JPH03234468A - Polishing method of metal mold mounting surface of stamper and polishing machine therefor - Google Patents
Polishing method of metal mold mounting surface of stamper and polishing machine thereforInfo
- Publication number
- JPH03234468A JPH03234468A JP2025250A JP2525090A JPH03234468A JP H03234468 A JPH03234468 A JP H03234468A JP 2025250 A JP2025250 A JP 2025250A JP 2525090 A JP2525090 A JP 2525090A JP H03234468 A JPH03234468 A JP H03234468A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- stamper
- thickness gauge
- mounting surface
- mold mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims description 14
- 239000002184 metal Substances 0.000 title abstract 2
- 238000005259 measurement Methods 0.000 claims abstract description 14
- 239000004744 fabric Substances 0.000 claims abstract description 13
- 238000007517 polishing process Methods 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000005323 electroforming Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、各種の情報信号が記録されたコンパクトディ
スクや光ディスク等の情報記録盤の複製基板を成形する
ためのスタンパの研磨に関し、特に該スタンパをプレス
用もしくは射出成形用の金型に取り付けるためのスタン
パの金型取付面の研磨方法およびその研磨機に関するも
のである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to the polishing of a stamper for forming a replica substrate of an information recording disk such as a compact disk or an optical disk on which various information signals are recorded, and is particularly applicable to the polishing of a stamper. The present invention relates to a method of polishing a mold attachment surface of a stamper for attaching a stamper to a mold for press or injection molding, and a polishing machine therefor.
［従来の技術］
従来、スタンパの金型取付面と研磨クロスとを互いに摺
擦させる研磨機を使用したスタンバの金型取付面の研磨
方法には、次のものがある。[Prior Art] Conventionally, there are the following methods of polishing the mold mounting surface of a stamper using a polishing machine that rubs the mold mounting surface of a stamper and a polishing cloth against each other.
まず、スタンバの厚さをマイクロメータ、超音波厚さ計
、渦電流厚さ計、光学式変位計等を用いて測定し、その
測定値と、研磨により仕上げようとするスタンバの厚さ
の所定の目標値とから研磨代を決定する。First, measure the thickness of the stand bar using a micrometer, ultrasonic thickness gauge, eddy current thickness gauge, optical displacement meter, etc., and use the measured value and the specified thickness of the stand bar to be finished by polishing. The polishing allowance is determined from the target value of .
該研磨代と経験的に求めておいた研磨レート（単位時間
当たりの研磨量、例えば１．０ｇ／分など。）とから、
誤差を見込んで研磨時間を計算して前記研磨機のタイマ
ーに設定する。From the polishing allowance and the polishing rate determined empirically (amount of polishing per unit time, for example 1.0 g/min.),
The polishing time is calculated taking into account the error and is set in the timer of the polishing machine.
該タイマーにより研磨機が自動停止するまで前記スタン
バの金型取付面の研磨をする。The mold mounting surface of the stand bar is polished until the polishing machine is automatically stopped by the timer.
該研磨を終えた後、スタンバを洗浄したのち、その厚さ
を測定し、その測定値が前記所定の目標値に達していれ
ば研磨をそのまま終了し、そうでなければ前記研磨レー
トを修正して同じ工程を前記目標値に達するまで繰り返
す。After finishing the polishing, the thickness of the stanbar is measured after cleaning, and if the measured value reaches the predetermined target value, the polishing is finished, and if not, the polishing rate is corrected. The same process is repeated until the target value is reached.
