JPH03236297A - Mounting device of chip parts - Google Patents
Mounting device of chip partsInfo
- Publication number
- JPH03236297A JPH03236297A JP3299790A JP3299790A JPH03236297A JP H03236297 A JPH03236297 A JP H03236297A JP 3299790 A JP3299790 A JP 3299790A JP 3299790 A JP3299790 A JP 3299790A JP H03236297 A JPH03236297 A JP H03236297A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- adhesive
- microcapsules
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 40
- 230000001070 adhesive effect Effects 0.000 claims abstract description 40
- 239000003094 microcapsule Substances 0.000 claims abstract description 32
- 230000004907 flux Effects 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 239000012790 adhesive layer Substances 0.000 abstract description 9
- 239000000126 substance Substances 0.000 abstract description 6
- 239000012188 paraffin wax Substances 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000005476 soldering Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- -1 aromatic fatty acid Chemical class 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 210000002615 epidermis Anatomy 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 210000003491 skin Anatomy 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明はリード線を有しない回路素子（以下、チップ部
品と称す）の印刷配線基板への取付装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an apparatus for attaching circuit elements (hereinafter referred to as chip components) without lead wires to a printed wiring board.
〈発明の概要〉
本発明は、接着剤が充填されたマイクロカプセルをフラ
ックスに混入したペーストを、チップ部品の印刷配線基
板取付面側に塗布してチップ部品本体に接着力を与え、
チップ部品の印刷配線基板への自動装着時に加わる圧力
によりマイクロカプセルを破壊し、流出した接着剤によ
りチップ部品を印刷配線基板に仮固定できるようにした
ものである。<Summary of the Invention> The present invention provides adhesive strength to the chip component body by applying a paste containing adhesive-filled microcapsules mixed in flux to the printed wiring board mounting surface of the chip component.
The microcapsules are destroyed by the pressure applied when the chip components are automatically attached to the printed wiring board, and the adhesive that flows out allows the chip components to be temporarily fixed to the printed wiring board.
〈従来の技術〉
一般に抵抗、コンデンサ等のチップ部品は第７図に示す
ように構成されている。第７図において、Ｉはチップ部
品本体であり、通常、抵抗の場合には直方体のセラミッ
ク基材上に抵抗体を焼付けることによって形成されてお
り、コンデンサの場合にはチタン酸バリウム等の誘電体
と電極箔とを積層構造にして形成されている。そして、
２はチップ部品本体Ｉの両端部に設けた電極であり、抵
抗の場合には通常コ字状に形成されており、コンデンサ
の場合には通常銀、パラジウム等でキャップ状に形成さ
れている。<Prior Art> Generally, chip components such as resistors and capacitors are constructed as shown in FIG. In Figure 7, I is the main body of the chip component, which is usually formed by baking a resistor on a rectangular ceramic base material in the case of a resistor, and a dielectric material such as barium titanate in the case of a capacitor. It is formed by making the body and electrode foil into a laminated structure. and,
Reference numeral 2 denotes electrodes provided at both ends of the chip component body I, and in the case of a resistor, they are usually formed in a U-shape, and in the case of a capacitor, they are usually formed in a cap shape of silver, palladium, etc.
ところで、このように構成されたチップ部品は通常第８
図、第９図に示すように印刷配線板に取付けられること
が多い。すなわち、第８図に示すようにチップ部品の電
極２より大きい半田ラウンド部５ａを有する印刷配線板
４を使用し、第１０図に示すように、まず、ここに接着
剤塗布ピン７を用いてチップ部品を仮固定する接着剤３
を塗布する。ここにチップ部品の各電極２，２を対向さ
せ、その後第９図に示すように半田６が盛り上がるよう
に半田付けし、印刷配線板にチップ部品を取付ける。By the way, chip parts configured in this way are usually
It is often attached to a printed wiring board as shown in FIG. That is, as shown in FIG. 8, a printed wiring board 4 having a solder round portion 5a larger than the electrode 2 of the chip component is used, and as shown in FIG. Adhesive 3 for temporarily fixing chip parts
Apply. The electrodes 2, 2 of the chip component are then made to face each other, and then soldered so that the solder 6 rises as shown in FIG. 9, and the chip component is mounted on the printed wiring board.
