JPH03199253A - Polyester resin composition - Google Patents
Polyester resin compositionInfo
- Publication number
- JPH03199253A JPH03199253A JP34468789A JP34468789A JPH03199253A JP H03199253 A JPH03199253 A JP H03199253A JP 34468789 A JP34468789 A JP 34468789A JP 34468789 A JP34468789 A JP 34468789A JP H03199253 A JPH03199253 A JP H03199253A
- Authority
- JP
- Japan
- Prior art keywords
- polyester resin
- resin composition
- bis
- group
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 25
- 229920001225 polyester resin Polymers 0.000 title claims abstract description 19
- 239000004645 polyester resin Substances 0.000 title claims abstract description 19
- -1 polybutylene terephthalate Polymers 0.000 claims abstract description 33
- 229920001707 polybutylene terephthalate Polymers 0.000 claims abstract description 11
- 229920006230 thermoplastic polyester resin Polymers 0.000 claims abstract description 10
- 125000003118 aryl group Chemical group 0.000 claims abstract description 8
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 5
- 229920001577 copolymer Polymers 0.000 claims abstract description 3
- 125000000962 organic group Chemical group 0.000 claims abstract description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims abstract description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000005977 Ethylene Substances 0.000 claims abstract 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000000126 substance Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 abstract description 18
- 238000002156 mixing Methods 0.000 abstract description 8
- 230000000704 physical effect Effects 0.000 abstract description 8
- 239000003963 antioxidant agent Substances 0.000 abstract description 7
- 238000000465 moulding Methods 0.000 abstract description 4
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 abstract description 3
- 230000003078 antioxidant effect Effects 0.000 abstract description 2
- 239000011342 resin composition Substances 0.000 abstract description 2
- 150000001408 amides Chemical class 0.000 abstract 2
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 238000006467 substitution reaction Methods 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 description 13
- 239000002253 acid Substances 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 229920000728 polyester Polymers 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000007774 longterm Effects 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- 238000006068 polycondensation reaction Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 125000003107 substituted aryl group Chemical group 0.000 description 3
- VNXJRBGZIXAZRZ-UHFFFAOYSA-N 1-n,4-n-bis(2-hydroxyethyl)benzene-1,4-dicarboxamide Chemical compound OCCNC(=O)C1=CC=C(C(=O)NCCO)C=C1 VNXJRBGZIXAZRZ-UHFFFAOYSA-N 0.000 description 2
- HIGNUZCYRQTKJH-UHFFFAOYSA-N 3-[[3-(2-carboxyethylcarbamoyl)benzoyl]amino]propanoic acid Chemical compound OC(=O)CCNC(=O)C1=CC=CC(C(=O)NCCC(O)=O)=C1 HIGNUZCYRQTKJH-UHFFFAOYSA-N 0.000 description 2
- UJILDELNQBKFJB-UHFFFAOYSA-N 4-[[3-(3-carboxypropylcarbamoyl)benzoyl]amino]butanoic acid Chemical compound OC(=O)CCCNC(=O)C1=CC=CC(C(=O)NCCCC(O)=O)=C1 UJILDELNQBKFJB-UHFFFAOYSA-N 0.000 description 2
