JPH03237151A - Cured product of alumina-filled resin - Google Patents
Cured product of alumina-filled resinInfo
- Publication number
- JPH03237151A JPH03237151A JP3245990A JP3245990A JPH03237151A JP H03237151 A JPH03237151 A JP H03237151A JP 3245990 A JP3245990 A JP 3245990A JP 3245990 A JP3245990 A JP 3245990A JP H03237151 A JPH03237151 A JP H03237151A
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- cured product
- particle size
- size distribution
- rounded corners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 229920005989 resin Polymers 0.000 title claims abstract description 11
- 239000011347 resin Substances 0.000 title claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 28
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 12
- 239000000945 filler Substances 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 239000012756 surface treatment agent Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 10
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 229930185605 Bisphenol Natural products 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 abstract description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011810 insulating material Substances 0.000 abstract description 4
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- 239000004014 plasticizer Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 239000007789 gas Substances 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 229910018503 SF6 Inorganic materials 0.000 description 7
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 7
- 229960000909 sulfur hexafluoride Drugs 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 101000856246 Arabidopsis thaliana Cleavage stimulation factor subunit 77 Proteins 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007785 strong electrolyte Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- LSJNBGSOIVSBBR-UHFFFAOYSA-N thionyl fluoride Chemical compound FS(F)=O LSJNBGSOIVSBBR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
Ａ 産業上の利用分野
本発明は、高電圧機器の絶縁材料及び構造材料として好
適なアルミナ充填樹脂硬化物に関する。DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a cured alumina-filled resin suitable as an insulating material and a structural material for high-voltage equipment.
Ｂ 発明の概要
本発明は、マトリックスとしてエポキシ樹脂を用いると
共にアルミナを充填材とする硬化物において、アルミナ
として特定の粒度分布を有すると共に角がとれ且つ必要
に応じてシランカップリング剤で表面処理されているも
のを用いることｔこより、硬化物の機械強度の向上を図
るものである。B. Summary of the Invention The present invention provides a cured product using an epoxy resin as a matrix and alumina as a filler, which has a specific particle size distribution as alumina, has rounded corners, and is surface-treated with a silane coupling agent if necessary. This is intended to improve the mechanical strength of the cured product.
Ｃ３従来の技術
従来より、高電圧機器の絶縁材料及び構造材料として、
エポキシａｍをマトリックスとした高分子複合硬化物、
いわゆるモールド注型品が広く用いられている。そして
、構造材料としてのモールド注型品の充填材には、低熱
膨張率化とモールド品の低コスト化のため、シリカが多
く用いられている。C3 Conventional technology Traditionally, it has been used as an insulating material and structural material for high voltage equipment.
Polymer composite cured product with epoxy am as a matrix,
So-called mold cast products are widely used. Silica is often used as a filler for molded products as a structural material in order to lower the coefficient of thermal expansion and reduce the cost of molded products.
しかし、シリカは、超高圧機器のガス絶縁システムに用
いられる六フッ化硫黄（ＳＦ、）の分解ガスと反応して
しまうという問題を有している。すなわち、ＳＦ、は機
器中のアークやコロナ等の放電により、次の化学式のよ
うに分解され、
Ｓ Ｆ６− Ｓ Ｆ４． Ｓ Ｆ２． Ｓ ＯＦ２など
ＳＦ ＋Ｈ０−３ＯＦ （２）請求項ＨＦＳＯＦ ＋Ｈ
Ｏ→Ｓｏ （２）請求項ＨＦＳＦ、１分解ガスであるフ
ッ化水素（ＨＦ）がシリカ（Ｓ ｉ Ｏ２）と次のよう
に反応する。However, silica has a problem in that it reacts with decomposition gas of sulfur hexafluoride (SF) used in gas insulation systems of ultra-high pressure equipment. That is, SF is decomposed as shown in the following chemical formula due to arc, corona, etc. discharge in the equipment, and SF6- SF4. SF2. SF such as SOF2 +H0-3OF (2) Claim HFSOF +H
O→So (2) Claim HFSF, 1 Hydrogen fluoride (HF), which is a cracked gas, reacts with silica (S i O2) as follows.
