JP2722679B2 - Lead bending equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The lead bending apparatus of the present invention will be described in detail according to the following items.

A. Industrial application fields B. Summary of the invention C. Background art D. Problems to be solved by the invention E. Means for solving the problems F. Embodiment a. Circuit board [FIG. 1, FIG. , Figures 4 and 5] b. Lead bending device [Figs. 1 to 4] b-1. Lead bending member b-2. Base, swing base b-3. Eccentric drive mechanism b-4 .Support plate b-5. Oscillating plate b-6. Bending of lead G. Effect of the invention (A. Field of industrial application) The present invention relates to a novel lead bending apparatus. For more information,
The present invention relates to a device for bending the tip of a lead of an electronic component with a lead inserted into a lead insertion hole of a circuit board, and
A novel lead bending device that can simultaneously bend a plurality of leads by the swinging motion of one swinging member, and bends the leads regardless of the arrangement direction of the leads of individual electronic components. It is intended to provide.

(B. Summary of the Invention) A lead bending apparatus according to the present invention includes a support plate facing a lead projecting surface of a circuit board, and a support plate that is rotated in a plane parallel to the support plate.
A lead bending member rotatably supported by a supporting plate at a position corresponding to the lead insertion hole of the circuit board in a direction around an axis and rotated by the rocking plate. By rotating the member, the lead bending portion at the distal end of the lead bends the distal end of the lead projecting from the lead projecting surface. Can be bent at the same time, and the leads can be bent regardless of the arrangement direction of the leads of the individual electronic components.

(C. Background Art) An electronic component with an insertion type lead is mounted on a printed circuit board by inserting the lead into a predetermined lead insertion hole formed in the printed circuit board.
The connection with the circuit on the printed circuit board is performed by soldering a portion of the lead protruding from the lead insertion hole to a circuit formed on the printed circuit board.

Then, in order to prevent the lead from falling out of the lead insertion hole until the soldering is performed after the lead is inserted into the lead insertion hole as described above, usually,
A portion of the lead protruding from the lead insertion hole is bent.

(D. Problems to be Solved by the Invention) As a device for mechanically mounting electronic components with leads on a printed circuit board, there is a so-called automatic insertion machine. This type of device usually has two leads. For such electronic components, a mechanism for bending the lead (sometimes referred to as a “clinch mechanism” or the like) is provided. In addition, lead insertion and bending are performed consistently.

However, when electronic components with leads are mounted on a printed circuit board by hand, the bending of the leads is unavoidable only by hand, and therefore, it takes time and effort to assemble the circuit board. However, there is a problem that the assembling quality is not constant, such as a variation in soldering due to the degree of variation.

Many of the electronic components with leads have three or more leads, and some have three or more leads arranged in a circumferential direction or a direction close to the circumferential direction. Since it is extremely difficult to compactly incorporate a means for performing mechanically into an automatic insertion machine, it has often been necessary to give up mounting on a printed circuit board by the automatic insertion machine.

(E. Means for Solving the Problems) In order to solve the above-described problems, the lead bending apparatus of the present invention faces a lead protruding surface of a circuit board in a state in which a lead of an electronic component is inserted into a lead insertion hole. A support plate having a support hole corresponding to the lead formed therein, and a lead bent portion provided at one end on the circuit board side rotatably inserted into the support plate and an eccentric shaft portion at the other end. And a rocking plate which is rotated by one eccentric drive mechanism in a plane parallel to the support plate and has an engagement hole with which the eccentric shaft portion is engaged. When the swing plate swings, the lead bending member is rotated in the direction around the axis, and the lead bending portion bends the lead of the electronic component.

Therefore, in the lead bending apparatus of the present invention, even if any number of lead bending members are supported by the support plate, all of the lead bending members can be simultaneously rotated by one rocking plate, so that a plurality of electronic bending members can be used. The leads of the components can be bent at the same time, and the leads are bent by the lead bending part that rotates in a plane parallel to the lead projecting surface of the circuit board. Regardless of the arrangement direction of the leads, whether in the circumferential direction or in the circumferential direction, the leads can be bent, and furthermore, the lead bending member only rotates about the axis of the lead bending portion as the center of rotation. No space is required for moving the lead bending member at all, and therefore the lead bending member can be provided even when the arrangement interval of the electronic components on the circuit board is quite narrow.

(F. Example) Hereinafter, details of the lead bending apparatus of the present invention will be described with reference to Example 1 illustrated.

First, an example of a circuit board will be described, and then the lead bending device 1 will be described.

