JPH03215555A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPH03215555A JPH03215555A JP827890A JP827890A JPH03215555A JP H03215555 A JPH03215555 A JP H03215555A JP 827890 A JP827890 A JP 827890A JP 827890 A JP827890 A JP 827890A JP H03215555 A JPH03215555 A JP H03215555A
- Authority
- JP
- Japan
- Prior art keywords
- component
- resin
- copolymer
- impact resistance
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 13
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920001577 copolymer Polymers 0.000 claims abstract description 19
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 12
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 11
- 229920001519 homopolymer Polymers 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 20
- 229920005989 resin Polymers 0.000 abstract description 16
- 239000011347 resin Substances 0.000 abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 16
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 14
- 238000002156 mixing Methods 0.000 abstract description 13
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052901 montmorillonite Inorganic materials 0.000 abstract description 8
- 239000004793 Polystyrene Substances 0.000 abstract description 3
- 229920000578 graft copolymer Polymers 0.000 abstract description 3
- 229920002223 polystyrene Polymers 0.000 abstract description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract description 2
- VNSBYDPZHCQWNB-UHFFFAOYSA-N calcium;aluminum;dioxido(oxo)silane;sodium;hydrate Chemical compound O.[Na].[Al].[Ca+2].[O-][Si]([O-])=O VNSBYDPZHCQWNB-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000271 hectorite Inorganic materials 0.000 abstract description 2
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 abstract description 2
- 229910000273 nontronite Inorganic materials 0.000 abstract description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 2
- 239000002245 particle Substances 0.000 description 23
- 229920000642 polymer Polymers 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- -1 terephthalic acid Chemical class 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000004952 Polyamide Substances 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- 239000006185 dispersion Substances 0.000 description 8
- 229920002647 polyamide Polymers 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 239000008188 pellet Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000003607 modifier Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000002174 Styrene-butadiene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 229920006164 aromatic vinyl copolymer Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000011115 styrene butadiene Substances 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- ZDPHROOEEOARMN-UHFFFAOYSA-N undecanoic acid Chemical compound CCCCCCCCCCC(O)=O ZDPHROOEEOARMN-UHFFFAOYSA-N 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- WAEOXIOXMKNFLQ-UHFFFAOYSA-N 1-methyl-4-prop-2-enylbenzene Chemical group CC1=CC=C(CC=C)C=C1 WAEOXIOXMKNFLQ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- WCASXYBKJHWFMY-NSCUHMNNSA-N 2-Buten-1-ol Chemical compound C\C=C\CO WCASXYBKJHWFMY-NSCUHMNNSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- CRQSAKXMWFFXJG-UHFFFAOYSA-N 2-[(4-ethenylphenyl)methyl]oxirane Chemical compound C1=CC(C=C)=CC=C1CC1OC1 CRQSAKXMWFFXJG-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- YMOONIIMQBGTDU-UHFFFAOYSA-N 2-bromoethenylbenzene Chemical compound BrC=CC1=CC=CC=C1 YMOONIIMQBGTDU-UHFFFAOYSA-N 0.000 description 1
- MUUOUUYKIVSIAR-UHFFFAOYSA-N 2-but-3-enyloxirane Chemical compound C=CCCC1CO1 MUUOUUYKIVSIAR-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- JRKURGYOYLHRHT-UHFFFAOYSA-N 2-ethenyl-2,3-dimethyloxirane Chemical compound CC1OC1(C)C=C JRKURGYOYLHRHT-UHFFFAOYSA-N 0.000 description 1
- SZERAFCDZCHRQS-UHFFFAOYSA-N 2-ethenyl-3-methyloxirane Chemical compound CC1OC1C=C SZERAFCDZCHRQS-UHFFFAOYSA-N 0.000 description 1
- UBYWYEGPDNYPHZ-NSCUHMNNSA-N 2-hydroxyethyl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OCCO UBYWYEGPDNYPHZ-NSCUHMNNSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical class CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 1
- UWRZIZXBOLBCON-UHFFFAOYSA-N 2-phenylethenamine Chemical compound NC=CC1=CC=CC=C1 UWRZIZXBOLBCON-UHFFFAOYSA-N 0.000 description 1
- ZSPTYLOMNJNZNG-UHFFFAOYSA-N 3-Buten-1-ol Chemical compound OCCC=C ZSPTYLOMNJNZNG-UHFFFAOYSA-N 0.000 description 1
- CXJAFLQWMOMYOW-UHFFFAOYSA-N 3-chlorofuran-2,5-dione Chemical compound ClC1=CC(=O)OC1=O CXJAFLQWMOMYOW-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical class O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229920002633 Kraton (polymer) Polymers 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical class C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- WOLATMHLPFJRGC-UHFFFAOYSA-N furan-2,5-dione;styrene Chemical compound O=C1OC(=O)C=C1.C=CC1=CC=CC=C1 WOLATMHLPFJRGC-UHFFFAOYSA-N 0.000 description 1
- 229920001112 grafted polyolefin Polymers 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005394 methallyl group Chemical group 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229910052615 phyllosilicate Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000275 saponite Inorganic materials 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、成形性が優れており、その成形品は優れた耐
熱性、剛性、耐水性、表面性および耐衝撃性(面衝撃性
)を有している樹脂組成物に関する.
[従来の技術]
一般にポリアミド樹脂は、耐摩耗性、耐衝撃性、成形性
、耐薬品性および機械的強度などが優れているが、吸水
時に剛性が低下したり、寸法変化を起こすという問題が
ある。[Detailed Description of the Invention] [Industrial Application Field] The present invention has excellent moldability, and its molded products have excellent heat resistance, rigidity, water resistance, surface properties, and impact resistance (surface impact resistance). It relates to a resin composition having. [Prior Art] Polyamide resins generally have excellent abrasion resistance, impact resistance, moldability, chemical resistance, and mechanical strength, but they suffer from problems such as a decrease in rigidity and dimensional changes when water is absorbed. be.
吸水時に寸法変化を小さくし、吸水時の剛性の低下を改
良するために、ガラス繊維または無機フィラーを混合し
た材料が従来より用いられてきたが、これらの組成物は
、耐衝撃性(特に耐面衝撃性)や表面性に問題があるた
め、用途分野が限られていた。Materials mixed with glass fibers or inorganic fillers have traditionally been used to reduce dimensional changes when water is absorbed and to improve the decrease in rigidity when water is absorbed. The field of application has been limited due to problems with surface impact resistance) and surface properties.
