JP2003318224A - Manufacturing method of semiconductor device and display device, and junction material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To take countermeasures to light malfunction in junction of a semiconductor chip to a substrate. <P>SOLUTION: A junction material is transferred to an IC mounting region 6 on a transparent substrate 7 of a liquid crystal display device, and a liquid crystal driving IC 3 is positioned and mounted on the transparent substrate 7. In positioning, the junction material is before color development and is in a light transmitting state. Compression is carried out by a compression head 12 from an upper surface part of the mounted liquid crystal driving IC 3. A junction material 5b held by the IC mounting region 6 between the liquid crystal driving IC 3 and the transparent substrate 7 reacts and becomes hardened through heating and pressurization in compression. In the process, the junction material 5b develops color and has an effect of light screening. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip (hereinafter referred to as an IC) as a substrate on which COG (Chip.
and a method for manufacturing a liquid crystal display device in which an IC for driving a liquid crystal is mounted on a substrate by using this mounting method. More specifically, the present invention relates to a technique for preventing optical malfunction of an IC mounted on a transparent substrate.

[0002]

2. Description of the Related Art As a method of mounting an IC on a transparent substrate by a face-down method, there is a bonding method using an anisotropic conductive film. Anisotropic conductive film is mounted on the substrate where electrodes are arranged,
The electrodes on the substrate and the connection terminals of the IC are aligned with each other, and pressure is applied from the upper surface of the IC to the substrate by a pressure bonding head. I
The anisotropic conductive film sandwiched between C and the substrate is reactively cured by heating and pressurization to complete the connection.

[0003]

In a liquid crystal display device, natural light or a backlight is used as a light source. The conventional method for manufacturing a liquid crystal display device has a problem of optical malfunction of the IC due to these light sources due to the mounting structure. In order to block the light transmitted through the transparent substrate, it is necessary to take measures such as sticking a light shielding tape on the back side of the substrate mounting portion, which causes a problem that a process and a material are newly added. Further, in the conventional connecting material, since it is necessary to align the respective connecting terminals of the IC and the substrate, there is a problem that the connecting material itself cannot have a light shielding function.

[0004]

Therefore, according to the present invention, when the electrodes on the substrate and the connection terminals of the IC are aligned with each other, the sandwiched bonding material is kept in a transparent state from the upper surface of the IC. It was decided that a light-shielding effect is produced in the bonding material by the process of pressure bonding to the substrate by the pressure bonding head. Therefore,
Positioning can be easily performed, and a light-shielding effect is generated in the subsequent bonding step. Therefore, malfunction due to light can be prevented without adding new steps and materials.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION A method of manufacturing a semiconductor device according to the present invention comprises a step of forming an electrode on a transparent substrate, a step of aligning the electrode on the transparent substrate and a semiconductor chip, and bonding the semiconductor chip on the transparent substrate. And a step of causing the bonding material to have a light-shielding function. Therefore, the alignment can be easily performed, and then the light-shielding effect is generated in the bonding material, so that the malfunction due to light can be prevented. Here, the bonding material maintains a state of transmitting light when the semiconductor chip and the electrode are aligned.

Further, the bonding material has a light-shielding effect depending on the conditions applied to the bonding material when the semiconductor chip is connected to the transparent substrate. Therefore, it is possible to prevent malfunction due to light without requiring a new process. For example, the light-shielding effect is produced by the reaction of the bonding material depending on the heating condition or the pressing condition at the time of bonding.

Further, in the method of manufacturing a display device according to the present invention, the step of forming the display element, the step of aligning the electrode provided on the display element with the semiconductor chip, and the step of connecting the semiconductor chip and the display element with a bonding material. And a step of causing the bonding material to have a light shielding function.

Further, the bonding material according to the present invention has a property of transmitting light when the transparent substrate and the element (component) are aligned with each other, and the light shielding function is generated by connecting the transparent substrate and the element.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, a case where an IC is mounted on a glass substrate which constitutes a liquid crystal display device will be described in detail.

FIG. 1 is a perspective view showing the appearance of a liquid crystal display device according to this embodiment. As shown in the figure, a polarizing plate 2 is provided in a liquid crystal display element 1 in which liquid crystal is sealed. A liquid crystal driving IC 3 is mounted in an IC mounting area 6 of a substrate that constitutes the liquid crystal display element 1. Details of the IC mounting area will be described with reference to FIG. Further, FIG. 3 is a vertical sectional view schematically showing the structure of this bonding material.

