JPH0320985A - Connector - Google Patents

Abstract

PURPOSE:To obtain the precise positioning function by providing elliptic or rectangular positioning guide holes on a connector. CONSTITUTION:When a module is to be coupled with a connector, input/output signal pins 23 of the module are guided to signal pin coupling guide holes 13 of the connector by the positioning between positioning guide pins 24 of the module end positioning guide holes 16 of the connector before input/output signal pins 23 of the module are brought into contact with a connector housing 11. Guide holes 16 provided at four corners of the housing 11 are formed in an elliptic or rectangular shape radially from the center of the connector. The positioning precision when the module and connector are coupled is not reduced when the ambient temperature changes and a difference in size is generated between them.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a connector, and particularly to a high-density connector used for fitting high-density, multi-pin hybrid modules such as electronic computers or communication devices.

[Conventional technology]

Generally, in logic devices such as electronic computers, many LSI chips are mounted on a ceramic substrate to achieve high density.
On the opposite side of the ceramic substrate, a hybrid module with a bottle erected is used for signal connection with the outside. This module is used by either soldering directly onto the printed circuit board or by mating with a module connector attached to the printed circuit board. FIG. 5 shows an example of a hybrid module, in which an LSI 21 is mounted on a multilayer ceramic substrate 22 by soldering, etc., and input/output signal pins 2 are mounted on the opposite side of the LSI 21.
It has a structure of 3. If this hybrid module has many pins, a connector is used so that it can be easily replaced in the event of a defect or failure of the LSI. Figure 6 shows an example of the structure of a conventional connector for this type of module. The connector has a large number of socket contacts 12 built into a molded housing 11, and a guide hole 13 for fitting the signal pin of the module is provided in the upper surface of the housing 11. FIG. 7 is a plan view of the connector, and the fitting guide hole 13 has a round or square shape. The connector is held in its entirety by having contact leads 14 pulled out from the contact area 2, inserting the leads 14 into a printed circuit board 15, and soldering them.

When fitting a module to a connector, insert the input/output signal pin 23 of the module into the fitting guide hole 13 of the connector 11.
However, if the position shifts at this time, the pins 23 of the module will hit the surface of the housing 11 of the connector, and the diameter will be 0.2 to 0. If the bottle is as thin as 4 m+m, the pins will easily bend or the bottle will break, resulting in the destruction of the expensive module. To prevent this,
It is necessary to align the pins of the module with the sockets of the connector in some way.

Conventionally, the following two methods have been used to align the pins of this module and the socket of the connector. 1st
The method is described, for example, in Nikkei Electronics, June 1985.
- As shown in No. 17, page 261, this is a method in which fixing metal fittings are attached around the module and connector, a positioning pin and a hole are provided in the metal fitting, and positioning is performed using the pin and hole. . The second method is to set up a round pin for the insertion guide on the outer periphery of the ceramic board of the module and insert the round pin for the guide around the periphery of the connector housing without using a guide fitting. This is a method of positioning by providing a guide hole. In this case, make the module's guide pin longer than the input/output signal pin, and position the module's input/output signal pin with the guide hole before the input/output signal bin hits the connector housing. It is designed to guide the signal bottle into the guide hole for fitting.

[Problem to be solved by the invention]

In the above conventional technology, the method of attaching the fixing and insertion/extraction guide fittings to the module and connector takes into consideration the accuracy of the fittings, making it difficult to obtain the relative accuracy between the input/output signal bin of the module and the socket contact in the connector. , and in order to improve accuracy, the metal fittings have to be processed at a higher quality, resulting in higher costs.

On the other hand, the method of setting round guide pins on the module and drilling round guide holes on the connector is inexpensive, but if the molding materials of the module board and connector are different, the thermal expansion coefficients may not be the same. However, it is necessary to provide guide holes taking into account the difference in thermal expansion corresponding to temperature changes during use, which poses a problem of lowering positioning accuracy.

The purpose of the present invention is to take into account the difference in thermal expansion between the module substrate and the connector molding material due to the temperature change, and to
An object of the present invention is to provide a guide structure for a connector that is inexpensive and has a highly accurate positioning function.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a housing made of plastic resin or the like, on the periphery of the surface where a large number of fitting guide holes are provided corresponding to the pins of the module.
For example, a plurality of elliptical or rectangular guide holes are provided radially.

[For production]

For the elliptical or rectangular guide holes provided around the connector housing, the module has multiple guide pins placed around the ceramic board.

The positioning guide pins erected around this module are made longer than the input/output signal pins, allowing for high positional accuracy with respect to the input/output signal pins. On the other hand, the guide holes on the connector housing are also made of the same mold as the guide holes for fitting the input/output signal pins, so high precision can be achieved. Therefore, by inserting the guide pins of the module into the guide holes of the connector and positioning them, the relative positions between the input/output pins of the module and the contacts of the connector can be adjusted with high precision. In addition, even if the relative dimensions of the guide pin and guide hole change due to expansion of the module and connector due to temperature rise during use, the guide hole on the connector is made oval or rectangular to avoid collision, resulting in damage or deformation of the pin. can be prevented. [Example] Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of one embodiment of the connector of the present invention.