そこで、最近2種ないしはそれ以上のポリマーを混合(
ボリマーアロイ)し、このような問題点を解決しようと
する試みがなされてきた。そして、ボリアミド樹脂の優
れた性質を保持しつつ、吸水による寸法、剛性変化の欠
点を改善した発明が提案されている。Recently, two or more types of polymers have been mixed (
Attempts have been made to solve these problems. An invention has been proposed that maintains the excellent properties of polyamide resin while improving the drawbacks of changes in dimensions and rigidity due to water absorption.
しかし、2種ないしはそれ以上のボリマーを混合して異
なった複数の優れた性能を樹脂に付与する場合、その2
種ないしはそれ以上のポリマー同士は当然ながら融点、
結晶性などの性質が異なり、お互いに混ざりにくいもの
同士であることが多い。従って、ポリマーアロイのアロ
イ化技{ホjは、いかに2種ないしはそれ以上のポリマ
ーを相溶化させ、理想的な分散形状・分敗粒径を取らせ
るかという点にポイントがある。However, when mixing two or more types of polymers to impart different and excellent properties to the resin, the two
Of course, the melting point of seeds or larger polymers is
They often have different properties such as crystallinity and are difficult to mix with each other. Therefore, the key point in alloying technology for polymer alloys is how to make two or more types of polymers compatible and obtain an ideal dispersion shape and particle size.
通常、非相湾型ポリマーアロイにおいては、海島横造を
取るのが好ましいとされており、海部となる71・リク
ス樹脂と、島部となるドメイン樹脂とからなり、この島
部の分散形状・分敢粒径が物性に大きな影響を与える。Normally, it is preferable to have a sea-island horizontal structure in non-phase bay type polymer alloys, which consists of 71-RIX resin that forms the sea area and domain resin that forms the island area, and the dispersed shape of the island area. The particle size has a great influence on physical properties.
この島部(ドメイン)の分数形状・分敗粒径に一ついて
は、組み合わせる樹脂によって、その適切な分散形状・
分敢粒径は異なるが、多くの特許に述べられているよう
に、平均粒径は1〜2 pm以下にすることが好ましい
。Regarding the fractional shape and particle size of these islands (domains), the appropriate dispersion shape and particle size depend on the resin to be combined.
Although the particle size may vary, it is preferred that the average particle size be 1 to 2 pm or less, as stated in many patents.
しかし、樹脂どうしの単なる混合で島部の平均粒径を1
〜2 pm以下にすることは難しい。そこで、樹脂どう
しの相溶性を向上させ、さらには混合方法を工夫するこ
とによって、平均粒径l〜2pm以下にてきる技f41
iがいくつか発表されている。However, by simply mixing resins, the average particle size of the islands can be reduced by 1
It is difficult to reduce the temperature to 2 pm or less. Therefore, by improving the compatibility of the resins and further devising the mixing method, it is possible to reduce the average particle size to less than 1 to 2 pm.
Several i have been announced.
また、島部の平均粒径の下限についても、理論的に{ま
最逼範囲をはずれる限界があるが、実際硯在の技術段階
では、ほとんどの樹脂の組み合わせにおいて、いかに島
部の平均粒径を小さくし、耐衝撃性などの物性や成形性
・耐衝撃性を向上させるかがポイントになっていると言
える。また形状についても、成形品としての変形等を防
止するためにも、なるべく球形に近づけたほうがよく、
また均一性についても、その平均粒径のバラツキが少な
く、特に平均粒径に対して極端に大きな粒子が存在しな
いことが大切である。In addition, there is a theoretical lower limit to the average particle size of the islands, which is beyond the maximum range, but in reality, at the current technological stage, for most combinations of resins, the average particle size of the islands can be It can be said that the key point is to reduce the size and improve physical properties such as impact resistance, moldability, and impact resistance. Regarding the shape, it is better to make it as close to a spherical shape as possible in order to prevent deformation of the molded product.
Regarding uniformity, it is important that there is little variation in the average particle size, and in particular that there are no particles that are extremely large compared to the average particle size.
ある特許では、アロイ化しようとするポリマーに親和性
のある官能基を導入したり、2種ないしはそれ以上のポ
リマーそれぞれに親和性を持った第3成分を相溶化剤ど
して用いて相溶性を向上させ、島部の分散を良くし、物
性を向上させるかが述べられている.
しかし、今までの方法では、島部の分散は十分でなく、
特に平均粒径としては、細かいものが作成できても、形
状や均一性の点でまだまだ十分でなく、目的とする物性
、特にボリアミドの吸水による欠点をカバーしつつ、熱
変形温度と耐衝撃性のバランスのとれた優れた性能を有
する材料又は材料を得るための技術はまだ開発されてい
なかった。In one patent, compatibility is achieved by introducing a functional group that has an affinity for the polymer to be alloyed, or by using a third component that has an affinity for each of two or more polymers as a compatibilizer. It is discussed how to improve the physical properties by improving the dispersion of the islands and improving the physical properties. However, with the existing methods, the dispersion of islands is not sufficient;
In particular, even if the average particle size is fine, it is still not sufficient in terms of shape and uniformity, and while covering the desired physical properties, especially the drawbacks due to water absorption of polyamide, it is necessary to improve the heat distortion temperature and impact resistance. Materials or techniques for obtaining materials with excellent, balanced performance have not yet been developed.
[発明が解決しようとする課題]
上記のとおり、従来のポリアミドの改質(ボリマーアロ
イ等)によって、成形性、耐熱性、剛性、耐水性、表面
性および耐衝撃性の全ての特性を,満足するものは開発
されておらず、かかる特性を同時に具備した材料の開発
が強く望まれているのが瑛状である。[Problems to be solved by the invention] As mentioned above, it is possible to satisfy all the properties of moldability, heat resistance, rigidity, water resistance, surface properties, and impact resistance by modifying conventional polyamides (bolymer alloy, etc.). No material has been developed yet, and there is a strong desire to develop a material that also has these properties.