［発明が解決しようとする課題］
上記従来の技術では、実際の研磨レートは、研磨クロス
の目詰まり度、スタンバの金型取付面の面粗度、各部の
温度等の諸条件により研磨のたびに変化するので、あら
かじめ経験的に求めておいた研磨レートとは差異が生じ
てしまう。したがって、研磨時間の計算には誤差を見込
む必要があり、研磨を終えるたびにスタンバの厚さの測
定をしなければならないという問題点がある。また、ス
タンバの厚さの測定前には洗浄が必要であり、その洗浄
時あるいは測定時に傷をつけやすいという問題点もある
。さらに、縁り返しの研磨、測定に多大の時間がかかる
という問題点がある。[Problems to be Solved by the Invention] In the above-mentioned conventional technology, the actual polishing rate depends on various conditions such as the degree of clogging of the polishing cloth, the surface roughness of the mold mounting surface of the stand bar, and the temperature of each part. Since the polishing rate changes, there will be a difference from the polishing rate determined empirically in advance. Therefore, it is necessary to allow for errors in calculating the polishing time, and there is a problem in that the thickness of the stand bar must be measured every time polishing is completed. In addition, it is necessary to clean the stand bar before measuring its thickness, and there is also the problem that it is likely to be damaged during cleaning or measurement. Furthermore, there is a problem in that it takes a lot of time to polish and measure the edges.
本発明は、上記従来の技術の問題点に鑑みてなされたも
のであり、研磨を終えるたびに、スタンバの洗浄とその
厚さの測定とを繰り返す必要のない、研磨時間の短いス
タンバの金型取付面の研磨方法およびその研磨機を提供
することを目的とするものである。The present invention has been made in view of the above-mentioned problems of the conventional technology, and provides a mold for a stand bar that requires a short polishing time and eliminates the need to repeatedly clean the stand bar and measure its thickness every time polishing is completed. The object of the present invention is to provide a method for polishing a mounting surface and a polishing machine for the same.
［課題を解決するための手段］
上記目的を達成するため１本発明のスタンバの金型取付
面の研磨方法は、
研磨機を使用するスタンバの金型取付面の研磨方法にお
いて、
研磨中、超音波厚さ計により前記スタンバの厚さを常時
測定してその測定値が所定の目標値に達したときに前記
研磨機を停止させることを特徴とするものである。[Means for Solving the Problems] In order to achieve the above object, a method for polishing a mold mounting surface of a standber according to the present invention includes: a method for polishing a mold mounting surface of a standber using a polishing machine; The polishing machine is characterized in that the thickness of the stand bar is constantly measured using a sonic thickness gauge, and when the measured value reaches a predetermined target value, the polishing machine is stopped.
また、前記超音波厚さ計の代りに渦電流厚さ計を使用す
るものもある。Furthermore, there is also one that uses an eddy current thickness gauge instead of the ultrasonic thickness gauge.
本発明のスタンバの金型取付面の研磨機は、保護盤に被
着しているスタンバの金型取付面と研磨クロスとを互い
に摺擦させる研磨機において、
前記保護盤のスタンバが被着している面と反対側の面に
当接する位置に設置された超音波厚さ計のセンサと、
該センサの測定信号に基づいて常時スタンバの厚さの測
定値を演算して求める前記超音波厚さ計の演算部と、
前記測定値が所定の目標値に達したときに前記研磨機を
停止させる制御ユニットとを備えたことを特徴とするも
のである。The polishing machine for the mold mounting surface of a stand bar of the present invention is a polishing machine that rubs the mold mounting surface of the stand bar attached to a protection plate and a polishing cloth against each other, wherein the stand bar of the protection plate is attached to the polishing cloth. The ultrasonic thickness is determined by constantly calculating the measured value of the thickness of the stand bar based on the measurement signal of the sensor of the ultrasonic thickness gauge installed at a position in contact with the surface opposite to the surface facing the ultrasonic thickness gauge. The present invention is characterized by comprising: a calculation unit for a grinder; and a control unit that stops the polishing machine when the measured value reaches a predetermined target value.
また、前記超音波厚さ計のセンサに代えて渦電流厚さ計
のセンサとし、かつ前記超音波厚さ計の演算部に代えて
前記渦電流厚さ計の演算部としたものとすることもでき
る。Further, the sensor of the ultrasonic thickness gauge may be replaced by a sensor of an eddy current thickness gauge, and the computing unit of the ultrasonic thickness gauge may be replaced by a computing unit of the eddy current thickness gauge. You can also do it.
