JPH03220556A - Method and device for inspecting and correcting original pattern plate - Google Patents

Abstract

PURPOSE:To allow the correction of the defect positions of an original plate to be detected by collation without errors when the positions are detected by forming punch holes positioned to the coordinates of a defect on a mask film to be superposed on the pattern original plate to be inspected and registering and superposing this mask film on the pattern original plate to be inspected. CONSTITUTION:The etching original plate 11 is subjected to the inspection of the presence or absence of defects of the patterns 12 thereof. The master film 15 is bored with the punch holes 16 in the defect coordinate positions in accordance with the detection data of the above-mentioned defect coordinates without expanding or contracting the coordinate systems and is bored with registration holes 17 in correspondence to the position reference marks 13 of the original plate 11. The only the defect parts of the patterns 12 on the original plate 11 are, therefore, exposed by the punch holes 16 when the film 15 is superposed on the original plate 11 and the position reference marks 13 and the registration holes 17 are registered. The conduction of a touch operation is, therefore, possible through the punch holes 16. The easy and sure correction of the defect parts without requiring the special collation operation is possible in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to a method and apparatus for inspecting pattern original plates such as etching original plates and printing original plates.

"Prior Art and its Problems" For example, in the case of a printed circuit board, after a photoresist film is applied thereto, an etching master having a conductive pattern is subjected to reduction exposure and then developed.

When this printed circuit board is etched, the remaining portion of the photoresist film is not etched, but the removed portion is etched to form a conductive pattern identical to that of the etching master.

The etching master plate used for this purpose is printed on a transparent film at a predetermined size and interval, and completely black (
The pattern must be free of defects such as light-shielding pinholes.

For this reason, etching master inspection devices have been developed. However, this conventional inspection device compares the pattern of the original plate to be inspected with the pattern of design data to detect the coordinates of the defective portion. For this reason, a complicated verification process is required in which the detected coordinates are compared with the corresponding portion of the original plate to be inspected, and if this verification is incorrect, a serious defect may occur in that the portion that should be corrected is not corrected by the retouching process.

``Object of the Invention'' Based on this awareness of the problem, the present invention has been developed to detect the defect position of the original plate to be inspected without making a mistake in the defect position.
The object of the present invention is to obtain an inspection method and an inspection device for an original plate to be inspected, which can be verified and corrected.

"Summary of the Invention" The method for inspecting a test pattern master of the present invention involves inspecting the test pattern master, detecting the coordinates of the defective part, and applying the defect coordinates to a mask film to be overlaid on the test pattern master. This mask film is positioned and punched to form a hole, the mask film is aligned and overlapped with the pattern original to be tested, and correction work is performed through the punch hole.

According to this method, since the part with the punch hole is the defective part, correction work can be easily and reliably performed through the punch hole without requiring any special verification work.

Furthermore, the method of the present invention can also be used by overlapping a mask film under the pattern original to be tested.

In this case, a defect index consisting of a hole or a mark is attached to the defect coordinate position instead of a punch hole, and the defect index is projected onto the pattern master to be tested by illumination from below. Correction work is added to the pattern located at .

When the defect indicators are comprised of holes, it is desirable that the mask film be comprised of an opaque material. When the defect index is composed of marks, the mask film can be made transparent and the marks can be colored in a specific color.

The device of the present invention also includes a mask film punching device for punching holes in a mask film, and an inspection and correction device including the same.

The punching device includes a defect coordinate detector that inspects a test pattern original having a predetermined pattern and detects the coordinates of a defective part in the pattern; and a defect coordinate detector that detects the coordinates of a defective part in the pattern; It is characterized by having a bunch hole puncher for punching holes on the coordinates.

In addition to the above-mentioned punch hole punching device, the inspection and correction device stores the test pattern original inspected by the defect coordinate detector and the mask film punched by the bunch hole punching device in an alternating manner. It is characterized by having a discharge stocker.

"Embodiments of the Invention" The present invention will be described below with reference to illustrated embodiments. FIG. 1 explains the method of the invention. On an etching master plate 11 made of a transparent film, black patterns 12 of a predetermined size are drawn at one interval. Also, at the periphery,
A position reference mark l3 is drawn.

