JPH03212109A - Method for peeling insulating film of enameled wire - Google Patents

Method for peeling insulating film of enameled wire

Info

Publication number
JPH03212109A
JPH03212109A JP2004442A JP444290A JPH03212109A JP H03212109 A JPH03212109 A JP H03212109A JP 2004442 A JP2004442 A JP 2004442A JP 444290 A JP444290 A JP 444290A JP H03212109 A JPH03212109 A JP H03212109A
Authority
JP
Japan
Prior art keywords
laser beam
insulating film
wire
electric wire
enameled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004442A
Other languages
Japanese (ja)
Inventor
Akira Usui
明 臼井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2004442A priority Critical patent/JPH03212109A/en
Publication of JPH03212109A publication Critical patent/JPH03212109A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve a peeling effect by setting the position for applying a laser beam to an enameled wire to the position close to a condensing lens but avoiding a plasma-generating position in the vicinity of the focus of the condensing lens. CONSTITUTION:A laser apparatus is equipped with a heating apparatus composed of a heater 12, fan 13, etc., and constituted so as to enable blowing a heated inert gas against an enameled wire 9. When the insulting film of the enameled wire 9 is peeled, the peeled part of the enameled wire 9 is arranged in the position close to a condensing lens 4 but avoiding a plasma-generating position in the vicinity of the focus of the condensing lens 4, an inert gas is blown against the wire 9 by the heating apparatus before irradiation with a laser beam, the enameled wire 9 is heated within the range of 230-250 deg.C and a laser beam is applied thereafter. Thus, the insulating film of the wire can be peeled satisfactorily.

Description

【発明の詳細な説明】 [産業上の利用分野〕 本発明はエナメル電線の絶縁膜の剥離方法の改良に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a method for peeling an insulating film of an enameled electric wire.

[従来の技術] 各種機器特に精密部品のマグネットコイルに多用される
エナメル電線は、近年その径が細くなり極細線では十数
ミクロンのものが提供されている。
[Prior Art] Enamel electric wires, which are frequently used in magnet coils of various devices, especially precision parts, have recently become thinner in diameter, and ultra-fine wires with a diameter of more than ten microns are now available.

こうしたエナメル電線はハンダ付けの際などその絶縁膜
を剥離する必要があり、径の太い線にあっては機械的方
法で剥離されている。しかし上述したような径の細い線
の場合は、線が伸長あるいは切断しやすくなるため機械
的方法では剥離が困難である。ツルコート溶剤などを利
用する化学的方法による剥離は可能であるが、溶液管理
や取扱管理それに安全管理などの管理面で煩わしいこと
となる。
It is necessary to peel off the insulating film of such enameled electric wires when soldering, etc., and in the case of wires with a large diameter, this is done by a mechanical method. However, in the case of a wire with a small diameter as described above, it is difficult to separate the wire using a mechanical method because the wire is easily stretched or cut. Although it is possible to remove the film by a chemical method using vine coat solvent, etc., it is troublesome in terms of management such as solution management, handling management, and safety management.

こうした難点を避けるため最近レーザによる剥離方法が
提供されている。第5図はこのレーザによる剥離方法を
示す構成図で、図中1は短パルス高尖頭出力を備えたパ
ルスレーザで、通常TEACO2レーサが使用される。
To avoid these difficulties, laser ablation methods have recently been proposed. FIG. 5 is a block diagram showing this laser stripping method. In the figure, 1 is a pulse laser with a short pulse and high peak output, and a TEACO2 laser is usually used.

2はレーザビーム、3はビーム2の方向を変えるための
ペンドミラー4はビーム2を集光する集光レンズ、5は
集光されるビーム、6は拡がるビーム、7はビームを反
射させる反射鏡、8は反射ビーム、9はエナメル電線、
10は集光レンズ4の焦点である。
2 is a laser beam, 3 is a pend mirror 4 for changing the direction of the beam 2, a condensing lens for condensing the beam 2, 5 is a condensed beam, 6 is a spreading beam, 7 is a reflecting mirror for reflecting the beam, 8 is a reflected beam, 9 is an enameled wire,
10 is the focal point of the condensing lens 4.