- JQHYFILQXICLMR-UHFFFAOYSA-N 4-[[4-(3-carboxypropylcarbamoyl)benzoyl]amino]butanoic acid Chemical compound OC(=O)CCCNC(=O)C1=CC=C(C(=O)NCCCC(O)=O)C=C1 JQHYFILQXICLMR-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Chemical group 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000002993 cycloalkylene group Chemical group 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical compound NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000547 substituted alkyl group Chemical group 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- RGASRBUYZODJTG-UHFFFAOYSA-N 1,1-bis(2,4-ditert-butylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C RGASRBUYZODJTG-UHFFFAOYSA-N 0.000 description 1
- VKFJRODGSPLZTD-UHFFFAOYSA-N 1-n,3-n-bis(2-hydroxyethyl)benzene-1,3-dicarboxamide Chemical compound OCCNC(=O)C1=CC=CC(C(=O)NCCO)=C1 VKFJRODGSPLZTD-UHFFFAOYSA-N 0.000 description 1
- MKCKORDBPQHSTK-UHFFFAOYSA-N 1-n,3-n-bis(3-hydroxypropyl)benzene-1,3-dicarboxamide Chemical compound OCCCNC(=O)C1=CC=CC(C(=O)NCCCO)=C1 MKCKORDBPQHSTK-UHFFFAOYSA-N 0.000 description 1
- ROHSLYYOPPECMM-UHFFFAOYSA-N 1-n,4-n-bis(2-hydroxypropyl)benzene-1,4-dicarboxamide Chemical compound CC(O)CNC(=O)C1=CC=C(C(=O)NCC(C)O)C=C1 ROHSLYYOPPECMM-UHFFFAOYSA-N 0.000 description 1
- ZZSCJFCZZMKSQF-UHFFFAOYSA-N 1-n,4-n-bis(3-hydroxypropyl)benzene-1,4-dicarboxamide Chemical compound OCCCNC(=O)C1=CC=C(C(=O)NCCCO)C=C1 ZZSCJFCZZMKSQF-UHFFFAOYSA-N 0.000 description 1
- TUYBEVLJKZQJPO-UHFFFAOYSA-N 19-(3,5-ditert-butyl-4-hydroxyphenyl)heptatriacontan-19-ylphosphonic acid Chemical compound CCCCCCCCCCCCCCCCCCC(CCCCCCCCCCCCCCCCCC)(P(O)(O)=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 TUYBEVLJKZQJPO-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FEXBEKLLSUWSIM-UHFFFAOYSA-N 2-Butyl-4-methylphenol Chemical compound CCCCC1=CC(C)=CC=C1O FEXBEKLLSUWSIM-UHFFFAOYSA-N 0.000 description 1
- ZUHPIMDQNAGSOV-UHFFFAOYSA-N 2-benzyl-2-phenylpropanedioic acid Chemical compound C=1C=CC=CC=1C(C(=O)O)(C(O)=O)CC1=CC=CC=C1 ZUHPIMDQNAGSOV-UHFFFAOYSA-N 0.000 description 1
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 1
- ODJQKYXPKWQWNK-UHFFFAOYSA-L 3-(2-carboxylatoethylsulfanyl)propanoate Chemical compound [O-]C(=O)CCSCCC([O-])=O ODJQKYXPKWQWNK-UHFFFAOYSA-L 0.000 description 1
- WPMYUUITDBHVQZ-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoic acid Chemical compound CC(C)(C)C1=CC(CCC(O)=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-N 0.000 description 1
- SPCDXTRMGAWWQO-UHFFFAOYSA-N 3-[[3-(2-carboxyethylamino)-3-oxopropanoyl]amino]propanoic acid Chemical compound OC(=O)CCNC(=O)CC(=O)NCCC(O)=O SPCDXTRMGAWWQO-UHFFFAOYSA-N 0.000 description 1
- LJHGNWFRCPCFMW-UHFFFAOYSA-N 3-[[4-(2-carboxyethylamino)-4-oxobutanoyl]amino]propanoic acid Chemical compound OC(=O)CCNC(=O)CCC(=O)NCCC(O)=O LJHGNWFRCPCFMW-UHFFFAOYSA-N 0.000 description 1
- QBCJYUYHMPMKDO-UHFFFAOYSA-N 3-[[4-(2-carboxyethylcarbamoyl)benzoyl]amino]propanoic acid Chemical compound OC(=O)CCNC(=O)C1=CC=C(C(=O)NCCC(O)=O)C=C1 QBCJYUYHMPMKDO-UHFFFAOYSA-N 0.000 description 1