(A. Circuit Board) [FIG. 1, FIG. 2, FIG. 4, FIG. 5] Reference numeral 2 denotes a printed circuit board, mainly one side thereof.
2a (hereinafter referred to as a “lead protruding surface”) is printed with a conductor pattern (not shown), and the other surface 2b is formed.
IC2 having a large number of leads arranged in two rows, an IF transformer 4 having two leads, a semi-fixed capacitor 5 having three leads arranged substantially in the circumferential direction, and other various electronic components (not shown) Are mounted, and leads 3a, 3a,... Of these IC3, leads 4a, 4a,.
.. the leads 5a, 5a,... Of the semi-fixed capacitor 5 have lead insertion holes 6, 6,.
.., 7, 7 and 8, 8,.

After the mounting of the predetermined electronic components is completed, the circuit board 2 has guide rails 9 on both sides thereof.
(See FIG. 5), and is slidably engaged and transferred above the lead bending device 1.

(B. Lead bending device) [FIGS. 1 to 4] (b-1. Lead bending member) 10, 10 are lead bending members for bending the leads 3a, 3a,. IF transformer 4 leads 4a, 4a
And 12 are lead bending members for bending the leads 5a, 5a,... Of the semi-fixed capacitor 5, and are respectively connected to the pressed portion and the pressed portion in an external fitting manner. Each of the electronic components has the same structure except that the lead bending portion, which forms the upper end of the head portion, has a structure corresponding to the number and arrangement of the leads of the electronic component.

, 13, ... are pressed portions, and are cylindrical connecting portions 13a, 13a, ... in which spline grooves are formed on the outer peripheral surface.
... and the outer peripheral portion of the lower surface of the flange portions 13b, 13b, ... located at the lower ends of the coupling portions 13a, 13a, ..., that is, the coupling portions 13a, 13a, ... pressed pins 13c, 13 protruding from a position eccentric to the axis of
c,...

Reference numeral 14, 14, ... denote a head portion, which has a cylindrical shape whose upper end is closed, and has spline grooves formed in the inner peripheral surface of the holes 14a, 14a, ..., and the lower end of the outer peripheral surface. To flange
14b, 14b, ... are formed, and the upper end surfaces 14c, 14c, ...
Lead bending portions 15, 15, 16 and 17 are separately formed. The lead bending portions 15, 15 of the lead bending members 10, 10 for the IC3 are located on opposite sides of the center of the upper end surface 14c, and are two projections 1 extending in the radial direction of the upper end surface 14c.
The lead bending portion 16 of the lead bending member 11 for the IF transformer 4 is formed in a ridge shape extending in the radial direction through the center of the upper end surface 14c. The lead bending portion 17 of the lead bending member 12 for five has three projections 17a, 17 extending substantially radially from the center of the upper end surface 14c.
a, ...

And such lead bending members 10, 10, 11 and 12
Are connected parts 13a, 13a of the pressed parts 13, 13, ...
Are inserted into the holes 14a, 14a,... Of the heads 14, 14,..., Whereby the parts other than the pressed pins 13c, 13c,. It is joined so as to rotate.

The lead bending members 10, 10, 11 and 12 are rotatably supported by a support plate described later, and all of them are simultaneously rotated by a swing plate described later.

(B-2. Base, Swing Base) Reference numeral 18 denotes a base of the lead bending apparatus 1 which is formed in a rectangular plate shape and has four pillars 19, 1 extending from four corners of an upper surface 18a thereof.
9 are projected, and a support hole 1
8b are formed, and support holes 18c, 18c,... Are formed at positions close to the four columns 19, 19,.

20, 20, ... are eccentric support shafts, and the support columns 19, 1
9, a cylindrical main part 20 having a length approximately half of that of the main part 20.
a, 20a, ... and the main parts 20a, 20a, ... are eccentric and short axially eccentric parts 20b, 20b, ...
Are formed integrally, and the lower ends of the main parts 20a, 20a,... Are formed at the corners of the base 18 at the support holes 18c, 18c.
c,... are rotatably inserted respectively.

21 is a swing base. The swing base 21 is formed in the shape of a rectangular flat plate which is substantially smaller than the base 18 by one turn.
A circular insertion hole 21a, 21a, ... is formed at one of the corners, and the eccentric portion 20b of the eccentric support shaft 20, 20, ..., is formed in the insertion hole 21a, 21a, ... Are rotatably inserted, and the opening edges of the insertion holes 21a, 21a, ... are the upper end surfaces of the main parts 20a, 20a, ... of the eccentric support shafts 20, 20, ... The position in the height direction is defined by being placed on the.

Therefore, the swing base 21 can swing in the circumferential direction in a substantially horizontal plane around the axis of the main parts 20a, 20a,... Of the eccentric support shafts 20, 20,. It is supported by a base 18.

