent antistatic properties,
It has excellent mechanical properties such as impact resistance and moldability, and there is no delamination.

Claims (1)

Scope of Claims: (A) (a) An aminocarboxylic acid or lactam having 6 or more carbon atoms, or a salt of a diamine and dicarboxylic acid having 6 or more carbon atoms, (b) A poly( alkylene oxide) glycol and/or one or more diol compounds H■R^1■_mO-Ar-O■R^2■_nH......
(I) (In the formula, Ar represents an aromatic group or alicyclic group having 6 to 20 carbon atoms, R^1 and R^2 represent an ethylene oxide group or a propylene oxide group, and m and n each represent 1 (represents an integer from 1 to 15) and (c) polyether ester amide 1 obtained by copolymerizing a dicarboxylic acid having 4 to 20 carbon atoms, with a polyether ester unit content of 10 to 90% by weight. ~40 parts by weight, (B) 20 to 98 parts by weight of polyolefin, and (C) 0.1 of a modified olefin polymer containing at least one functional group of a carboxyl group, an epoxy group, an amino group, and a substituted amino group.
-40 parts by weight, and the total amount of (A) + (B) + (C) is 100 parts by weight.