〈考案が解決しようとする課題〉
前項従来技術において、接着剤塗布工程はチップ部品の
半田付けまでの仮の固定である。又、チップ部品の形状
、大きさに対し、接着剤の塗布量をそれに合わせて変え
る必要がある。これは、接着剤塗布量が多かったり、接
着剤塗布位置がずれることによって接着剤が半田ラウン
ド部にかかり、半田付不良及び電気的接触不良を招く危
険性があり、少ないと接着力が弱くなり半田付けする前
に印刷配線板よりチップ部品が脱落する危険性があるた
めである。<Problem to be solved by the invention> In the prior art described above, the adhesive application process is a temporary fixation until the chip components are soldered. Furthermore, it is necessary to change the amount of adhesive applied depending on the shape and size of the chip component. This is because if the amount of adhesive applied is too large or the position of the adhesive applied is shifted, the adhesive may be applied to the solder round part, leading to poor soldering and electrical contact. This is because there is a risk that the chip components may fall off the printed wiring board before soldering.
チップ部品本体に接着剤を塗布しておき印刷配線板に取
付ける方法があるが、これではチップ部品を取付ける前
段階、すなわちチップ部品の保管、梱包、搬送時に、接
着剤が別のところに張りついたり、乾燥して接着力を失
なってしまうことがあり、きわめて不都合であった。There is a method of applying adhesive to the chip component body and attaching it to the printed wiring board, but this method causes the adhesive to stick to other parts during the stage before mounting the chip component, that is, during storage, packaging, and transportation of the chip component. This is extremely inconvenient because it may dry out and lose its adhesive strength.
〈課題を解決するための手段〉
本発明は上記課題を解決するために、接着剤が充填され
圧力を加えることで破壊することが可能な複数個のマイ
クロカプセルをフラックスに混入したペーストを、チッ
プ部品の印刷配線基板取付面側に塗布して、自動装着機
によりチップ部品を印刷配線基板へ装着するようにした
ものである。<Means for Solving the Problems> In order to solve the above problems, the present invention uses a paste in which flux is mixed with a plurality of microcapsules that are filled with adhesive and can be destroyed by applying pressure. It is applied to the printed wiring board mounting surface of the component, and the chip component is mounted on the printed wiring board using an automatic mounting machine.
〈作 用〉
接着剤をマイクロカプセルで被うことにより、接着剤の
乾燥を防ぐことができる。<Function> By covering the adhesive with microcapsules, drying of the adhesive can be prevented.
フラックスは前記マイクロカプセルをチップ部品に塗布
するだめの結合材として作用する他、マイクロカプセル
の外部荷重の保護材として作用するとともに、半田付は
時の導体層表面上の酸化被膜を取り除き半田の付着性を
向上させるフラックス本来の作用がある。In addition to acting as a bonding agent for applying the microcapsules to chip components, the flux also acts as a protection material for the external load of the microcapsules, and during soldering, it removes the oxide film on the surface of the conductor layer and prevents the adhesion of solder. Flux has the inherent effect of improving sex.
自動装着機によりチップ部品を印刷配線基板へ装着する
際に、チップ部品は印刷配線基板へ押し付けられるため
、この際に加わる圧力により前記マイクロカプセルは破
壊され、マイクロカプセルより接着剤が流出する。When a chip component is mounted on a printed wiring board by an automatic mounting machine, the chip component is pressed against the printed wiring board, so the pressure applied at this time destroys the microcapsules and the adhesive flows out from the microcapsules.
〈実施例〉 以下、本発明の実施例を図面と共に説明する。<Example> Embodiments of the present invention will be described below with reference to the drawings.
第１図において、１１はチップ部品本体であり、印刷配
線基板取付面の電極１２．１２の間の部分にペーストが
塗布されて、接着剤層８が形成されている。第２図は第
１図中破線Ａで囲んだ部分の拡大図であり、８Ｉは接着
剤が充填された粒子状のマイクロカプセル、８２は該マ
イクロカプセル８１をチップ部品本体１１へ塗り付は安
定させるフラックスである。In FIG. 1, reference numeral 11 denotes a chip component body, and paste is applied to a portion between electrodes 12 and 12 on the mounting surface of the printed wiring board to form an adhesive layer 8. FIG. 2 is an enlarged view of the part surrounded by the broken line A in FIG. It is a flux that causes
上記チップ部品は第３図乃至第５図に示すように、電極
１２．１２の印刷配線基板取付面が、印刷配線基板１４
に形成した導体層】５の半田ランド部＋５ａに接触する
ように、自動装着機により印刷配線基板１４に押し付け
られる。この際チップ部品の接着剤層８に加わる圧力に
より、マイクロカプセル８１が破裂し、中の接着剤が流
出することにより、接着剤層８は接着力を得、チップ部
品本体■１を印刷配線基板１４のチップ部品取付位置に
仮固定させる。As shown in FIGS. 3 to 5, in the above chip component, the printed wiring board mounting surface of the electrode 12.12 is attached to the printed wiring board 14.