Ｓ ｉｏ ＋４ＨＦ−４Ｓ ｉ Ｆ （２）請求項
ＨＯ３ｉ Ｆ （２）請求項ＨＦ−”ＨＳ ｉ Ｆ
ここで、四フッ化ケイ素（ＳｉＦ、）は沸点が８６℃の
気体であり、このＳ ｉ Ｆ、とＨＦとが反応して生成
するＨ２Ｓ ｉ Ｆ６は強電解質で表面抵抗を下げてし
まう作用を有する。S io +4HF-4S i F (2) Claim HO3i F (2) Claim HF-"HS i F
Here, silicon tetrafluoride (SiF) is a gas with a boiling point of 86°C, and H2S i F6 produced by the reaction of SiF and HF is a strong electrolyte that has the effect of lowering the surface resistance. have
Ｄ 発明が解決しようとする課題
前述したように、シリカはＳＦ分解ガスと反応してしま
うので、シリカを充填材とするモールド注型品はガス絶
縁システムを具えろ超高圧機器には用いろことができな
いという問題カアル。マタ、ＴｉＯ２，ＺｒＯ２，Ｓｂ
、Ｏ，。D Problems to be Solved by the Invention As mentioned above, silica reacts with SF decomposition gas, so molded products containing silica as a filler should be equipped with a gas insulation system and should not be used in ultra-high pressure equipment. The problem is that you can't do it. Mata, TiO2, ZrO2, Sb
,O,.
Ｋ２Ｓｏ、、タルクなどの充填材も、ＳＦ、分解ガスと
反応する点ではシリカと同様である。Fillers such as K2So and talc are similar to silica in that they react with SF and cracked gas.
そこで、ＳＦ６分解ガスと反応しないアルミナ（Ａｊ２
０．）を充填材として用いたアルミナ充填樹脂硬化物が
高電圧機器の絶縁材料や構造材料に用いられることが多
い。Therefore, alumina (Aj2) that does not react with SF6 decomposition gas
0. ) is often used as an insulating material or structural material for high-voltage equipment.
しかし、アルミナ充填！ＩＭ脂硬化物は、シリカを充填
材としたものと比べて機械的強度が低いという問題があ
る。例えば引張り強度を比ヘルドシリカ充填系硬化物が
８ｋｇ・−一２の値であるのに対して、アルミナ系硬化
物では７ ｋｇ・−２程度である。したがって、アルミ
ナ充填ｆＩＩ脂硬化物を用いると、機器のコンパクト化
を図ることができず、製品の長期信頼性にも問題がある
。But alumina filling! The problem with cured IM resins is that they have lower mechanical strength than those using silica as a filler. For example, the tensile strength of a cured silica-filled material is 8 kg.-2, while that of a cured alumina material is about 7 kg.-2. Therefore, if an alumina-filled fII resin cured product is used, it is not possible to make the equipment more compact, and there is also a problem in the long-term reliability of the product.
本発明はこのような事情に鑑み、機械的強度を高くして
材料の信頼性を向上させたアルミナ充填樹脂硬化物を提
供することを目的とする。In view of these circumstances, an object of the present invention is to provide an alumina-filled resin cured product that has high mechanical strength and improved material reliability.
Ｅ、 Ｍａｌを解決するための手段
前記目的を達成する本発明に係るアルミナ充填ｌ！ｔＴ
Ｉｊ硬化物は、マトリックスとしてエポキシ樹脂を用い
、アルミナを充填材として含有する硬化物であって、上
記アルミナとして粒径１〜１．５μｍ及び２０μｍにそ
れぞれピークがある粒度分布を有し且つ角がとれたもの
を用いたことを特徴とし、また、上記アルミナがさらに
表面処理剤としてのシランカップリング剤で表面処理さ
れていることを特徴とする。E. Means for Solving Mal Alumina filling l! according to the invention which achieves the above object! tT
The Ij cured product is a cured product that uses an epoxy resin as a matrix and contains alumina as a filler, and has a particle size distribution with peaks at particle sizes of 1 to 1.5 μm and 20 μm, respectively, and has an angle. The present invention is characterized in that alumina is used, and the alumina is further surface-treated with a silane coupling agent as a surface treatment agent.
本発明においてマトリックスとして用いるエポキシ樹脂
は、従来のモールド注型品に用いられているものでよく
、例えばビスフェノールタイプのエポキシ、又はビスフ
ェノールタイプにグリシジルエステルタイプや脂環式エ
ステルタイプをブレンドしたエポキシに、酸無水物など
の硬化剤を混合したものを挙げることができる。また、
かかるエポキシ樹脂客とは必要に応じて可塑剤などを加
えてもよい。The epoxy resin used as the matrix in the present invention may be one that is used in conventional mold casting products, such as bisphenol type epoxy, or epoxy blended with bisphenol type and glycidyl ester type or alicyclic ester type. Examples include those mixed with a curing agent such as an acid anhydride. Also,
A plasticizer or the like may be added to the epoxy resin as necessary.
