JPH0323510A - Production of thin-film magnetic head - Google Patents

Abstract

PURPOSE:To prevent the deterioration in recording and reproducing characteristics by penetrating a specific soln. between the upper surface of a protective layer and a protective plate consisting of a nonmagnetic material and heating the soln. to solidify, thereby joining and fixing the protective plate onto the protective layer. CONSTITUTION:The silicon alkoxide soln. 21 consisting of, for example, the silicon alkoxide, an acid as an H2O catalyst necessary for hydrolysis and a solvent is penetrated between the protective layer 11 and the protective plate 8. Silicon alkoxide molecules 22 exist in the protective soln. 21 interposed in the spacing between the protective layer 11 and the protective plate 8. Flocculated particles 24 are formed and the soln. gelatinizes when the laminate penetrated with the silicon alkoxide soln. 21 is heated. The flocculation is further progressed by the high-temp. heating, by which the soln. is solidified and a nonmagnetic oxide layer 13 consisting of the solid of SiO2 is formed. The protective plate 8 is, therefore, securely joined onto a head element 10. The deterioration in the recording and reproducing characteristics is prevented in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a method of manufacturing a thin film magnetic head suitable for high-density recording or reproduction.

{Explanation} Conventional technology Conventionally, this type of thin film magnetic head has been disclosed in, for example, Japanese Patent Application Laid-Open No. 62-46416 (011 [35...31).
There are some things disclosed in .

FIG. 9 is a sectional view of a main part of a thin M magnetic head, and FIG. 10 is a diagram showing a surface of the thin film magnetic head that contacts the medium.

Conventional thin film magnetic heads are shown in FIGS. 9 and 101! As shown in Fig. 1, a lower magnetic layer (1) made of a ferromagnetic metal material calculated by Sendust is formed on a substrate (1) made of a magnetic material such as Ni-Zn ferrite 1 or a non-magnetic material such as crystallized glass. 2), a spiral conductor coil layer (3) made of conductive N material such as Cu, and SiOz covering the conductor coil layer (3).
An interlayer insulating layer (4) made of a non-magnetic insulating material such as Si0
A gap baser (5) for forming a magnetic gap made of a non-magnetic material such as No. 2, li! such as Sendust, etc. lirij
An upper magnetic layer (6) made of an i-type metal material and a protective layer (7) made of a non-magnetic material such as SiOz are deposited, and the protective layer (7) L contains B a T i O i The protective plate {8} is made of a non-magnetic material such as low melting point glass (9)
It is bonded and fixed by.

However, in the case of the above conventional thin film magnetic head, the thickness of the low melting point glass (9) is required to be about 30 μm;
The hardness of the medium sliding contact surface is the same as that of the substrate (1) and the protection plate (8).
), the low melting point glass (9), which is smaller than that of
Due to long-term sliding contact with the medium, the low melting point glass (9) wears down and becomes depressed, resulting in poor contact with the magnetic medium and the problem that good recording and reproduction cannot be performed. Also, Japanese Patent Application Laid-Open No. 63-251908 (Gl1 [{
5. ．． ．． / 3 1), apply silica sol to the surface of the magnetic head component to be bonded,
There is a method of bonding and fixing the protective plate to the magnetic head ellipse or Murakami by heating the protective plate while pressurizing the coated surface. In this bonding method using silica sol, the OH groups on the surface of the bonding Jf1 and the O adsorbed on the k surface of the material to be bonded are
Bonding is performed by hydrolyzing the H group to form Si-0-A+H20 (A is an atom of the material to be bonded), and OH
The basis is important. However, with the bonding method disclosed in the above-mentioned publication, the OH groups in the silica sol are reduced by hydrolysis, and therefore the protective plate cannot be firmly bonded and fixed.

(c) Problems to be solved by the invention The present invention has been made in view of the drawbacks of the above-mentioned conventional examples.
An object of the present invention is to provide a method for manufacturing a thin-film magnetic head that can firmly bond a protective plate to a magnetic head component and prevent recording and reproducing characteristics from deteriorating due to spacing loss caused by wear of the bonding layer. That is.

