JPH03217071A - Firing method for thick-film circuit - Google Patents
Firing method for thick-film circuitInfo
- Publication number
- JPH03217071A JPH03217071A JP2012031A JP1203190A JPH03217071A JP H03217071 A JPH03217071 A JP H03217071A JP 2012031 A JP2012031 A JP 2012031A JP 1203190 A JP1203190 A JP 1203190A JP H03217071 A JPH03217071 A JP H03217071A
- Authority
- JP
- Japan
- Prior art keywords
- belt
- thick
- firing
- printed
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010304 firing Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000007639 printing Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 42
- 239000000956 alloy Substances 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 230000002787 reinforcement Effects 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 230000037351 starvation Effects 0.000 description 1
Landscapes
- Tunnel Furnaces (AREA)
- Furnace Charging Or Discharging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は厚膜回路の焼成方法に関するものであり、特
に、厚膜回路基板の焼成能率を向上し、大量生産を可能
とした厚膜回路の焼成方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a method for firing thick film circuits, and in particular, to a method for firing thick film circuit boards, which improves the firing efficiency of thick film circuit boards and enables mass production. This relates to a firing method.
［従来の技術］ 従来此種厚膜回路の焼成方法を別紙添付図面のー１ 第６図及び第７図に従って説明する。[Conventional technology] The conventional firing method for this type of thick film circuit is shown in the attached drawing -1. This will be explained according to FIGS. 6 and 7.
図に於て、（１）は焼成機であり、炉（２）内をベルト
（３）が貫通して設けられている。該ベルト（３）はモ
ータ（図示せず）により駆動するように構成されている
。そして、該ベルト（３）の上面には基板（４）（４）
・・・が載置される。該基板（４Ｘ４）・・・には厚膜
印刷により配線パターンや電極、ボンデイング或は抵抗
素子用等のペーストが塗布されている。又、該基板（４
）（４）・・・は前記ベルト（３）上の巾方向に該ベル
ト面に基板（４）（／Ｉ）・・・を平行にして順次載置
される。そして、ベルト（３）を駆動し、基板（４）（
４）・・・を炉（２）内に通過させることにより焼成し
て厚膜回路基板を製造する。In the figure, (1) is a baking machine, and a belt (3) is provided to pass through the inside of a furnace (2). The belt (3) is configured to be driven by a motor (not shown). On the top surface of the belt (3) are substrates (4) (4).
... will be placed. Pastes for wiring patterns, electrodes, bonding, resistive elements, etc. are applied to the substrate (4×4) by thick film printing. Moreover, the substrate (4
)(4)... are sequentially placed on the belt (3) in the width direction with the substrates (4) (/I)... parallel to the belt surface. Then, the belt (3) is driven, and the substrate (4) (
4)... is baked by passing it through the furnace (2) to produce a thick film circuit board.
［発明が解決しようとする課題］
上述した従来の厚膜回路の焼成方法は、基板をベルト面
と平行にして載置していたので、該ベルト上面に載置で
きる基板の数は極めて少なく、該基板の焼成工程に多大
な時間を要し、大量生産に支障を来たしていた。[Problems to be Solved by the Invention] In the conventional thick film circuit firing method described above, the substrates are placed parallel to the belt surface, so the number of substrates that can be placed on the top surface of the belt is extremely small. The firing process of the substrate takes a lot of time, which poses a problem in mass production.
そこで、ベルト上に載置できる基板の数を増大し、生産
性を向上するために解決せられるべき技２
術的課題が生じてくるのであり、本発明は該課題を解決
することを目的とする。Therefore, a technical problem arises that must be solved in order to increase the number of substrates that can be placed on the belt and improve productivity.The present invention aims to solve this problem. do.
［課題を解決するための手段］
この発明は、上記目的を達成するために提案せられたも
のであり、厚膜印刷を施した基板を焼成炉内を通過する
ベルト上に載置して該基板の厚膜印刷を焼成するように
した厚膜回路の焼成方法に於て、前記基板は治具を用い
て前記ベルト走行方向に平行、且つ、所定の間隔を有し
て多数枚立設並置され、該基板を前記焼成炉内を通過せ
しめることにより該基板に施した厚膜印刷を焼成するよ
うにしたことを特徴とする厚膜回路の焼成方法を提供せ
んとするものである。[Means for Solving the Problems] The present invention has been proposed to achieve the above object, and is based on a method in which a thick-film printed substrate is placed on a belt passing through a firing furnace. In a method for firing a thick film circuit in which a thick film printed on a substrate is fired, a large number of the substrates are vertically arranged in parallel to the belt running direction and at predetermined intervals using a jig. It is an object of the present invention to provide a method for firing a thick film circuit, characterized in that the thick film printing applied to the substrate is fired by passing the substrate through the firing furnace.
