JPH0322500A - Lead bender - Google Patents

Abstract

PURPOSE:To make it possible to bend a plurality of leads simultaneously irrespective of the direction of arrangement by a construction wherein a lead bending member rotates in accordance with a swinging motion of a swinging plate by an eccentric drive mechanism and the leads projecting from a circuit board are bent by a lead bending part of the member. CONSTITUTION:When a piston rod 28 moves, a drive lever 29 rotates integrally with a drive gear 25, a gear 24 to be driven and an eccentric drive shaft 23 rotate, the eccentric part 23b of the shaft is moved thereby in the circumferential direction on a horizontal plane around the axis of a main part 23a, and thereby a swinging base 21 is made to swing. A swinging plate 32 is so positioned below a supporting plate 30 as to be parallel therewith and opposite thereto, and when the swinging base 21 rotates, it rotates within a horizontal plane integrally with the base. Pins 13c to be pressed of lead bending members 10, 11 and 12 are inserted rotatably into pressing holes 32b, 32c and 32d respectively. When the swinging plate 32 swings, accordingly, said pins 13c are pressed in the circumferential direction and the lead bending members 10, 11 and 12 are made to rotate in the direction around the axis. Thereby projections 15a and 17a of lead bending parts 15 and 17 press leads 3a and 5a, while a lead bending part 16 presses a lead 4a, so as to bent these leads.

Description

DETAILED DESCRIPTION OF THE INVENTION The lead bending device of the present invention will be described in detail according to the following items.

A. Industrial application field B. Summary of the invention C. Background technology D. Problem to be solved by the inventionE. Means for solving problems F. Example a. Circuit board [Fig. 1, Fig. 2, Fig. 4, Fig. 5] b. Lead bending device [Figures 1 to 4] b-1. Lead bending member b-2. Base, swing base b-3. Eccentric drive mechanism b-4. Support plate b-5 Rocking plate b-6. Bending of leat G. Effects of the Invention (A. Field of Industrial Application) The present invention relates to a novel lead bending device. Specifically, it relates to a device for bending the tip of a lead of an electronic component with a lead inserted into a lead insertion hole of a circuit board, and is capable of bending multiple leads at the same time by the swinging motion of one swinging member. Moreover, it is an object of the present invention to provide a novel lead bending device that can bend the leads of individual electronic components regardless of the direction in which the leads are arranged.

(B. Summary of the Invention) The lead bending device of the present invention includes a support plate facing the lead protruding surface of a circuit board, a swing plate that rotates in a plane parallel to the support plate, and a lead insertion hole of the circuit board. and a lead bending member rotatably supported by the support plate at a corresponding position in a direction around the axis and rotated by the rocking plate, and when the lead bending member is rotated, the tip portion of the lead bending member is rotated. The bending portion bends the tip of the lead protruding from the lead protruding surface, thereby making it possible to bend a plurality of leads at the same time by the swinging movement of one swinging member. There is a device that allows the leads of a component to be bent regardless of the direction in which they are arranged.

(C. Background Art) An electronic component with an insertion type lead is mounted on a printed circuit board by inserting its leads into a predetermined lead insertion hole formed in the printed circuit board. Connection to the circuit on the board is made by soldering the portion protruding from the lead insertion hole to the circuit formed on the printed circuit board.

In order to prevent the lead from falling out of the lead insertion hole after the lead is inserted into the lead insertion hole and before soldering is performed as described above, the lead is usually pasted into the lead insertion hole. The protruding portion is bent.

(D. Invention or problem to be solved) There is a so-called automatic insertion machine as a device that mechanically mounts electronic components with leads onto a printed circuit board.This type of device usually has two leads. Electronic components with leads are equipped with a mechanism (sometimes referred to as a "clinch mechanism") to bend the leads, so when electronic components with leads are mounted using such an automatic insertion machine, , lead insertion and bending are performed consistently.

However, when electronic components with leads are mounted on a printed circuit board manually, the bending of the leads must also be done manually, which requires time and effort to assemble the circuit board. Since there are variations in the degree of soldering, there is a problem that the assembly quality is not constant, such as variations in soldering.