(2) Means for Solving the Problems The method for manufacturing a thin film magnetic head of the present invention includes forming a lower magnetic layer, a conductive coil layer, an interlayer insulating layer covering the conductive coil layer, a magnetic gap portion, and an upper magnetic layer on a substrate. After forming a protective layer made of a non-magnetic insulating material and having a flat top surface on the head element, the top surface of the protective layer and a protective plate made of a non-magnetic material are formed. The protective plate is bonded and fixed onto the protective layer by infiltrating a solution of a metal organic compound containing an OH group during the process and solidifying the solution by heating.

{E} Effect: According to the above manufacturing method, it is possible to form a thin non-magnetic oxide layer, which is a bonding layer for bonding and fixing the protective plate on the head element, and the non-magnetic oxide layer is thin. Since the metal-organic compound solution that is the starting solution for forming the bond contains OH groups in advance, the OH groups, which are important for fixing the bond, are diminished by hydrolysis and the bonding strength decreases. can be prevented.

(F) Example Hereinafter, an example of the method for manufacturing a thin film magnetic head of the present invention will be described in detail with reference to the drawings.

3 to 6 are cross-sectional views of essential parts showing the method for manufacturing the thin film magnetic head of this embodiment. First, as shown in Fig. 3, a thin film technique such as sputtering or a photophosphorographic technique is applied to the upper surface of a substrate (1) made of a magnetic material such as Ni-Zn ferrite or non-magnetic NIV1 such as crystallized glass. The lower magnetic layer (
2), conductor coil layer (3), glabella insulating layer (ll). A henodic element consisting of a gear base (5) and an upper magnetic layer (6) is deposited and formed.

Next, as shown in FIG.
:SfO. , T t O 2, the upper surface (1
1) Deposit and form. The thickness t of the thinnest part of the protective layer (}1) is 2 μm. The protective layer (l1) is formed by depositing the film '3 made of the non-magnetic insulating material until all parts are located above the top surface of the head element 1m, and then depositing the top surface on the thin film. A resist is applied so that the surface becomes flat, and ion beam etching is performed so that the -E surface of the thin film becomes flat like the upper surface of the resist.

Next, as shown in FIG. 5, SiOz and A 0 2 having a thickness of 1 μm or less are placed at the four corners of the upper surface of the protective layer (1l).
0 3, a substrate such as Tie2 {I2} is provided, and the top surface of the protective layer {l1} is subjected to ultrasonic cleaning and ultraviolet cleaning. Protective plate (8) made of non-magnetic material such as
Place it. Next, between the protective layer (11) and the protective plate {8}, as shown in FIG.
A silicon alkoxide solution (21) consisting of PI as a catalyst (e.g. HCI) and a solvent (e.g. C 2 H so H ) is infiltrated. FIG. Silicon alkoxide molecules (22) are present in the silicon alkoxide solution (21) interposed in the gap between the protective plate (8) and the silicon alkoxide solution (21).

Next, in the above step, silicon alkoxide solution (21)
The above-mentioned laminate impregnated with is heated under the conditions shown in FIG. Through this heating process, the silicon alkoxide molecules in the silicon alkoxide solution are first hydrolyzed as shown in the following (iJ formula), and S 1 (OH) a generated by this hydrolysis is as shown in the following (iil formula). The clay is polymerized to become sio2 particles, and the solution between the core blocks (18a) and (18b) rises.
It becomes a sol. ? sifOc211s)a+4111120'll
si (011), +4aCJs011 +・+
)osi (Oi1)a→nSiO■+2o112
0 −(l+1The formula close to the actual hydrolysis described above is M (OR) o+xll■OJ (011) X (
01? ) o-uROII-(llI)?
The above (i) is the ideal state of the fiil formula.

Moreover, the above-mentioned polymerization reaction occurs through the dehydration reaction and dealcoholization reaction shown below.

