JPH03231486A - Circuit device - Google Patents
Circuit deviceInfo
- Publication number
- JPH03231486A JPH03231486A JP2027448A JP2744890A JPH03231486A JP H03231486 A JPH03231486 A JP H03231486A JP 2027448 A JP2027448 A JP 2027448A JP 2744890 A JP2744890 A JP 2744890A JP H03231486 A JPH03231486 A JP H03231486A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit board
- brightness
- resin
- resistance element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
この発明は、回路基板の表面に面付けによって搭載され
る抵抗素子等の回路素子が設置された回路装置に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit device in which circuit elements such as resistive elements are mounted on the surface of a circuit board by surface mounting.
従来、回路基板に面付けされる抵抗素子等の複数の回路
素子が実装された回路装置では、回路基板に搭載すべき
範囲を表す表示部をシルク印刷によって施し、その表示
部を画像認識装置を以て認識しながら回路素子を実装す
る。また、抵抗素子では、その実装後、回路基板上で画
像認識装置の画像を基準にしてその抵抗値トリミングが
行われている。Conventionally, in circuit devices in which multiple circuit elements, such as resistive elements, are mounted on a circuit board, a display section indicating the area to be mounted on the circuit board is printed using silk printing, and the display section is printed using an image recognition device. Implement circuit elements while recognizing them. Further, after the resistance element is mounted, its resistance value is trimmed on the circuit board based on an image taken by an image recognition device.
（発明が解決しようとする課題）
ところで、表示部は、搭載すべき回路素子を包囲するよ
うに形成されているので、回路素子が設置された回路基
板には、回路素子と表示部との間に回路基板の地肌が透
けて見える。この部分は抵抗体と同程度の明度であるた
め、画像認識装置で得られる画像から、抵抗素子のみを
認識することは困難なことである。(Problem to be Solved by the Invention) By the way, since the display section is formed to surround the circuit element to be mounted, there is a gap between the circuit element and the display section on the circuit board on which the circuit element is installed. The surface of the circuit board is clearly visible. Since this portion has a brightness comparable to that of the resistor, it is difficult to recognize only the resistor from an image obtained by an image recognition device.
そこで、この発明は、回路基板に搭載される回路素子の
認識を容易にした回路装置の提供を目的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a circuit device in which circuit elements mounted on a circuit board can be easily recognized.
即ち、この発明の回路装置は、回路基板（２）の表ｆｒ
に設けられた複数の電極（電極バッド８１、８２）間に
接続すべき回路素子（抵抗素子４）の搭載範囲を囲むと
ともに、前記電極間に臨む表示部（６Ａ、６Ｂ）を前記
回路素子との間で明度差を持つ樹脂を以て形成し、その
表示部に前記回路素子を搭載し、その回路素子と前記表
示部との明度差を以て前記回路素子の識別を可能にした
ことを特徴とする。That is, the circuit device of the present invention has the surface fr of the circuit board (2).
It surrounds the mounting range of the circuit element (resistance element 4) to be connected between the plurality of electrodes (electrode pads 81, 82) provided in The circuit element is formed using a resin having a brightness difference between the two, and the circuit element is mounted on the display part, and the circuit element can be identified by the difference in brightness between the circuit element and the display part.
この発明によれば、表示部は、回路素子の搭載範囲を明
示するとともに、回路素子の背面側に臨んでいる。そこ
で、回路素子は、その表示部を覆７て形成されるので、
明度の高い樹脂印刷によって形成された表示部と回路素
子との間には、顕著な明度差を生じ、その明度差から画
像認識装置によって回路素子の状況が明確に表され、そ
の状況が確実に認識されるのである。According to this invention, the display section clearly indicates the mounting range of the circuit element and faces the back side of the circuit element. Therefore, since the circuit element is formed by covering the display part,
There is a noticeable difference in brightness between the display area formed by high-brightness resin printing and the circuit elements, and from this difference in brightness, the status of the circuit elements can be clearly displayed by the image recognition device, and the status can be reliably detected. It is recognized.
〔実 施 例］
以下、この発明を図面に示した実施例を参照して詳細に
説明する。[Example] Hereinafter, the present invention will be described in detail with reference to an example shown in the drawings.
第１図は、この発明の回路装置の一実施例を示す。FIG. 1 shows an embodiment of the circuit device of the present invention.