［作用］
上記のように構成された本発明のスタンバの金型取付面
の研磨方法およびその研磨機において、センサおよび演
算部からなる超音波厚さ計あるいは渦電流厚さ計は、保
護盤のスタンバが被着している面と反対側の面から保護
盤を通して、研磨クロスとスタンバの金型取付面との摺
擦を止めることなく該スタンバの厚さを常時測定する。[Function] In the polishing method and polishing machine for the mold mounting surface of a standber of the present invention configured as described above, the ultrasonic thickness gauge or the eddy current thickness gauge consisting of the sensor and the calculation section is installed on the protection board. The thickness of the stand bar is constantly measured through a protective plate from the side opposite to the side to which the stand bar is attached, without stopping the rubbing between the polishing cloth and the mold mounting surface of the stand bar.
制御ユニットは、前記超音波厚さ計あるいは渦電流厚さ
計により常時測定される測定値が所定の目標値に達した
ときに研磨機を停止させて研磨を終了する。The control unit stops the polishing machine and finishes polishing when the measurement value constantly measured by the ultrasonic thickness gauge or the eddy current thickness gauge reaches a predetermined target value.
［実施例］ 本発明の実施例を図面に基づいて説明する。[Example] Embodiments of the present invention will be described based on the drawings.
まず、本発明の方法の実施に使用するスタンパの金型取
付面の研磨機の第１実施例について説明する。First, a first embodiment of a polisher for polishing the mold attachment surface of a stamper used to carry out the method of the present invention will be described.
第１図および第２図において、スタンパ１は、情報信号
をカッティングしたガラス原盤上にニッケルを５００〜
２０００人の厚さに蒸着して導電化した後、その上に電
鋳によりニッケルを３０５〜３３０−の厚さに電着して
形成したものであり、前記ガラス原盤そのものである保
護盤２に剥離されずにそのまま被着されている。また、
該スタンパ１の金型取付面１ａは、研磨定盤６に張られ
た研磨クロス５に当接する。In FIGS. 1 and 2, the stamper 1 stamps 500 to 500 nickel on the glass master disk into which the information signal has been cut.
After making it conductive by vapor deposition to a thickness of 2,000 mm, nickel was electrodeposited on top of it by electroforming to a thickness of 305 to 330 mm. It is adhered as is without being peeled off. Also,
The mold mounting surface 1a of the stamper 1 comes into contact with a polishing cloth 5 stretched on a polishing surface plate 6.
前記研磨定盤６は、図示しない研磨機本体（以下、単に
「本体」という。）に回転可能に設置されており、その
軸部６ａは、電動モーター等から構成される本体に設け
られた駆動部９の出力軸に接続され、設定された回転数
で研磨定盤６を回転させる。The polishing surface plate 6 is rotatably installed in a polishing machine main body (hereinafter simply referred to as "main body"), not shown, and its shaft portion 6a is connected to a drive provided in the main body, which is composed of an electric motor or the like. It is connected to the output shaft of section 9 and rotates polishing surface plate 6 at a set rotation speed.
一方、本体に着脱かつ回転自在に装着された軸部７ａを
有する円盤状の研磨ホルダ７は、図示しない移動機構に
より、軸方向に移動自在であり、前記保護盤２のスタン
パ１が被着している面と反対側の全面を前記研磨定盤６
に対して設定された圧力で均一に押圧可能である。また
、該研磨ホルダ７には図示しない吸盤が埋設されており
、該吸盤により前記保護盤２を吸着することができる。On the other hand, a disc-shaped polishing holder 7 having a shaft portion 7a detachably and rotatably attached to the main body is movable in the axial direction by a moving mechanism (not shown), and the stamper 1 of the protection plate 2 is attached to the disc-shaped polishing holder 7. The polishing surface plate 6 is used to polish the entire surface opposite to the surface
It is possible to press uniformly with the pressure set against. Further, a suction cup (not shown) is embedded in the polishing holder 7, and the protection disc 2 can be sucked by the suction cup.