Dehydration reaction If - O II + H - 0 series → -M -
0 - M + II■0 Dealcoholization reaction -0 11 + R - 0 - M-→-M -
0 - M + R0 It Figure 8 (b) shows that the silicon alkoxide solution {2l} becomes Si02 grains (23) through the reaction of the above-mentioned equation (i) and {Kan} equation, and the solution becomes a sol. It shows. The SiOz particles +231 are further agglomerated to form agglomerated particles (
24), and the solution becomes gel-like. This agglomeration is 500
The solution progresses further by heating to .degree. C., and the solution solidifies to form a nonmagnetic oxide layer (13) made of solid SiO2, as shown in FIG. 8(d). In the reaction described above, S i O ! in silicon alkoxide solution (21). - 820 dissociates from OH present in the oxide layer on the surface of the protective layer (1!) and the surface of the protective plate (8), and the nonmagnetic oxide layer (13), the protective layer (I1), and the protective Bonding of -A-0-Si- (A is an atom in the protective layer or protective plate) occurs at the interface with the plate (8), and the non-magnetic oxide layer (13) acts as a bonding layer. As shown in FIGS. 1 and 2, the protection plate (8) has a protection M (IIj
It is bonded and fixed on top. Incidentally, FIG. 1 is a sectional view of the main part of the lJfi magnetic head, and FIG. 2 is a diagram showing the sliding contact surface of the medium. In the heating step shown in FIG. 7, preheating at 200° C. is performed using H.I. It is used to volatilize O, alcohol, etc., and this volatilization allows for good bonding of large areas. Thereafter, the thin film magnetic head of this embodiment is formed by subjecting the bonded body formed through the above steps to a predetermined external shape.

In the method for manufacturing the rIiH magnetic head as described above, the
The very thin non-magnetic oxide layer (l3) with a thickness of less than m allows the protection plate (8) to be firmly bonded to the head element Lllllt, and it is possible to prevent wear of the non-magnetic oxide 1 (13+).

In addition, in the above manufacturing method, a non-magnetic compound layer for bonding (
13) The silicon anolecoxide solution (2 liters), which is the starting solution for forming Si(○Cz}-1'i)a
Since this is a solution that has been separated in acid (HCR) and solvent (C2H,OH), the non-magnetic oxidation scoop Jti4 (13
}I4 groups, which are important for bonding between the atoms in the protective layer (1j) and the protective plate (8), are present in sufficient quantity, and the protective plate (8) is placed on the head element ill. Can be firmly bonded.

Further, as the non-magnetic oxide layer, in addition to Sin2, Al
zOi, Tie2, Zr02 SiO2, T1 02
S l 02. I neo S no. N
a. zo BzOi-S i 02, BaTiO3,
P b T i O <, KT i 0 . 1 yen is 4b
These can be produced using metal alkoxide solutions such as Al (QC 3}+7) 3, metal organic compounds such as acetylacetonate, carboxylates, etc.

(G) Effects of the Invention According to the present invention, it is possible to manufacture a thin film magnetic head that has excellent mechanical strength and prevents deterioration of recording and reproducing characteristics due to spacing.

[Brief explanation of drawings]

Figures 1L7I to 8 relate to the present invention; Figure 1 is a cross-sectional view of a main part of a thin-film magnetic head, Figure 2 is a diagram showing a surface in contact with the medium of a thin-film magnetic head, Figure 3; 4, 51A and 6 are sectional views of main parts showing a method of manufacturing a thin film magnetic head;
FIG. 7 is a diagram showing the bonding temperature, and No. 8 is a diagram showing the bonding process. No. 9 1'2I and No. 101A relate to the conventional example, and FIG. 9 is a sectional view of the main part of the thin film magnetic head,
The figure shows the surface in contact with the medium t8 of a thin film magnetic head. (1)...substrate, (2)--lower magnetic layer, (3)...
・Conductor coil layer, (l1)...interlayer insulation layer. (5)...
Gyanops base, (6)...Top magnetic layer, (8) Protective plate, []Ol...Head element, (I1)...Protective layer, (Ilal...Top surface, (l3)...Nonmagnetic oxide thing f
fi. +211...Silicon alkoxide solution (solution of metal organic compound).

Claims (1)

[Claims] (1) A head element consisting of a lower magnetic layer, a conductive coil layer, an interlayer insulating layer covering the conductive coil layer, a magnetic gap portion, and an upper magnetic layer is formed on a substrate, and a non-magnetic insulating material is placed on the head element. After depositing and forming a protective layer made of aluminum with a flat upper surface, a solution of a metal organic compound containing an OH group is infiltrated between the upper surface of the protective layer and a protective plate made of a non-magnetic material. A method of manufacturing a thin-film magnetic head, characterized in that the protective plate is bonded and fixed onto the protective layer by solidifying by heating.