As shown in FIG. 2A, the liquid crystal display element 1
The bonding material 5a is transferred to the IC mounting area 6 on the glass substrate 7, and the liquid crystal driving IC 3 held by the IC mounting head 11 is aligned with the transparent electrode 4 on the glass substrate 7. At the time of alignment, the bonding material 5a is in a state of not transmitting color and transmitting light. Therefore, in this state, the transparent electrode 4 can be sufficiently recognized, the liquid crystal driving IC 3 and the transparent electrode 4 can be aligned, and the liquid crystal driving IC 3 can be mounted in the IC mounting area 6. As shown in FIG. 2B, the pressure bonding head 12 performs pressure bonding from the upper surface of the mounted liquid crystal driving IC 3. The bonding material sandwiched in the IC mounting region 6 between the liquid crystal driving IC 3 and the transparent electrode 4 is reactively hardened by heating and pressing during pressure bonding. At that time, the bonding material 5b develops a color and has an effect of blocking light. In other words, in the present invention, since the bonding material contains a material that develops color when heated and pressed, it is in a state of transmitting light when necessary for alignment, and blocks light after completion of pressure bonding. Become.

As shown in FIG. 3, the bonding material 5 contains conductive particles 8 and a color former 9 that contribute to connection. Here, the developer 10 which further chemically reacts with the color former by an acidic substance to generate a dye is added. As a result, the bonding material has the effect of developing color by heat and pressure and blocking light. A thermosetting material typified by an anisotropic conductive film can be used as the base material of the bonding material. Further, here, a leuco dye or the like is used as the color former 9.

In the above embodiment, in the manufacturing process of the liquid crystal display device, the liquid crystal driving IC 3 is sandwiched between the liquid crystal driving IC 3 and the transparent substrate 7 and the liquid crystal driving IC 3 is pressure-bonded to the liquid crystal driving IC 3 to make use of the liquid crystal. Although an example of applying the optical malfunction countermeasure to the driving IC 3 has been described, the present invention is not limited to the liquid crystal display device as long as it is a process of mounting the IC by using the pressure bonding process. The invention may be applied. In addition, as a mounting method of the IC, as a connection material,
The present invention can be applied to a mounting method using an anisotropic conductive film, a thermosetting resin, heat sealing, or the like.

[Brief description of drawings]

FIG. 1 is a perspective view showing an appearance of a liquid crystal display device.

FIG. 2 is a diagram of an IC mounting area of the liquid crystal display device shown in FIG.

FIG. 3 is a vertical sectional view schematically showing the structure of a bonding material.

[Explanation of symbols]

1 Liquid crystal display element 2 Polarizer 3 Liquid crystal drive IC (semiconductor chip) 4 transparent electrodes 5 Bonding material 6 IC mounting area 7 glass substrate 8 Conductive particles 9 Coloring agent (leuco dye) 10 Developer 11 IC mounted head 12 Crimping head

Claims (8)

[Claims] 1. A step of forming an electrode on a transparent substrate, a step of aligning a semiconductor chip and the electrode, and connecting the semiconductor chip to the transparent substrate with a bonding material; and a light shielding function for the bonding material. A method of manufacturing a semiconductor device, comprising: 2. The method of manufacturing a semiconductor device according to claim 1, wherein the bonding material maintains a state of transmitting light when the semiconductor chip and the electrode are aligned with each other. 3. The bonding material according to claim 1, wherein when the semiconductor chip is connected to the transparent substrate, the bonding material produces a light-shielding effect depending on a condition applied to the bonding material. Manufacturing method of semiconductor device. 4. The method for manufacturing a semiconductor device according to claim 3, wherein the bonding material reacts under heating conditions to produce a light-shielding effect. 5. The method of manufacturing a semiconductor device according to claim 3, wherein the bonding material reacts under a pressurizing condition to generate a light-shielding effect. 6. A step of forming a display element, a step of aligning an electrode provided on the display element with a semiconductor chip, a step of connecting the semiconductor chip and the display element with a bonding material, and a bonding material A step of producing a light-shielding function, and a method of manufacturing a display device. 7. A bonding material used for mounting an element on a transparent substrate, wherein the bonding material has a property of transmitting light when aligning the transparent substrate with the element, A bonding material, which has a light-shielding function by connecting a substrate and the element. 8. The bonding material comprises a resin, conductive particles that contribute to connection, a color former, and a developer that chemically reacts with the color former to generate a dye.
The bonding material according to 7.