JPH0321871U - - Google Patents
Info
- Publication number
- JPH0321871U JPH0321871U JP8235689U JP8235689U JPH0321871U JP H0321871 U JPH0321871 U JP H0321871U JP 8235689 U JP8235689 U JP 8235689U JP 8235689 U JP8235689 U JP 8235689U JP H0321871 U JPH0321871 U JP H0321871U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- circuit pattern
- lead
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8235689U JPH0321871U (el) | 1989-07-13 | 1989-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8235689U JPH0321871U (el) | 1989-07-13 | 1989-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0321871U true JPH0321871U (el) | 1991-03-05 |
Family
ID=31629093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8235689U Pending JPH0321871U (el) | 1989-07-13 | 1989-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0321871U (el) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006190799A (ja) * | 2005-01-06 | 2006-07-20 | Sony Chem Corp | 電気部品付き基板の製造方法 |
-
1989
- 1989-07-13 JP JP8235689U patent/JPH0321871U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006190799A (ja) * | 2005-01-06 | 2006-07-20 | Sony Chem Corp | 電気部品付き基板の製造方法 |