本発明者らは、成形性、耐熱性、剛性、耐水性表面性の
優hだ樹脂を開発することを目的とし、鋭意研究を行な
った結果、ポリアミド樹脂と芳香族ビニル単独重合体ま
たは共重合体を配合することにより、その目的が達成さ
れることを見出し、本発明を完成した。The inventors of the present invention have conducted intensive research with the aim of developing a resin with excellent moldability, heat resistance, rigidity, water resistance, and surface properties. The present invention was completed by discovering that the objective can be achieved by blending the combination.
F課頭を解決するための千段〕
本発明の組成物は、2種ないしはそれ以上の樹脂の海島
構造のモルホロジーをベースとし、その島部の核となる
無櫻物との組み合わせからなる組成物に関するものであ
る。核となる無機物は、所望の島部の粒径にあわせた大
きさのものを選択し、島部とすべき樹脂に予め微細な状
態で分散させておき、海部となるべき樹脂と溶融混線又
はペレットブレンドし,組成物を作成する。または、海
部・島部を溶融混練する際に無機物を分散よ《同時に混
合して、組成物を作成する。場合によっては海部となる
べき樹脂に予め無機物を分散しておき、島部となるべき
tit脂と溶融混線又はペレットブレンドし、組成物を
作成する。本発明の組成物は、このような方法によって
得られたポリマーアロイにおける島邪の分散を改善し、
粒径を均一にまた形状を均一にし、さらに微細化した組
成物である。1,000 Steps to Solve Question F] The composition of the present invention is a composition based on the morphology of a sea-island structure of two or more resins, and a composition consisting of a combination of a solid material that forms the core of the island part. It is about things. The inorganic material that will serve as the core is selected to match the particle size of the desired island part, is dispersed in a fine state in advance in the resin that will become the island part, and is melted or mixed with the resin that will be the sea part. Blend the pellets and create a composition. Alternatively, when melting and kneading the sea and island parts, an inorganic substance is dispersed and mixed at the same time to create a composition. In some cases, an inorganic substance is previously dispersed in the resin that will form the sea area, and the resin is melt mixed or pellet blended with the tit fat that will form the island area to create a composition. The composition of the present invention improves the dispersion of Shimaya in the polymer alloy obtained by such a method,
It is a composition with uniform particle size and shape, and is further refined.
本発明において、(A)成分と(B)成分のどちらが、
島邪になってもよく、珪酸塩は(A)成分と(B)成分
のどちらか片方もしくは両方に含まれてよく、島部に存
在するものは、島部を微細にしかも均一にまた島部の剛
性、耐熱付を向上させ、海部に存在するものは、樹脂全
体の剛性 耐熱性を向上させるとともに、島部の分散に
もよい影響を与える。In the present invention, which of component (A) and component (B) is
The silicate may be contained in either or both of the components (A) and (B), and the silicate present in the island part may cause the island part to become fine and uniform. Those present in the sea area improve the rigidity and heat resistance of the entire resin, and also have a positive effect on the dispersion of the island areas.
具体的にその内容について説明する。The contents will be explained in detail.
本発明の組成物は(A)ポリアミド樹脂10〜90重量
%と、(B)芳香族ビニル単独重合体または共重合体9
0〜10重量%、ならびに(C)前記(A)8よび/ま
たは(B)成分中に層状珪酸塩を前記(A)および(B
)成分の合計量100重量部に対して0 05〜30重
量部を均一に分散させたものからなる樹脂組成物に関す
る。The composition of the present invention comprises (A) 10 to 90% by weight of a polyamide resin, and (B) 9% of an aromatic vinyl homopolymer or copolymer.
0 to 10% by weight, and (C) the layered silicate in the (A) 8 and/or (B) components.
) A resin composition comprising 0.05 to 30 parts by weight of the components uniformly dispersed in 100 parts by weight of the total amount of the components.
本発明の組成物を構成する(A)成分のボリアミド樹脂
は、分子中に酸アミド結合(−CONH−)を有するも
のであり、具体的には、ε一カブロラクタム、6−アミ
ノカブロン酸、ω一エナントラクタム、7−アミノへブ
タン酸、l1−アミノウンデカン酸、9−アミノノナン
酸、α−ピロリドン、α−ピベリドンなどから得られる
重合体または共重合体:ヘキサメチレンジアミン、ノナ
メチレンジアミン、ウンデカメチレンジアミン、ドデカ
メチレンジアミン、メクキシリレンジアミンなどのジア
ミンとテレフタル酸、イソフクル酸、アジビン酸、セバ
シン酸などのジカルボン酸とを重縮合して得られる重合
体もしくは共重合体又はこれらの混合物を例示すること
ができる。(A)成分のポリアミド樹脂は、平均分子量
が9000〜30000のものが好ましい。The polyamide resin of component (A) constituting the composition of the present invention has an acid amide bond (-CONH-) in the molecule, and specifically includes ε-cabrolactam, 6-aminocabrolactam, ω Polymers or copolymers obtained from monoenantholactam, 7-aminohbutanoic acid, l1-aminoundecanoic acid, 9-aminononanoic acid, α-pyrrolidone, α-piveridone, etc.: hexamethylenediamine, nonamethylenediamine, undecanoic acid, etc. Examples include polymers or copolymers obtained by polycondensation of diamines such as methylene diamine, dodecamethylene diamine, and mexylylene diamine and dicarboxylic acids such as terephthalic acid, isofucric acid, adibic acid, and sebacic acid, or mixtures thereof. can do. The polyamide resin of component (A) preferably has an average molecular weight of 9,000 to 30,000.
本発明で用いる芳香族ビニル単独重合体は、スチレン、
α−メチルスチレン、メチルスチレン、ビニルキシレン
、モノクロルスチレン、ジクロルスチレン、モノブロム
スチレン、ジブロムスチレン、p tert−プチル
スチレン、エチルスチレン、ビニルなどから逼ばれる単
量体の重合体であり、特にポリスチレンが好ましい。The aromatic vinyl homopolymer used in the present invention is styrene,
It is a polymer of monomers such as α-methylstyrene, methylstyrene, vinylxylene, monochlorostyrene, dichlorostyrene, monobromstyrene, dibromstyrene, p-tert-butylstyrene, ethylstyrene, vinyl, etc. Polystyrene is preferred.
また芳香族ビニル共重合体とは、芳香族ビニル単量体と
共重合可能なビニル単量体との共重合物であり、ビニル
単量体としては、アクリロニトリル、メタクリロニトリ
ルなどのビニルシアン化合物、メチルアクリレート、エ
チルアクリレー1−、ブチルアクリレート、2−エチル
ヘキシルアクリレートなどのアクリル酸アルキルエステ
ル、メチルメタクリレート、エチレンメタクリレート、
2ーエヂルヘキシルメタクリレートなどのメタクリル酸
アルキルエステル、マレイミド、N−フエニルマレイミ
ド、N−シクロヘキシルマレイミドなどのマレイミド化
合物、アクリル酸、メタクリル酸、イタコン酸、マレイ
ン酸、クロトン酸、ケイヒ酸などの不飽和酸、無水マレ
イン酸、無水イタコン酸、クロロ無水マレイン酸、無水
シトラコン酸、ブテニル無水コハク酸、テトラヒド口無
水フタル酸などの不飽和カルホン酸無水物、グリシジル
アクリレート、グリシジルメタクリート、アワルグリシ
ジルエーテル、2−メチルアリルグリシジルエーテル、
2−メチルアリルグリシジルエーテル、スチレンーp−
グリシジルエーテル、3.4−エポキシブテン、3.4
−エボキシ−3−メチル−1−ブテン、3.4−エボキ
シーl−ペン−rン、3.4−エポキシ−3−メチルペ
ンテン、5.6−エボキシ−1−ヘキセン、ビニルシク
ロヘキセンモノ才キシド、p−グリシジルスチレンなど
のエポキシ基含有不飽和化合物、アリルアミン、メクク
リル酸アミノエチル、メタクリル酸アミノブロビル、ア
ミノスチレンなどのアミン基含有不飽和化合物、3−ヒ
ドロキシ−1−プロペン、4−ヒドロキシ−1−ブテン
、シスー4−ヒドロキシ−2−ブテン、トランス−4−
ヒドロキシ−2−ブテン、3−ヒドロキシ−2−メチル
ー1−ブロベン、シスー5−ヒドロキシ−2−ベンテン
、トランス−5−ヒドロキシ−2−ベンテン、シスー1
.4−ヒドロキシ−2−ブテン、トランス−1.4−ヒ
ドロキシ−2−ブテン、2ーヒドロキシエチルアクリレ
ー}・、2−ヒドロキシエチルメタクリレート、3−ヒ
ドロキシブ口ビルアクリレート、3−ヒドロキシプ口ビ
ルメタクリレート、2−ヒドロキシエチルクロトネート
、2.3.4.5.6−ペンクヒドロキシへキシルアク
リレート、2,3.4.5.6−ペンタヒドロキシへキ
シルメタクリレート、2.3.4.5−テ1・ラヒドロ
キシベンチルアクリレート、2.3.4.5−テトヒド
ロキシベンチルメタクノレートなどの水酸基含有不飽和
化合物などが挙げられ、これらの芳香族ビニル化合物と
共重合可能な他のビニル単量体は1種または2種以上で
使用される.さらに、これらと、ゴム基質となりうるシ
エン系単量体との共重合体であってもよい。An aromatic vinyl copolymer is a copolymer of an aromatic vinyl monomer and a copolymerizable vinyl monomer, and examples of the vinyl monomer include vinyl cyanide compounds such as acrylonitrile and methacrylonitrile. , acrylic acid alkyl esters such as methyl acrylate, ethyl acrylate 1-, butyl acrylate, and 2-ethylhexyl acrylate, methyl methacrylate, ethylene methacrylate,
Methacrylic acid alkyl esters such as 2-edylhexyl methacrylate, maleimide compounds such as maleimide, N-phenylmaleimide, and N-cyclohexylmaleimide, unsaturated substances such as acrylic acid, methacrylic acid, itaconic acid, maleic acid, crotonic acid, and cinnamic acid. Acid, unsaturated carbonic anhydride such as maleic anhydride, itaconic anhydride, chloromaleic anhydride, citraconic anhydride, butenyl succinic anhydride, tetrahydrophthalic anhydride, glycidyl acrylate, glycidyl methacrylate, awalglycidyl ether, 2 - methyl allyl glycidyl ether,
2-methylallyl glycidyl ether, styrene p-
Glycidyl ether, 3.4-epoxybutene, 3.4
- eboxy-3-methyl-1-butene, 3,4-epoxy-1-pentene, 3,4-epoxy-3-methylpentene, 5,6-epoxy-1-hexene, vinylcyclohexene monooxide, Epoxy group-containing unsaturated compounds such as p-glycidylstyrene, amine group-containing unsaturated compounds such as allylamine, aminoethyl meccrylate, aminobrobyl methacrylate, aminostyrene, 3-hydroxy-1-propene, 4-hydroxy-1-butene , cis-4-hydroxy-2-butene, trans-4-
Hydroxy-2-butene, 3-hydroxy-2-methyl-1-broben, cis-5-hydroxy-2-bentene, trans-5-hydroxy-2-bentene, cis-1
.. 4-Hydroxy-2-butene, trans-1,4-hydroxy-2-butene, 2-hydroxyethyl acrylate}, 2-hydroxyethyl methacrylate, 3-hydroxybubutyl acrylate, 3-hydroxybubutyl methacrylate , 2-hydroxyethyl crotonate, 2.3.4.5.6-penkhydroxyhexyl acrylate, 2,3.4.5.6-pentahydroxyhexyl methacrylate, 2.3.4.5-te1 - Other vinyl monomers that can be copolymerized with these aromatic vinyl compounds, such as hydroxyl group-containing unsaturated compounds such as hydroxybentyl acrylate and 2.3.4.5-tethydroxybentyl methacnolate. The body is used in one or more types. Furthermore, it may be a copolymer of these and a cyanogen monomer that can serve as a rubber substrate.
好ましい芳香族ビニル共重合体の例としては、ボリスチ
レン、アクリルニトリルーブタジエンースチレングラフ
トボリマー、スチレン/無水マレイン酸共重合体、スチ
レン/N−フェニルマレイミド共重合体、スチレン/無
水マレイン酸/N−フェニルマレイミド共重合体、スチ
レン/メタクノル酸共重合体、スチレングリシジルメタ
クリレート共重合体などである。(B)成分は耐衝撃性
改良材とは異なり、曲げ弾性率10.000kg/cm
”以上のものを言う。Examples of preferred aromatic vinyl copolymers include polystyrene, acrylonitrile-butadiene-styrene graft polymer, styrene/maleic anhydride copolymer, styrene/N-phenylmaleimide copolymer, styrene/maleic anhydride/N - phenylmaleimide copolymer, styrene/methacnolic acid copolymer, styrene glycidyl methacrylate copolymer, etc. Component (B) has a flexural modulus of 10.000 kg/cm, unlike the impact resistance improving material.
“It says more than that.
(A)および(B)成分の配分比は、(A)成分が10
〜90重量部であり、(B)成分が90〜lO重量部で
ある。(A)成分の配合比が10重量部未満だと成形性
が低下し、90重量部を越えると吸水時の剛性が低下す
る。The distribution ratio of components (A) and (B) is that component (A) is 10
90 parts by weight, and component (B) is 90 to 10 parts by weight. If the blending ratio of component (A) is less than 10 parts by weight, moldability will decrease, and if it exceeds 90 parts by weight, rigidity upon water absorption will decrease.
(C)成分は層状珪酸塩である。この(C)成分は樹脂
組成物から得られる成形体において、(B)成分を(A
)成分のポリアミド中に、又は(A)成分を(B)成分
中に微細に分散させるとともに、成形性が優れた機械的
性質、耐熱性および耐面衝撃性を付与するのに資する物
質である。Component (C) is a layered silicate. This component (C) is used to replace component (B) with (A) in a molded article obtained from a resin composition.
It is a substance that contributes to finely dispersing component (A) in the polyamide of component () or component (B), and imparting mechanical properties with excellent moldability, heat resistance, and surface impact resistance. .
さらに均一に分散された層状珪酸塩は、剛性の付与なら
びに分散粒子となる樹脂を微細に分散させるという特徴
があり、従来相反する性質である剛性と耐衝撃性(面衝
撃性)を同時に満足するという、公知技術による剛性及
び耐衝撃性付与法とは全く異なる多成分系重合体ブレン
ド安定化法を提供するのに不可欠な成分である。Furthermore, the uniformly dispersed layered silicate has the characteristic of imparting rigidity and finely dispersing the resin that becomes the dispersed particles, and simultaneously satisfies rigidity and impact resistance (surface impact resistance), which are conventionally contradictory properties. This is an essential component for providing a multi-component polymer blend stabilization method that is completely different from known techniques for imparting stiffness and impact resistance.
層状珪酸塩は(A)成分中に分散した際、それぞれが平
均的に20人以上の層間距離を保ち、均一に分散してい
ることを特徴とする。本発明において層状珍酸塩とは一
辺が0.002〜1)/Ml、厚みが6〜2OAの物質
の一単位を示すものである。The layered silicate is characterized in that when dispersed in component (A), each layer maintains an average interlayer distance of 20 or more and is uniformly dispersed. In the present invention, a layered rare acid salt refers to one unit of a substance having a side of 0.002 to 1)/Ml and a thickness of 6 to 2 OA.
また、層間距離とは層状珪酸塩の平板の重心間の距離を
言い、均一に分散するとは層状珪酸塩の一枚一枚が、も
しくは平均的に重なりが5層以下の多屡物が平行に,ま
たはランダムに、もしくは平行とランダムが混在した状
態で50重量%以上が、好ましくは70重量%以上が局
所的な塊を形成することなく分散する状態を言う。In addition, the interlayer distance refers to the distance between the centers of gravity of flat plates of layered silicate, and uniform dispersion means that each sheet of layered silicate is distributed in parallel, or that many layers with an average overlap of 5 or less layers are distributed in parallel. , or randomly, or in a mixed state of parallel and random, 50% by weight or more, preferably 70% by weight or more, is dispersed without forming local lumps.
このような層状珪酸塩の原料としては、珪酸マグネシウ
ムまたは珪酸アルミニウムの暦から構成される層状フィ
ロ珪酸鉱物を例示することができる。具体的には、モン
モリロナイト、サポナイト、バイデライト、ノントロナ
イト、ヘクトライト、スディブンサイトなどのスメクタ
イト系粘土鉱物やバーミキュライト、パロイサイトなど
を例示することができ、これらは天然のものであっても
、合成されたものであってもよい、これらのなかでもモ
ンモリ口ナイトが好ましい。As a raw material for such a layered silicate, a layered phyllosilicate mineral composed of magnesium silicate or aluminum silicate can be exemplified. Specifically, examples include smectite clay minerals such as montmorillonite, saponite, beidellite, nontronite, hectorite, and sudibunsite, as well as vermiculite and paroysite, which may be natural or synthetic. Among these, montmori kuchinite is preferred.
(C)成分の口己合割合は、(A)成分と(B)成分の
合計量が100重量部に対して0405〜30重量部で
あり、好ましくは0.1〜10重量部である。(C)成
分の配合割合が0.05重量部未満であると、成形品の
耐熱性および耐衝撃性の向上効果が小さく、30重量部
を超えると、樹脂組成物の流動性が極端に低下し、成形
性が低下する.
さらに、本発明には前述の(A)、(B)、(C)成分
の他に耐衝撃性改良材を必要に応じて加えることができ
る。耐衝撃性改良材としては、−FIiにボリアミドに
用いられる耐衝撃改良材ならば、特に限定はなく次に挙
げるようなものである。ポリアミドに20重量%添加し
た時、その耐衝撃性が、2倍以上になる程度のものであ
り、その曲げ弾性率は、1 0 . 0 0 0kg/
cm2以下である。The mixing ratio of component (C) is 0.405 to 30 parts by weight, preferably 0.1 to 10 parts by weight, per 100 parts by weight of the total amount of components (A) and (B). When the blending ratio of component (C) is less than 0.05 parts by weight, the effect of improving the heat resistance and impact resistance of the molded product is small, and when it exceeds 30 parts by weight, the fluidity of the resin composition is extremely reduced. However, the moldability decreases. Furthermore, in addition to the above-mentioned components (A), (B), and (C), impact resistance modifiers can be added to the present invention as needed. The impact resistance improving material is not particularly limited as long as it is an impact resistance improving material used for -FIi and polyamide, and the following materials may be used. When 20% by weight is added to polyamide, its impact resistance is more than doubled, and its flexural modulus is 10. 0 0 0 kg/
cm2 or less.
耐衝撃性改良材としては、室温下でエラストマー状であ
るスチレンーブタジエン(またはイソプレン)共重合体
(ランダム共重合体、ブロック共重合体、水素添加ブロ
ック共重合体、グラフト共重合体)、各種才レフィンの
共重合体を例示することができる.具体的にはスチレン
ーブタジエンランダム共重合体、スチレンーブタジエン
ースチレンブロック共重合体、スチレンーイソブレンー
スチレンブロック共重合体、水素添加スチレンブタジエ
ンースチレンブロック共重合体、水素添加スチレンーイ
ソプレンースチレンブロック共重合体.エチレン、プロ
ピレン、ブテンー1、ヘキセンーl、デセンー1および
4−メチルブテンー4−メチルベンテンーlなどから運
ばれる2種以上の才レフィンの共重合体を例示すること
ができる。Examples of impact resistance modifiers include styrene-butadiene (or isoprene) copolymers (random copolymers, block copolymers, hydrogenated block copolymers, and graft copolymers) that are elastomeric at room temperature; An example is a copolymer of polyolefins. Specifically, styrene-butadiene random copolymer, styrene-butadiene-styrene block copolymer, styrene-isobrene-styrene block copolymer, hydrogenated styrene-butadiene-styrene block copolymer, hydrogenated styrene-isoprene- Styrene block copolymer. Examples include copolymers of two or more olefins derived from ethylene, propylene, butene-1, hexene-1, decene-1, and 4-methylbutene-4-methylbenten-1.
この耐衝撃性改良材は、不飽和カルポン酸などで変性し
たものを用いることができる。This impact resistance improving material can be modified with unsaturated carboxylic acid or the like.
耐衝撃性改良材の好ましい配合量は、(A)、(B)お
よび(C)成分の合計量100重量部に対して30重量
部以下である。30重量部を超えると成形性が低下し、
成形品の耐熱性が低下するために好ましくない。A preferred blending amount of the impact resistance modifier is 30 parts by weight or less based on 100 parts by weight of the total amount of components (A), (B), and (C). If it exceeds 30 parts by weight, moldability decreases,
This is not preferred because the heat resistance of the molded product decreases.
相箔化剤は,例えば(C)−2ポリ(エチレン/メタク
リル酸グリシジル)共重合体(エチレン/メタクリル酸
グリシジル=85/15)を70重量部と過酸化結合を
側鎖に有するポリ(アクリル酸ブチルーb−スチレン)
(アクリル酸ブチル/スチレンー10/90)30重量
部とを溶融押出器を用い、溶融1度200±20゜c−
c’溶融混練して得られたポリ (エチレン/メタクリ
ル酸グリシジル)一g−ポリ(アクリル酸ブチルーb−
スチレン)であるグラフト化ポリオレフィン変性物(日
本油脂(掬製グレード名モディパ−A4100)などが
使用され得る。The phase foil forming agent is, for example, 70 parts by weight of (C)-2 poly(ethylene/glycidyl methacrylate) copolymer (ethylene/glycidyl methacrylate = 85/15) and poly(acrylic acid) having a peroxide bond in the side chain. butyl-b-styrene)
(butyl acrylate/styrene - 10/90) and 30 parts by weight were melted at 200±20°C using a melt extruder.
c' Poly(ethylene/glycidyl methacrylate) obtained by melt-kneading 1 g-Poly(butyl acrylate) b-
A grafted polyolefin modified product (grade name: Modiper-A4100 manufactured by Nihon Yushi Co., Ltd., manufactured by Kyoiku Co., Ltd.), which is styrene), may be used.
本発明の組成物には必要に応じて、染料、顔料、核剤、
離型剤などの充填剤、ガラス繊維、金属繊維、炭素繊維
などの補強剤、可塑剤、滑剤、耐熱性付与剤、発泡剤、
難燃剤などを配合することができる。The composition of the present invention may contain dyes, pigments, nucleating agents,
Fillers such as mold release agents, reinforcing agents such as glass fiber, metal fiber, carbon fiber, plasticizers, lubricants, heat resistance imparting agents, foaming agents,
Flame retardants and the like can be added.
本発明の樹脂組成物の製造方法は特に制限されるもので
はない。例えば、(C)成分の層状珪酸塩を膨潤化剤と
接触させてあらかしめ層間を拡げて層間にモノマーを取
り込みやすくしたのち、(A)成分を形成するモノマー
を混合し、重合(特開昭62−74957号公報参照)
させ、さらに(B)成分の熱可塑性樹脂を混合し、23
0〜250゜C、好ましくは250〜320゜Cで溶融
混練する方法;重合終了後の溶融状態にあるポリアミド
中に、(B)成分の熱可塑性樹脂を溶融させたものと、
あらかじめ層間距龍を50人以上に拡げた(C)成分の
層状珪酸塩を混練・配合する方法等を適用することがで
きる。The method for producing the resin composition of the present invention is not particularly limited. For example, after the layered silicate of component (C) is brought into contact with a swelling agent to expand the interlayers and make it easier to incorporate monomers between the layers, the monomers forming component (A) are mixed and polymerized (in Japanese Patent Application Laid-open No. (Refer to Publication No. 62-74957)
and further mix the thermoplastic resin of component (B), 23
A method of melt-kneading at 0 to 250°C, preferably 250 to 320°C; a thermoplastic resin as component (B) is melted in polyamide in a molten state after completion of polymerization;
It is possible to apply a method of kneading and blending the layered silicate of component (C) in which the interlayer distance is expanded to 50 or more in advance.
本発明の樹脂組成物においては、分散粒子となり得る粒
子が数平均粒子径で2p7n以下で分散相を形成するこ
とが好ましい。In the resin composition of the present invention, it is preferable that particles that can become dispersed particles have a number average particle diameter of 2p7n or less and form a dispersed phase.
(C)成分の層状珪酸塩は(A)成分および(B)成分
の両方の相に分散していても、またいずれかの一方の相
に分散していてもよい。The layered silicate of component (C) may be dispersed in both the phases of component (A) and component (B), or may be dispersed in one of the phases.
本発明は、(A)成分と(B)成分との混合物に、さら
に層状珪酸塩を配合することにより、成形品の耐熱性お
よび耐衝撃性の両方を同時に向上させることができるも
のである。通常、無機質充填剤をボリアミド樹脂と熱可
塑性樹脂との混合物中に配合した場合は剛性および耐熱
性は向上させることができるが、一方で耐衝撃性は低下
する。In the present invention, by further blending a layered silicate into the mixture of components (A) and (B), both the heat resistance and impact resistance of a molded article can be improved at the same time. Generally, when an inorganic filler is blended into a mixture of polyamide resin and thermoplastic resin, rigidity and heat resistance can be improved, but impact resistance is reduced.
しかし、本発明の組成物においては、層状珪酸塩は非常
に微細な状態で分散存在しており、少量の配合で剛性、
耐熱性を向上させ、しかもポリマー同士の分散もドメイ
ンを小さな粒子径で微細に分散させることができるため
に、剛性、耐熱性とともに耐衝撃性も向上するものと考
えられる。However, in the composition of the present invention, the layered silicate is dispersed in a very fine state, and even with a small amount of addition, rigidity and
It is thought that the heat resistance is improved, and since the domains can be finely dispersed with small particle diameters in the dispersion of the polymers, the rigidity, heat resistance, and impact resistance are also improved.
・本発明の樹脂組成物は、自動車の各種部品、電子電気
部品、機械部品、一般雑貨の製造材科として利用するこ
とができる。- The resin composition of the present invention can be used as a manufacturing material for various automobile parts, electronic and electrical parts, mechanical parts, and general miscellaneous goods.
(実施例)
以下、実施例により不発明をさらに詳しく説明する。な
お、部は重量部を表わす。また、以下において示した各
特性の試験方法は下記のとおりである。(Example) Hereinafter, the non-invention will be explained in more detail with reference to Examples. Note that parts represent parts by weight. Moreover, the test method for each characteristic shown below is as follows.
引張り強さ・.A S T M D − 6 3 8
曲げ強さ、曲げ弾性率・ASTM D−790アイゾ
ット衝12強さ: .A S T M D − 2
5 6熱変形温度 ASTM D−648
高速衝撃強さ:まず、本発明の樹脂組成物のベレッ1〜
を厚さ3.2mm、直径100mmの円盤に成形し、そ
の円盤を試験片とした。次に、30゜Cで先端径1/2
インチラウンドミサイルを前紀試験片中央に2 5m/
秒の速度で落下させ、その場合の破壊の際の応力ひずみ
曲線の面積から、その破壊エネルギーを算出する面衝撃
測定法(UBE法)によった。Tensile strength... ASTM D-6 3 8
Bending strength, bending modulus/ASTM D-790 Izod test 12 strength: . ASTM D-2
5 6 Heat distortion temperature ASTM D-648 High speed impact strength: Firstly, the resin composition of the present invention has a
was formed into a disk with a thickness of 3.2 mm and a diameter of 100 mm, and the disk was used as a test piece. Next, the tip diameter is 1/2 at 30°C.
An inch round missile was placed in the center of the previous test piece at 25m/
A surface impact measurement method (UBE method) was used in which the fracture energy was calculated from the area of the stress-strain curve at the time of fracture by dropping the specimen at a speed of seconds.
分散粒子径 シクロトームを用いて各成形体の小片を調
裂し、その小片をローグミンBで染色し、水洗したのち
、光学顕微鏡(xlo00)で該小片中の分散粒子径を
測定した。Dispersed Particle Diameter A small piece of each molded body was split using a cyclotome, and the small piece was stained with Roguemin B, washed with water, and then the dispersed particle size in the small piece was measured using an optical microscope (xlo00).
実施例及び比較例
下記の表に示した各成分の組合せ及び配合比で樹脂組成
物を製造し、成形体として各特性評価用の試験片を製造
した。Examples and Comparative Examples Resin compositions were produced using the combinations and blending ratios of each component shown in the table below, and test pieces for each characteristic evaluation were produced as molded bodies.
(.A)ボリアミド
層状珪酸塩の一単位の厚みが平均的に96 5人で一辺
の平均長さが約0 1μmのモンモリロナイト200g
を102の水に分散し、これに51 2gの12−アミ
ノドデカン酸と24−の濃塩酸を加え、5分間撹拌した
のち、2戸過した。(.A) 200g of montmorillonite with an average thickness of one unit of polyamide layered silicate of 965 people and an average side length of about 0.1μm
was dispersed in 102 g of water, 512 g of 12-aminododecanoic acid and 24-g of concentrated hydrochloric acid were added thereto, stirred for 5 minutes, and then passed through two doors.
さらにこれを十分洗浄したのち、真空乾燥した。Furthermore, after thoroughly washing this, it was vacuum dried.
この操作により、12−アミノドデカン酸アンモニウム
イオンとモンモリロナイトの複合体を調製した。複合体
中の層状珪酸塩分は80重量%となった。また、この複
合体のX線回折による測定では珪酸塩層間距離が18
0人であった。Through this operation, a complex of ammonium 12-aminododecanoate ion and montmorillonite was prepared. The layered silicate content in the composite was 80% by weight. Furthermore, X-ray diffraction measurements of this composite revealed that the silicate interlayer distance was 18
There were 0 people.
次に撹拌機付きの反応容器に、10kgのε一カブ口ラ
クタム、lkgの水および200gの乾燥した前記複合
体を入れ、100’Cて反応系内が均一な状態になるよ
うに撹拌した。さらに温度を2 6 0 ’Cに上昇さ
せ、1 5 kg/ cm2の加圧下で1時間撹拌した
。その後、放圧し、水分を反応容器から揮散させながら
、常圧下で3時間反応させた。反応終了後、反応容器の
下部ノズルから、ストランド状に取り出した反応物を水
冷し、カンティングを行ない、ポリアミド樹脂(平均分
子量15.000)およびモンモリロナイトからなるベ
レットを得た。次にこのペレットを熱水中に浸漬し、未
反応のモノマー(約10%)を抽出、除去したのち、真
空中で乾燥した。この乾燥ベレット中におけるポリアミ
ドとモンモリロナイトの割合は、ボリアミド樹脂100
重量部に対してモンモリロナイトが1 6重量部であっ
た。Next, 10 kg of ε-1-cubic lactam, 1 kg of water, and 200 g of the dried composite were placed in a reaction vessel equipped with a stirrer, and stirred at 100'C so that the inside of the reaction system became uniform. The temperature was further increased to 260'C and stirred for 1 hour under a pressure of 15 kg/cm2. Thereafter, the pressure was released and the reaction was carried out under normal pressure for 3 hours while evaporating water from the reaction vessel. After the reaction was completed, the reaction product taken out in the form of a strand from the lower nozzle of the reaction vessel was cooled with water and canted to obtain a pellet made of polyamide resin (average molecular weight 15.000) and montmorillonite. Next, the pellets were immersed in hot water to extract and remove unreacted monomers (about 10%), and then dried in vacuum. The ratio of polyamide and montmorillonite in this dry pellet is 100% of polyamide resin.