さらに、該研磨ホルダ７は、前記研磨定盤６の回転中心
軸とずれた位置にその回転中心軸があり、研磨定盤６が
回転することにより、その回転とは反対回りの回転をす
る。これにより前記スタンパ１の金型取付面１ａと前記
研磨クロス５とが互いに摺擦して研磨される。該研磨に
際しては、液体の研磨剤が設定された割合で前記研磨ク
ロス５に滴下される。Furthermore, the polishing holder 7 has its rotation center axis at a position offset from the rotation center axis of the polishing surface plate 6, and as the polishing surface plate 6 rotates, it rotates in the opposite direction to the rotation. As a result, the mold mounting surface 1a of the stamper 1 and the polishing cloth 5 rub against each other and are polished. During the polishing, a liquid abrasive is dropped onto the polishing cloth 5 at a set rate.
超音波厚さ計（例えば、日本パナメトリクス株式会社製
のモデル５２２３超音波厚さ計）３のセンサ３ａは、前
記研磨ホルダ７に穿設された孔４ａ内に挿入され、該セ
ンサ３ａの先端面が、蓋４ｃで押止されているばね４ｂ
により、前記保護盤２のスタンパ１か被着している面と
反対側の面に常時押圧され、両者が離れることなく当接
するよう構成されている。また、該センサ３ａはコート
３ｃおよび不図示のスリップリング等を介して前記超音
波厚さ計３の演算部３ｂに接続されている。A sensor 3a of an ultrasonic thickness gauge (for example, model 5223 ultrasonic thickness gauge manufactured by Japan Panametrics Co., Ltd.) 3 is inserted into a hole 4a drilled in the polishing holder 7, and the tip of the sensor 3a a spring 4b whose surface is held down by a lid 4c;
As a result, the protection plate 2 is constantly pressed against the surface opposite to the surface on which the stamper 1 is attached, so that the two are in contact with each other without being separated. Further, the sensor 3a is connected to the calculation section 3b of the ultrasonic thickness gauge 3 via a coat 3c and a slip ring (not shown).
該演算部３ｂは、前記センサ３ａの測定信号に基づいて
、常時、前記スタンパ１の厚さである測定値を演算して
求め、制御ユニット８に入力するものである。The calculating section 3b constantly calculates a measured value, which is the thickness of the stamper 1, based on the measurement signal of the sensor 3a, and inputs it to the control unit 8.
本体に設けられた該制御ユニット８は、研磨により仕上
げようとするスタンパの厚さの所定の目標値を設定でき
、かつ前記演算部３ｂの研磨中の測定値が該目標値に達
したときに前記駆動部９を停止させて研磨を終了させる
機能を有する公知のものである。The control unit 8 provided in the main body can set a predetermined target value for the thickness of the stamper to be finished by polishing, and when the measured value during polishing by the calculation section 3b reaches the target value. This is a known device that has a function of stopping the drive section 9 to finish polishing.
つぎに、本実施例を用いた、スタンパの金型取付面の研
磨方法の実施例について説明する。Next, an example of a method of polishing a mold mounting surface of a stamper using this example will be described.
まず、研磨ホルダ７に、保護盤２のスタンパ１が被着し
ている面と反対側の全面を当接させて該保護盤２を吸着
させる。このとき超音波厚さ計３が測定したスタンパ１
の厚さの測定値をモニターしてもよい。First, the entire surface of the protection plate 2 opposite to the surface on which the stamper 1 is adhered is brought into contact with the polishing holder 7 to attract the protection plate 2. At this time, the stamper 1 measured by the ultrasonic thickness gauge 3
The thickness measurements may be monitored.
つぎに、制御ユニット８に所定の目標値として２９５ｕ
＋を設定する。また、酸化アルミニウム研磨剤（例えば
、商品名ポリブラフ００）を毎分５０ｍ１の割合で研磨
クロス５に滴下させ始め、前述した移動機構を操作して
前記研磨ホルダ７を移動させ、スタンパ１の金型取付面
１ａを前記研磨クロス５に圧力１００ ｇ ７ｃｍ２で
押圧させる。その状態で研磨定盤６を駆動部９により回
転数６０ｒｐｍで回転させ研磨を開始する。Next, the control unit 8 is given a predetermined target value of 295u.
Set +. In addition, aluminum oxide abrasive (for example, trade name Polybluff 00) is started to be dripped onto the polishing cloth 5 at a rate of 50 ml per minute, and the aforementioned moving mechanism is operated to move the polishing holder 7 and mold the stamper 1. The mounting surface 1a is pressed against the polishing cloth 5 with a pressure of 100 g and 7 cm2. In this state, the polishing surface plate 6 is rotated by the drive unit 9 at a rotation speed of 60 rpm to start polishing.