一方、本発明で用いるアルミナは、特定の粒度分布を有
し且つ角がとれたものであること以外は従来と同様なも
のである。On the other hand, the alumina used in the present invention is the same as the conventional one except that it has a specific particle size distribution and has rounded corners.
本発明で用いるアルミナは、粒径１〜１．５μｍ及び２
０μｍのところにそれぞれピークがある粒度分布を有し
且つ角がとれたものであるので、高充填できろ粒子特性
を有していると言える。例えば、粒度分布のピークが何
れか一方にしかないものでは、後述する比較例にも示す
ように、硬化物の機械的強度の向上を図ることはできな
い。The alumina used in the present invention has a particle size of 1 to 1.5 μm and 2
Since it has a particle size distribution with a peak at 0 μm and has rounded corners, it can be said that it has particle characteristics that allow it to be highly packed. For example, if the peak of the particle size distribution is only on one side, it is not possible to improve the mechanical strength of the cured product, as shown in the comparative examples described below.
本発明に係るアルミナを用いると、充填されたときのア
ルミナ粒子間の距離が小さくなり、また、アルミナ粒子
と樹脂との界面接着面積が大きくなるという作用により
、硬化物の機械的強度が向上すると考えられろ。When the alumina according to the present invention is used, the distance between the alumina particles when filled is reduced, and the interfacial adhesion area between the alumina particles and the resin is increased, which improves the mechanical strength of the cured product. Be able to think.
なお、本発明で用いる角のとれたアルミナとは、例えば
粉砕したアルミナに角をまるめる処理を施したものをい
い、好ましくは球体若しくは球体形状に近いものがよい
。Note that the rounded alumina used in the present invention refers to, for example, pulverized alumina subjected to rounding treatment, and is preferably spherical or nearly spherical.
また、本発明で；よアルミナの充填量は１０〜６０重量
％とするのがよい。これより少ないと充填材の効果が発
揮されず、一方、高充填特性を有しているとζよいえ６
０容量％を超えろと混合、注型が困難になるからである
。Further, in the present invention, the amount of alumina filled is preferably 10 to 60% by weight. If the amount is less than this, the effect of the filler will not be exhibited; on the other hand, if it has high filling characteristics, it will be
This is because if it exceeds 0% by volume, mixing and casting become difficult.
本発明では、上記アルミナにさらに表面処理を施すとよ
い。表面処理剤としてはシランカップリング剤を用い、
その配合量はアルミナに対して０．１〜５．０重量％、
好ましくは０．５〜２．０重量％とするのがよい。In the present invention, the alumina may be further subjected to surface treatment. A silane coupling agent is used as a surface treatment agent,
Its blending amount is 0.1 to 5.0% by weight based on alumina.
The content is preferably 0.5 to 2.0% by weight.
このようにアルミナにざらにシランカップリング剤で表
面処理を施すと、Ｉｆ脂とアルミナ粒子との界面におけ
る接着力が高まるためか、硬化物の機減的強度がさらに
向上する。When alumina is roughly surface-treated with a silane coupling agent in this way, the mechanical strength of the cured product is further improved, probably because the adhesive strength at the interface between If fat and alumina particles is increased.
なお、シランカップリング剤が上記範囲を外れて少ない
とその効果が顕著ではなく、方、多いと硬化剤の特性に
好ましくないからである。Note that if the amount of the silane coupling agent is less than the above range, the effect will not be significant, whereas if the amount is too much, the properties of the curing agent will be unfavorable.
Ｆ実施例 以下、本発明を実施例に基づいて説明する。F example Hereinafter, the present invention will be explained based on examples.
エポキシ樹脂として、ビスフェノールタイプのＣＴ−２
００（チバガイギー社製）と硬化剤としての酸無水物Ｈ
ＨＰＡ （新日本理化社製）とを化学量論的に加えたも
のを用い、これに充填材としてアルミナＡＳ−４０（昭
和電工社製）を第１表に示す割合（Ｖｏｊ％）で配合し
、１００℃で１６時間及び１５０℃で８時間の条件で硬
化させた。なお、アルミナＡｓ−４０は粒径１〜１．５
μｍ及び２０ ｐｒｎにそれぞれピークがある粒度分
布を有すると共に角のとれた球体形状に近いものである
。Bisphenol type CT-2 as epoxy resin
00 (manufactured by Ciba Geigy) and acid anhydride H as a curing agent
HPA (manufactured by Shin Nihon Rika Co., Ltd.) was added in a stoichiometric manner, and alumina AS-40 (manufactured by Showa Denko K.K.) was added as a filler to this in the proportions (Voj%) shown in Table 1. , 16 hours at 100°C and 8 hours at 150°C. In addition, alumina As-40 has a particle size of 1 to 1.5.