レーザ1は通常パルス幅約1.8μSee 、ピーク出
力約10メガワツト以上のパルスレーザで、波長10.
6μmのTEAC02レーザである。発振したレーザビ
ーム2はベンドミラー3により直下方向に曲げられ、レ
ンズ4により集光される。集光したビーム5はレンズ焦
点10を通過後拡がり、拡がりビーム6の一部はエナメ
ル電線9を照射し、残りのビームは反射鏡7により反射
され反対側からエナメル電線9を照射する。なおエナメ
ル電線9は反射鏡7の焦点位置にあり、その結果一方向
からの照射でエナメル電線9の全周の絶縁膜の剥離が可
能となる。
Laser 1 is a pulse laser with a normal pulse width of about 1.8 μSee and a peak output of about 10 megawatts or more, and a wavelength of 10.
It is a 6 μm TEAC02 laser. The oscillated laser beam 2 is bent directly downward by a bend mirror 3 and focused by a lens 4. The focused beam 5 is expanded after passing through a lens focal point 10, and a part of the expanded beam 6 illuminates the enameled electric wire 9, and the remaining beam is reflected by the reflecting mirror 7 and illuminates the enameled electric wire 9 from the opposite side. Note that the enameled wire 9 is located at the focal point of the reflecting mirror 7, and as a result, the insulating film around the entire circumference of the enameled wire 9 can be peeled off by irradiation from one direction.

[発明が解決しようとする課題] ト1.− ロで上記レーザビームによる絶縁膜剥離方法
においては、使用される短パルス高尖頭出力を備えたパ
ルスレーザは、集光点10において気中破壊によるプラ
ズマを発生し、レーザビームのエネルギはプラズマ生成
にのみ消費され、エナメル電線の絶縁膜剥離効果を生じ
ない。プラズマ発生の生しないレベルまでレーザ出力を
下げると、細い線の場合は剥離可能であるが、線径が大
きくなると剥離が不可能となる。それに剥離ができても
剥離が完全でなく品質に問題が残る。このように従来の
レーザビームによるエナメル電線の絶縁膜剥離方法はい
くつかの問題点を擁している。
[Problem to be solved by the invention] G1. - In the method for stripping an insulating film using a laser beam, the pulsed laser with a short pulse and high peak output used generates plasma by aerial destruction at the condensing point 10, and the energy of the laser beam is It is consumed only for generation and does not cause the effect of peeling off the insulation film of the enamelled wire. If the laser output is lowered to a level where plasma generation does not occur, thin wires can be peeled off, but when the wire diameter becomes large, peeling becomes impossible. Moreover, even if the film can be peeled off, the peeling is not complete and quality remains a problem. As described above, the conventional method of stripping an insulating film from an enameled wire using a laser beam has several problems.

本発明は従来装置の上記問題点を解消するためになされ
たもので、細線から径の大きい線まで剥離可能であると
ともに、細線でも安定して剥離の可能なエナメル電線の
絶縁膜剥離方法を提供しようとするものである。
The present invention has been made in order to solve the above-mentioned problems of conventional devices, and provides a method for stripping insulating films from enameled electric wires, which is capable of stripping from thin wires to wires with large diameters, and is also capable of stably stripping even thin wires. This is what I am trying to do.

[課題を解決するための手段] 上記目的を達成するため、本発明に係るレーザビームに
よる剥離方法においては、レーザビーム照射を受けるエ
ナメル電線の位置を、レーザビームの集光レンズの焦点
近傍のプラズマ発生位置を避けた集光レンズ寄りの位置
とするとともに、レーザビーム照射に当たってエナメル
電線に対しレーザ吸熱効果を備えた次の前処理を行なう
[Means for Solving the Problem] In order to achieve the above object, in the peeling method using a laser beam according to the present invention, the position of the enameled electric wire to be irradiated with the laser beam is set to the plasma near the focal point of the condensing lens of the laser beam. At the same time, the enameled electric wire is placed at a position close to the condenser lens away from the generation position, and the following pretreatment is performed on the enamelled electric wire to provide a laser heat absorption effect upon irradiation with the laser beam.

■エナメル電線の剥離部分を加熱する。■Heat the peeled part of the enamel wire.

■エナメル電線の剥離部分を水に浸漬する。■Immerse the peeled part of the enamel wire in water.

■エナメル電線の剥離部分に傷をつける。■Do not damage the peeled part of the enamel wire.