研磨中、超音波厚さ計３の演算部３ｂは、センサ３ａの
測定信号に基づいて、常時、前記スタンパ１の厚さであ
る測定値を演算して求め、前記制御ユニット８に入力す
る。該制御ユニット８は、前記所定の目標値に該測定値
が達したときに前記駆動部９を停止させ研磨を終了させ
る。During polishing, the calculation unit 3b of the ultrasonic thickness gauge 3 constantly calculates a measured value that is the thickness of the stamper 1 based on the measurement signal from the sensor 3a, and inputs it to the control unit 8. The control unit 8 stops the drive section 9 and finishes polishing when the measured value reaches the predetermined target value.
上記方法に従って、保護盤に被着しているスタンパの厚
さの測定値が３１７ｕであったものを研磨したところ、
研磨開始から終了までに要した時間は２０分間であった
。また、研磨後のスタンバの厚さを保護盤から剥離して
マイクロメータで測定してみたところ、その結果は２９
５μであり、前記目標値と一致した。When the stamper attached to the protection plate had a measured thickness of 317u and was polished according to the above method,
The time required from the start to the end of polishing was 20 minutes. In addition, when I peeled off the thickness of the stand bar after polishing from the protective plate and measured it with a micrometer, the result was 29.
It was 5μ, which matched the target value.
なお、前記所定の目標値、研磨ホルダ７の圧力、研磨剤
の滴下割合および研磨定盤６の回転数は、上記以外の適
宜値にそれぞれ設定可能である。Note that the predetermined target value, the pressure of the polishing holder 7, the dropping rate of the polishing agent, and the rotation speed of the polishing surface plate 6 can be set to appropriate values other than the above.
本発明の研磨機の第２実施例について説明する。A second embodiment of the polishing machine of the present invention will be described.
上記第１実施例では、電鋳に用いたガラス原盤をそのま
ま保護盤２として使用する例を示したが、本実施例では
第３図に示すように、ガラス原盤と同様の大きさの円盤
状のガラス板を保護盤２２として使用している。電鋳後
、スタンバ２１をガラス原盤から剥離し、その内径およ
び外径を所定の寸法に切断し、ついで該スタンバ２１の
情報信号面２１ｂに接着剤２２ｂを塗布し、該スタンバ
２１を、該接着剤２２ｂを介して前記保護盤２２に被着
させている。その他の点は第１実施例と同様である。In the above first embodiment, an example was shown in which the glass master disk used for electroforming was used as it is as the protection plate 2, but in this embodiment, as shown in FIG. A glass plate is used as the protection panel 22. After electroforming, the standber 21 is peeled off from the glass master disk, its inner diameter and outer diameter are cut to predetermined dimensions, and then an adhesive 22b is applied to the information signal surface 21b of the standber 21, and the standber 21 is attached to the adhesive. The protective plate 22 is coated with the agent 22b. Other points are similar to the first embodiment.
本実施例では、超音波厚さ計３は前記接着剤２２ｂおよ
び保護盤２２を介してスタンバ２１の厚さを測定する。In this embodiment, the ultrasonic thickness gauge 3 measures the thickness of the stand bar 21 via the adhesive 22b and the protection plate 22.
また、所定の目標値、研磨ホルダ７の圧力、研磨剤の滴
下割合および研磨定盤６の回転数の値をそれぞれ第１実
施例と同一に設定し、スタンバの厚さの測定値が３１４
ｕ＋であったものを研磨したところ、研磨開始から終了
までに要した時間は２５分間であフた。また、研磨後の
スタンバを保護盤から剥離してその厚さをマイクロメー
タで測定したところ、その測定値は、前記目標値２９５
一対して±１％の範囲内にあフた。Further, the values of the predetermined target value, the pressure of the polishing holder 7, the dropping rate of the polishing agent, and the rotation speed of the polishing surface plate 6 are respectively set to be the same as in the first embodiment, and the measured value of the thickness of the stand bar is 314.