［作用］
この発明は、焼成機のベルト上に治具を用いて多数の基
板を立設して載置するので、該ベルト１−に載置できる
基板の数を著しく増大することができる。[Function] Since the present invention uses a jig to erect and place a large number of substrates on the belt of a baking machine, the number of substrates that can be placed on the belt 1- can be significantly increased.
従って、基板の焼成能率を向」ニシて厚膜回路基板の大
量生産を促進することができる。Therefore, the baking efficiency of the substrate can be improved and mass production of thick film circuit boards can be promoted.
［実施例］
以下、この発明の一実施例を別紙添付図面の第１図及び
第５図に従って詳述する。[Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1 and 5 of the attached drawings.
図に於て、（１０）は焼成機であり、第１図に示すよう
に、炉θ１）内にベル｝ ０２を貫通して設けられて（
Ｘる。該ベルト（ｌ■はモータ（図示せず）により駆動
するように構成されている。該ベルトθつの上面には基
板（１■（１■・・・が載置され、該ベルト（＋２１の
駆動に伴って基板θ■（ｌ■・・・を前記炉Ｑ ＋）内
を通過させて焼成するように構成している。該基板（１
■（１■・・・には銀パラジウム（電極、配線用）、金
（ボンデイング用）、酸化ルテニウム（抵抗素子用）等
のペーストが厚膜印刷により塗布されており、前述した
焼成により厚膜回路基板が製造される。該基板（１■θ
→・・・は、第２図及び第３図に示すようにベルト上面
に治具（ｌ４）を用いて立設して載置される。In the figure, (10) is a firing machine, and as shown in FIG.
X Ru. The belt (l) is configured to be driven by a motor (not shown). On the top surface of the belt θ, a board (1) (1)... is placed, and the belt (+21) is driven The structure is such that the substrate θ■(l■...) is passed through the furnace Q + and fired.
■(1■...) is coated with pastes such as silver palladium (for electrodes and wiring), gold (for bonding), ruthenium oxide (for resistive elements), etc., by thick film printing, and the above-mentioned baking process produces a thick film. A circuit board is manufactured.The board (1■θ
→... are placed upright on the upper surface of the belt using a jig (14) as shown in FIGS. 2 and 3.
該治具（１４）は熱容量が低く、耐熱性の高いＨＡ２１
４合金にて形成されている。又、該治具（ｋ１）は板状
の２本のフレーム（１５ｉ）（１’９を立設し、該フレ
ーム（＋！９（＋５９の−Ｌ縁部に溝（＋６１（＋６）
・・・及び（ｒ７）（φ・・・が対峙して刻設されてい
る。溝（＋６）よりも（のはやや深く形成される。該溝
（ｒ７）（ｒ７）・・・は一定の間隔を有して設けられ
、溝（Ｉｌｌ）（Ｉ［９・・・は５ ｍ／ｍＰｃｈ程度
で設けられている。そして、前記治具（Ｓ４）は前記フ
レームθ５）（＋’ｌｉ）に補強プレー１（ｌｅ・・・
を架設して井桁状に形成される。即ち、補強プレート（
ト）の両側に溝（１８ａＨＩ８ａ）を刻設し、該溝（１
８ａ） （１８ａ）を対峙するフレーム（＋５ｉ）（ｔ
！；）の溝（ｒ７）（Ｉηに係合させ、該補強プレート
（時の両側をカシメてフレーム（！つ（＋５９に固定す
る。The jig (14) is made of HA21, which has low heat capacity and high heat resistance.
4 alloy. In addition, the jig (k1) has two plate-shaped frames (15i) (1'9) erected, and a groove (+61 (+6)
... and (r7) (φ... are carved facing each other. The () is formed slightly deeper than the groove (+6). The groove (r7) (r7)... is constant. The grooves (Ill) (I[9... are provided at a spacing of about 5 m/mPch. The jig (S4) is provided with an interval of about 5 m/mPch. Reinforcement play 1 (le...
