JPH03215048A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH03215048A JPH03215048A JP2011322A JP1132290A JPH03215048A JP H03215048 A JPH03215048 A JP H03215048A JP 2011322 A JP2011322 A JP 2011322A JP 1132290 A JP1132290 A JP 1132290A JP H03215048 A JPH03215048 A JP H03215048A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- base
- resin
- adhesive tape
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000002390 adhesive tape Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 229920002050 silicone resin Polymers 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000000740 bleeding effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はファクシミリ、プリンターなどに使用される感
熱記録用のサーマルヘッドに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thermal head for heat-sensitive recording used in facsimiles, printers, and the like.
従来の孜術
従来のサーマルヘッドは、複数個の発熱抵抗体が一列に
形成された基板と、この基板を支持する基台が接着テー
プにより接着された構成であって、発熱抵抗体により発
熱し、基板に蓄熱された熱は、接着テープを介して基台
側へ放熱させるようにしている。なお前記接着テープは
不織布に接着剤を含浸させたものである。A conventional thermal head has a structure in which a substrate on which a plurality of heating resistors are formed in a line and a base supporting this substrate are adhered with adhesive tape, and the heating resistors generate heat. The heat stored in the substrate is radiated to the base side via the adhesive tape. Note that the adhesive tape is a nonwoven fabric impregnated with an adhesive.
発明が解決しようとする課題
前述のような構成のサーマルヘッドにおいては、接着テ
ープ内に混入している気泡が熱伝導の大きな抵抗となる
ため、発熱抵抗体によシ発生した熱が基板に蓄熱され、
この基板の温度が上昇することにより記録に尾引きや、
にじみが発生すると言う問題があった。そこで本発明は
、基板上で発生した熱を十分に基台側へ放熱させ、前記
尾引きやにじみを防止することを目的とするものである
。Problems to be Solved by the Invention In the thermal head configured as described above, the air bubbles mixed in the adhesive tape create a large resistance to heat conduction, so the heat generated by the heating resistor is stored in the substrate. is,
As the temperature of this substrate rises, there may be tails in the recording,
There was a problem with bleeding. Therefore, an object of the present invention is to sufficiently dissipate the heat generated on the substrate to the base side, thereby preventing the above-mentioned trailing and bleeding.
課題を解決するための手段
前述のような目的を達成するために、本発明は基台の基
板側面の一部に凹部を設け，前記凹部に対応する接着テ
ープ部には切欠き部を設けるとともに、この凹部内に熱
伝導性の良い樹脂を充填したものである。Means for Solving the Problems In order to achieve the above-mentioned objects, the present invention provides a concave portion in a part of the side surface of the substrate of the base, and provides a notch in the adhesive tape portion corresponding to the concave portion. This recess is filled with a resin having good thermal conductivity.
作用
以上のような構成とすれば、接着テープに形成した切欠
き部を介して基台と基板が熱伝導性の良い樹脂で結合さ
れるので、発熱抵抗体により発生した熱は、基台の基板
側面に設けられた凹部に充填した熱伝導性の良い樹脂を
介して，すみやかに基台側へ放熱され、この結果として
尾引きや、にじみが防止されることとなる。Effects With the above configuration, the base and the board are bonded with a resin with good thermal conductivity through the notch formed in the adhesive tape, so the heat generated by the heating resistor is transferred to the base. Heat is quickly radiated to the base side through the resin with good thermal conductivity filled in the recesses provided on the side surface of the substrate, and as a result, trailing and bleeding are prevented.
実施例
以下、本発明の一実施例について図面を参照しながら説
明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図は本発明によるサーマルヘッドの要部斜視図、第
２図，第３図はそれぞれ第１図の断面図で、同一構成品
には同一番号を付与した。FIG. 1 is a perspective view of a main part of a thermal head according to the present invention, and FIGS. 2 and 3 are sectional views of FIG. 1, and the same components are given the same numbers.