The conductor layer formed on the conductor layer]5 is pressed onto the printed wiring board 14 by an automatic mounting machine so as to be in contact with the solder land portion +5a. At this time, due to the pressure applied to the adhesive layer 8 of the chip component, the microcapsule 81 ruptures and the adhesive inside flows out, which gives the adhesive layer 8 adhesive strength and connects the chip component body 1 to the printed wiring board. Temporarily fix it at the chip component mounting position No. 14.
この後、チップ部品本体■１は電極１２．１２が半田デ
イツプ法によって印刷配線基板Ｉ４の半田ランド部＋５
ａＫ半田付けされ完全に固定される。After this, the chip component main body ■1 has electrodes 12 and 12 connected to the solder land portion +5 of the printed wiring board I4 by the solder dip method.
AK soldered and completely fixed.
ここで上記実施例をより詳細に説明する。The above embodiment will now be described in more detail.
第６図は第２図に示したマイクロカプセル８Ｉの拡大断
面図であり、８］ａは接着剤、８１ｂはそれを包むマイ
クロカプセルを示す。接着剤８１ａの主剤は、変性アセ
レート系樹脂を基として、光重合触媒、反応性希釈剤、
安定剤、着色顔料、無機充填剤で構成し、硬化剤は有機
過酸化物を用いる。ただし硬化剤含有量は、従来の接着
剤より少なくし、粘性を保たなければならない。これは
後に説明するマイクロカプセルという特殊な使用方法に
対処する為である。FIG. 6 is an enlarged sectional view of the microcapsule 8I shown in FIG. 2, where 8]a indicates an adhesive and 81b indicates a microcapsule enclosing it. The main ingredient of the adhesive 81a is based on a modified acelate resin, and contains a photopolymerization catalyst, a reactive diluent,
It consists of a stabilizer, a color pigment, and an inorganic filler, and an organic peroxide is used as a hardening agent. However, the curing agent content must be lower than in conventional adhesives to maintain viscosity. This is to deal with the special usage of microcapsules, which will be explained later.
マイクロカプセル８１ｂは、保湿性に優れ、皮膜表面張
力及び外部荷重破壊臨界強度、接着剤８１ａとの化学的
干渉のないことを考慮し、パラフィン系硬化皮膜（芳香
族系脂肪酸）を主剤とする。The microcapsules 81b have a paraffin-based cured film (aromatic fatty acid) as a main ingredient, considering the excellent moisture retention properties, film surface tension, external load failure critical strength, and absence of chemical interference with the adhesive 81a.
上記パラフィン系硬化皮膜により接着剤を包みこんだも
のが第２図に示すマイクロカプセル８１である。マイク
ロカプセル８Ｉは数百ミクロンの粒子であり、それ自体
に粘着力はない為、このままの状態ではチップ部品への
塗布は不可能である。Microcapsules 81 shown in FIG. 2 are obtained by enclosing an adhesive with the above-mentioned paraffin-based cured film. Microcapsules 8I are particles of several hundred microns and do not have adhesive strength themselves, so it is impossible to apply them to chip components in this state.
よってマイクロカプセル粒子をチップ部品に付着させる
結合材としてフラックス８２を用いる。Therefore, flux 82 is used as a binder to attach the microcapsule particles to the chip component.
フラックス８２はマイクロカプセル表皮（パラフィン系
硬化皮膜）と化学的干渉がないことが必要である。これ
はフラックスの成分がマイクロカプセル表皮成分に干渉
し、表皮が溶け、破れることを防ぐためである。また、
溶融温度が接着剤８１ａ及びマイクロカプセル８１ｂよ
り低いことが必要である。これはフィクロカプセル８Ｉ
を混入する際、フラックス８２を一旦熱融解する為であ
り、融解点が３種同じ、もしくは、接着剤８１ａ、マイ
クロカプセル８１ｂがフラックス８２より低いと、熱に
よってマイクロカプセル８１は破壊してしまう。これら
を防ぐことを考慮し、フラックス８２は、主剤樹脂成分
として、ガムロジン（天然松脂）、フェノール変性ロジ
ン、溶剤ソルベントＳ−１０００（アルコール系溶剤）
を８０％以上とする。It is necessary that the flux 82 has no chemical interference with the microcapsule skin (paraffin-based hardened film). This is to prevent the flux components from interfering with the microcapsule epidermal components, causing the epidermis to melt and tear. Also,
It is necessary that the melting temperature is lower than that of the adhesive 81a and the microcapsules 81b. This is Ficrocapsule 8I
This is to thermally melt the flux 82 once when mixed in. If the melting points of the three types are the same or the adhesive 81a and the microcapsules 81b are lower than the flux 82, the microcapsules 81 will be destroyed by the heat. In order to prevent these problems, Flux 82 contains gum rosin (natural pine resin), phenol-modified rosin, and solvent Solvent S-1000 (alcoholic solvent) as the main resin component.