When the U+ type was polished, the time required from the start to the end of polishing was 25 minutes. In addition, when the polished stand bar was peeled off from the protection board and its thickness was measured with a micrometer, the measured value was 295, which was the target value.
It was flushed within a range of ±1%.
本発明の研磨機の第３実施例について説明する。A third embodiment of the polishing machine of the present invention will be described.
第４図および第５図に示すように、本実施例では、第１
および第２実施例で説明した超音波厚さ計３のセンサ３
ａに代えて渦電流厚さ計３３のセンサ３３ａとし、かつ
前記超音波厚さ計３の演算部３ｂに代えて前記渦電流厚
さ計３３の演算部３３ｂとしたものである。その他の点
は第１実施例と同様なのでその説明は省略する。As shown in FIGS. 4 and 5, in this embodiment, the first
and the sensor 3 of the ultrasonic thickness gauge 3 explained in the second embodiment.
a is replaced by a sensor 33a of the eddy current thickness gauge 33, and the calculation unit 3b of the ultrasonic thickness gauge 3 is replaced by a calculation unit 33b of the eddy current thickness gauge 33. The other points are the same as those in the first embodiment, so the explanation thereof will be omitted.
本発明の第１および第２実施例と比較するために行なっ
た、従来の技術の欄で説明した方法によるスタンバの金
型取付面の研磨の一例について説明する。An example of polishing the die mounting surface of the stand bar by the method described in the prior art section, which was carried out for comparison with the first and second embodiments of the present invention, will be described.
まず、電鋳後のスタンバの厚さをマイクロメータで測定
したところ３１５鱗であった。研磨により仕上げようと
する目標値を２９５鱗と設定し、研磨機の研磨レートを
実績値から１．０．７分とし、過剰研磨しないよう考慮
して研磨時間を計算して１５分間とした。該研磨時間を
研磨機のタイマーに設定し、また、研磨ホルダの圧力、
酸化アルミニウム研磨剤の滴下割合および研磨定盤の回
転数を第１および第２実施例と同一に設定して研磨を開
始した。前記タイマーにより研磨機が停止した後、スタ
ンバを洗浄してその厚さをマイクロメータで測定したと
ころ、３０２ｐであフた。First, the thickness of the electroformed stand bar was measured with a micrometer and found to be 315 scales. The target value to be finished by polishing was set as 295 scales, the polishing rate of the polishing machine was set to 1.0.7 minutes from the actual value, and the polishing time was calculated to be 15 minutes to avoid excessive polishing. Set the polishing time on the polisher's timer, and also adjust the polishing holder pressure,
Polishing was started by setting the dropping rate of the aluminum oxide abrasive and the rotation speed of the polishing surface plate to be the same as in the first and second examples. After the polishing machine was stopped by the timer, the stand bar was washed and its thickness was measured with a micrometer and found to be 302p.
ついで、前記研磨レートを０．９ｇ／分に修正し、あら
たに研磨時間を８分として研磨機のタイマーに設定し、
再び同様に研磨を開始した。研磨機が停止した後、スタ
ンバを洗浄してその厚さをマイクロメータで測定したと
ころ、２９１−であった。Next, the polishing rate was corrected to 0.9 g/min, the polishing time was newly set to 8 minutes, and the timer of the polishing machine was set.
Polishing was started again in the same way. After the polishing machine stopped, the stanbar was washed and its thickness was measured with a micrometer and found to be 291-.
研磨開始から終了までに要した時間は、全体で４３分で
あり、研磨終了時のスタンバの厚さは前記目標値より４
μ薄く仕上がった。The total time required from the start to the end of polishing was 43 minutes, and the thickness of the stand bar at the end of polishing was 43 minutes lower than the target value.
μ Finished thin.
以下に本発明の第１および第２実施例と従来の技術の欄
で説明した方法とを比較した結果について説明する。Below, the results of a comparison between the first and second embodiments of the present invention and the method described in the prior art section will be described.