This etching original plate 11 has defects (
The presence or absence of pattern abnormalities is inspected. Defects in the pattern 12 include size (width), spacing, local protrusions and recesses, pinholes, and the like. The defect positions of these patterns 12 are detected as abnormal coordinates with the position reference mark 13 as a reference. Such inspection devices are already known, and their specific mechanism does not matter.

A punch hole 16 is punched in the mask film 15 at the defect coordinate position based on the detection data of the defect coordinate by this inspection device without expanding or contracting the coordinate system, and also corresponds to the position reference mark 13 of the etching original plate 11. A positioning hole 17 is drilled therein.

Therefore, when the mask film 15 is placed on the etching original plate 11 and the position reference mark 13 and the alignment hole 17 are aligned, the pattern 12 on the etching original plate 11 will be
Only the defective portion is exposed by the punched hole 16. Therefore, the operator can perform retouching work through the punch holes 16. It is preferable that the punch hole 16 is not unnecessarily large in size as long as retouching work can be performed. For example, about 5a+mφ is sufficient. The mask film 15 may be made of an opaque film.

Furthermore, instead of the punch holes 16, a defect indicator consisting of a hole or a mark may be attached, and the mask film may be placed under the pattern original to be tested, and the defective pattern may be corrected by applying illumination from below. When the defect indicators are made of holes, the mask film is preferably made of an opaque material. Further, when the defect index is composed of marks, the mask film will be made transparent and the marks will be explained in a specific light color. FIG. 2 shows the entire apparatus according to the invention. This device is designed to create a mask film 15 as shown in FIG. It has a device 30 (optical inspection device) 30, a discharge stocker 40, a film supply and discharge mechanism 50, and a punch hole punching device (mask film making device) 60.

The supply stocker 20 stores the etching original plates 11 in a stacked state. The film supply/discharge mechanism 50 supplies the etching masters 11 stacked on the supply stocker 20 onto the defect coordinate detector 30 and discharges the etching masters 11 that have been inspected by the defect coordinate detector 30 to the discharge stocker 40. It is something.

This film supply and discharge mechanism 50 has a lifting shaft 51,
A rotating arm 52 is provided at the upper end of this lifting shaft 51. A vacuum suction device 53 for suctioning and releasing the etching original plate 11 is provided at the tip of the rotating arm 52. This film supply/discharge mechanism 50 can give the vacuum suction device 53 vertical movement and rotational movement by means of a lifting shaft 51 and a rotating arm 52. By synchronizing the stops, it is possible to supply the etching original 11 from the supply stocker 20 to the defect coordinate detector 30 and to discharge the etching original 11 from the defect coordinate detector 30 to the discharge stocker 40.

The defect coordinate detector 30 divides the pattern of the etching master 11 into two orthogonal directions, the feed direction F and the scan direction S, and inspects the pattern. This defect coordinate detector 30 itself is already known.

FIG. 3 shows the principle. A pattern on the etching original plate 11 illuminated by an illumination device (not shown) is incident on a CCD line sensor 31 arranged in the scanning direction S. CCD line sensor 31 and etching original plate 1
1, relative feed in the feed direction F is given at constant time intervals.

The output signal of this CCD line sensor 31 is given to a control amplifier 32. The control amplifier 32 simultaneously has a CC
An output signal from a feed drive system 33 that provides relative feed in the feed direction F between the D line sensor 31 and the etching master 11 is also provided. The control amplifier 32 receives the inspection signal (
O1l signal) a, a pixel clock signal p based on the output of the CCD line sensor 31 and the feed drive system 33, and a scan reset signal r.

After the test signal a is corrected by the illuminance correction circuit 34 that corrects uneven illuminance, it is input to the two-dimensional filter determiner 35A and the comparison determiner 35B. The two-dimensional filter determiner 35A selects 0 out of the output of the CCD line sensor 31.
, the abnormal two-dimensional output included in the l signal is determined to be a pattern abnormality (defect). The comparison/determination unit 35B compares the design data and the output of the CCD line sensor 31, and determines a mismatched portion as a pattern abnormality (defect). Both abnormal signals are input to the memory 38 via the counter 37 by the OR circuit 36.

