JPH0320464U - - Google Patents
Info
- Publication number
- JPH0320464U JPH0320464U JP8112189U JP8112189U JPH0320464U JP H0320464 U JPH0320464 U JP H0320464U JP 8112189 U JP8112189 U JP 8112189U JP 8112189 U JP8112189 U JP 8112189U JP H0320464 U JPH0320464 U JP H0320464U
- Authority
- JP
- Japan
- Prior art keywords
- copper paste
- power supply
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8112189U JPH0320464U (de) | 1989-07-10 | 1989-07-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8112189U JPH0320464U (de) | 1989-07-10 | 1989-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0320464U true JPH0320464U (de) | 1991-02-28 |
Family
ID=31626780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8112189U Pending JPH0320464U (de) | 1989-07-10 | 1989-07-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0320464U (de) |
-
1989
- 1989-07-10 JP JP8112189U patent/JPH0320464U/ja active Pending