- OSKUWLFGNONNIR-UHFFFAOYSA-N 3-[[5-(2-carboxyethylamino)-5-oxopentanoyl]amino]propanoic acid Chemical compound OC(=O)CCNC(=O)CCCC(=O)NCCC(O)=O OSKUWLFGNONNIR-UHFFFAOYSA-N 0.000 description 1
- VKLOPQHLJNFYKK-UHFFFAOYSA-N 3-dodecylsulfanylpropanoic acid Chemical compound CCCCCCCCCCCCSCCC(O)=O VKLOPQHLJNFYKK-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- MLQABRFZVKQENQ-UHFFFAOYSA-N 4-[[3-(3-carboxypropylamino)-3-oxopropanoyl]amino]butanoic acid Chemical compound OC(=O)CCCNC(=O)CC(=O)NCCCC(O)=O MLQABRFZVKQENQ-UHFFFAOYSA-N 0.000 description 1
- GSMOHXDXSGPUPM-UHFFFAOYSA-N 4-[[5-(3-carboxypropylamino)-5-oxopentanoyl]amino]butanoic acid Chemical compound OC(=O)CCCNC(=O)CCCC(=O)NCCCC(O)=O GSMOHXDXSGPUPM-UHFFFAOYSA-N 0.000 description 1
- NHUOVGCDWFKXOD-UHFFFAOYSA-N 4-[[6-(3-carboxypropylamino)-6-oxohexanoyl]amino]butanoic acid Chemical compound OC(=O)CCCNC(=O)CCCCC(=O)NCCCC(O)=O NHUOVGCDWFKXOD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- HGQHSVUYTYOICO-UHFFFAOYSA-N C(C)(C)(C)OC(C(=C)C1=CC=C(C=C1CC1=C(C(=CC(=C1)C)C(C)(C)C)O)C)=O Chemical compound C(C)(C)(C)OC(C(=C)C1=CC=C(C=C1CC1=C(C(=CC(=C1)C)C(C)(C)C)O)C)=O HGQHSVUYTYOICO-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- QAEPIAHUOVJOOM-UHFFFAOYSA-N OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC Chemical compound OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC QAEPIAHUOVJOOM-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 235000010582 Pisum sativum Nutrition 0.000 description 1
- 240000004713 Pisum sativum Species 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- SZKKRCSOSQAJDE-UHFFFAOYSA-N Schradan Chemical group CN(C)P(=O)(N(C)C)OP(=O)(N(C)C)N(C)C SZKKRCSOSQAJDE-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- IFVTZJHWGZSXFD-UHFFFAOYSA-N biphenylene Chemical group C1=CC=C2C3=CC=CC=C3C2=C1 IFVTZJHWGZSXFD-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000003869 coulometry Methods 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- IPZJQDSFZGZEOY-UHFFFAOYSA-N dimethylmethylene Chemical group C[C]C IPZJQDSFZGZEOY-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 1
- RRZCFXQTVDJDGF-UHFFFAOYSA-N dodecyl 3-(3-octadecoxy-3-oxopropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC RRZCFXQTVDJDGF-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- WRIRWRKPLXCTFD-UHFFFAOYSA-N malonamide Chemical compound NC(=O)CC(N)=O WRIRWRKPLXCTFD-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- OSGRUAAPIRXZTJ-UHFFFAOYSA-N n,n'-bis(2-hydroxyethyl)hexanediamide Chemical compound OCCNC(=O)CCCCC(=O)NCCO OSGRUAAPIRXZTJ-UHFFFAOYSA-N 0.000 description 1
- VETNKKRRBZTKDW-UHFFFAOYSA-N n,n'-bis(3-hydroxypropyl)hexanediamide Chemical compound OCCCNC(=O)CCCCC(=O)NCCCO VETNKKRRBZTKDW-UHFFFAOYSA-N 0.000 description 1
- QEGUKPBWRNAZOV-UHFFFAOYSA-N n,n'-bis(3-hydroxypropyl)pentanediamide Chemical compound OCCCNC(=O)CCCC(=O)NCCCO QEGUKPBWRNAZOV-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はポリエステル樹脂組成物に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to polyester resin compositions.
更に詳しくは、耐熱性、特に高温下での耐久性が改良さ
れた熱可塑性ポリエステル樹脂組成物に関するものであ
る。More specifically, the present invention relates to a thermoplastic polyester resin composition with improved heat resistance, particularly durability under high temperatures.