A substantially central portion of the swing base 21 is formed to be slightly thicker than the remaining portion, and a circular fitting hole 21 is formed on the lower surface of this portion.
b is formed, and the axis of the fitting hole 21b is slightly eccentric with respect to the axis of the support hole 18b formed in the center of the base 18.

The eccentric portions 20b, 2 of the eccentric support shafts 20, 20,.
The eccentric distance and the phase of the eccentricity with respect to the main portions 20a, 20a,... Of the central portions 0b,. Phase, and the lead bending members 10, 10, 11
The eccentric distance between the pressed pins 13c, 13c,... And the rest of the eccentric support shafts 20, 20,... In the eccentric portions 20b, 20b,. , 20a,... Are the same as the eccentric distances.

(B-3. Eccentric drive mechanism) Reference numeral 22 denotes an eccentric drive mechanism.

Reference numeral 23 denotes an eccentric drive shaft, which is a cylindrical main part 23a and an axially short cylindrical eccentric part 2 located at the upper end of the main part 23a.
3b is formed integrally with the base 1a.
The eccentric portion 23b is rotatably inserted into a fitting hole 21b formed in the swing base 21 while being rotatably inserted into the center support hole 18b of the eighth base 8.

Reference numeral 24 denotes a driven gear fixed to the intermediate portion of the eccentric drive shaft 23 so as to be fitted externally, 25 denotes a drive gear rotatably supported on a gear support shaft 26 erected from the upper surface 18a of the base 18, The drive gear 25 is meshed with the driven gear 24.

27 is an air cylinder fixed on the upper surface of the base 18,
An intermediate portion of a drive lever 29 is rotatably connected to the distal end of the piston rod 28, and one end of the drive lever 29 is fixed to the outer peripheral portion of the upper surface of the drive gear 25.
The connection between the piston rod 28 and the drive lever 29 is made by a connection pin 28a provided on the piston rod 28 slidably engaging a long hole 29a formed in the drive lever 29.

When the piston rod 28 moves, the drive lever
Since the drive gear 29 is rotated integrally with the drive gear 25, the driven gear
24, whereby the eccentric drive shaft 23 is rotated, and the eccentric part 23b is moved in the circumferential direction on a horizontal surface around the axis of the main part 23a, whereby the swing base 21 is moved. Rocked.

Note that the eccentric drive shaft 23 is configured to rotate in a range of approximately 120 ° at the central angle.

(B-4. Support Plate) Reference numeral 30 denotes a support plate that rotatably supports the lead bending members 10, 10, 11, and 12.

The support plate 30 has a flat plate shape having substantially the same size as the base 18, and mounting holes 30a, 30a,.
Are screw holes 19a, 19a,... Formed at the upper ends of the columns 19, 19,... Inserted through the mounting holes 30a, 30a,. Are fixed to the columns 19, 19,... By being screwed into the swinging base 21 so as to be arranged above the swinging base 21 so as to face in parallel with the swinging base 21.

After the mounting of the predetermined electronic components is completed, the printed circuit board 2 is transferred from the upper side to the support plate 30 in a state where the printed circuit board 2 has a predetermined space therebetween and is opposed to the support plate 30 at a predetermined interval, and is not shown. It is positioned between the support plate 30 and the positioning means.

The support plate 30 has circular support holes 30b, 30b, 30.
c and 30d are formed, and these support holes 30b, 30b, 30
c and 30d are arranged so as to coincide with the IC 3, the IF transformer 4, and the semi-fixed capacitor 5 mounted on the printed circuit board 2 positioned with respect to the support plate 30. That is, in a state where the printed circuit board 2 comes to a position positioned above the support plate 30 (hereinafter referred to as a “lead bending position”), the center of the support holes 30b, 30b is the lead 3a of the IC 3, Three
a,... formed at positions opposite to the center one of the three ends on one end of one row and the center end of the three ends on the other end of the other row from below. The center of the support hole 30c faces the IF transformer 4 from below,
Further, the support hole 30d is formed so as to coincide with an intermediate position between the two leads 4a and 4a, and the center of the support hole 30d faces the semi-fixed capacitor 5 from below, and the three leads 5a , 5a,... Are aligned with the center of the array.

The lead bending members 10 and 10 have their head portions 14 and 14
The lower ends of the head portions 14 of the lead bending member 11 and the lower ends of the head portions 14 of the lead bending members 12 are similarly rotatably inserted through the support holes 30b, 30b. Are rotatably inserted into the support holes 30c and 30d, respectively, so that the lead bending members 10, 10, 11 and 12 are supported by the support plate 30 so as to be rotatable around the axis. Is done.

