JPH03210380A - Adhesive composition - Google Patents
Adhesive compositionInfo
- Publication number
- JPH03210380A JPH03210380A JP2004681A JP468190A JPH03210380A JP H03210380 A JPH03210380 A JP H03210380A JP 2004681 A JP2004681 A JP 2004681A JP 468190 A JP468190 A JP 468190A JP H03210380 A JPH03210380 A JP H03210380A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- pts
- adhesive composition
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 19
- 239000000203 mixture Substances 0.000 title claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 8
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 5
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 4
- 150000002009 diols Chemical class 0.000 claims abstract description 3
- 239000012948 isocyanate Substances 0.000 claims abstract description 3
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 3
- 239000000126 substance Substances 0.000 abstract description 7
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 3
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 abstract description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 6
- 239000011888 foil Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- KKKDZZRICRFGSD-UHFFFAOYSA-N 1-benzylimidazole Chemical compound C1=CN=CN1CC1=CC=CC=C1 KKKDZZRICRFGSD-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- XHLKOHSAWQPOFO-UHFFFAOYSA-N 5-phenyl-1h-imidazole Chemical compound N1C=NC=C1C1=CC=CC=C1 XHLKOHSAWQPOFO-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 glycidyl ester Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明はポリイミドフィルムと銅箔等の金属箔とを貼
り合わせて成るＦＰＣ用基板、ＴＡＢ用基板に使用され
る接着剤組成物に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to an adhesive composition used for FPC substrates and TAB substrates made by bonding polyimide films and metal foils such as copper foils. be.
「従来技術およびその問題点」
ポリイミドフィルムに銅箔等の金属箔を貼り合せて金属
張ポリイミドフィルムに形成し、この金属張ポリイミド
フィルムの金属箔の不要部をエツチングにより除去して
ＦＰＣ，ＴＡＢ用基板として用いる場合に、ポリイミド
フィルムと金属箔との間の貼り合せ用の接着剤の特性と
して、接着性・半田耐熱性・電気絶縁性・耐薬品性など
の特性が要求されると共に、製造過程における加熱加圧
の条件下で接着剤樹脂のフローが少ないと云う特性も要
求される。"Prior art and its problems" A metal foil such as copper foil is bonded to a polyimide film to form a metal-clad polyimide film, and unnecessary parts of the metal foil of this metal-clad polyimide film are removed by etching for use in FPCs and TABs. When used as a substrate, the adhesive for bonding polyimide film and metal foil must have properties such as adhesiveness, soldering heat resistance, electrical insulation, and chemical resistance, as well as the manufacturing process. The adhesive resin is also required to have a property that there is little flow under the heating and pressurizing conditions.
また他方では、ＴＡＢ用の回路基板において回路パター
ンのファイン化が進められ、１デバイス当たり１００ビ
ンから２００ビン〜４００ビンに増加することにより、
回路パターン幅が５０μｍ、回路パターン間隔が５０μ
ｍ程度にファイン化することが予定され、接着剤に対し
て接着強度、耐熱性、等の特性の優れたものが要求され
る。On the other hand, the refinement of circuit patterns on circuit boards for TAB is progressing, increasing from 100 bins to 200 to 400 bins per device.
Circuit pattern width is 50μm, circuit pattern spacing is 50μm
It is planned that the adhesive will be made finer than 0.0 m, and adhesives with excellent properties such as adhesive strength and heat resistance will be required.
従来この種の接着剤として、アクリロニトリルゴム系、
共重合ナイロン系、ブチラール−エポキシまたはフェノ
ール系などの接着剤が用いられていた。Conventional adhesives of this type include acrylonitrile rubber,
Adhesives such as copolymerized nylon, butyral-epoxy or phenol have been used.
しかし、上記接着剤では接着強度、耐熱性において所望
の要求を満たし得す、信頼性に欠けるという問題点があ
る。However, the above-mentioned adhesives have a problem in that they cannot meet the desired requirements in adhesive strength and heat resistance, and lack reliability.
口問題点を解決するための手段］
この発明は、上記の問題点を解決するために、（Ａ）平
均重合度が１０００〜２４００のブチラール樹脂１００
重量部と、（Ｂ）１分子中にエポキシ基を２個以上有す
るエポキシ樹脂７０〜１８０重量部と、（Ｃ）イソシア
ネートとジオールとを反応させてできるヒドロキシル末
端線状ポリウレタン樹脂２５〜７０重量部と、（Ｄ）硬
化剤、硬化促進剤とからなる接着剤組成物に構成したの
である。Means for Solving the Problems] In order to solve the above problems, the present invention provides (A) a butyral resin with an average degree of polymerization of 1000 to 2400.