In addition, many leaded electronic components have three or more leads, and some have three or more leads arranged in the circumferential direction or in a direction close to the circumferential direction. Since it is extremely difficult to compactly incorporate a mechanical means into an automatic insertion machine, it has often been necessary to abandon mounting printed circuit boards using an automatic insertion machine.

(E. Means for Solving the Problems) Therefore, in order to solve the above-mentioned problems, the lead bending device of the present invention is arranged so that the lead bending device faces the lead protruding surface of the circuit board in which the leads of the electronic component are inserted into the lead insertion holes. a support plate which is arranged as a support plate and has a support hole corresponding to the lead; a support plate which is rotatably inserted into the support hole, has a lead bending part at one end on the circuit board side, and has an eccentric shaft part at the other end; a lead bending member provided with a lead bending member, and a rocking plate that is rotated by an eccentric drive mechanism in a plane parallel to the support plate and has an engagement hole in which the eccentric shaft portion is engaged, the rocking plate When the lead bending member swings, the lead bending member is rotated in the direction around the axis, and the lead bending portion thereof bends the lead of the electronic component.

Therefore, in the lead bending device of the present invention, no matter how many lead bending members are supported on the support plate, all the lead bending members can be simultaneously rotated by one rocking plate. The leads of the electronic component can be bent at the same time, and since the bending of the leads is performed by the lead bending part that rotates in a plane parallel to the lead protruding surface of the circuit board, the arrangement direction of the leads of the electronic component is linear. The leads can be bent regardless of the direction in which the leads are arranged, whether in the groove or in the circumferential direction.Furthermore, the lead bending member only rotates around the axis of the bending part of the lead. No space is required for the movement of the bending member, and therefore the lead bending member can be provided even if the electronic components on the circuit board are arranged at fairly narrow intervals.

(F. Example) Below, details of the lead bending device of the present invention will be explained according to Example 1 shown in the drawings.

First, an example of a circuit board will be explained, and then the reed bending device 1 will be explained.

(a. Circuit board) [Fig. 1, Fig. 2, Fig. 4, and Fig.
A (hereinafter referred to as the "lead protruding surface") is printed with a conductive pattern (not shown), and the other surface 2
b includes an IC 3 with a large number of leads arranged in two rows, an IF transformer 4 with two leads, and an IC 3 arranged approximately in the circumferential direction;
A semi-fixed type capacitor 5 having a book lead and various other electronic components (not shown) are mounted, and these I
The leads 3a1 3a1 of C3, the leads 4a, 4a, . . . of the IFI lance 4, the leads 5a, 5a, .
Lead insertion holes 6, 6,..., 7, 7 and 8 formed in
, 8, . . .

After the predetermined electronic components have been mounted on the circuit board 2, both sides of the circuit board 2 are slidably engaged with the guide rails 9, 9 (see FIG. 5), and the lead bending device 1 is connected. It is transported upwards.

(b. Lead bending device) [Figures 1 to 4 (b-1
．． (Lead bending member) 10, 10 is a lead bending member for bending the leads 3a, 3a, . . . of the IC 3, 11 is a lead bending member for bending the leads 4a, 4a of the IF transformer 4, 12
are the leads 5a and 5a of the semi-fixed capacitor 5.
Each of these is a lead bending member for bending a lead bending member, each consisting of a pressed portion and a head portion coupled to the pressed portion in an externally fitted manner, and the lead bending portion forming the upper end of the head portion is They all have the same structure except that they have a structure that corresponds to the number and arrangement of leads of the electronic component.

13, 13, . . . are pressed parts, which are cylindrical joint parts 13a, 13a with spline grooves formed on the outer peripheral surface.
,... and the connecting portions 13a, 13a1... The flange portions 13b, 13b, ... located at the lower ends of the flange portions 13b113b, ..., the outer periphery of the lower surface, that is, the connecting portions 13a, 13a1 Pressed pins 13゛C, 13c, . . . protrude from eccentric positions relative to the axis of the .
・Consists of.