80% or more.
これらマイクロカプセル８１及びフラックス８２によっ
てペーストが構成され、このペーストがチップ部品本体
１１へ塗布される。ペーストの塗布作業は霧吹きによる
吹き付けや、印刷等と同様の刷毛塗り等の方法によって
行なうことができるが、何れの方法でもチップ部品の自
動装着の工程中において行なうことが可能である。These microcapsules 81 and flux 82 constitute a paste, and this paste is applied to the chip component body 11. The paste can be applied by spraying with a sprayer or by brush coating similar to printing, but either method can be applied during the automatic mounting process of chip components.
ペーストは第１図のようにチップ部品本体■１の印刷配
線基板取付面の電極１２．１２の間の部分にのみ塗布さ
れることが最も好ましいが、簡易な塗布作業の採用や、
チップ部品の装着時に接着剤層８からペーストがはみ出
る等して電極１２゜＋２の印刷配線基板取付面にペース
トが付着したとしても、チップ部品本体】■には半田デ
イツプ時に第５図に示すように電極１２．１２の側面及
び上面（取付面と反対の面）にまで半田が付着するため
、電気的な接続不良は発生しない。It is most preferable that the paste is applied only to the area between the electrodes 12 and 12 on the printed wiring board mounting surface of the chip component body 1 as shown in FIG.
Even if the paste sticks out from the adhesive layer 8 and adheres to the mounting surface of the printed wiring board of electrode 12°+2 when the chip component is mounted, the chip component itself will not be as shown in Figure 5 during soldering. Since the solder adheres to the side and top surfaces (surfaces opposite to the mounting surface) of the electrodes 12.12, no electrical connection failure occurs.
ペーストが塗布されて接着剤層８が形成されたチップ部
品本体１１は、チップ部品を印刷配線基板へ押し付ける
際の押圧力が適宜調整された自動装着機により、印刷配
線基板１４へ押し付けられ、接着剤層８のマイクロカプ
セル８Ｉが破裂し、中の接着剤８１ａが流出し、フラッ
クス８２中を浸透して、チップ部品本体１１の印刷配線
基板取付面に染み出して、該チップ部品本体１１を印刷
配線基板Ｉ４へ接着、仮固定する。The chip component body 11 on which the paste has been applied and the adhesive layer 8 has been formed is pressed onto the printed wiring board 14 by an automatic mounting machine whose pressing force when pressing the chip component onto the printed wiring board is appropriately adjusted. The microcapsules 8I in the adhesive layer 8 rupture, and the adhesive 81a inside flows out, permeates through the flux 82, and oozes onto the printed wiring board mounting surface of the chip component body 11, thereby printing the chip component body 11. Glue and temporarily fix to the wiring board I4.
〈発明の効果〉
以上のように本発明のチップ部品の取付装置は接着剤が
充填され圧力を加えることで破壊することが可能な複数
個のマイクロカプセルをフラックスに混入したペースト
と、印刷配線基板取付面側に前記ペーストが塗布されて
自動装着機により印刷配線基板に装着されるチップ部品
とからなるため、自動装着機によりチップ部品を印刷配
線基板へ押し付ければ、ペースト中のマイクロカプセル
が破壊され、流出した接着剤によりチップ部品を印刷配
線基板に仮固定することができる。<Effects of the Invention> As described above, the chip component mounting device of the present invention uses a paste containing flux mixed with a plurality of microcapsules that are filled with adhesive and can be destroyed by applying pressure, and a printed wiring board. The paste is applied to the mounting surface and the chip components are mounted on the printed wiring board by an automatic mounting machine, so if the chip parts are pressed against the printed wiring board by the automatic mounting machine, the microcapsules in the paste will be destroyed. The chip components can be temporarily fixed to the printed wiring board using the adhesive that flows out.