It is constructed in the form of a parallel grid. That is, the reinforcing plate (
Grooves (18aHI8a) are carved on both sides of the groove (18aHI8a).
8a) Frame (+5i) (t
! Engage with the groove (r7) (Iη) of the reinforcing plate () and fix it to the frame (! (+59) by caulking both sides of the reinforcing plate ().
斯くして、井桁状に形成された治具Ｈの対峙する溝（＋
６）（１０， （１６Ｘｌ６），・・・に前記基板（１
釈ｌ傍・・・の両側縁部を嵌入して立設する。そして、
基板（１■θ■・・・を立設した治具（１４）を前記ベ
ルト上に載置する。このときは、基板（１■（ｌ→・・
・がベルト（１乃の進行方向或は炉（１１）の前後（第
１図中左右）方向に沿って立設され、且つ、ベルト（１
ネの中方向に並設される。In this way, the opposing grooves (+
6) The substrate (10, (16Xl6), ...)
Insert the edges on both sides and set it upright. and,
A jig (14) with a substrate (1■θ■...
・ is erected along the traveling direction of the belt (1) or the front and rear (left and right in FIG. 1) direction of the furnace (11), and
They are placed side by side in the middle direction.
又、第４図に示すように、基板（１１９（１■・・・を
焼成する前工程の厚膜印刷を終了した後、前記基板（Ｉ
１（１つ・・・はマガジン（＋９）に収容される。該マ
ガジン（＋９）の両側壁内側には溝（イ）（イ）・・・
が対峙して刻設されており、５
該溝（イ）（イ）．ｂｒｈｃ飢・・・に基板（１罎０■
・・・の両側縁部を挿入して収容される。このマガジン
（１ツの開口部に前記治具（ゆを嵌入できるように構成
し、マガジン（！ウの溝（２１（イ）・・・のピツチと
治具（ｋｌ）の溝（１６）（１６）・・・ノヒツチを同
一に形成すれば、該マガジン（０）の開口部に嵌入する
ことにより、該治具Ｈの満（＋０００， （＋ＯＯ＠．
・・・に多数の基板（ｌ■（１■・・・を同時、且つ、
容易に挿入することができる。そして、該マガジン（ｌ
９）を治具（１／ｌ）を挿入した開口部を下方にして前
記ベルト０■上に載置し、マガジン（＋’ｌ）のみを取
り除けば、基板Ｏ■（１傍・・・はベルト（１２」：に
立設して載置される。従って、多数の基板θ■０■・・
・をベルト０■上に載置する作業が著しく簡素化し、作
業性及び生産性を向上することができる。Further, as shown in FIG. 4, after completing the thick film printing in the pre-process of firing the substrate (119
1 (one...) is accommodated in the magazine (+9). There are grooves (A) (A)... on the inside of both side walls of the magazine (+9).
are carved facing each other, and 5 grooves (A) (A). brhc starvation... board (1 box 0)
It is accommodated by inserting both side edges of .... The opening of this magazine (1) is configured so that the jig (Y) can be inserted into the opening of the magazine (1), and the pitch of the groove (21 (a)...) of the magazine (!U) and the groove (16) of the jig (kl) ( 16)...If the nohitchi is formed in the same way, by fitting into the opening of the magazine (0), the jig H will be fully (+000, (+OO@.
...at the same time, and
Can be easily inserted. Then, the magazine (l
9) is placed on the belt 0■ with the opening into which the jig (1/l) was inserted facing downward, and if only the magazine (+'l) is removed, the board O■ (1 side...) is placed on the belt 0■. Belt (12"): Placed vertically on the belt. Therefore, a large number of substrates θ■0■...
The work of placing ・on the belt 0■ is significantly simplified, and workability and productivity can be improved.
然ル後、ベルト（１■を駆動し、該基板０■０■・・・
を移動して炉（１１）内を通過させれば多数の基板０■
θ■・・・を同時に焼成し、厚膜回路基板を製造する。After that, the belt (1) is driven and the board 0*0*...
If the substrate is moved and passed through the furnace (11), a large number of substrates 0■
θ■... are simultaneously fired to produce a thick film circuit board.