(B) 70 to 180 parts by weight of an epoxy resin having two or more epoxy groups in one molecule, and (C) 25 to 70 parts by weight of a hydroxyl-terminated linear polyurethane resin produced by reacting isocyanate and diol. and (D) a curing agent and a curing accelerator.
本発明に用いられるブチラール樹脂は平均重合度が１０
００〜２４００のものを用いる。平均重合度が１０００
以下では耐熱性、耐薬品性において劣るものとなる。ブ
チラール樹脂の具体例として電気化学製ブチラール＃４
０００．＃５０００、＃６０００などがあげられ、最も
好ましいものはブチラール＃６０００である。The butyral resin used in the present invention has an average degree of polymerization of 10
00 to 2400 is used. Average degree of polymerization is 1000
Below that, the heat resistance and chemical resistance will be poor. Butyral #4 made by Denki Kagaku Co., Ltd. is a specific example of butyral resin.
000. Examples include #5000, #6000, and the most preferred is butyral #6000.
本発明に用いられるエポキシ樹脂は、分子中に２個以上
のエポキシ基を有するものであれば良いが、好ましくは
ビスフェノール型エポキシ樹脂、ノボラック型エポキシ
樹脂などのエステル型あるいはグリシジルエーテル型、
あるいは芳香族型エポキシ樹脂、環状脂肪族型エポキシ
樹脂などのエステル型あるいはグリシジルエステル型の
ものでも良い。更にはこれらのエポキシ樹脂のブレンド
系でも良い。とりわけ良好なものは、ビスフェノールＡ
型であり、具体的には旭化成製ＡＥＲ−３３１、ＡＥＲ
−３３７，ＡＥＲ−６６１などがあげられる。配合量に
おいてエポキシ樹脂が７０重量部以下になると電気絶縁
性が低下し、１８０重量部を越えると接着性が低下し且
つ銅箔貼り合わせ時の接着剤のニジミが多くなり本願発
明の目的を達し得ない。The epoxy resin used in the present invention may be one having two or more epoxy groups in the molecule, but is preferably an ester type or glycidyl ether type such as a bisphenol type epoxy resin or a novolac type epoxy resin.
Alternatively, an ester type or glycidyl ester type such as an aromatic type epoxy resin or a cycloaliphatic type epoxy resin may be used. Furthermore, a blend system of these epoxy resins may be used. Particularly good is bisphenol A
type, specifically Asahi Kasei AER-331, AER
-337, AER-661, etc. If the amount of the epoxy resin is less than 70 parts by weight, the electrical insulation properties will decrease, and if it exceeds 180 parts by weight, the adhesive will decrease and the adhesive will smear more when bonding the copper foils, so that the purpose of the present invention is not achieved. I don't get it.
本発明で用いられるヒドロキシル末端線状ポリウレタン
樹脂は、平均分子量１０万〜３０万、水酸基含有率０．
１〜０．２％のものが好ましく、例えば次のような分子
構造をしている。The hydroxyl-terminated linear polyurethane resin used in the present invention has an average molecular weight of 100,000 to 300,000 and a hydroxyl group content of 0.
It is preferably 1 to 0.2%, and has, for example, the following molecular structure.
［１行余白コ
但し、
Ｒ：アルキレン基またはアリーレン基
Ｒ’ 、Ｒ“：アルキレン基
ｎ絢１０ ｍ″ｆ６０
具体的には、住友バイエルウレタン製デスモコール５０
０．５１Ｏ８，５３０，５４０などが挙げられるが、接
着性、耐熱性の面からデスモコール５４０が最適である
。[1 line margin] However, R: alkylene group or arylene group R', R": alkylene group n 10 m" f 60 Specifically, Desmocol 50 manufactured by Sumitomo Bayer Urethane
Examples include 0.51O8, 530, and 540, but Desmocol 540 is most suitable in terms of adhesiveness and heat resistance.