When the printed circuit board 2 comes to the lead bending position, the lead bending portions 15 of the lead bending members 10
One of the three leads 3a, 3a,.
The lead bending portion 16 of the lead bending member 11 is opposed to each of the book and the other three of the other end of the other row.
And the lead bending portion 17 of the lead bending member 12 is connected to the leads 5a, 5a,.
・ It is opposed.

(B-5. Oscillating plate) 32 is an oscillating plate for rotating the lead bending members 10, 10, 11 and 12, and has a rectangular flat plate shape slightly smaller than the oscillating base 21; The mounting holes 32a, 32a, which are placed on the upper surface of the swing base 21 and formed at four corners thereof,
Are inserted through the swing base 21
Are fixed to the swing base 21 by being screwed into screw holes 21c, 21c,.

Accordingly, the swing plate 32 is located below the support plate 30 so as to be opposed to the support plate 30 in parallel, and when the swing base 21 rotates, the swing base 21 is rotated in a horizontal plane integrated therewith.

The swing plate 32 has a support hole 30 formed in the support plate 30.
Pressing holes 32b, 32b, 32c and 32d are formed at positions eccentric by a predetermined distance separately from positions coaxial with b, 30b, 30c and 30d. The eccentric distance is the length of the lead bending member 10, 1
The eccentric distance between the axis of the pressed pins 13c, 13c,... Of 0, 11 and 12 and the axis of the remaining part is the same, and the phase of the eccentricity is in the eccentric support shaft 20. Eccentric part 20
The phase of the eccentricity of b, 20b,... with respect to the main parts 20a, 20a,.

Then, the pressed pins 13c, 13c of the lead bending members 10, 10
Are pressed holes 13b of the lead bending member 11 in the pressing holes 32b, 32b.
c is in the pressing hole 32c, and the pressed pin of the lead bending member 12 is
13c are rotatably inserted into the pressing holes 32d.

Therefore, when the swing plate 32 swings, the pressed pin 13
are pressed in the circumferential direction, whereby the lead bending members 10, 10, 11 and 12 are rotated in the direction around the axis.

In the initial state, that is, in a state in which the piston rod 28 of the air cylinder 27 is not pushed out of the casing, the lead bending members 10, 10 have two protrusions 15a, 15a of the lead bending portions 15, 15, respectively. 3a, 3a,... Are arranged in a direction oblique to the respective arrangement directions, and the lead bending portion 16 of the lead bending member 11 is arranged in the arrangement direction of the leads 4a, 4a of the IF transformer 4. , And the protrusions 17a, 17a,... Of the lead bending portion 17 of the lead bending member 12 are formed of the leads 5a, 5a,. It is in a direction opposite to the position between them.

(B-6. Bending of Lead) Then, when the circuit board 2 is transferred to the lead bending position, the floating prevention member 34 (shown only in FIG. 1) moves downward and its pad 35 is moved. , 35,... Are prevented from floating from the printed circuit board 2 by lightly contacting the electronic components 3, 4, 5 from above, and the lead bending apparatus 1 is moved upward by a lifting means (not shown). Thereby, the upper ends of the lead bending members 10, 10, 11 and 12 are brought close to the printed circuit board 2, and the protrusions 15a, 15a,... Of the lead bending portions 15, 15 of the lead bending members 10, 10 are connected to the leads of the IC3. 3a, 3a, ..., both ends of the lead bending portion 16 of the lead bending member 11 are connected to the leads 4a, 4a of the IF transformer 4, and
Projections 17a, 17a,... Of the lead bending portion 17 of the lead bending member 12
Are opposed to the leads 5a, 5a,... Of the semi-fixed capacitor 5 from the side.

Then, from this state, the piston rod 28 of the air cylinder 27 is projected, whereby the swing base 21 and the swing plate 32
Are rocked as described above, and the lead bending members 10, 10, 11
When the lead bending members 10, 10, 11, and 12 are rotated, as shown in FIG.
The projections 15a, 15a,... Of the 5, 15 are leads 3a, 3a,.
To bend it, and the lead bent portion 16 causes the leads 4a, 4a to project, and the protrusions 17a, 17a,.
Presses each of the leads 5a, 5a,... To bend them.

.., The leads 4a, 4a of the IF transformer 4 and the leads 5a, 5a,... Of the semi-fixed capacitor 5 are all bent at the same time.