[作用] エナメル電線のレーザビーム照射位置を集光レンズの焦
点近傍のプラズマ発生位置を避けた集光レンズ寄りの位
置としたので、レーザビームがプラズマ発生のためにエ
ネルギを消費することがなく剥離部分を加熱するので、
剥離の効果が上がる。
[Function] Since the laser beam irradiation position of the enameled electric wire was set close to the condenser lens, avoiding the plasma generation position near the focal point of the condenser lens, the laser beam can peel off without consuming energy for plasma generation. Because the part is heated,
Increases peeling effect.

また前処理を行うことにより剥離部分にレーザ吸熱効果
を生じ剥離効果が上がる。
Further, by performing pretreatment, a laser heat absorption effect is generated in the peeled portion, and the peeling effect is improved.

[発明の実施例コ 第1図はエナメル電線の加工位置を決めるための実験方
法を示す構成図で、図中4〜10は上記装置における同
一または相当部品である。焦点距離R1−95,3ts
の集光レンズ4を使用するレーザ装置において、エナメ
ル電線を集光レンズ4より1 −85++vの位置A1
8と、同II a −93mmの位置B19とに配置し
た場合の実験結果を第1表に示す。
Embodiment of the Invention FIG. 1 is a block diagram showing an experimental method for determining the processing position of an enamelled electric wire, and numerals 4 to 10 in the figure are the same or equivalent parts in the above-mentioned apparatus. Focal length R1-95, 3ts
In a laser device using a condensing lens 4 of
Table 1 shows the experimental results for the case where the sample was placed at the position B19 of II a -93 mm.

第1表が示すように、電線の加工位置はプラズマの影響
の少ない位置A18の方が極めて安定した剥離が可能で
ある。
As shown in Table 1, the wire processing position A18, which is less affected by plasma, allows for extremely stable peeling.

また第1表の実験No、7はエステルリミドヮイヤの例
であるが、加工位置Bであっても前処理を行わない場合
は、外観的には剥離ができていても芯線の表面に絶縁被
服材料が残り、ハンダがのらないことをしめしている。
In addition, experiment No. 7 in Table 1 is an example of ester limide wire, but if no pretreatment is performed even at processing position B, the surface of the core wire may be peeled off even if it appears to be peeled off. This shows that the insulation coating material remains and the solder does not adhere.

すなわちレーザビームの照射前に電線に何等かの処理が
必要であることが判る。
In other words, it can be seen that some kind of treatment is required for the electric wire before irradiation with the laser beam.

こうした実験結果を踏まえて構成した一実施例が第2図
に示すエナメル電線の絶縁膜剥離方法で、図中1〜10
は従来方法における装置と同一または相当部品、11は
吹付はノズル、12は加熱器、13は循環ファン、14
はガスダクト、15はガス供給装置、16はパワーダン
パ、17は加工室である。
One embodiment constructed based on these experimental results is a method for removing an insulating film from an enameled electric wire as shown in FIG.
11 is a nozzle for spraying, 12 is a heater, 13 is a circulation fan, 14 is the same or equivalent part as the device in the conventional method.
1 is a gas duct, 15 is a gas supply device, 16 is a power damper, and 17 is a processing chamber.

図にみるように、本発明に係るレーザ装置は、加熱器1
2、ファン13などよりなる加熱装置を備え、加熱した
不活性ガスをエナメル電線に吹付けられるように構成さ
れている。エナメル電線の絶縁膜剥離に当たっては、エ
ナメル電線9の剥離部分を集光レンズ4の焦点近傍のプ
ラズマ発生位置を避けた集光レンズ4寄りの位置に配置
し、レーザビーム照射前に上記加熱装置により不活性ガ
スを電線に吹付け、エナメル電線9を230〜250℃
の範囲で加熱し、その後レーザビームを照射する。この
結果電線の絶縁膜を極めてうまく剥離することができ、
ハンダもうまく載るようになった。
As shown in the figure, the laser device according to the present invention includes a heater 1
2. It is equipped with a heating device such as a fan 13, and is configured to spray heated inert gas onto the enamelled wire. When peeling off the insulating film of the enameled wire, the peeled part of the enameled wire 9 is placed in a position close to the condenser lens 4, avoiding the plasma generation position near the focal point of the condenser lens 4, and heated by the heating device described above before irradiation with the laser beam. Spray inert gas onto the wire and heat the enamel wire 9 to 230-250°C.
The material is heated in a range of As a result, the insulating film of the electric wire can be removed extremely well.
The solder also started to stick well.

