JPH0322417A - Manufacturing apparatus for semiconductor device - Google Patents

Abstract

PURPOSE:To improve the temperature uniformity of a semiconductor substrate by turning a cylindrical core tube, the inside of which has a semiconductor- substrate supporter fixing mechanism, to an external heater. CONSTITUTION:A production device has a rotatable core tube 5, one side of which has a gas introducing section 6 and the reverse side of which is formed in an opening section, external heaters 3 fixed so as to surround the periphery of the core tube 5, a motor 4 and mechanisms 10 rotating the core tube by using driving force from the motor 4, and a fixing mechanism 1 is fastened onto the inwall of the tube 5 and a supporter 2 for semiconductor substrates 9 is fastened to the mechanism 1 through hanging and fixing. In the device, the semiconductor-substrate supporter 2 is fixed to a fixing device 1 in the tube and heated by the external heaters 3, and a reciprocating rotary motion is conducted to the tube 5 only at an angle A by using the rotary mechanisms 10 by the rotational driving force of the driving motor 4. Accordingly, temperature uniformity on the semiconductor substrates is improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor integrated circuit manufacturing apparatus, and particularly to a cylindrical furnace tube having a gas introduction section and an open section, and a cylindrical furnace tube that is heated from the outside. The present invention relates to a heat treatment apparatus for semiconductor substrates having an external heater.

[Conventional technology]

Conventionally, this type of heat treatment equipment has been used in the oxidation and diffusion processes of semiconductor substrates. For example, in heat treatment equipment used for forming oxide films, a cylindrical furnace core tube is fixed and a semiconductor substrate support is attached to the heat treatment equipment. The semiconductor substrate was heated by an external heater placed inside the furnace core tube from outside, and at the same time gas was introduced to form an oxide film.

[Problem to be solved by the invention]

However, in the conventional apparatus, the temperature uniformity of the semiconductor substrate is poor due to variations in the output of the external heater, which causes non-uniform formation of an oxide film grown on the semiconductor substrate and non-uniform diffusion.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a heat treatment apparatus with good temperature uniformity of a semiconductor substrate.

[Means to solve the problem]

The semiconductor integrated circuit manufacturing apparatus of the present invention has a cylindrical furnace core tube having a semiconductor substrate support fixing mechanism therein, and a drive mechanism for rotating the cylindrical furnace core tube with respect to an external heater. Example] Next, the present invention will be explained with reference to the drawings. Referring to FIGS. 1 and 2, a heat treatment apparatus according to an embodiment of the present invention has a gas introduction section 6 on one side (the right end of the drawing) and the opposite side (the right end of the drawing).
The one on the left side of the figure uses a rotatable furnace core tube 5 which is an open part, an external heater 3 fixedly arranged to surround the furnace core tube 5, a motor 4, and the driving force from the motor 4. A fixing mechanism 1 is fixed to the inner wall of the furnace core tube 5, and a support 2 for a semiconductor substrate 9 is fixed thereto with a hook. This device fixes a semiconductor substrate support 2 to a fixing device 1 in a furnace core tube, heats it with an external heater 3, and uses a rotating mechanism 10 with the rotational driving force of a drive motor 49 to move a furnace core tube 5 as shown in FIG. A reciprocating rotational motion is performed by an angle A shown in .

This improves temperature uniformity on the semiconductor substrate. The support body 2 has a dish-shaped accommodating portion having such a depth that the semiconductor substrate 9 does not fall when rotated by an angle A.

Referring to FIGS. 3 and 4, another embodiment of the present invention is different from the embodiment shown in FIG.
The difference is that fins 7 for stirring the gas introduced from the substrate are attached, and that the semiconductor substrate support 8 has a structure that surrounds the entire periphery of the semiconductor substrate 9. In this embodiment, the furnace core tube 5 can be rotated by 360 degrees, which, together with the presence of the fins 7, can improve the circulation of the introduced gas and keep the gas concentration in the tube uniform. The temperature uniformity above is also improved.

〔Effect of the invention〕

As explained above, the present invention has the effect of making the temperature on the semiconductor substrate uniform by rotating the furnace core tube. Furthermore, the rotational movement makes the gas concentration in the furnace uniform, and in addition, new gas constantly comes into contact with the semiconductor substrate surface. These effects have the effect of, for example, promoting uniform formation of the oxide film on the semiconductor substrate.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal cross-sectional view of one embodiment of the present invention, FIG. 2 is a cross-sectional view thereof, FIG. 3 is a longitudinal cross-sectional view of another embodiment of the present invention, and FIG.
The figure is a cross-sectional view thereof. 1... Semiconductor substrate support fixing mechanism, 2, 8... Semiconductor substrate support, 3... External heater, 4. Drive motor, 5... Cylindrical furnace core tube, 6... Gas introduction part, 7...
- Stirring fin, 9... semiconductor substrate, 10... rotating mechanism.

Claims (1)

[Claims] In a semiconductor device manufacturing apparatus equipped with a mechanism for heating a cylindrical furnace core tube having a gas introduction part and an open part with an external heater, a semiconductor support body housing a semiconductor substrate is placed inside the cylindrical furnace core tube. 1. An apparatus for manufacturing a semiconductor device, comprising: a mechanism for fixing the cylindrical furnace core tube to an external heater; and a mechanism for rotating the cylindrical furnace core tube relative to an external heater.