On the other hand, the pixel clock signal p and the scan reset signal r are input to the scan coordinate counter 39S and the feed coordinate counter 39F, respectively, and the inspection coordinates of the CCD line sensor 31 detected by these are input to the memory 38 every moment. The scan reset signal r is reset every time the feed position changes. The pixel clock signal p is a clock corresponding to each element of the CCD line sensor 31. When a pattern abnormality signal is output from the OR circuit 36, a write pulse is input to the mesh 38 in response to the signal, and as a result, the coordinates where the pattern abnormality occurs are written. In this way, when there is a pattern abnormality in the pattern 12 of the etching master 11, the coordinates in the feed direction F and scan direction S are written into the memory 38. Inspections in all directions F and scan direction S are performed continuously.

The bunch hole puncher 60 uses the pattern 12 of the etching master 11 stored in the memory 38 of the defect coordinate detector 30.
Based on the abnormal pattern coordinates, punch holes 16 can be punched at corresponding coordinates on the mask film 15. In FIG. 4, the long roll film 15R wound around the roll 59 is sent in the feed direction F by a pair of feed rolls 61 and 62. This long roll film 15R
A guide bar 63 and a feed screw 64 are disposed on the feed plane parallel to the scan direction S perpendicular to the feed direction F, and the guide bar 63 is movably fitted onto the guide bar 63 and screwed onto the feed screw 64. A puncher 65 is supported. The feed screw 64 is rotationally driven by a motor 66, and when the feed screw 64 rotates, the puncher 65 moves in the Kaskian direction S direction. A cutter 67 is further provided on the downstream side of the puncher 65.

The feed roll 61 is rotationally driven by a motor 68,
The rotational position, ie, the feeding position of the long roll film 15R in the feed direction F, is detected by the encoder 69. A drive signal is applied to the motor 68 via a comparator 70.

The output of the encoder 69 and a speed instruction signal are given to the comparator 70, and this feedback system causes the motor 68 (feed roll 61) to rotate at the specified speed and feed the long roll film 15R in a predetermined feed direction F. is given.

On the other hand, the output signal of encoder 69 is input to comparator 72 via counter 71 . The comparator 72 includes the memory 3
Among the pattern abnormal coordinates stored in 8, a feed coordinate signal f is input at the same time, and this feed coordinate signal f and
When the feed position of the long roll film 15R by the encoder 69 matches, a drive signal is output to the control circuit 73. Of the pattern abnormality signals stored in the mesori 38, the scan coordinate signal S is also input to the control circuit 73 at the same time. Based on the scan coordinate signal S, the control circuit 73 moves the puncher 65 to the abnormal coordinate position in the scan direction S via the motor 66. The control circuit 73 issues a punching signal to the puncher 65 on the condition that the puncher 65 has moved to an abnormal coordinate position in the scan direction S based on the scan coordinate signal S and that a coincidence signal has been input from the comparator 72. . Therefore, punch holes 16 are punched on the long roll film 15R at the abnormal pattern coordinate positions of the pattern 12 detected by the defect coordinate detector 30. Of course, alignment holes 176 are punched on the long roll film 15R at the same positions as the position reference marks 13 of the etching original plate 11.

After punching holes 16 at the coordinate positions of all pattern abnormalities in this way, the control circuit 73 causes the cutter 6 to
Output the cut signal of the long roll film 15R to 7,
Cut out the mask film 15.

This mask film 15 is discharged into the discharge stocker 40. This mask film 1 is placed in the discharge stocker 40.
Prior to the discharge of step 5, the film supply and discharge mechanism 50
The etching original plate 11 that has been inspected by the defect coordinate detector 30 is being discharged. Therefore, the etching original plate 11 that has been inspected and the mask film 15 that has been prepared based on the inspection results are stored in an overlapping manner. During the punching operation by the punch hole puncher 60, the next etching original plate 11 can be inspected by the defect coordinate detector 30, and during the inspection by the defect coordinate detector 30, the etching original plate that has been inspected can be 5, the etching original plate 11 and the mask film 1, which are shown with diagonal lines, are stored in the discharge stocker 40, as shown in FIG.
5 can be stacked and stored alternately. Therefore,
It is extremely easy to take these out and stack them as shown in Figure 1 for correction work.