結晶性熱可塑性ポリエステル樹脂、例えばポリアルキレ
ンテレフタレート樹脂等は機械的性質、電気的性質、そ
の他物理的・化学的特性に優れ、かつ、加工性が良好で
あるがゆえにエンジニアリングプラスチックとして自動
車、電気・電子部品等の広汎な用途に使用されている。Crystalline thermoplastic polyester resins, such as polyalkylene terephthalate resins, have excellent mechanical properties, electrical properties, and other physical and chemical properties, and are easy to process, so they are used as engineering plastics in automobiles, electrical and electronics. It is used for a wide range of purposes such as parts.
しかしながら、用途の拡大、多様化に伴い、樹脂に対し
ては更に高度な性能や特殊性が求められる事が多く、こ
の様な特性の一つに、耐久性、特に高温雰囲気での長期
的な使用に対する物性の安定性(長期耐熱性)が要求さ
れる場合が増大しつつある。However, with the expansion and diversification of applications, resins are often required to have even higher performance and special properties, and one of these characteristics is durability, especially long-term durability in high-temperature atmospheres. Stability of physical properties (long-term heat resistance) during use is increasingly required.
例えば、自動車業界では、安全上の必要性から、熱可塑
性ポリエステル樹脂の物性が、高温度下で、長期間の使
用においても保持されることが要望される。For example, in the automotive industry, safety requirements require that the physical properties of thermoplastic polyester resins be maintained even at high temperatures and during long-term use.
かかる要求に応えるため、従来まり熱可塑性ポリエステ
ル樹脂にエポキシ樹脂、ポリカルボジイミド等を配合す
る方法等が提案されている。In order to meet such demands, methods have been proposed in which epoxy resins, polycarbodiimides, etc. are blended with thermoplastic polyester resins.
ところが、これらの添加剤が配合されたポリエステル樹
脂でも、長期耐熱性は未だ十分でなく、その解決が切望
されていた。However, even polyester resins containing these additives still do not have sufficient long-term heat resistance, and a solution to this problem has been desired.
本発明者等は、かかる要求に鑑み、優れた機械的性質、
成形加工性等を損なうことなく、耐久性特に高温下で長
期間使用しても物性の低下することのないポリエステル
樹脂組成物を得るため鋭意検討を重ねた結果、本発明に
到達した。In view of such demands, the present inventors have developed excellent mechanical properties,
The present invention has been arrived at as a result of extensive research in order to obtain a polyester resin composition that has durability, especially no deterioration in physical properties even after long-term use at high temperatures, without impairing moldability or the like.
即ち、本発明は、(A)熱可塑性ポリエステル樹脂10
0重量部に対し、(B)下記−形式(1)で示されるア
ミド系化合物0.005〜10電量部を配合してなるポ
リエステル樹脂組成物に関するものである。That is, the present invention provides (A) thermoplastic polyester resin 10
The present invention relates to a polyester resin composition in which (B) 0.005 to 10 coulometric parts of an amide compound represented by the following format (1) is blended to 0 parts by weight.
先ず本発明に用いられる熱可塑性ポリエステル樹脂(A
)とは、ジカルボン酸化合物とジヒドロキシ化合物の重
縮合、オキシカルボン酸化合物の重縮合或いはこれら3
威分混合物の重縮合等によって得られるポリエステルで
あり、ホモポリエステル、コポリエステルの何れに対し
ても本発明の効果がある。First, the thermoplastic polyester resin (A
) means polycondensation of a dicarboxylic acid compound and a dihydroxy compound, polycondensation of an oxycarboxylic acid compound, or these three.
It is a polyester obtained by polycondensation of a polyester mixture, and the present invention is effective on both homopolyester and copolyester.