第3図は他の実施例を示すもので、(a)は前処理方法
の説明図、(b)はレーザビーム照射の構成図である。
FIG. 3 shows another embodiment, in which (a) is an explanatory diagram of a preprocessing method, and (b) is a configuration diagram of laser beam irradiation.

図にみるように、エナメル電線の絶縁膜剥離に当たって
、前処理として電線の剥離部分20をビーカ21内の水
22内に7日間浸漬し、ソノ後レーザビームで剥離部分
を照射する。この結果は第1表NO19に示すもので、
好結果を得ている。
As shown in the figure, when removing the insulating film from the enameled wire, the peeled portion 20 of the wire is immersed in water 22 in a beaker 21 for seven days as a pretreatment, and after sowing, the peeled portion is irradiated with a laser beam. The results are shown in Table 1, No. 19.
We are getting good results.

第4図はさらに他の実施例を示す(a)は前処理方法の
説明図、(b)はレーザビームの照射の構成図である。
FIG. 4 shows still another embodiment, in which (a) is an explanatory diagram of a pretreatment method, and (b) is a configuration diagram of laser beam irradiation.

(a)図にみるようにカッタナイフ23により電線の絶
縁膜部分に傷を付け、その後(b)図にみるようにレー
ザビームの照射を行う。この場合も第1表No、 8に
みるように好結果を得ている。
(a) As shown in the figure, the insulating film portion of the electric wire is scratched with a cutter knife 23, and then (b) a laser beam is irradiated as shown in the figure. In this case as well, good results were obtained as shown in Table 1, No. 8.

なお上記第3図、第4図に示すレーザビーム照射におい
ては、電線の加工位置は前記実施例と同様に集光レンズ
4の焦点近傍のプラズマ発生位置を避けた集光レンズ4
寄りの位置である。
Note that in the laser beam irradiation shown in FIGS. 3 and 4 above, the processing position of the electric wire is set at the condenser lens 4 avoiding the plasma generation position near the focal point of the condenser lens 4, as in the above embodiment.
This is a close position.

なお上記3種類の前処理方法はそれぞれ個別に行っても
よく、またいずれか2種類を併用してもよい。
Note that the three types of pretreatment methods described above may be performed individually, or any two of them may be used in combination.

また集光レンズの代わりにシリンドリカルレンズを用い
ても同様な効果を上げることとなる。
Further, the same effect can be obtained even if a cylindrical lens is used instead of a condensing lens.

[発明の効果コ 本発明は、エナメル電線の絶縁膜剥離方法において、エ
ナメル電線の剥離部分にレーザ吸熱に有効な前処理を行
った後レーザビームによる照射を行い、そのレーザビー
ムによる加工位置を集光レンズ4の焦点近傍のプラズマ
発生位置を避けた集光レンズ4寄りの位置としたので、
径の小さい電線から径の大きい電線までその絶縁膜をう
まく剥離できるようになった。
[Effects of the Invention] The present invention is a method for stripping an insulating film of an enameled wire, in which the stripped portion of the enameled wire is subjected to a pretreatment effective for laser heat absorption, and then irradiated with a laser beam, and the processing position by the laser beam is focused. Since the plasma generation position near the focal point of the optical lens 4 was placed close to the condenser lens 4,
The insulating film can now be successfully removed from both small and large diameter wires.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はエナメル電線の絶縁膜剥離の実験方法を示す説
明図、第2図は本発明の一実施例である電線を加温した
後レーザビーム照射を行う剥離方法の説明図、第3図は
電線を水に浸漬後レーザビーム照射を行う他の実施例の
説明図、第4図は電線の絶縁膜に傷をつけた後レーザビ
ーム照射を行う他の実施例の説明図、第5図は従来のレ
ーザビーム照射による剥離方法の説明図である。 図中2はレーザビーム、4は集光レンズ、10はその焦
点、11は吹付はノズル、12は加熱器、13は循環フ
ァン、14はガスダクト、15はガス供給装置、16は
パワーダンパ、17は加工室、18は加工位置A119
は加工位置B、20は電線の剥離部分、22は水、23
はカッタナイフである。 なお図中の同一符号は同一または相当部品を示すものと
する。
Fig. 1 is an explanatory diagram showing an experimental method for peeling off the insulation film of an enameled electric wire, Fig. 2 is an explanatory diagram of a peeling method in which the electric wire is heated and then irradiated with a laser beam, which is an embodiment of the present invention, and Fig. 3 4 is an explanatory diagram of another embodiment in which laser beam irradiation is performed after the wire is immersed in water, FIG. 4 is an explanatory diagram of another embodiment in which laser beam irradiation is performed after the insulating film of the wire is damaged, and FIG. 5 FIG. 2 is an explanatory diagram of a conventional peeling method using laser beam irradiation. In the figure, 2 is a laser beam, 4 is a condensing lens, 10 is its focal point, 11 is a spray nozzle, 12 is a heater, 13 is a circulation fan, 14 is a gas duct, 15 is a gas supply device, 16 is a power damper, 17 is the processing room, 18 is the processing position A119
is the processing position B, 20 is the peeled part of the electric wire, 22 is water, 23
is a cutter knife. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (4)