第１図において、基板４上には発熱抵抗体６が複数個一
列に配置されている（当図ではそれらの発熱抵抗体を略
して直線として示した）。また基台２の基板４側面の，
発熱抵抗体６の列と平行で発熱抵抗体列からずらせた位
置には，凹部１が設けられている。また前記凹部１に対
応する部分を切り欠いた接着テープ３により、基板４が
基台２上に接着されている。以上の構成において、第２
図のように基台２に設けられた凹部１の底部両端には、
それぞれ１ケ所貫通孔６が下方に向けて設けられている
。以上のような構成とした後、貫通孔６の片側から、熱
伝導性のよい樹脂７、例えばシリコン系樹脂にアルミナ
粉末を添加したものを注入し、凹部１に充填する。なお
前記樹脂７が硬化性でない場合は，前記樹脂充填後、貫
通孔６部を封止する必要がある。本実施例においては硬
化性の樹脂を用い、かつ硬化後においてゴム性を有する
ものを使用した。また、基板４はセラミック、基台２は
アルミニウムを使用した。In FIG. 1, a plurality of heat generating resistors 6 are arranged in a line on a substrate 4 (in this figure, these heat generating resistors are abbreviated and shown as straight lines). Also, on the side of the board 4 of the base 2,
A recess 1 is provided at a position parallel to the row of heating resistors 6 and offset from the row of heating resistors. Further, a substrate 4 is adhered onto the base 2 with an adhesive tape 3 having a cutout portion corresponding to the recess 1 . In the above configuration, the second
As shown in the figure, at both ends of the bottom of the recess 1 provided in the base 2,
A through hole 6 is provided at one location in each case facing downward. After having the above structure, a resin 7 having good thermal conductivity, such as a silicone resin to which alumina powder is added, is injected from one side of the through hole 6 to fill the recess 1 . Note that if the resin 7 is not curable, it is necessary to seal the through hole 6 after filling the resin. In this example, a curable resin was used that had rubber properties after curing. Furthermore, the substrate 4 was made of ceramic, and the base 2 was made of aluminum.
以上のように構成された本実施例のサーマルヘッドにお
いては、基板４の熱は接着テープ３を介して基台２側へ
放熱されると同時に熱抵抗の大きな接着テープ３を切り
欠いた部分すなわち、基台２に設けられた凹部１に充填
した熱伝導性の良い樹脂７を介して基台２側へすみやか
に放熱されるため、基板４の温度上昇をおさえることが
できる。In the thermal head of this embodiment configured as described above, the heat of the substrate 4 is radiated to the base 2 side via the adhesive tape 3, and at the same time, the heat from the substrate 4 is radiated to the side of the base 2 through the adhesive tape 3, which has a large thermal resistance. Since heat is quickly radiated to the base 2 side through the resin 7 with good thermal conductivity filled in the recess 1 provided in the base 2, the temperature rise of the substrate 4 can be suppressed.
なお、第３図に示すように基台２に設ける凹部１を、発
熱抵抗体６の列からでだけずらせることにより、プラテ
ンローラーの抑圧による基板４のたわみが発生しないた
め、感熱紙と発熱抵抗体の接触を損なうことがない。As shown in FIG. 3, by shifting the recess 1 provided in the base 2 only by a distance from the row of heat-generating resistors 6, the board 4 is not bent due to the suppression of the platen roller, so that the thermal paper and the heat-generating It does not damage the contact of the resistor.
また、樹脂７を注入する時において気泡が混入し、前記
気泡が基板４に接触した場合、当部の基板４の温度が極
部的に上昇するが、凹部１を発熱抵抗体６からずらせて
おけば画質への影響が小さくてすむ。Furthermore, if air bubbles are mixed in when injecting the resin 7 and the air bubbles come into contact with the substrate 4, the temperature of the substrate 4 in that area will rise extremely, but if the recess 1 is shifted from the heating resistor 6, If you do this, the effect on image quality will be small.