ここモ用いられるジカルボン酸化合物の例を示せば、テ
レフタル酸、イソフタル酸、ナフタレンジカルボン酸、
ジフェニルジカルボン酸、ジフェニルエーテルジカルボ
ン酸、ジフェニルエタンジカルボン酸、シクロヘキサン
ジカルボン酸、アジピン酸、セバシン酸の如き公知のジ
カルボン酸及びこれらの置換体等である。また、これら
のジカルボン酸化合物は、エステル形成可能な反応性誘
導体、例えばジメチルエステルの如き低級アルコールエ
ステルの形で重合に使用することも可能である。これは
2I1以上が使用されることもある。Examples of dicarboxylic acid compounds used here include terephthalic acid, isophthalic acid, naphthalene dicarboxylic acid,
These include known dicarboxylic acids such as diphenyldicarboxylic acid, diphenyl ether dicarboxylic acid, diphenylethanedicarboxylic acid, cyclohexanedicarboxylic acid, adipic acid, and sebacic acid, and substituted products thereof. These dicarboxylic acid compounds can also be used in the polymerization in the form of reactive derivatives capable of forming esters, for example lower alcohol esters such as dimethyl ester. 2I1 or higher may also be used.
次に本発明のポリエステルを構成するジヒドロキシ化合
物の例を示せば、エチレングリコール、プロピレングリ
コール、ブタンジオール、ネオペンチルグリコール、ハ
イドロキノン、レゾルシン、ジヒドロキシフェニル、ナ
フタレンジオール、ジヒドロキシジフェニルエーテル、
シクロヘキサンジオール、2.2−ビス(4−ヒドロキ
シフェニル)プロパン、ジェトキシ化ビスフユノールへ
の如きジヒドロキシ化合物、ポリオキシアルキレングリ
コール及びこれらの置換体等であり、1種又は2種以上
を混合使用することができる。Examples of dihydroxy compounds constituting the polyester of the present invention include ethylene glycol, propylene glycol, butanediol, neopentyl glycol, hydroquinone, resorcinol, dihydroxyphenyl, naphthalene diol, dihydroxy diphenyl ether,
These include dihydroxy compounds such as cyclohexanediol, 2,2-bis(4-hydroxyphenyl)propane, jetoxylated bisfunol, polyoxyalkylene glycols, and substituted products thereof, and they can be used alone or in combination of two or more. can.
また、オキシカルボン酸の例を示せば、オキシ安息香酸
、オキシナフトエ酸、ジフェニレンオキシカルボン酸等
のオキシカルボン酸及びこれらの置換体が挙げられる。Examples of oxycarboxylic acids include oxybenzoic acid, oxynaphthoic acid, diphenyleneoxycarboxylic acid, and substituted products thereof.
また、これら化合物のエステル形成可能な誘導体も使用
できる。Furthermore, derivatives of these compounds capable of forming esters can also be used.
本発明においては、これら化合物の1種又は2種以上が
用いられる。In the present invention, one or more of these compounds may be used.
また、これらの他に三官能性七ツマー1即ちトリメリッ
ト酸、トリメシン酸、ピロメリット酸、ペンタエリスリ
トール、トリメチロールプロパン等を少量併用した分岐
又は架橋構造を有するポリエステルであってもよい。In addition to these, a polyester having a branched or crosslinked structure containing a small amount of trifunctional heptamer 1, ie, trimellitic acid, trimesic acid, pyromellitic acid, pentaerythritol, trimethylolpropane, etc., may also be used.
本発明では、上記の如き化合物をモノマー成分として、
重縮合により生成する熱可塑性ポリエステルは何れも本
発明の(A)成分として使用することができ、好ましく
はポリアルキレンテレフタレート、更に好ましくはポリ
ブチレンテレフタレート及びこれを主体とする共重合体
又は混合物が使用される。In the present invention, the above compounds are used as monomer components,
Any thermoplastic polyester produced by polycondensation can be used as component (A) of the present invention, preferably polyalkylene terephthalate, more preferably polybutylene terephthalate, and copolymers or mixtures mainly composed of this. be done.
本発明のポリエステル樹脂組成物は、前述の如き(A)
熱可塑性ポリエステルに、(B)−形式(1)で示され
るアミド系化合物を配合することを特徴とするものであ
り、かかる化合物の配合により、長期高温度下での使用
に対し、初期の優れた物性を維持することが可能となっ
たのである。The polyester resin composition of the present invention comprises (A) as described above.