第１図の（Ａ）に示すように、回路基板２の表面には、
実装すべき電子回路を構成する回路素子として例えば、
抵抗素子４の平面形状を包囲してその抵抗素子４との明
度差の対比を取る表示部６Ａ、６Ｂがシルク印刷によっ
て樹脂で形成されている。この表示部６Ａ、６Ｂは抵抗
素子の形状に対応した外形、例えば、矩形の環状を成し
、その中間側部には、抵抗素子４の背面側に臨む張出部
６１．６２、その側部に突出させた張出部６３．６４が
形成されている。即ち、表示部６Ａは、単一の抵抗素子
４に対して形成され、表示部６Ｂは、隣接して実装され
る複数の抵抗素子４に一括して形成されたものである。As shown in FIG. 1(A), on the surface of the circuit board 2,
For example, the circuit elements constituting the electronic circuit to be implemented include:
Display parts 6A and 6B surrounding the planar shape of the resistor element 4 and comparing the brightness difference with the resistor element 4 are formed of resin by silk printing. The display portions 6A, 6B have an external shape corresponding to the shape of the resistance element, for example, a rectangular ring shape, and an overhang portion 61, 62 facing the back side of the resistance element 4 is provided at the middle side thereof, Projecting portions 63 and 64 are formed. That is, the display section 6A is formed for a single resistance element 4, and the display section 6B is formed for a plurality of resistance elements 4 that are mounted adjacent to each other.
そして、表示部６Ａ、６Ｂは、抵抗素子４の表面の色彩
が灰色で、比較的明度が低いことから、この抵抗素子４
に対して明度差が生しるように比較的明度の高い色、例
えば白色の樹脂を以て形成する。The display portions 6A and 6B show that the resistance element 4 has a gray color on its surface and a relatively low brightness.
The resin is made of a relatively bright color, for example, white, so that a difference in brightness occurs between the two.
また、各表示部６Ａ、６Ｂの内部における回路基板２の
表面には、抵抗素子４の電極を接続すべき電極パッド８
１．８２が形成され、また、回路基板２の縁部には端子
リード１０を接続すべき電極パッド８が形成される。換
言すれば、各表示部６Ａ、６Ｂは、各電極パッド８１．
８２及びその電極パッド８１．８２間に接続すべき抵抗
素子４の搭載範囲を包囲して形成されている。Further, on the surface of the circuit board 2 inside each display section 6A, 6B, an electrode pad 8 to which the electrode of the resistive element 4 is to be connected is provided.
1.82 are formed, and electrode pads 8 to which terminal leads 10 are to be connected are formed on the edges of the circuit board 2. In other words, each display section 6A, 6B has each electrode pad 81.
82 and its electrode pads 81 and 82 to surround the mounting range of the resistance element 4 to be connected.
そして、第１図の（Ｂ）に示すように、回路基板２には
、電極パッド８１．８２の間は、各電極パッド８１．８
２に跨がって抵抗素子４が接着剤等の接着手段を用いて
実装され、抵抗素子４の電極が電極パッド８１．８２に
半田によって電気的に接続される。また、各電極パッド
８には端子リード１０が半田によって接続されている。As shown in FIG. 1B, on the circuit board 2, between the electrode pads 81.82, each electrode pad 81.8
A resistive element 4 is mounted across the resistive elements 2 using an adhesive such as an adhesive, and the electrodes of the resistive element 4 are electrically connected to electrode pads 81 and 82 by solder. Further, a terminal lead 10 is connected to each electrode pad 8 by solder.
このように構成された回路装置では、例えば、第２図に
示すように、回路基板２に画像認識装置１２のカメラ１
４を臨ませ、そのＣＲＴ１６に抵抗素子４とともに表示
部６Ａを映像として写し出す。この画像認識装置１２に
よれば、例えば、第３図の（Ａ）に示すように、表示部
６Ａでは抵抗素子４とその表示部６Ａとの間の明度差か
ら、ＣＲＴ１６には、第３図の（Ｂ）に示すように、抵
抗素子４を表す映像４０と表示部６Ａを表す映像６０と
が映し出され、抵抗素子４の有無及び配置がその映像４
０から容易に認識される。このような認識に基づいて、
抵抗素子４に′例えばレーザトリミングによって抵抗値
調整を行えば、その抵抗値を正確かつ容易に調整するこ
とができる。In the circuit device configured in this way, for example, as shown in FIG. 2, the camera 1 of the image recognition device 12 is mounted on the circuit board 2.
4 and project the display section 6A together with the resistive element 4 on the CRT 16 as an image. According to this image recognition device 12, for example, as shown in FIG. As shown in (B) of FIG.
Easily recognized from 0. Based on this recognition,
If the resistance value of the resistor element 4 is adjusted by, for example, laser trimming, the resistance value can be adjusted accurately and easily.
そして、このような表示部６Ａ、６Ｂを形成したことに
より、画像認識のみならず、肉眼によって視覚的に抵抗
素子４を識別する場合にも、その明度差から極めて容易
に行うことができ、回路構成の検査や調整等の処理精度
を高めることができる。By forming such display sections 6A and 6B, not only image recognition but also visual identification of the resistor element 4 with the naked eye can be performed extremely easily based on the difference in brightness, and the circuit can be easily identified. Processing accuracy such as inspection and adjustment of the configuration can be improved.
また、表示部６Ａ、６Ｂが樹脂によって形成されるので
、半田デイツプ処理によるブリッジを防止することがで
き、回路装置の信頼性の向上に寄与することができる。Furthermore, since the display portions 6A and 6B are formed of resin, bridging due to solder dip treatment can be prevented, contributing to improved reliability of the circuit device.
なお、実施例では、表示部６Ａ、６Ｂを抵抗素子４の搭
載範囲に形成した場合を例に取って説明したが、表示部
はトランジスタ等の他の回路素子の搭載範囲を峻別する
ために形成してもよい。In the embodiment, the case where the display parts 6A and 6B are formed in the mounting range of the resistor element 4 has been explained as an example, but the display parts are formed to clearly distinguish the mounting range of other circuit elements such as transistors. You may.
また、表示部６Ａ、６Ｂの張出部６１．６２は、回路素
子の背面側に跨がって一体に形成するようにしてもよい
。Further, the projecting portions 61 and 62 of the display portions 6A and 6B may be integrally formed so as to straddle the back side of the circuit element.
以上説明したように、この発明によれば、回路基板に設
置される回路素子の認識を容易かつ確実に行うことがで
き、その位置精度や調整精度を高めることができ、回路
装置の信転性を高めることができる。As explained above, according to the present invention, circuit elements installed on a circuit board can be easily and reliably recognized, their positional accuracy and adjustment accuracy can be improved, and the reliability of the circuit device can be improved. can be increased.
第１図はこの発明の回路装置の一実施例を示す図、
第２図は画像認識装置を用いた回路装置の認識方法の一
例を示す図、
第３図は第１図に示す回路装置の一部及び画像認識装置
のＣＲＴ上の映像を示す図である。
２・・・回路基板
４・・・抵抗素子（回路素子）
６Ａ。
６Ｂ ・
・表示部
８１．８２
・電極パラ
ド
（電極）
第 １
（回路装置の
図
実施例〉
第２図
イ回路装置の認識方法の一例〕
第３図
（回路装置の一部及びその映像２）FIG. 1 is a diagram showing an embodiment of the circuit device of the present invention, FIG. 2 is a diagram showing an example of a method for recognizing the circuit device using an image recognition device, and FIG. 3 is a diagram showing an example of the circuit device shown in FIG. 1. It is a figure which shows a part and the image|video on CRT of an image recognition device. 2...Circuit board 4...Resistance element (circuit element) 6A. 6B ・・Display section 81.82 ・Electrode Parade (electrode) 1st (Illustrated example of a circuit device) FIG. 2 A: An example of a method for recognizing a circuit device] FIG. 3 (Part of a circuit device and its image 2)
Claims (1)
き回路素子の搭載範囲を囲むとともに、前記電極間に臨
む表示部を前記回路素子との間で明度差を持つ樹脂を以
て形成し、その表示部に前記回路素子を搭載し、その回
路素子と前記表示部との明度差を以て前記回路素子の識
別を可能にしたことを特徴とする回路装置。A display part that surrounds the mounting area of the circuit elements to be connected between the plurality of electrodes provided on the surface of the circuit board and faces between the electrodes is formed using a resin having a brightness difference between the display part and the circuit elements. A circuit device characterized in that the circuit element is mounted on a display section, and the circuit element can be identified based on a difference in brightness between the circuit element and the display section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2027448A JPH0642587B2 (en) | 1990-02-07 | 1990-02-07 | Circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2027448A JPH0642587B2 (en) | 1990-02-07 | 1990-02-07 | Circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03231486A true JPH03231486A (en) | 1991-10-15 |
| JPH0642587B2 JPH0642587B2 (en) | 1994-06-01 |
Family
ID=12221402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2027448A Expired - Lifetime JPH0642587B2 (en) | 1990-02-07 | 1990-02-07 | Circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642587B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03254197A (en) * | 1990-03-05 | 1991-11-13 | Japan Electron Control Syst Co Ltd | Wiring board |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5837178U (en) * | 1981-09-02 | 1983-03-10 | 株式会社東芝 | electronic circuit equipment |
| JPS6022865U (en) * | 1983-07-22 | 1985-02-16 | 日立電子株式会社 | Chip component mounting range mark on printed circuit board |
| JPS60192469U (en) * | 1984-05-30 | 1985-12-20 | 株式会社東芝 | printed wiring board |
| JPS62132396A (en) * | 1985-12-04 | 1987-06-15 | 富士通株式会社 | Mounting of chip parts |
| JPS6359372U (en) * | 1986-10-07 | 1988-04-20 | ||
| JPS6413171U (en) * | 1987-07-13 | 1989-01-24 | ||
| JPH0167777U (en) * | 1987-10-23 | 1989-05-01 | ||
| JPH02104669U (en) * | 1989-02-01 | 1990-08-20 |
-
1990
- 1990-02-07 JP JP2027448A patent/JPH0642587B2/en not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5837178U (en) * | 1981-09-02 | 1983-03-10 | 株式会社東芝 | electronic circuit equipment |
| JPS6022865U (en) * | 1983-07-22 | 1985-02-16 | 日立電子株式会社 | Chip component mounting range mark on printed circuit board |
| JPS60192469U (en) * | 1984-05-30 | 1985-12-20 | 株式会社東芝 | printed wiring board |
| JPS62132396A (en) * | 1985-12-04 | 1987-06-15 | 富士通株式会社 | Mounting of chip parts |
| JPS6359372U (en) * | 1986-10-07 | 1988-04-20 | ||
| JPS6413171U (en) * | 1987-07-13 | 1989-01-24 | ||
| JPH0167777U (en) * | 1987-10-23 | 1989-05-01 | ||
| JPH02104669U (en) * | 1989-02-01 | 1990-08-20 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03254197A (en) * | 1990-03-05 | 1991-11-13 | Japan Electron Control Syst Co Ltd | Wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642587B2 (en) | 1994-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5283677A (en) | Liquid crystal display with ground regions between terminal groups | |
| TW201627915A (en) | A method of producing sensing device | |
| JPH03231486A (en) | Circuit device | |
| JPH01283993A (en) | Circuit printed board, its surface mounting component position recognition device and surface mounting component inspecting device | |
| US5346748A (en) | Fluorescent display panel containing chip of integrated circuit with discrepancy markers to aid in lead bonding | |
| JP2000077484A (en) | Tape material for flexible substrate, manufacture of the flexible substrate, manufacture of semiconductor device, and manufacture of liquid crystal device | |
| JPH08298361A (en) | Printed board and its discriminating method | |
| JPH04147660A (en) | Package of electronic component and mounting structure thereof | |
| JP2582822B2 (en) | Circuit board | |
| JPH0119396Y2 (en) | ||
| JPS6230519B2 (en) | ||
| JP2625595B2 (en) | Printed circuit board connection device | |
| JPH0219976B2 (en) | ||
| JPH0520359U (en) | Printed circuit board | |
| JPH0555738A (en) | Electronic parts mounting method | |
| JPS6155931A (en) | Manufacture of thick film hybrid integrated circuit device | |
| JPH08288421A (en) | Semiconductor device | |
| JP2007067141A (en) | Chip component and distinguishing method thereof | |
| JPH07130908A (en) | Hybrid integrated circuit device | |
| JPH07240569A (en) | Circuit board and its marking detection method | |
| JPH06302933A (en) | Mounting structure for chip component | |
| JPS6248034A (en) | Lead bonding device | |
| JPH04120745A (en) | Short-circuiting prevention structure of ic packaging substrate | |
| JPH05107518A (en) | Liquid crystal display device and manufacture of the same | |
| JPH0862095A (en) | Inspection device for electrooptical element |