この焼成の際、第１図に示すように炉（１１）の入口か
ら出口方向（第１図中矢印Ｘ方向）にドライエアが流さ
れるが、前記基板（１■（１→が進行方向に沿って立設
さ６
れているため、該ドライエアの流れを妨げることはなく
、且つ、炉（１１）内の雰囲気を乱さずに基板（１■θ
■・・・を正しく焼成することができる。又、前記治具
（ゆは熱容量の少ない合金で形成されているので、該治
具Ｈが基板（ｌｉ（１■・・・より熱を吸収して焼成の
妨げとなることを防■１−．する。更に、該治具（１４
）は補強プレー１（Ｉｎ・・・をカシメて連結固定され
ているので、該補強プレート（四（ト）・・・やフレー
ム（１ツθつが熱により伸縮しても該伸縮を吸収して治
具（ｌ／０の変形を防止する。During this firing, as shown in Fig. 1, dry air is flowed from the inlet to the exit of the furnace (11) (in the direction of the arrow X in Fig. 1). Because it is installed vertically, the flow of the dry air is not obstructed and the atmosphere inside the furnace (11) is not disturbed.
■... can be fired correctly. In addition, since the jig H is made of an alloy with low heat capacity, the jig H is prevented from absorbing heat from the substrate (1) and interfering with firing. Furthermore, the jig (14
) is connected and fixed by caulking the reinforcing plate 1 (In...), so even if the reinforcing plate (4)... or the frame (1) expands and contracts due to heat, it will absorb the expansion and contraction. Jig (prevents deformation of l/0.
一方、前記炉０！）は第１図に示すように加熱部Ｇ２１
）と冷却部（ニ）とから構成され、該炉（１１）の入口
と出口及び、加熱部（２１）と冷却部（イ）の境界はエ
アカーテンで仕切られている。該冷却部Ｇ！のには管（
至）（ト）・・・が配設され、該管（至）（至）・・・
に水を注入して焼成された基板（１■（鋤・・・を冷却
できるように構成している。又、この冷却部は通常の物
よりも長く延設され、鉛直方向に並設された多数の基板
（ｌ■（１■・・・を所定の温度まで確実に冷却できる
ように構成している。On the other hand, the furnace 0! ) is the heating part G21 as shown in FIG.
) and a cooling section (d), and the inlet and outlet of the furnace (11) and the boundary between the heating section (21) and the cooling section (a) are partitioned by air curtains. The cooling part G! The tube (
To) (g)... is arranged, and the pipe (to) (to)...
The structure is such that it can cool the substrate (1) (plow... The structure is such that a large number of substrates (1) (1)... can be reliably cooled to a predetermined temperature.
又、第４図に示すように、前記加熱部Ｑ１）は進行方向
を複数のゾーン（２）（ロ）・・・に分割し、夫々のゾ
ーン（２ＩＯ（ト））・・・を個々に制御して温度調整
を可能としている。このゾーン（ロ）は両側壁と、上面
及び下面とのヒータ（ハ）（ハ）・・・及び（４）（ハ
）・・・の方向を異にして０る。Further, as shown in FIG. 4, the heating section Q1) divides the advancing direction into a plurality of zones (2) (B)... and each zone (2IO (G))... is individually heated. It is possible to control and adjust the temperature. In this zone (B), the heaters (C), (C), . . . and (4), (C), . . . on both side walls and the upper and lower surfaces are arranged in different directions.
両側面のヒータ（５）（ハ）・・・は進行方向に沿った
姿勢で固定され且つ上下に並設されている。上下面のヒ
ータ（２６）（イ）は巾方向に沿った姿勢で固定され、
前後に並設されている。従って、両側面の夫々のヒータ
（ハ）（ハ）・・・を個々に制御することにより、各ゾ
ーン（ロ）（２）・・・の上下方向の温度調節が可能と
なるので前記基板０傍θ■・・・を立設して焼成しても
各基板面に均等に熱を与えることがてき厚膜回路の品質
を向上する。一方、上下面のヒータ（イ）（４）・・・
を制御することにより各ゾーン（２）勉）・・・内の進
行方向（前後方向）の温度調節が可能となる。又、上面
のヒータＧ！６）（４）・・・と下面ヒータ（４）（４
）・・・とは別個に制御できるように構成されている。The heaters (5) (c) on both sides are fixed in a posture along the traveling direction and are arranged vertically in parallel. The heaters (26) (a) on the upper and lower surfaces are fixed in a posture along the width direction,
They are arranged in front and behind each other. Therefore, by individually controlling the respective heaters (c), (c), etc. on both sides, it is possible to adjust the temperature in the vertical direction of each zone (b), (2), etc. Even if the substrates are erected and fired, heat can be applied evenly to each substrate surface, improving the quality of thick film circuits. On the other hand, the heaters (A) (4) on the upper and lower surfaces...