本発明の第１および第２実施例に示したスタンバの厚さ
の仕上り寸法精度は、目標値２９５−に対して±１％の
範囲内にあり、従来の方法に比較して仕上り寸法精度が
高い。また研磨開始から終了までに要する時間も、第１
および第２実施例では２０分間および２５分間であり、
従来の方法に比較して非常に短い。The finished dimensional accuracy of the thickness of the stand bar shown in the first and second embodiments of the present invention is within the range of ±1% with respect to the target value of 295-, and the finished dimensional accuracy is higher than that of the conventional method. expensive. Also, the time required from the start to the end of polishing is
and 20 minutes and 25 minutes in the second example,
Very short compared to traditional methods.
［発明の効果］
本発明は、以上説明したとおり構成されているので、以
下に記載するような効果を奏する。[Effects of the Invention] Since the present invention is configured as described above, it produces the following effects.
超音波厚さ計あるいは渦電流厚さ計は、研磨を中断せず
に研磨中のスタンパの厚さを常時測定することができる
。An ultrasonic thickness gauge or an eddy current thickness gauge can constantly measure the thickness of a stamper during polishing without interrupting polishing.
これにより、従来の如く経験的に求める研磨レートを採
用した研磨と該研磨後のスタンパの厚さの測定とを繰り
返し行なう必要がなくなるので、研磨開始から終了まで
に要する時間が大幅に短縮できる。This eliminates the need to repeatedly perform polishing using a polishing rate determined empirically and measuring the thickness of the stamper after the polishing, as in the past, so the time required from the start to the end of polishing can be significantly shortened.
また、前記測定が不必要となるので洗浄時あるいは測定
時にスタンパに傷が付くことがなくなる。Furthermore, since the measurement is unnecessary, the stamper is not damaged during cleaning or measurement.
さらに、不確定な前記研磨レートではなく測定分解能の
高い超音波厚さ計あるいは渦電流厚さ計を使用するので
、スタンパの厚さの仕上り寸法精度を高めることができ
、過剰研磨によるスタンパの不良発生も防止できる。Furthermore, since an ultrasonic thickness gauge or an eddy current thickness gauge with high measurement resolution is used instead of the uncertain polishing rate, it is possible to improve the finished dimensional accuracy of the stamper thickness, and the stamper may be defective due to excessive polishing. It can also be prevented from occurring.
第１図は本発明の第１実施例の要部断面図、第２図は本
発明の第１および第２実施例の構成を説明するためのブ
ロック図、第３図は本発明の第２実施例の要部断面図、
第４図は本発明の第３実施例の要部断面図、第５図は本
発明の第３実施例の構成を説明するためのブロック図で
ある。
１．２１．３１・・・スタンパ、
１ａ、２１ａ、３１ａ・・・金型取付面、２．２２．３
２・・・保護盤、
３・・・超音波厚さ計、
３３・・・渦電流厚さ計、
３ａ、３３ａ・・・センサ、
３ｂ、３３ｂ・・・演算部、
３ｃ、３３ｃ・・・ コード、
４ａ・・・孔、
４ｂ・・・ばね、
４ｃ・・・蓋、
５．３５・・・研磨クロス、
６．３６・・・研磨定盤、
７．３７・・・研磨ホルダ、
８．３８・・・制御ユニット、
９．３９・・・駆動部。FIG. 1 is a sectional view of essential parts of a first embodiment of the present invention, FIG. 2 is a block diagram for explaining the configurations of the first and second embodiments of the present invention, and FIG. 3 is a cross-sectional view of a second embodiment of the present invention. A sectional view of the main parts of the embodiment,
FIG. 4 is a sectional view of a main part of a third embodiment of the present invention, and FIG. 5 is a block diagram for explaining the configuration of the third embodiment of the present invention. 1.21.31... Stamper, 1a, 21a, 31a... Mold mounting surface, 2.22.3
2... Protection board, 3... Ultrasonic thickness gauge, 33... Eddy current thickness gauge, 3a, 33a... Sensor, 3b, 33b... Calculation unit, 3c, 33c... Code, 4a...hole, 4b...spring, 4c...lid, 5.35...polishing cloth, 6.36...polishing surface plate, 7.37...polishing holder, 8. 38... Control unit, 9.39... Drive section.