It is characterized by blending an amide compound represented by (B)-Form (1) into a thermoplastic polyester, and the blending of such a compound provides initial superiority for long-term use under high temperatures. This made it possible to maintain the same physical properties as before.
かかる目的で配合される(B)ア【ド系化合物とは下記
−形式(1)で示されるものである。The ad compound (B) blended for this purpose is represented by the following format (1).
(B)成分として添加されるアミド系化合物は(1)式
で示される構造を有していれば何れのものでも有効であ
る。Any amide compound added as component (B) is effective as long as it has the structure represented by formula (1).
(1)式中で、Rはn価、即ち2〜4価の有機基で、例
えば炭素数1−10のアルキレン基、炭素数6〜12の
アリーレン基、炭素数5〜12のシクロアルキレン基、
炭素数8〜20のアラールキレン基等が挙げられる。更
に具体的には、アルキレン基としては、メチレン、エチ
レン、プロピレン、ブチレン、ペンチレン、ヘキサメチ
レン、オクタメチルン、ノナメチレン、デカメチレン、
ジメチルメチレン等が例示でき、アリレン基としてはフ
ェニレン、ナフチレン、ジフェニレン等が例示でき、シ
クロアルキレン基としてはシクロヘキシレンが例示でき
る。中でもRは芳香族基を含むもの、特にフェニレン基
が好ましい。In the formula (1), R is an n-valent, that is, a di- to tetravalent organic group, such as an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, or a cycloalkylene group having 5 to 12 carbon atoms. ,
Examples include an aralkylene group having 8 to 20 carbon atoms. More specifically, the alkylene group includes methylene, ethylene, propylene, butylene, pentylene, hexamethylene, octamethylone, nonamethylene, decamethylene,
Examples include dimethylmethylene, arylene groups include phenylene, naphthylene, diphenylene, etc., and cycloalkylene groups include cyclohexylene. Among these, R is preferably one containing an aromatic group, particularly a phenylene group.
式中、χはC2〜C1゜のアルキレン基又はその置換体
であり、置換基としては、炭素数1〜10のアルキル基
、炭素数6〜12のアリール基、炭素数5〜12のシク
ロアルキル基、炭素数8〜20のアラールキル基が挙げ
られる。更に具体的には、アルキル基としては、メチル
、エチル、プロピル、ブチル、ペンチル、ヘキサメチル
、オクタメチル、ノナメチル、デカメチル、ジメチルメ
チル等が例示でき、アリール基としては、フェニル、ナ
フチル、ジフェニル等が例示でき、シクロアルキルとし
ては、シクロヘキシルが例示できる。これらのうち、X
としては、エチレン基、プロピレン基が好ましい。In the formula, χ is a C2-C1° alkylene group or a substituent thereof, and examples of the substituent include an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 12 carbon atoms, and a cycloalkyl group having 5 to 12 carbon atoms. group, and an aralkyl group having 8 to 20 carbon atoms. More specifically, examples of alkyl groups include methyl, ethyl, propyl, butyl, pentyl, hexamethyl, octamethyl, nonamethyl, decamethyl, dimethylmethyl, etc., and examples of aryl groups include phenyl, naphthyl, diphenyl, etc. An example of cycloalkyl is cyclohexyl. Of these, X
As such, ethylene group and propylene group are preferable.
式中、Yは−COOI+、 −011,−3H,−I+
、−NHアの何れか1種であり、これらの内、−COO
I+、−OHが好ましい。In the formula, Y is -COOI+, -011, -3H, -I+
, -NHa, and among these, -COO
I+, -OH are preferred.
又、nは2〜4の整数であり、好ましくは2である。Further, n is an integer of 2 to 4, preferably 2.
一般式(1)で表されるアミド系化合物(B)の具体例
としては、N、N’−ビス(2−カルボキシエチル)マ
ロンアミド、N、N’−ビス(2−カルボキシエチル)
コハクアミド、N、 N’−ビス(2−カルボキシエチ
ル)グルタルアミド、N。Specific examples of the amide compound (B) represented by general formula (1) include N,N'-bis(2-carboxyethyl)malonamide, N,N'-bis(2-carboxyethyl)
Succinamide, N, N'-bis(2-carboxyethyl)glutaramide, N.