In the embodiment described above, the long roll film 15R wound around the roll 59 is fed in the feed direction F, and the puncher 65 is driven on the long roll film 15R in the scan direction S perpendicular to the feed direction F. However, the puncher 65 is placed on the mask film 15 cut into a predetermined size in advance in the feed direction F.
It may also be driven in the scanning direction S direction.

"Effects of the Invention" As described above, according to the method of the present invention described in claims 1 and 2, when the mask film is superimposed on the test pattern original,
Since the punch holes or defect indicators in the mask film overlap the defective portions in the pattern and indicate their positions, correction work can be performed through the punch holes or defect indicators. Therefore, there is no need for the complicated verification work of comparing the detected defect coordinates with the corresponding portion of the original plate to be inspected, as in the past, and it is possible to significantly improve work efficiency.

According to the apparatus described in claim 2, the mask film used in the method of the present invention can be easily produced.

According to the apparatus according to the third aspect, the created mask film can be stored in a state overlapping the target pattern original plate.

[Brief explanation of drawings]

Fig. 1 is a perspective view explaining the method of the present invention, Fig. 2 is a perspective view showing the entire device according to the invention, Fig. 3 is a system connection diagram showing the principle of the defect coordinate detector, and Fig. 4 is a punch hole diagram. FIG. 5 is a system connection diagram showing an embodiment of the perforator, and FIG. 5 is a perspective view showing a state in which an etching original plate and a mask film according to the present invention are stacked and stored. 11... Etching original plate, 12... Pattern, 13
...Position reference mark, 15...Mask film, 1
6... Punch hole (defect index), 17... Positioning hole. 20... Supply stocker, 30... Defect coordinate detector. 31... CCD line sensor, 32... Control amplifier. 33... Feed drive system, 35A... Two-dimensional filter judge, 35B... Comparison judge, 39S... Scan coordinate counter, 39F... Feed coordinate counter, 40... Discharge stocker, 50 ...Film supply and discharge mechanism, 60...Bunch hole puncher, 61.62...
Feed roll, 63... Guide bar 64... Feed screw, 65... Puncher, 66.68... Motor,
67...Cutter, 69...Encoder, 70...
Comparator, 71...Counter, 72...Comparator, 73...Control circuit, F...Feed direction, S...
・Scan direction, f...Feed coordinate signal, S...
Scan coordinate signal.

Claims (4)

[Claims] (1) Inspect the test pattern master having a predetermined pattern, detect the coordinates of the defective part in the pattern, and place the mask film to be overlaid on the test pattern master,
A method for inspecting and correcting a pattern original, which comprises forming a punch hole located at the defect coordinates, aligning and overlapping the mask film on the pattern original to be inspected, and performing correction work through the punch hole. (2) Inspect the test pattern master having a predetermined pattern, detect the coordinates of the defective part in the pattern, and place the mask film to be overlaid on the test pattern master,
A defect indicator consisting of a hole or mark is placed at the defect coordinates, this mask film is aligned and overlapped under the original pattern to be inspected, and correction work is performed on the pattern located on this defect indicator. A method for inspecting and correcting a pattern original, characterized in that: (3) a defect coordinate detector that inspects a pattern master having a predetermined pattern to detect the coordinates of a defective part in the pattern; based on the defect coordinates detected by the defect coordinate detector, the corresponding coordinates on the mask film are detected; 1. A punching device for a mask film for pattern original correction, comprising a punch hole puncher for punching holes thereon. (4) A defect coordinate detector that inspects a pattern master having a predetermined pattern to detect the coordinates of a defective part in the pattern; Based on the defect coordinates detected by this defect coordinate detector, the corresponding coordinates on the mask film are detected; a punch hole puncher for punching holes on top; the test pattern original inspected by the defect coordinate detector and the mask film punched by the punch hole puncher are stacked alternately; An apparatus for inspecting and correcting pattern originals, comprising a discharge stocker for storing pattern originals.