【特許請求の範囲】[Claims] (1)レーザビームによるエナメル電線の絶縁膜剥離方
法において、 レーザビームによる照射の前に、レーザビームの吸熱性
を高めるための前処理を行ない、かつ上記レーザビーム
照射による電線の加工位置が、レーザビーム集光レンズ
の焦点近傍のプラズマ発生位置を避けた集光レンズ寄り
の位置である ことを特徴とするエナメル電線の絶縁膜剥離方法。
(1) In the method for removing the insulation film of an enameled electric wire using a laser beam, before irradiation with the laser beam, pretreatment is performed to increase the heat absorbing property of the laser beam, and the processing position of the electric wire by the laser beam irradiation is A method for stripping an insulating film of an enameled electric wire, characterized in that the plasma generation position near the focal point of a beam condensing lens is avoided and the insulating film is removed at a position near the condensing lens.
(2)上記前処理がエナメル電線を加温する方法である ことを特徴とする請求項1に記載のエナメル電線の絶縁
膜剥離方法。
(2) The method for peeling an insulating film from an enameled electric wire according to claim 1, wherein the pretreatment is a method of heating the enameled electric wire.
(3)上記前処理がエナメル電線を水中に浸漬する方法
である ことを特徴とする請求項1に記載のエナメル電線の絶縁
膜剥離方法。
(3) The method for removing an insulating film from an enameled electric wire according to claim 1, wherein the pretreatment is a method of immersing the enameled electric wire in water.
(4)上記前処理がエナメル電線の絶縁膜に傷をつける
方法である ことを特徴とする請求項1に記載のエナメル電線の絶縁
膜剥離方法。
(4) The method for peeling an insulating film of an enameled electric wire according to claim 1, wherein the pretreatment is a method of damaging the insulating film of the enamelled electric wire.
JP2004442A 1990-01-16 1990-01-16 Method for peeling insulating film of enameled wire Pending JPH03212109A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004442A JPH03212109A (en) 1990-01-16 1990-01-16 Method for peeling insulating film of enameled wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004442A JPH03212109A (en) 1990-01-16 1990-01-16 Method for peeling insulating film of enameled wire

Publications (1)

Publication Number Publication Date
JPH03212109A true JPH03212109A (en) 1991-09-17

Family

ID=11584322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004442A Pending JPH03212109A (en) 1990-01-16 1990-01-16 Method for peeling insulating film of enameled wire

Country Status (1)

Country Link
JP (1) JPH03212109A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0494833A (en) * 1990-08-10 1992-03-26 Matsushita Electric Works Ltd Method and device for stripping insulating layer
US5337941A (en) * 1993-03-31 1994-08-16 The Furukawa Electric Co., Ltd. Magnet wire having a high heat resistance and a method of removing insulating film covering magnet wire
NL9400983A (en) * 1993-07-26 1995-02-16 Mitsubishi Electric Corp Insulated wire.
JP2008234917A (en) * 2007-03-19 2008-10-02 Mitsubishi Electric Corp Manufacturing method of copper wire and copper wire coat peeling device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0494833A (en) * 1990-08-10 1992-03-26 Matsushita Electric Works Ltd Method and device for stripping insulating layer
US5337941A (en) * 1993-03-31 1994-08-16 The Furukawa Electric Co., Ltd. Magnet wire having a high heat resistance and a method of removing insulating film covering magnet wire
NL9400983A (en) * 1993-07-26 1995-02-16 Mitsubishi Electric Corp Insulated wire.
JP2008234917A (en) * 2007-03-19 2008-10-02 Mitsubishi Electric Corp Manufacturing method of copper wire and copper wire coat peeling device

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