Claims (1)
において、 研磨中、超音波厚さ計により前記スタンパの厚さを常時
測定してその測定値が所定の目標値に達したときに前記
研磨機を停止させることを特徴とするスタンパの金型取
付面の研磨方法。 ２、超音波厚さ計の代りに渦電流厚さ計を使用する請求
項１記載のスタンパの金型取付面の研磨方法。 ３、保護盤に被着しているスタンパの金型取付面と研磨
クロスとを互い摺擦させる研磨機において、 前記保護盤のスタンパが被着している面と反対側の面に
当接する位置に設置された超音波厚さ計のセンサと、 該センサの測定信号に基づいて常時スタンパの厚さの測
定値を演算して求める前記超音波厚さ計の演算部と、 前記測定値が所定の目標値に達したときに前記研磨機を
停止させる制御ユニットとを備えたことを特徴とするス
タンパの金型取付面の研磨機。 ４、超音波厚さ計のセンサに代えて渦電流厚さ計のセン
サとし、かつ前記超音波厚さ計の演算部に代えて前記渦
電流厚さ計の演算部とした請求項３記載のスタンパの金
型取付面の研磨機。[Claims] 1. In a method of polishing a mold mounting surface of a stamper using a polishing machine, during polishing, the thickness of the stamper is constantly measured using an ultrasonic thickness gauge, and the measured value is set to a predetermined target. A method for polishing a mold mounting surface of a stamper, characterized in that the polishing machine is stopped when a certain value is reached. 2. The method for polishing a mold mounting surface of a stamper according to claim 1, wherein an eddy current thickness gauge is used in place of the ultrasonic thickness gauge. 3. In a polishing machine that rubs the mold mounting surface of the stamper attached to the protection plate and the polishing cloth against each other, the position where the protection plate contacts the surface opposite to the side to which the stamper is attached. a sensor of the ultrasonic thickness gage installed in the ultrasonic thickness gage; a calculating section of the ultrasonic thickness gage that constantly calculates and obtains a measured value of the thickness of the stamper based on the measurement signal of the sensor; A polishing machine for a mold mounting surface of a stamper, comprising: a control unit that stops the polishing machine when a target value of is reached. 4. The sensor according to claim 3, wherein the sensor of the ultrasonic thickness gauge is replaced by an eddy current thickness gauge sensor, and the computing unit of the ultrasonic thickness gauge is replaced by a computing unit of the eddy current thickness gauge. Polishing machine for stamper mold mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025250A JPH03234468A (en) | 1990-02-06 | 1990-02-06 | Polishing method of metal mold mounting surface of stamper and polishing machine therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025250A JPH03234468A (en) | 1990-02-06 | 1990-02-06 | Polishing method of metal mold mounting surface of stamper and polishing machine therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03234468A true JPH03234468A (en) | 1991-10-18 |
Family
ID=12160748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025250A Pending JPH03234468A (en) | 1990-02-06 | 1990-02-06 | Polishing method of metal mold mounting surface of stamper and polishing machine therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03234468A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0819500A1 (en) * | 1996-07-18 | 1998-01-21 | Speedfam Co., Ltd. | Automatic measuring apparatus |
| EP1852220A1 (en) * | 2000-10-11 | 2007-11-07 | Ebara Corporation | Substrate holding apparatus |
| JP2009113149A (en) * | 2007-11-06 | 2009-05-28 | Disco Abrasive Syst Ltd | Grinder |
-
1990
- 1990-02-06 JP JP2025250A patent/JPH03234468A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0819500A1 (en) * | 1996-07-18 | 1998-01-21 | Speedfam Co., Ltd. | Automatic measuring apparatus |
| US5969521A (en) * | 1996-07-18 | 1999-10-19 | Speedfam Co., Ltd. | Automatic measuring apparatus having a switching means to generate an output signal only when a sensor is positioned at a predetermined space |
| EP1852220A1 (en) * | 2000-10-11 | 2007-11-07 | Ebara Corporation | Substrate holding apparatus |
| JP2009113149A (en) * | 2007-11-06 | 2009-05-28 | Disco Abrasive Syst Ltd | Grinder |
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