JPH03233514A - Bump connecting method for plzt optical device - Google Patents
Bump connecting method for plzt optical deviceInfo
- Publication number
- JPH03233514A JPH03233514A JP3075590A JP3075590A JPH03233514A JP H03233514 A JPH03233514 A JP H03233514A JP 3075590 A JP3075590 A JP 3075590A JP 3075590 A JP3075590 A JP 3075590A JP H03233514 A JPH03233514 A JP H03233514A
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- transparent conductive
- plzt
- substrate
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明はＰＬＺＴ光デバイスのバンプ接続方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a bump connection method for PLZT optical devices.
「従来の技術」
一般に、第２図（ａ）に示すように、ＰＬＺＴ（１）と
透明導電フィルム゛（２）とを、それぞれの一方の面に
形成されたバンプ（３） （４）を用いて接着剤（５）
で接合するが、従来は、透明導電フィルム（２）を単に
接着するだけであった。"Prior Art" Generally, as shown in FIG. 2(a), bumps (3) and (4) formed on one side of PLZT (1) and a transparent conductive film (2) are formed on one side of each. Using adhesive (5)
Conventionally, the transparent conductive film (2) was simply bonded.
［発明が解決しようとする課題」
ところが、第２図（ｂ）のように、接着剤（５）が硬化
すると、収縮してバンプ（３）（４）の間に凹部（６）
が形成され、これに伴い透明導電フィルム（２）に応力
がかかる。この応力のかかった光デバイスは偏光板を用
いてクロスニコルで観察すると、光もれ（光弾性効果）
が生じるということがわかる。[Problem to be Solved by the Invention] However, as shown in FIG. 2(b), when the adhesive (5) hardens, it contracts and forms a recess (6) between the bumps (3) and (4).
is formed, and stress is applied to the transparent conductive film (2) accordingly. When this stressed optical device is observed in crossed nicols using a polarizing plate, light leakage (photoelastic effect) occurs.
It can be seen that this occurs.
本発明は透明導電フィルムに応力がかからず、したがっ
て光もれの生じない光デバイスを得るための接続方法を
提供することを目的とする。An object of the present invention is to provide a connection method for obtaining an optical device in which stress is not applied to a transparent conductive film and, therefore, light leakage does not occur.
「課題を解決するための手段」
本発明は電極の形成されたＰＬＺＴ基板と透明導電フィ
ルムをバンプを用いて接着剤で接合する方法において、
前記透明導電フィルムを予めガラス基板に貼着してから
ＰＬＺＴ基板に接合するようにした方法である。"Means for Solving the Problems" The present invention provides a method for bonding a PLZT substrate on which electrodes are formed and a transparent conductive film with an adhesive using bumps.
In this method, the transparent conductive film is attached to a glass substrate in advance and then bonded to a PLZT substrate.
「作用」
透明導電フィルムのバンプとの反対面に予めガラス基板
を貼着しておき、この透明導電フィルムをガラス基板と
一体のままでＰＬＺＴ基板に接着剤で接合する。ガラス
基板はそのまま残すことによって透明導電フィルムには
応力がかからない。"Function" A glass substrate is previously attached to the surface of the transparent conductive film opposite to the bump, and this transparent conductive film is bonded to the PLZT substrate with an adhesive while remaining integral with the glass substrate. By leaving the glass substrate as it is, no stress is applied to the transparent conductive film.
したがって、光もれも生じない。Therefore, no light leakage occurs.
「実施例」 以下、本発明の一実施例を第１図に基き説明する。"Example" An embodiment of the present invention will be described below with reference to FIG.
（１）厚さ８００μｍ程度のＰＬＺＴ基板（１）の一方
の面にはバンプ（３）を用いて電極を形成する。(1) An electrode is formed using bumps (3) on one surface of a PLZT substrate (1) with a thickness of approximately 800 μm.
（２）厚さ１００μｍ程度の透明導電フィルム（２）の
一方の面にバンプ（４）を用いて電極を形成し、この透
明導電フィルム（２）の他方の面を、透明なガラス基板
（７）に貼着する。(2) An electrode is formed using bumps (4) on one side of a transparent conductive film (2) with a thickness of about 100 μm, and the other side of this transparent conductive film (2) is connected to a transparent glass substrate (7). ).
（３）工程（１）で形成したＰＬＺＴ基板（１）と工程
（２）で形成したガラス基板付き透明導電フィルム（２
）を、それぞれのバンプ（３）（４）が一致するように
接着剤（５）で接着する。接着剤（５）の硬化後もガラ
ス基板（７）は接着したまま残すことによって、透明導
電フィルム（２）に応力がかからない。(3) PLZT substrate (1) formed in step (1) and transparent conductive film with glass substrate (2) formed in step (2)
) with adhesive (5) so that the respective bumps (3) and (4) match. By leaving the glass substrate (7) bonded even after the adhesive (5) has hardened, no stress is applied to the transparent conductive film (2).
「発明の効果」
本発明は上述のように、透明導電フィルムをガラス基板
に貼着してＰＬＺＴ基板に接合したので、透明導電フィ
ルムに応力がかからず、光もれが生じない。"Effects of the Invention" As described above, in the present invention, a transparent conductive film is attached to a glass substrate and joined to a PLZT substrate, so no stress is applied to the transparent conductive film and light leakage does not occur.
第１図は本発明の方法により接続されたＰＬＺＴ光デバ
イスの断面図、第２図は従来の方法によるＰＬＺＴ光デ
バイスの断面図で、（ａ）は接着直後、（ｂ）は硬化後
の断面図である。
（１）・・・ＰＬＺＴ基板、（２）・・・透明導電フィ
ルム、（３）（４）・・・バンプ、（５）・・・接着剤
、（６）・・・凹部、（７）・・・ガラス基板。Figure 1 is a cross-sectional view of a PLZT optical device connected by the method of the present invention, and Figure 2 is a cross-sectional view of a PLZT optical device connected by a conventional method, where (a) is the cross-section immediately after bonding, and (b) is the cross-section after curing. It is a diagram. (1)...PLZT substrate, (2)...Transparent conductive film, (3) (4)...Bump, (5)...Adhesive, (6)...Concavity, (7) ...Glass substrate.
Claims (1)
ムをバンプを用いて接着剤で接合する方法において、前
記透明導電フィルムを予めガラス基板に貼着してからＰ
ＬＺＴ基板に接合するようにしたことを特徴とするＰＬ
ＺＴ光デバイスのバンプ接続方法。(1) In a method of bonding a PLZT substrate on which electrodes are formed and a transparent conductive film with an adhesive using bumps, the transparent conductive film is attached to a glass substrate in advance and then the P
A PL characterized by being bonded to an LZT substrate.
Bump connection method for ZT optical devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3075590A JPH03233514A (en) | 1990-02-09 | 1990-02-09 | Bump connecting method for plzt optical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3075590A JPH03233514A (en) | 1990-02-09 | 1990-02-09 | Bump connecting method for plzt optical device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03233514A true JPH03233514A (en) | 1991-10-17 |
Family
ID=12312504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3075590A Pending JPH03233514A (en) | 1990-02-09 | 1990-02-09 | Bump connecting method for plzt optical device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03233514A (en) |
-
1990
- 1990-02-09 JP JP3075590A patent/JPH03233514A/en active Pending
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