配分量はヒドロキシル末端線状ポリウレタン樹脂が２５
重量部以下になると接着性が低下し７０重量部を越える
と耐熱性、電気絶縁性などが低下し、本願発明の目的を
達し得なくなる。The distribution amount is 25% of the hydroxyl-terminated linear polyurethane resin.
If the amount is less than 70 parts by weight, the adhesiveness will decrease, and if it exceeds 70 parts by weight, the heat resistance, electrical insulation properties, etc. will decrease, making it impossible to achieve the object of the present invention.
本願発明に用いられる硬化剤は、脂肪族および芳香族ポ
リアミン、酸無水物、イミダゾール誘導体、ジシアンジ
アミドなどが代表例としてあげることができる。とりわ
け良好なものの具体例をあげれば、ジアミノジフェニル
メタン、ジアミノジフェニルスルホンなどである。また
硬化を促進するためにイミダゾール誘導体を硬化促進剤
として併用することができる。具体的には、２−フェニ
ルイミダゾール、４−フェニルイミダゾール、２．４−
ジフェニルイミダゾール、２−フェニル−４−メチルイ
ミダゾール、２−フェニル−４−エチルイミタゾール、
１−ベンジルイミダゾールなどがあげられる。好ましく
は ２−フェニル−４−メチルイミダゾールである。Typical examples of the curing agent used in the present invention include aliphatic and aromatic polyamines, acid anhydrides, imidazole derivatives, and dicyandiamide. Specific examples of particularly good ones include diaminodiphenylmethane and diaminodiphenyl sulfone. Further, in order to accelerate curing, an imidazole derivative can be used in combination as a curing accelerator. Specifically, 2-phenylimidazole, 4-phenylimidazole, 2.4-
diphenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-ethylimitazole,
Examples include 1-benzylimidazole. Preferably it is 2-phenyl-4-methylimidazole.
［実施例１〜６］
先ず、ブチラール樹脂の所定量をアセトン／トルエン＝
１：１溶剤に溶解して２０％溶液を作成する。これに、
エポキシ樹脂をメチルエチルケトン（ＭＥＫ）に溶解さ
せたものを添加し、更に、ヒドロキシル末端線状ポリウ
レタン樹脂をアセトンに溶解させた１０％溶液を加える
。この溶液に所定量のジアミノジフェニルスルフォン（
ＤＤＳ）および２フエニル４メチルイミダゾール（２Ｐ
４ＭＺ）を溶解したメチルセルソルブ溶液を加えて接着
剤組成物を得た。[Examples 1 to 6] First, a predetermined amount of butyral resin was mixed with acetone/toluene=
Dissolve in 1:1 solvent to make a 20% solution. to this,
An epoxy resin dissolved in methyl ethyl ketone (MEK) is added, followed by a 10% solution of a hydroxyl-terminated linear polyurethane resin dissolved in acetone. Add a predetermined amount of diaminodiphenylsulfone (
DDS) and 2 phenyl 4 methylimidazole (2P
A methylcellosolve solution in which 4MZ) was dissolved was added to obtain an adhesive composition.
これを７５μｍ厚のポリイミドフィルム（宇部興産製ユ
ービレックスＳタイプ）に２０μｍの塗工厚になるよう
にコンマバー塗工し１５０℃で４分間乾燥させ、その後
に３５μｍ厚の銅箔を重ね合せて１３０℃に加熱した熱
ロールを用いロール圧３ｋｇｆ／−で加圧し２時間硬化
させて銅張ポリイミドフィルムを作成した。その際の接
着剤組成の配合割合は第１表に示す通りである。接着剤
組成の各種の配合割合の銅張ポリイミドフィルムについ
て、接着性、半田耐熱性、耐薬品性、電気絶縁性の試験
を行いその結果を第１表に併せて示した。This was coated with a comma bar to a 75 μm thick polyimide film (Ubilex S type manufactured by Ube Industries) to a coating thickness of 20 μm, dried at 150°C for 4 minutes, and then overlaid with 35 μm thick copper foil to give a coating thickness of 130 μm. A copper-clad polyimide film was prepared by applying pressure with a roll pressure of 3 kgf/- using a hot roll heated to .degree. C. and curing for 2 hours. The blending ratio of the adhesive composition at that time is as shown in Table 1. Tests for adhesion, soldering heat resistance, chemical resistance, and electrical insulation were conducted on copper-clad polyimide films with various blending ratios of adhesive compositions, and the results are also shown in Table 1.