従って、印刷配線基板に接着剤を塗布する工程を廃止す
ることができる。また、チップ部品に接着剤を直接塗布
する方法と比べても、接着剤が取付け＠に乾燥する等の
不都合がなく、接着仮固定の信頼性、作業性が向上する
。Therefore, the step of applying adhesive to the printed wiring board can be eliminated. Furthermore, compared to the method of directly applying adhesive to chip components, there is no problem such as the adhesive drying out during installation, and the reliability and workability of temporary adhesive fixing are improved.
第１図は本発明のチップ部品の取付装置の側面図、第２
図は同チップ部品の取付装置の要部拡大図、第３図及び
第４図は本発明に係るチップ部品と印刷配線基板の取付
位置関係を示す斜視図及び平面図、第５図は本発明に係
るチップ部品を印刷配線基板へ半田付けした状態を示す
側面図、第６図は本発明に係るマイクロカプセルの断面
図、第７図はチップ部品の斜視図、第８図は従来例に係
るチップ部品と印刷配線基板の取付位置関係を示す平面
図、第９図は従来例に係るチップ部品を印刷配線基板へ
半田付けした状態を示す側面図、第１Ｏ図は従来の印刷
配線基板への接着剤塗布工程を示す斜視図である。
８・・接着剤層、１１・・・チップ部品本体、１４・・
・印刷配線基板、８１（８１ｂ）・・マイクロカプセル
、８１ａ・・・接着剤、８２・・・フラソク、ス。FIG. 1 is a side view of the chip component mounting device of the present invention, and FIG.
The figure is an enlarged view of the main parts of the chip component mounting device, FIGS. 3 and 4 are perspective views and plan views showing the mounting positional relationship between the chip component and the printed wiring board according to the present invention, and FIG. 5 is the present invention. 6 is a cross-sectional view of the microcapsule according to the present invention, FIG. 7 is a perspective view of the chip component, and FIG. 8 is a conventional example. FIG. 9 is a plan view showing the mounting positional relationship between the chip components and the printed wiring board, FIG. 9 is a side view showing the conventional chip component soldered to the printed wiring board, and FIG. It is a perspective view showing an adhesive application process. 8... Adhesive layer, 11... Chip component body, 14...
- Printed wiring board, 81 (81b)...Microcapsule, 81a...Adhesive, 82...Flasock, Su.
Claims (1)
が可能な複数個のマイクロカプセルをフラックスに混入
したペーストと、 印刷配線基板取付面側に前記ペーストが塗布されて自動
装着機により印刷配線基板に装着されるチップ部品とか
らなるチップ部品の取付装置。1. A paste containing a flux mixed with multiple microcapsules that are filled with adhesive and can be destroyed by applying pressure, and the paste is applied to the mounting surface of the printed wiring board and then attached to the printed wiring board by an automatic mounting machine. A chip component mounting device consisting of a chip component to be mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3299790A JPH03236297A (en) | 1990-02-13 | 1990-02-13 | Mounting device of chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3299790A JPH03236297A (en) | 1990-02-13 | 1990-02-13 | Mounting device of chip parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03236297A true JPH03236297A (en) | 1991-10-22 |
Family
ID=12374493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3299790A Pending JPH03236297A (en) | 1990-02-13 | 1990-02-13 | Mounting device of chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03236297A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996031840A1 (en) * | 1995-04-05 | 1996-10-10 | Orga Kartensysteme Gmbh | Pass card or the like in the form of a smart card |
| JP2014120472A (en) * | 2012-12-14 | 2014-06-30 | Boe Technology Group Co Ltd | Anisotropic conductive film and electronic device |
| KR20170048068A (en) * | 2015-10-26 | 2017-05-08 | 엘지전자 주식회사 | Chip inspection device |
-
1990
- 1990-02-13 JP JP3299790A patent/JPH03236297A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996031840A1 (en) * | 1995-04-05 | 1996-10-10 | Orga Kartensysteme Gmbh | Pass card or the like in the form of a smart card |
| US5965866A (en) * | 1995-04-05 | 1999-10-12 | Orga Kartensysteme Gmbh | Pass card having a semiconductor chip module attached by a microencapsulated adhesive |
| JP2014120472A (en) * | 2012-12-14 | 2014-06-30 | Boe Technology Group Co Ltd | Anisotropic conductive film and electronic device |
| US9796884B2 (en) | 2012-12-14 | 2017-10-24 | Boe Technology Group Co., Ltd. | Anisotropic conductive adhesive film and electronic device |
| KR20170048068A (en) * | 2015-10-26 | 2017-05-08 | 엘지전자 주식회사 | Chip inspection device |
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