Further, 14, 14, . . . is a head portion, which has a cylindrical shape with a closed upper end, and has spline grooves formed on the inner peripheral surface of its holes 14a114a, . portions 14b, 14b1... are formed, and lead bending portions 15, 15,
16 and 17 are formed separately. And IC3
Lead bending parts 15, 1 of lead bending members 10, 10 for
5 are two protrusions 15 located on opposite sides of the center of the upper end surface 14c and extending in the radial direction of the upper end surface 14c.
a. 15a. ..., the lead bending part 16 of the lead bending member 11 for the IFI-lance 4 is connected to the upper end surface 14.
It is formed in a protrusion shape extending in the radial direction through the center of c,
Further, the lead bending portion 17 of the lead bending member 12 for the semi-fixed capacitor 5 consists of three protrusions 17a, 17a, . . . extending substantially radially from the center of the upper end surface 14c.

The lead bending members 10, 10, 11 and 12 have a connecting portion 13 between the pressed portions 13, 13, .
a, 13a, . . . are holes 14a . By being inserted into 14a,...
Each part other than the pressed bottles 13c, 13c, .

These lead bending members 10, 10, 11, and 12 are rotatably supported by a support plate, which will be described later, and all of them are simultaneously rotated by a swing plate, which will be described later.

(b-2. Base, swing base) 18 is the base of the lead bending device 1, and is formed in a rectangular plate shape.
9, 19, .
Support holes 18c, 18C1 are located close to 19, .
... is formed.

20, 20, . . . are eccentric support shafts, and the support columns 19
, 19, . . . , cylindrical main portions 20a, 20a, . . . and the main portions 20a, 20a.
, 20b, . . . are formed integrally with each other, and the lower end portions of the main portions 20a, 20a, . The support holes 113c and 18C1 formed at the corners of the base 18.
... are rotatably inserted into each separately.

21 is a swing base. The swing base 21 is the base 18
It is formed into a rectangular flat plate shape that is approximately one size smaller than the above, and has circular insertion holes 21a, 21a, at its four corners.
... are formed, and the insertion holes 21a, 21a, ...
- Eccentric part 2 of the eccentric support shaft 20, 20, ...
0b, 20b. ... is rotatably inserted, and the insertion hole 21
The opening edges of a, 21a, ... are the eccentric support shafts 20, 20
, . . main parts 20a, 20a. By being placed on the upper end surface of..., the position in the height direction is defined.

Therefore, the swing base 21 has eccentric support shafts 20, 20,
Main part of... 20a, 20a%...
It is supported by the base 18 so as to be able to swing in the circumferential direction within a substantially horizontal plane about the axis of rotation.

Further, the approximately central portion of the swing base 21 is formed to be slightly thicker than the remaining portion, and a circular fitting hole 2 is formed on the lower surface of this portion.
1b is formed, and the axis of the fitting hole 2lb is aligned with the base 1.
The support hole 18b is slightly eccentric with respect to the axis of the support hole 18b formed in the center of the support hole 18b.

12 In addition, the eccentric portion 20b of the eccentric support shafts 20, 20, . , 20b. Main part 20a. 20a,
The eccentric distance and the phase of the eccentricity with respect to the axis of the fitting hole 2lb are the same as the eccentric distance and the phase of the eccentricity with respect to the axis of the central support hole 18b of the base 18 of the axis of the fitting hole 2lb. The eccentric distance between the pressed bins 13c, 13c, . Main parts 20a, 20 of...
It has the same size as the eccentric distance with respect to a, .

(b-3. Eccentric drive mechanism) 22 is an eccentric drive mechanism.

Reference numeral 23 designates an eccentric drive shaft, in which a cylindrical main portion 23a and an axially short cylindrical eccentric portion 23b located at the upper end of the main portion 23a are integrally formed. The lower end portion is rotatably inserted into the central support hole 18b of the base 1B, and the eccentric portion 23b is rotatably fitted into a fitting hole 21b formed in the swing base 21.