接着性は銅箔の両側に切り込みを入れ基板面に対して９
０度の方向に引き剥す際に必要な力を測定した。Adhesiveness is determined by making cuts on both sides of the copper foil and attaching it to the board surface.
The force required to peel off in the 0 degree direction was measured.
半田耐熱性は３００℃の半田浴に２分間フロートさせた
後の銅箔の基材よりの剥離を観察し判定した。Solder heat resistance was determined by observing peeling of the copper foil from the base material after floating it in a 300° C. solder bath for 2 minutes.
耐薬品性は常温で１５分間各種の薬品に浸漬後の接着剤
の外観を観察し良否を判定した。Chemical resistance was determined by observing the appearance of the adhesive after immersing it in various chemicals for 15 minutes at room temperature.
電気絶縁性は５龍巾の銅箔を１ｕ間隔に形成して銅箔間
に１００■の電圧を印加したときの絶縁抵抗を測定した
。The electrical insulation property was measured by forming copper foils of 5 widths at intervals of 1 μ and measuring the insulation resistance when a voltage of 100 μ was applied between the copper foils.
［以下１１行余白］
［発明の効果］
本発明の接着剤組成物は上述したように（Ａ）ブチラー
ル樹脂（Ｂ）エポキシ樹脂（Ｃ）ヒドロキシル末端線状
ポリウレタン樹脂および（Ｄ）硬化剤から構成すること
により、接着性・加工性・半田耐熱性耐薬品性・電気絶
縁性に優れた効果を発揮するものとなり、ポリイミドフ
ィルムと銅箔等金属箔と貼り合わせて成る回路基板用と
して好適に使用することができるものである。[11 blank lines below] [Effects of the Invention] As described above, the adhesive composition of the present invention is composed of (A) a butyral resin, (B) an epoxy resin, (C) a hydroxyl-terminated linear polyurethane resin, and (D) a curing agent. As a result, it exhibits excellent adhesion, processability, soldering heat resistance, chemical resistance, and electrical insulation properties, making it suitable for use in circuit boards made by laminating polyimide film and metal foil such as copper foil. It is something that can be done.
Claims (1)
脂１００重量部と、（Ｂ）１分子中にエポキシ基を２個
以上有するエポキシ樹脂７０〜１８０重量部と、（Ｃ）
イソシアネートとジオールとを反応させてできるヒドロ
キシル末端線状ポリウレタン樹脂２５〜７０重量部と、
（Ｄ）硬化剤および硬化促進剤とからなる接着剤組成物
。(A) 100 parts by weight of a butyral resin with an average degree of polymerization of 1000 to 2400; (B) 70 to 180 parts by weight of an epoxy resin having two or more epoxy groups in one molecule; (C)
25 to 70 parts by weight of a hydroxyl-terminated linear polyurethane resin produced by reacting an isocyanate and a diol;
(D) An adhesive composition comprising a curing agent and a curing accelerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004681A JP2844235B2 (en) | 1990-01-12 | 1990-01-12 | Adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004681A JP2844235B2 (en) | 1990-01-12 | 1990-01-12 | Adhesive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03210380A true JPH03210380A (en) | 1991-09-13 |
| JP2844235B2 JP2844235B2 (en) | 1999-01-06 |
Family
ID=11590636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004681A Expired - Fee Related JP2844235B2 (en) | 1990-01-12 | 1990-01-12 | Adhesive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2844235B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113845866A (en) * | 2021-11-18 | 2021-12-28 | 广州联茂电子科技有限公司 | Epoxy compound adhesive, covering film and preparation method |
| WO2024005072A1 (en) * | 2022-06-28 | 2024-01-04 | 株式会社寺岡製作所 | Adhesive composition, adhesive layer including adhesive composition, and adhesive sheet comprising adhesive layer |
-
1990
- 1990-01-12 JP JP2004681A patent/JP2844235B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113845866A (en) * | 2021-11-18 | 2021-12-28 | 广州联茂电子科技有限公司 | Epoxy compound adhesive, covering film and preparation method |
| WO2024005072A1 (en) * | 2022-06-28 | 2024-01-04 | 株式会社寺岡製作所 | Adhesive composition, adhesive layer including adhesive composition, and adhesive sheet comprising adhesive layer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2844235B2 (en) | 1999-01-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |