JPH0320449U - - Google Patents

Info

Publication number
JPH0320449U
JPH0320449U JP1989081283U JP8128389U JPH0320449U JP H0320449 U JPH0320449 U JP H0320449U JP 1989081283 U JP1989081283 U JP 1989081283U JP 8128389 U JP8128389 U JP 8128389U JP H0320449 U JPH0320449 U JP H0320449U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
lead terminal
external lead
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989081283U
Other languages
English (en)
Other versions
JPH0627960Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989081283U priority Critical patent/JPH0627960Y2/ja
Publication of JPH0320449U publication Critical patent/JPH0320449U/ja
Application granted granted Critical
Publication of JPH0627960Y2 publication Critical patent/JPH0627960Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す断面構造図、第
２図は外部リード端子の斜視構造図、第３図はハ
ンダ部材の長さと過電流の関係曲線であり、１…
…支持板、２……半導体チツプ、３……接続子、
４……外部リード端子、５……樹脂封止、Ａ……
ハンダ部材、Ｂ……軟質樹脂部である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 少なくとも半導体チツプ及び外部リード端
    子から成る樹脂封止型半導体装置において、外部
    リード端子の内、樹脂封止内に埋設される板状又
    は棒状部分に、該板状又は棒状部分とほぼ同一の
    断面積をもつハンダ部分を介在させ、所定の電流
    値を超えて通電したとき、該ハンダ部材の抵抗値
    を急激に増加させるように構成したことを特徴と
    する樹脂封止型半導体装置。 (2) 軟質樹脂材でハンダ部材の周囲の一部又は
    全部を被覆した実用新案登録請求の範囲第(1)項
    の樹脂封止型半導体装置。
JP1989081283U 1989-07-11 1989-07-11 樹脂封止型半導体装置 Expired - Lifetime JPH0627960Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989081283U JPH0627960Y2 (ja) 1989-07-11 1989-07-11 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989081283U JPH0627960Y2 (ja) 1989-07-11 1989-07-11 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPH0320449U true JPH0320449U (ja) 1991-02-28
JPH0627960Y2 JPH0627960Y2 (ja) 1994-07-27

Family

ID=31627087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989081283U Expired - Lifetime JPH0627960Y2 (ja) 1989-07-11 1989-07-11 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPH0627960Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153463A (ja) * 2006-12-18 2008-07-03 Mitsubishi Electric Corp 樹脂封止型半導体装置
JP2008227131A (ja) * 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
JP2015041676A (ja) * 2013-08-21 2015-03-02 三菱電機株式会社 電力用半導体装置およびその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153463A (ja) * 2006-12-18 2008-07-03 Mitsubishi Electric Corp 樹脂封止型半導体装置
JP4615506B2 (ja) * 2006-12-18 2011-01-19 三菱電機株式会社 樹脂封止型半導体装置
JP2008227131A (ja) * 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
JP2015041676A (ja) * 2013-08-21 2015-03-02 三菱電機株式会社 電力用半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPH0627960Y2 (ja) 1994-07-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term