It has a particle size distribution with peaks at μm and 20 prn, and is close to a spherical shape with rounded corners.
各硬化物について、ガラス転移温度（Ｔｇ）。Glass transition temperature (Tg) for each cured product.
ｍｓ張係数（α−２曲げ強度及び曲げ弾性率。ms tensile modulus (α-2 bending strength and bending modulus).
引張り強度及び引張り弾性率、並びに耐クラツク性を測
定し、結果を第１表に示した。The tensile strength, tensile modulus, and crack resistance were measured and the results are shown in Table 1.
一方、比較のため、粒径１０μｍにピークがある粒度分
布を有するが粉砕したままで角のとれていないアルミナ
ＡＬ−３３（住友化学社製）、また、粒径０．８〜４μ
ｍにブロードなピークと粒径１０〜１５μｍに急峻なピ
ークとを有してＡｓ−４０に似た粒度分布を有し、粒径
２０μｍ以上のものはカットしたアルミナＬＡ−１２０
０（太平洋ランダム社製）をそれぞれ上記Ａｓ−４０の
代りに用いて同様に硬化物をつくり、同様な物性を測定
した。On the other hand, for comparison, alumina AL-33 (manufactured by Sumitomo Chemical Co., Ltd.), which has a particle size distribution with a peak at a particle size of 10 μm but has no rounded edges after being crushed, and alumina AL-33 (manufactured by Sumitomo Chemical Co., Ltd.) with a particle size of 0.8 to 4 μm
It has a particle size distribution similar to As-40, with a broad peak at m and a steep peak at particle size 10 to 15 μm, and those with a particle size of 20 μm or more are cut alumina LA-120.
Cured products were prepared in the same manner using As-40 (manufactured by Pacific Random Co., Ltd.) in place of the above As-40, and the physical properties were measured in the same manner.
これらの結果は第２表及び第３表に示す。These results are shown in Tables 2 and 3.
／
／
／
これらの結果から明らかなように、アルミナとして粒径
１〜１．５μｍ及び２０μｍにそれぞれピークがある粒
度分布を有し且つ角がとれたものを用いた場合のみ硬化
物の特性が向上しており、機械強度で１．２〜１．３倍
の向上が認められた。/ / / As is clear from these results, the properties of the cured product are improved only when alumina having a particle size distribution with peaks at particle sizes of 1 to 1.5 μm and 20 μm and rounded corners is used. An improvement of 1.2 to 1.3 times in mechanical strength was observed.
また、上記実施例では、このような機械的強度の向上と
共に熱膨張率がモールド品の埋め込み部品（金具、ガラ
ス等）に近くなったことにより、モールドの割れ易さの
指標である耐クラツク性が向上している。In addition, in the above example, the mechanical strength has been improved and the thermal expansion coefficient has become close to that of the embedded parts (metal fittings, glass, etc.) of the molded product, so that the crack resistance, which is an index of the breakability of the mold, has improved. is improving.
次に、上記実施例で用いたアルミナＡｓ４０にさらにシ
ランカップリング剤で表面処理したものを充填材として
用いて同様に硬化物を製造し、同様な試験を行った。な
お、シランカフプリング剤としては、ＫＢＭ−４０３（
信越シリコーン社製）を使用した。これらの結ＪＩＩＬ
ｔ第４表及び第５表に示すが、第４表の実施例７〜１２
はシランカップリング剤ＫＢＭ〜４０３をアルミナに対
して１重量％使用してアルミナの充填量を変化させたも
の、第５表の実施例１３〜１８はアルミナ充填量を５０
重量％とし、シランカップリング剤ＫＢＭ−４０３を０
．１〜５．０重量％の間で変化させた例を示す。Next, a cured product was produced in the same manner using as a filler the alumina As40 used in the above example, which was further surface-treated with a silane coupling agent, and the same test was conducted. In addition, as a silane cuff pulling agent, KBM-403 (
(manufactured by Shin-Etsu Silicone Co., Ltd.) was used. These results JIIL
As shown in Tables 4 and 5, Examples 7 to 12 in Table 4
In Examples 13 to 18 in Table 5, the alumina filling amount was changed by using 1% by weight of the silane coupling agent KBM~403 based on the alumina, and in Examples 13 to 18 in Table 5, the alumina filling amount was changed to 50% by weight.
% by weight, and the silane coupling agent KBM-403 is 0.
．． An example in which the content was varied between 1 and 5.0% by weight will be shown.
／
第４表及び第５表の結果から明らかなように、特定の粒
度分布を有し且つ角のとれたアルミナにさらＣζシラン
カップリング剤により表面処理を施すと、硬化物の特性
がさらに向上し、機械的強度は従来の約１．５倍程度ま
で向上する。/ As is clear from the results in Tables 4 and 5, when alumina with a specific particle size distribution and rounded corners is further surface-treated with a Cζ silane coupling agent, the properties of the cured product are further improved. However, the mechanical strength is improved to about 1.5 times that of the conventional method.
Ｇ、 発明の詳細
な説明したように、本発明に係るアルミナ充填ＩＮ脂硬
化物は、特定の粒度分布を有し且つ角がとれており、必
要に応じてシランカップリング剤により表面処理された
アルミナを用いているので、機械強度が大幅に高くなり
材料の信頼性が向上したものである。これによりかかる
硬化物を構造材料等として用いた機器の信頼性が向上し
、コンパクト化が可能になる。G. Detailed Description of the Invention As described above, the alumina-filled IN resin cured product according to the present invention has a specific particle size distribution and rounded corners, and is surface-treated with a silane coupling agent if necessary. Since alumina is used, the mechanical strength is significantly increased and the reliability of the material is improved. This improves the reliability of devices using such cured products as structural materials, etc., and makes it possible to make them more compact.
また、機械強度の向上と共に高充填化が可能になったこ
とから、硬化物の熱膨張率がその埋め込み部品に近くな
ったので、耐クラツク性が向上し、この点からも機器の
信頼性が向上する。In addition, as mechanical strength has improved and high filling has become possible, the coefficient of thermal expansion of the cured product is similar to that of the embedded parts, improving crack resistance and improving the reliability of the equipment. improves.
特許出 株式会社 代 理Patent issue Co., Ltd. Principle
Claims (1)
ナを充填材として含有する硬化物であつて、上記アルミ
ナとして粒径１〜１．５μｍ及び２０μｍにそれぞれピ
ークがある粒度分布を有し且つ角がとれたものを用いた
ことを特徴とするアルミナ充填樹脂硬化物。（２）請求
項１記載のアルミナ充填樹脂硬化物において、アルミナ
が、表面処理剤としてのシランカップリング剤で表面処
理されていることを特徴とするアルミナ充填樹脂硬化物
。(1) A cured product using an epoxy resin as a matrix and containing alumina as a filler, which has a particle size distribution with peaks at particle sizes of 1 to 1.5 μm and 20 μm, respectively, and has rounded corners. An alumina-filled resin cured product characterized by using alumina-filled resin. (2) The alumina-filled resin cured product according to claim 1, wherein the alumina is surface-treated with a silane coupling agent as a surface treatment agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3245990A JP2830301B2 (en) | 1990-02-15 | 1990-02-15 | Alumina-filled resin cured product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3245990A JP2830301B2 (en) | 1990-02-15 | 1990-02-15 | Alumina-filled resin cured product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03237151A true JPH03237151A (en) | 1991-10-23 |
| JP2830301B2 JP2830301B2 (en) | 1998-12-02 |
Family
ID=12359558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3245990A Expired - Fee Related JP2830301B2 (en) | 1990-02-15 | 1990-02-15 | Alumina-filled resin cured product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2830301B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391924A (en) * | 1992-09-14 | 1995-02-21 | Kabushiki Kaisha Toshiba | Plastic package type semiconductor device |
| DE4446944A1 (en) * | 1994-12-28 | 1996-07-04 | Abb Research Ltd | High voltage system |
| JP2006024844A (en) * | 2004-07-09 | 2006-01-26 | Nec Tokin Corp | Magnetic core and coil component using same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6212660B1 (en) * | 2015-11-19 | 2017-10-11 | 積水化学工業株式会社 | Thermosetting material and cured product |
-
1990
- 1990-02-15 JP JP3245990A patent/JP2830301B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391924A (en) * | 1992-09-14 | 1995-02-21 | Kabushiki Kaisha Toshiba | Plastic package type semiconductor device |
| DE4446944A1 (en) * | 1994-12-28 | 1996-07-04 | Abb Research Ltd | High voltage system |
| JP2006024844A (en) * | 2004-07-09 | 2006-01-26 | Nec Tokin Corp | Magnetic core and coil component using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2830301B2 (en) | 1998-12-02 |
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