24 is a driven gear externally fixed to the middle part of the eccentric drive shaft 23, 25 is a drive gear rotatably supported by a gear support shaft 26 erected from the upper surface 18a of the base 18, The driving gear 25 is meshed with the driven gear 24.

Reference numeral 27 denotes an air cylinder fixed to the upper surface of the base 18, and an intermediate portion of a drive lever 29 is rotatably connected to the tip of the piston rod 28.
One end portion is fixed to the outer periphery of the upper surface of the drive gear 25 . The piston rod 28 and the drive lever 29 are connected by a connecting pin 28a provided on the piston rod 28.
This is achieved by slidably engaging an elongated hole 29a formed in the drive lever 29.

When the piston rod 28 moves, it is rotated integrally with the drive lever 29 or the drive gear 25, so the driven gear 24 is rotated, and the eccentric drive shaft 23 is thereby rotated to rotate its eccentric portion. , and the swing base 21 is moved in the circumferential direction, thereby swinging the swing base 21 .

Incidentally, the eccentric drive shaft 23 is configured to be rotated within a range of about 120 degrees in terms of center angle.

(b-4. Support Plate) 30 is a support plate that rotatably supports the lead bending members 10, 10, 11, and 12.

The support plate 30 has a flat plate shape having approximately the same size as the base 18, and has mounting holes 30a, 30a at its four corners.
,... are formed, and the mounting holes 30a, 30
a. ... are inserted into the bolts 31, 31, ...
are fixed to the pillars 19, 19, . . . by being screwed into screw holes 19a, 19a, . . . formed at the upper ends of the pillars 19, 19, . is placed above and parallel to and facing it.

After the printed circuit board 2 has been loaded with predetermined electronic components, it is transferred from above to a position facing the support plate 30 in parallel with a predetermined distance therebetween. It is positioned with respect to the support plate 30 by the positioning means.

The support plate 30 has circular support holes 30b, 30.
b, 30c and 30d are formed, and these support holes 30b, 30b, 30c and 30d are for IC mounted on the printed circuit board 2 positioned with respect to the support plate 30.
3, IFI-lance 4 and semi-fixed capacitor 5 are arranged. That is, with the printed circuit board 2 at the position above the support plate 30 (hereinafter referred to as the "lead bending position"), the support holes 30b,
30b has leads 3a, 3a, . . . whose centers are IC3.
... are formed in positions facing each other from below to the center of the three trees on one end side of one row and the center of the three trees on the other end side of the other row, and , support hole 3
0c is formed so that its center faces the IF transformer 4 from below and coincides with the intermediate position between the two leads 4a, and the center of the support hole 30d is semi-fixed. A toothpick is formed facing the type capacitor 5 from below and coinciding with the arrangement center of the three leads 5a, 5a, .

The lead bending members 10, 10 have their head portions 14
, 14 are respectively rotatably inserted into the support holes 30b, 30b, and similarly, the lower ends of the head portion 14 of the lead bending member 11 and the lead bending member 12
The lower ends of the head portions 14 are inserted into the support holes 30c and 30d separately so that they can be rotated freely, thereby allowing the lead bending members 10, 10, 11, and 12 to rotate around the support plate 30 in the axial direction. It is supported so that it can move freely.

When the printed circuit board 2 reaches the lead bending position, the lead bending portions 15 of the lead bending members 10, 10
are respectively opposed to the three leads on one end side of one row and the three leads on the other end side of the other row among the leads 3a, 3a, . . . of the IC 3; is opposed to the leads 4a, 4a of the IFI-lance 4, and the lead bending portion 17 of the lead bending member 12 is opposed to the leads 5a, 5a, . . . of the semi-fixed capacitor 5.

(b-5. Swing plate) 32 is a swing plate for rotating the lead bending members 10, 10, 11, and 12, and has a rectangular flat plate shape that is one size smaller than the swing base 21. Swing base 21
The screws 33, 3 are placed on the top surface of the holder and inserted through the mounting holes 32a, 32a1 formed at the four corners thereof.
3,... are screw holes 21c and 2 formed in the swing base 21.
1C1...by being screwed into the swing base 21.
Fixed.

Therefore, the swing plate 32 is located below the support plate 30 and parallel to it, and the swing base 21
When it rotates, it rotates along with it in a horizontal plane.

The swing plate 32 also has support holes 3 formed in the support plate 30.
Press holes 32b, 32b are located at positions that are eccentric by a predetermined distance from the positions coaxial with 0b, 30b, 30c, and 30d.
, 32c and 32d are formed. The above eccentric distance is the same as the eccentric distance between the axis of the pressed bins 13c, 13c1... of the lead bending members 10, to, it and 12 and the axis of the remaining parts, and, The phase of the eccentricity is determined by the eccentric portions 20b and 20b1 in the eccentric support shaft 20.
The phase of the eccentricity with respect to the main portions 20a, 20a, . . .

Then, the pressed pins 13c of the lead bending members 10, 10
, 13c are inserted into the pressing holes 32b, 32b, and the lead bending member 1
The pressed pin 13c of the lead bending member 12 is rotatably inserted into the pressing hole 32c, and the pressed pin 13c of the lead bending member 12 is rotatably inserted into the pressing hole 32d.

Therefore, when the swing plate 32 swings, the pressed pin 13
c, 13c, .

Incidentally, in the initial state, that is, the state in which the piston rod 28 of the air cylinder 27 is not pushed out from the casing, the lead bending members 10, 10 have their lead bending portions 15
, 15 each of two protrusions 15a. 15a are lined up in a direction oblique to the arrangement direction of each row of leads 3a, 3a,... of the IC 3, and the lead bending portion 16 of the lead bending member 11 is aligned with the lead 4a of the IFI-lance 4. ,4a
It is oriented to extend obliquely to the arrangement direction of
Further, the lead bending portion 17 of the lead bending member 12 has its protrusions 17a, 17a, .

(b-6. Lead Bending) Then, when the circuit board 2 is transferred to the lead bending position, the floating prevention member 34 (shown only in FIG. 1) is placed.

) moves downward and its pads 35, 35, . The upper ends of the lead bending members 10, 11, and 12 are brought close to the printed circuit board 2, and the protrusions 15a of the lead bending parts 15, 15 of the lead bending members 10, 10 are moved upward by a lifting means (not shown). ,1
5a, . . . are the leads 3a, 3a, ・ of IC3.
..., both ends of the lead bending part 16 of the lead bending member 11 are connected to the leads 4a, 4a of the F transformer 4, and the protrusions 17a, 17 of the lead bending part 17 of the lead bending member 12 are connected to the leads 4a, 4a of the F transformer 4.
a, . . . are the leads 5a, 5a of the semi-fixed capacitor 5.
, ... are faced from the sides.

Then, the piston rod 28 of the air cylinder 27 is projected from this state, and the swing base 21 and the swing plate 32 are thereby swung as described above, and the lead bending member 10
, 10, 11 and 12 are rotated, and the reed bending member 10
, 10, 11 and 12 rotate, as shown in FIG. 4, the protrusions 15a . 15a
, . . press the leads 3a, 3a, . . . to bend them, and the lead bending portion 16 presses the leads 3a, 3a, .
, the protrusion 17a117a1 of the reed bending portion 17...
is lead 5a. 5a, . . . are pressed to bend them.

Therefore, the leads 3a, 3a of IC3. ..., the leads 4a, 4a of the IF transformer 4, and the leads 5a, 5a, ... of the semi-fixed capacitor 5 are all bent at the same time.

Note that when the lead is bent in this way, the lead bending device 1 is lowered, and then the piston rod 2
8 is pulled back and the swing base 21, swing plate 32, and lead bending members 10, 10, 11, and 12 are returned to their original positions, and another printed circuit board 2 is transferred to the lead bending position and its printed circuit board 2 is moved to the lead bending position. Bending of the leads for the circuit board 2 is performed as described above.

(G Effect of the Invention) The lead bending device of the invention is arranged facing the lead protruding surface of the circuit board with the lead of the electronic component inserted into the lead insertion hole, and a support hole corresponding to the lead is formed. a supporting plate provided opposite to the side surface of the supporting plate opposite to the circuit board, capable of rotating in a plane parallel to the supporting plate, and corresponding to a supporting hole formed in the supporting plate; A rocking plate in which an engagement hole is formed at a position shifted by a predetermined distance from the position, an eccentric drive mechanism for rocking the rocking plate, and one end provided with a lead bending portion formed in the support hole of the support plate. The other end of the lead is rotatably inserted through the lead, and the other end thereof is provided with a shaft portion that is eccentric with respect to the rotation axis of the lead bending portion, and the shaft portion is engaged with the engagement hole of the rocking plate. and a bending member, the lead bending member rotates in response to the rocking of the rocking plate by the eccentric drive mechanism, and the lead protruding from the circuit board is bent by the lead bending part. do.

Therefore, in the lead bending device of the present invention, no matter how many lead bending members are supported on the supporting plate, all the lead bending members can be simultaneously rotated by one swing plate. The leads of electronic components can be bent at the same time, and since the bending of the leads is performed by the lead bending part that rotates in a plane parallel to the lead protruding surface of the circuit board, the arrangement direction of the leads of the electronic components is straight. The lead bending member can be bent regardless of the direction in which the leads are arranged, whether in the direction or the circumferential direction, and the lead bending member only rotates around the axis of the lead bending part. Therefore, no space is required for the movement of the lead bending member, and therefore, the lead bending member can be provided even when the electronic components on the circuit board are arranged at fairly narrow intervals.

According to the lead bending device of the present invention, it is possible to mechanically bend a large number of electronic component leads that are manually mounted on a circuit board at the same time, and it is also possible to mount them using an automatic insertion machine. The range of electronic components can be expanded.

In the above embodiment, the support plate and the rocking plate were made to be replaceable with respect to the base of the device, but by doing so, the layout of the parts arrangement can be changed by simply replacing some parts. It can be adapted to various circuit boards with different values.

Furthermore, the structure of the circuit board and the shape of the lead bending part of the lead bending member shown in the examples are shown as just an example of implementing the present invention, and the lead bending device of the present invention can be used to bend the leads. The types of electronic components that can be bent and the structure of the lead bending member are not limited to those shown in the embodiments.

[Brief explanation of the drawing]

The drawings show an example of the implementation of the lead bending device of the present invention, in which Fig. 1 is a plan view showing the initial state, Fig. 2 is a sectional view taken along line II-II in Fig. 1, and Fig. 3 is an exploded view. Perspective view,
FIG. 4 is a plan view of the main parts showing a state in which the bending of the leads is completed, and FIG. 5 is a perspective view showing an example of the circuit board. Explanation of symbols 1...Lead bending device, 2...Circuit board, 2a...Lead protruding surface, 3, 4, 5...Electronic component, 3a, 4a, 5a... Lead, 6, 7 , 8...
...Lead insertion hole, 10, 11, 12...Lead bending member, 13c...
Shaft part, 15, 16, 17... Lead bending part, 22... Eccentric drive mechanism, 30... Support plate, 30b, 30c, 30d...-Support hole, 32... Rocking plate, 32b , 32c, 32d... - Engagement hole applicant Sony Corporation

Claims (1)

[Scope of Claims] A support plate disposed opposite to a lead protruding surface of a circuit board with leads of electronic components inserted into the lead insertion holes, and in which support holes corresponding to the leads are formed; The support plate is provided opposite to the side surface of the support plate opposite to the circuit board, is rotatable in a plane parallel to the support plate, and is shifted a predetermined distance from the position corresponding to the support hole formed in the support plate. A rocking plate having an engagement hole formed at a position, an eccentric drive mechanism for rocking the rocking plate, and one end provided with a lead bending portion rotatably inserted into the support hole of the support plate. and a lead bending member, the other end being provided with a shaft part eccentric to the rotation axis of the lead bending part, and the shaft part being engaged with the engagement hole of the rocking plate; A lead bending device characterized in that a lead bending member rotates in response to the rocking of a rocking plate by an eccentric drive mechanism, and the lead protruding from a circuit board is bent by the lead bending part.