When the lead is bent in this way,
The lead bending device 1 is lowered and then the piston rod
28 is pulled back, and the swing base 21, the swing plate 32 and the lead bending members 10, 10, 11 and 12 are returned to their original positions,
Another printed circuit board 2 is transferred to the lead bending position,
The bending of the leads for the printed circuit board 2 is performed as described above.

(G. Effects of the Invention) As is clear from the above description, the lead bending apparatus of the present invention faces the lead protruding surface of the circuit board in a state where the leads of the electronic component are inserted into the lead insertion holes. Disposed, a support plate having a support hole corresponding to the lead, and provided opposite to the counter circuit board side surface of the support plate;
One swinging member which is configured to be rotatable in a plane parallel to the support plate and has an engagement hole formed at a position shifted by a predetermined distance from a position corresponding to the support hole formed in the support plate. Plate, one eccentric drive mechanism for rocking the rocking plate, and one end provided with a lead bending portion is rotatably inserted into the support hole of the support plate, and the other end has A shaft portion eccentric to the rotation axis of the lead bending portion is provided, and the shaft portion includes a lead bending member engaged with an engagement hole of the rocking plate,
The lead bending member rotates in response to the swing of the swing plate by the eccentric drive mechanism, and the lead protruding from the circuit board is bent by the lead bent portion.

Therefore, in the lead bending apparatus of the present invention, even if any number of lead bending members are supported by the support plate, all of the lead bending members can be simultaneously rotated by one rocking plate, so that a plurality of electronic bending members can be used. The leads of the components can be bent at the same time, and the leads are bent by the lead bending part that rotates in a plane parallel to the lead projecting surface of the circuit board. Regardless of the arrangement direction of the leads, whether in the circumferential direction or in the circumferential direction, the leads can be bent, and furthermore, the lead bending member only rotates about the axis of the lead bending portion as the center of rotation. No space is required for moving the lead bending member at all, and therefore the lead bending member can be provided even when the arrangement interval of the electronic components on the circuit board is quite narrow.

According to the lead bending apparatus of the present invention, even a lead of an electronic component which is manually mounted on a circuit board can be mechanically and simultaneously bent in large numbers, and can be mounted by an automatic insertion machine. The range of simple electronic components can be expanded.

In the above-described embodiment, the support plate and the swinging plate are made exchangeable with respect to the base portion of the apparatus. Can correspond to various circuit boards having different.

Further, the structure of the circuit board and the shape of the lead bending portion of the lead bending member shown in the examples are merely examples when the present invention is implemented, and the lead bending device of the present invention is used to form the lead. The types of electronic components that can be bent and the structure of the lead bending member are not limited to those described in the embodiments.

[Brief description of the drawings]

1 is a plan view showing an initial state, FIG. 2 is a sectional view taken along the line II-II of FIG. 1, and FIG. 3 is an exploded view. FIG. 4 is a plan view of a main part showing a state in which bending of the lead has been completed, and FIG. 5 is a perspective view showing an example of the circuit board. DESCRIPTION OF SYMBOLS 1 ... lead bending device, 2 ... circuit board, 2a ... lead protruding surface, 3,4,5 ... electronic component, 3a, 4a, 5a ... lead, 6,7,8 ... lead Insertion hole, 10, 11, 12: Lead bending member, 13c: Shaft, 15, 16, 17: Lead bending portion, 22: Eccentric drive mechanism, 30: Support plate, 30b, 30c, 30
d: Support hole, 32: Swing plate, 32b, 32c, 32d: Engagement hole

Continuing from the front page (72) Inventor Satoshi Masuda 8-4 Shiomi Kisarazu-shi, Chiba Prefecture Inside Sony Kisarazu Co., Ltd. References JP-A-61-238431 (JP, A) JP-A-61-266140 (JP, A) JP-A-61-57588 (JP, U)

Claims (1)

(57) [Claims] A support plate having a support hole in which a support hole corresponding to the lead is formed, wherein the support plate is provided so as to face a lead protruding surface of a circuit board in a state in which a lead of the electronic component is inserted into the lead insertion hole; A position provided opposite to the side of the circuit board opposite to the circuit board so as to be rotatable in a plane parallel to the support plate and at a predetermined distance from a position corresponding to a support hole formed in the support plate. A rocking plate having an engagement hole formed therein, one eccentric drive mechanism for rocking the rocking plate, and one end provided with a lead bending portion is turned to the support hole of the support plate. A lead bending member that is movably inserted and has a shaft portion eccentric to the rotation axis of the lead bending portion at the other end portion, the shaft portion being engaged with an engagement hole of the rocking plate. A lead bending member is rotated in accordance with the swing of the swing plate by the eccentric drive mechanism, and A lead protruding from a circuit board is bent by a lead bending portion of the lead bending device.