In FIG. 1, the housing 11 is molded and
A large number of socket contacts 12 are accommodated therein, and guide holes 13 for fitting signal pins of the module are provided on the upper surface of the contacts. socket contact {2
The contacts 1 to 14 are pulled out downward from the terminal, and the leads 14 are soldered to the printed circuit board 15. 16
denotes a positioning guide hole, and a plurality of positioning guide holes are provided in a radial elliptical or rectangular shape around the signal pin fitting guide hole l3 on the housing 11.

2 and 3 are plan views of the connector, and FIG. 2 shows the case where oval positioning guide holes 16 are provided radially around the periphery of the housing l1, and FIG. 3 shows the case where the positioning guide holes 16 are rectangular. 16 is similarly provided radially.

Figure 4 shows an example of the structure of a hybrid module used in combination with the connector shown in Figure 1. The module is -LS
I21 is mounted on the surface of a ceramic substrate 22, and a large number of input/output signal bins 23 are erected on the back surface of the ceramic substrate 22, and positioning holes corresponding to the connector positioning guide holes 16 are provided around them. It has a structure in which a plurality of round pins 24 are provided. In addition, the positioning guide pin 24
should be longer than the input/output signal pin 23. When fitting a module to a connector, before the input/output signal pin 23 of the module hits the housing 11 of the connector, the input/output signal of the module is detected by positioning between the module positioning guide pin 24 and the connector positioning guide hole 16. Connect pin 23 to signal pin fitting guide hole 1 of the connector.
Try to invite them to 3. In this case, when the pin pitch becomes high, the allowable deviation amount between the module's signal pin 23 and the connector's signal bin guide hole 13 becomes smaller, and the play between the module's positioning guide pin 24 and the connector's positioning guide hole l6 becomes smaller. It is necessary to make it small and enable high-precision positioning. However, if there is a large difference in thermal expansion coefficient between the ceramic substrate 22 of the module and the molded resin of the connector housing, it is necessary to adjust the diameter of the guide hole 16 of the connector and the guide pin 24 of the module in order to ensure accurate fitting at room temperature. Although it is necessary to reduce the difference in diameter, a large dimensional difference occurs between the connector and the module board due to temperature rise due to heat generated by the module during use. For example, the ceramic substrate 22 of the module has a coefficient of thermal expansion of (3 to 4)
0) There is almost an order of magnitude difference from XIO-', and the total length is 100mm.
0.1-0.2m with a temperature rise of 50-60℃
The difference in size is m. For this reason, if the positioning guide hole l6 of the connector is made circular, the guide pin 24 of the module will collide with the side of the guide hole king 6 of the connector at high temperatures.
It may damage the pin. Also, leave the module inserted in the connector. If exposed to a low-temperature environment during @feeding, the mold will shrink thicker, contrary to the above, and the pin will also be damaged.

However, if the diameter of the positioning guide hole of the connector is increased while remaining circular for this purpose, the positioning accuracy during fitting will deteriorate, leading to damage to the input/output signal pin 23 of the module.

In contrast, in the connector of the present invention, as shown in FIGS. 2 and 3, the positioning guide holes 16 provided at the four corners of the housing 11 of the connector are formed into elliptical or rectangular shapes radiating from the center of the connector. Even if the ambient temperature of the module and connector changes and a dimensional difference occurs between them, it is possible to prevent the positioning accuracy of the fitting characteristics between the two from decreasing. [Effects of the Invention] As explained above, by using the connector having an oval or rectangular positioning guide hole of the present invention,
When the temperature rises or falls, the play between the guide hole of the connector and the pin of the module can be kept constant, and a decrease in positioning accuracy due to the difference in expansion between the connector and the module can be prevented. In addition, by setting guide pins on the module and providing guide holes on the connector, the accuracy of the input/output signal bin and connector contacts can be ensured, and an inexpensive guide structure can be provided.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the connector of the present invention, FIGS. 2 and 3 are plan views of the connector of FIG. 1, and FIG. 4 is a front view of a hybrid module used with the connector of the present invention. Figure 5 is a front view of a hybrid module without guide pins, Figure 6 is a cross-sectional view of a conventional connector,
FIG. 7 is a plan view of the connector of FIG. 6. DESCRIPTION OF SYMBOLS 11... Connector housing, 12... Socket contact, l3... Signal bottle fitting guide hole, l6... Positioning guide hole, 21... LSI. 22... Ceramic substrate, 2
3... Input/output signal pin, 24... Positioning guide pin. 1G weight large Figure 5 Figure 6 Figure 7

Claims (1)

[Claims] (1) A connector in which a plurality of fitting guide holes corresponding to connecting pins of an electronic component are provided on a molded housing, and contacts are accommodated in the fitting guide holes, wherein the connecting pin of the housing is provided. A connector comprising a plurality of positioning guide holes provided in an elliptical or rectangular shape for a plurality of positioning guide pins provided on the electronic component on the periphery of a surface on which the fitting guide holes are provided.