また、基台２に設ける凹部１の深さは浅く，幅は広くし
た方が基台２への放熱がより十分に行える。Further, heat radiation to the base 2 can be more fully achieved by making the depth of the recess 1 provided in the base 2 shallower and the width wider.
本実施例においては、基台２凹部１を発熱抵抗体６列の
片側に設けたが、前記と同様の凹部１を発熱抵抗体６列
の両側に設け、それぞれに熱伝導性の良い樹脂７を充填
してもよい。In this embodiment, the recess 1 of the base 2 was provided on one side of the six rows of heating resistors, but the recesses 1 similar to those described above were provided on both sides of the six rows of heating resistors, and a resin 7 with good thermal conductivity was provided on each side. may be filled with.
発明の効果
本発明によれば，基板上で発生した熱がすみやかに基台
側へ放熱され基板の温度上昇をおさえることができるた
め、尾引きや、にじみの少ない記録が得られる。また、
高速記録や高エネルギーでの記録でも良好な記録品質が
得られる。Effects of the Invention According to the present invention, the heat generated on the substrate is quickly dissipated to the base side and the rise in temperature of the substrate can be suppressed, so that recording with less trailing and bleeding can be obtained. Also,
Good recording quality can be obtained even during high-speed recording and high-energy recording.
第１図は本発明の一実施例を示すもので一部切欠斜視図
，第２図は第１図の正面饅断面図、第３図は第１図の側
面側断面図である。
１・・・・・・凹部、２・・・・・・基台、３・・・・
・・接着テープ、４・・・・・・基板、７・・・・・・
樹脂。FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention, FIG. 2 is a front sectional view of FIG. 1, and FIG. 3 is a side sectional view of FIG. 1. 1... recess, 2... base, 3...
...adhesive tape, 4...substrate, 7...
resin.
Claims (2)
この基板を支持する基台と、この基台上に前記基板を接
着する接着テープとを備え、前記基台の基板側に凹部を
形成し、この凹部に対応する前記接着テープ部には切欠
き部を設けるとともに、前記基台凹部内に熱伝導性の良
い樹脂を充填したことを特徴とするサーマルヘッド。(1) A substrate on which a plurality of heating resistors are arranged in a row,
A base for supporting the substrate and an adhesive tape for bonding the substrate onto the base, a recess is formed on the substrate side of the base, and a notch is provided in the adhesive tape portion corresponding to the recess. 1. A thermal head characterized in that the base recess is filled with a resin having good thermal conductivity.
せた位置に形成した請求項１に記載のサーマルヘッド。(2) The thermal head according to claim 1, wherein the recessed portion of the base is formed at a position offset from the row of heating resistors on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011322A JPH03215048A (en) | 1990-01-19 | 1990-01-19 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011322A JPH03215048A (en) | 1990-01-19 | 1990-01-19 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03215048A true JPH03215048A (en) | 1991-09-20 |
Family
ID=11774792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011322A Pending JPH03215048A (en) | 1990-01-19 | 1990-01-19 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03215048A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0709202A3 (en) * | 1994-10-31 | 1997-04-16 | Canon Kk | Manufacturing method of ink jet head, ink jet head manufactured by same and ink jet device having ink jet head |
-
1990
- 1990-01-19 JP JP2011322A patent/JPH03215048A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0709202A3 (en) * | 1994-10-31 | 1997-04-16 | Canon Kk | Manufacturing method of ink jet head, ink jet head manufactured by same and ink jet device having ink jet head |
| US5826333A (en) * | 1994-10-31 | 1998-10-27 | Canon Kabushiki Kaisha | Method of manufacturing an ink jet head |
| CN1058660C (en) * | 1994-10-31 | 2000-11-22 | 佳能株式会社 | Manufacturing method of ink jet head, ink jet head manufactured by same and ink jet device having ink jet head |
| US6499828B1 (en) | 1994-10-31 | 2002-12-31 | Canon Kabushiki Kaisha | Manufacturing method of ink jet head, ink jet head manufactured by same and ink jet device having ink jet head |
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