The amount of montmorillonite was 16 parts by weight.
(B)芳香族ビニル単独重合体または共重合体スチレン
・無水マレイン酸共重合体(アーコボノマ=(掬製グレ
ード名、グイラーク232、以下S MA Hと略す)
耐衝撃性改良材
水添スチレンブタジエンブロック共重合体(シェル化学
■製グレード名、クレイトンG1651、以下SEBS
と略す)
成形体は、次の方法で製造した。まず、表に示す量の各
成分を予備混合したのち、スクリュー径30mmの押出
1幾を用いて250゜C〜300゜Cて溶融混諌してペ
レット化した。その後、該ペレットを真空乾燥したのち
、射出成形磯によりシリンダー温度250〜300゜C
金型温度80゜Cの条件で射出成形を行ない成形体を得
た。(B) Aromatic vinyl homopolymer or copolymer Styrene/maleic anhydride copolymer (Arcobonoma = (Kiyusei grade name, Guiraku 232, hereinafter abbreviated as SMA H) Impact resistance modifier Hydrogenated styrene butadiene block Copolymer (grade name manufactured by Shell Chemical ■, Kraton G1651, hereinafter SEBS)
) The molded body was manufactured by the following method. First, the amounts of each component shown in the table were premixed, and then melted and mixed at 250°C to 300°C using an extruder with a screw diameter of 30 mm to form pellets. After that, the pellets were vacuum dried, and then molded using an injection molding machine at a cylinder temperature of 250 to 300°C.
Injection molding was performed at a mold temperature of 80°C to obtain a molded product.
得られた成形体を各特性評価用の試験片として用い、評
価試験を行なった結果を表に示す。The obtained molded bodies were used as test pieces for each characteristic evaluation, and evaluation tests were conducted. The results are shown in the table.
(発明の効果)
表の結果に示した如く、ボリアミドと熱可塑性樹脂との
混合物に、さらに層状珪酸塩を配合することにより、剛
性のみならず同時に耐衝撃性も{憂れている。(Effects of the Invention) As shown in the results in the table, by further blending a layered silicate into the mixture of polyamide and thermoplastic resin, not only the rigidity but also the impact resistance was improved.
Claims (1)
に (C)(A)および/または(B)成分中に均一に分散
された層状珪酸塩 からなる樹脂組成物。[Scope of Claims] (A) polyamide resin, (B) aromatic vinyl homopolymer or copolymer, and (C) layered silicate uniformly dispersed in components (A) and/or (B). A resin composition consisting of.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008278A JP3017233B2 (en) | 1990-01-19 | 1990-01-19 | Resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008278A JP3017233B2 (en) | 1990-01-19 | 1990-01-19 | Resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03215555A true JPH03215555A (en) | 1991-09-20 |
JP3017233B2 JP3017233B2 (en) | 2000-03-06 |
Family
ID=11688716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008278A Expired - Lifetime JP3017233B2 (en) | 1990-01-19 | 1990-01-19 | Resin composition |
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Country | Link |
---|---|
JP (1) | JP3017233B2 (en) |
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EP0590390A2 (en) * | 1992-09-23 | 1994-04-06 | Bayer Ag | Moulding compositions of ABS polymers and aluminosilicates, mouldings obtainable therefrom and process for their production |
KR100375438B1 (en) * | 2000-12-06 | 2003-03-10 | 제일모직주식회사 | Thermoplastic Composition and Method of Preparing the same |
KR100384563B1 (en) * | 1997-12-16 | 2003-08-14 | 제일모직주식회사 | Rubber modified thermoplastic composite material and preparation method thereof |
KR100383546B1 (en) * | 1997-12-16 | 2003-08-21 | 제일모직주식회사 | Preparation method of thermoplastic composite material |
KR100443211B1 (en) * | 2001-10-19 | 2004-08-04 | 제일모직주식회사 | Method of Preparing Rubber Modified Polystyrene Resin Composition With High Gloss and Impact Resistance |
JPWO2004016693A1 (en) * | 2002-07-23 | 2005-12-02 | 株式会社カネカ | Polyamide resin composition and method for producing the same |
KR101218763B1 (en) * | 2009-12-07 | 2013-01-07 | 금호석유화학 주식회사 | Polyamide Thermoplastic Resin |
-
1990
- 1990-01-19 JP JP2008278A patent/JP3017233B2/en not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0590390A2 (en) * | 1992-09-23 | 1994-04-06 | Bayer Ag | Moulding compositions of ABS polymers and aluminosilicates, mouldings obtainable therefrom and process for their production |
EP0590390A3 (en) * | 1992-09-23 | 1994-06-15 | Bayer Ag | Moulding compositions of abs polymers and aluminosilicates, mouldings obtainable therefrom and process for their production |
KR100384563B1 (en) * | 1997-12-16 | 2003-08-14 | 제일모직주식회사 | Rubber modified thermoplastic composite material and preparation method thereof |
KR100383546B1 (en) * | 1997-12-16 | 2003-08-21 | 제일모직주식회사 | Preparation method of thermoplastic composite material |
KR100375438B1 (en) * | 2000-12-06 | 2003-03-10 | 제일모직주식회사 | Thermoplastic Composition and Method of Preparing the same |
KR100443211B1 (en) * | 2001-10-19 | 2004-08-04 | 제일모직주식회사 | Method of Preparing Rubber Modified Polystyrene Resin Composition With High Gloss and Impact Resistance |
JPWO2004016693A1 (en) * | 2002-07-23 | 2005-12-02 | 株式会社カネカ | Polyamide resin composition and method for producing the same |
JP4542035B2 (en) * | 2002-07-23 | 2010-09-08 | 株式会社カネカ | Polyamide resin composition and method for producing the same |
KR101218763B1 (en) * | 2009-12-07 | 2013-01-07 | 금호석유화학 주식회사 | Polyamide Thermoplastic Resin |
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