By controlling the temperature in each zone (2), it becomes possible to adjust the temperature in the direction of movement (back and forth direction). Also, the heater G on the top! 6) (4)... and the bottom heater (4) (4
)... are configured so that they can be controlled separately.
［発明の効果］
この発明は、基板を移動するベルト上に多数の基板を立
設して焼成するので、該ベルト」―に載置する基板の量
を著しく増大することができる。[Effects of the Invention] Since the present invention fires a large number of substrates by standing them on a belt that moves the substrates, it is possible to significantly increase the amount of substrates that can be placed on the belt.
従って、該基板を焼成する単位時間あたりの数を増大し
、大量生産を可能として生産性の向−ヒに寄与できる。Therefore, the number of substrates to be fired per unit time can be increased, making mass production possible and contributing to improved productivity.
第１図乃至第５図は本発明の一実施例を示し、第１図は
焼成機を示す解説図、第２図はベルト上に基板を載置し
た状態を示す平面図、第３図は治具に基板を立設した状
態を示す斜視図、第４図はマガジンに治具を嵌大した状
態を示す斜視図、第５図はヒータの配列を示す焼成機の
一部切欠斜視図、第６図及び第７図は従来方法を示し、
第６図は焼成機の解説図、第７図はベルト上に基板を載
置した状態を示す平面図である。1 to 5 show an embodiment of the present invention, FIG. 1 is an explanatory view showing a baking machine, FIG. 2 is a plan view showing a state in which a substrate is placed on a belt, and FIG. 3 is an explanatory view showing a baking machine. FIG. 4 is a perspective view showing the state in which the substrate is set up on the jig; FIG. 4 is a perspective view showing the state in which the jig is fitted into the magazine; FIG. 5 is a partially cutaway perspective view of the baking machine showing the heater arrangement; 6 and 7 show the conventional method,
FIG. 6 is an explanatory view of the baking machine, and FIG. 7 is a plan view showing a state in which a substrate is placed on a belt.
Claims (1)
に載置して該基板の厚膜印刷を焼成するようにした厚膜
回路の焼成方法に於て、前記基板は治具を用いて前記ベ
ルト走行方向に平行、且つ、所定の間隔を有して多数枚
立設並置され、該基板を前記焼成炉内を通過せしめるこ
とにより該基板に施した厚膜印刷を焼成するようにした
ことを特徴とする厚膜回路の焼成方法。In a thick film circuit firing method in which a thick film printed substrate is placed on a belt passing through a firing furnace and the thick film printed on the substrate is fired, the substrate is heated using a jig. A large number of substrates are arranged vertically parallel to the belt running direction and at predetermined intervals, and the thick film printing applied to the substrates is fired by passing the substrates through the firing furnace. A method for firing a thick film circuit, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012031A JPH03217071A (en) | 1990-01-22 | 1990-01-22 | Firing method for thick-film circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012031A JPH03217071A (en) | 1990-01-22 | 1990-01-22 | Firing method for thick-film circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03217071A true JPH03217071A (en) | 1991-09-24 |
Family
ID=11794239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012031A Pending JPH03217071A (en) | 1990-01-22 | 1990-01-22 | Firing method for thick-film circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03217071A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06265277A (en) * | 1993-03-15 | 1994-09-20 | Ngk Insulators Ltd | Baking implement for long molding |
| JPH06326447A (en) * | 1993-05-10 | 1994-11-25 | Tokyo Kakoki Kk | Drying device |
-
1990
- 1990-01-22 JP JP2012031A patent/JPH03217071A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06265277A (en) * | 1993-03-15 | 1994-09-20 | Ngk Insulators Ltd | Baking implement for long molding |
| JPH06326447A (en) * | 1993-05-10 | 1994-11-25 | Tokyo Kakoki Kk | Drying device |
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