N’−ビス(2−カルボキンエチル)アジピンアミド、
N、N’−ビス(2−カルボキシエチル)イソフタルア
ミド、N、N″−ビス(2−カルボキシエチル)テレフ
タルアミド、N、N’−ビス(3カルボキシプロピル)
マロンアミド、N、N’−ビス(3−カルボキシプロピ
ル)コハクアミド、N、N’−ビス(3−カルボキシプ
ロピル)グルタルアミド、N、 N’−ビス(3−カル
ボキシプロピル)アジピンアミド、N、 N’−ビス(
3−カルボキシプロピル)イソフタルアミド、N、N’
−ビス(3−カルボキシプロピル)テレフタルアミド、
N、N゛−ヒス(2−ヒドロキシエチル)マロンアミド
、N、 N’−ビス(2−ヒドロキシエチル)コハクア
ミド、N、 N’〜ビス(2−ヒドロキシエチル)グル
タルアくド、N、 N’−ビス(2−ヒドロキシエチル
)アジピンアミド、N、N”−ビス(2ヒドロキシエチ
ル)イソフタルアミド、N、N’ビス(2−ヒドロキシ
エチル)テレフタルアミド、N、 N’−ビス(3−ヒ
ドロキシプロピル)マロンアくド、N、N’−ビス(3
−ヒドロキシプロピル)コハクアミド、N、 N’−ビ
ス(3−ヒドロキシプロピル)グルタルアミド、N、N
’−ビス(3−ヒドロキシプロピル)アジピンアミド、
N、 N’−ビス(3−ヒドロキシプロピル)イソフタ
ルアミド、N、N’−ビス(3−ヒドロキシプロピル)
テレフタルアミド、N、N’、N” −トリス(2−ヒ
ドロキシエチル)トリメシンアミド、3.3’。N'-bis(2-carboquinethyl)adipinamide,
N,N'-bis(2-carboxyethyl)isophthalamide, N,N''-bis(2-carboxyethyl)terephthalamide, N,N'-bis(3carboxypropyl)
Malonamide, N,N'-bis(3-carboxypropyl)succiamide, N,N'-bis(3-carboxypropyl)glutaramide, N,N'-bis(3-carboxypropyl)adipinamide, N,N' −Bis(
3-carboxypropyl)isophthalamide, N, N'
-bis(3-carboxypropyl)terephthalamide,
N, N'-his(2-hydroxyethyl)malonamide, N, N'-bis(2-hydroxyethyl)succiamide, N, N'-bis(2-hydroxyethyl)glutarate, N, N'-bis (2-Hydroxyethyl)adipinamide, N,N''-bis(2-hydroxyethyl)isophthalamide, N,N'-bis(2-hydroxyethyl)terephthalamide, N,N'-bis(3-hydroxypropyl)malona Kudo, N, N'-bis (3
-hydroxypropyl)succiamide, N, N'-bis(3-hydroxypropyl)glutaramide, N,N
'-bis(3-hydroxypropyl)adipinamide,
N,N'-bis(3-hydroxypropyl)isophthalamide, N,N'-bis(3-hydroxypropyl)
Terephthalamide, N,N',N''-tris(2-hydroxyethyl)trimesinamide, 3.3'.
5.5゛−テトラキス(2−ヒドロキシエチルアミノカ
ルボニル)ビフェニル等を挙げることができる。これら
の化合物は、単独で使用しても2種以上併用してもよい
。Examples include 5.5'-tetrakis(2-hydroxyethylaminocarbonyl)biphenyl. These compounds may be used alone or in combination of two or more.
これらの化合物の内、特に好ましくは、N、 N’ビス
(2−カルボキシエチル)イソフタルアミド、N、 N
’−ビス(3−カルボキシプロピル)イソフタルアミド
、N、N’−ビス−(2−カルボキシエチル)テレフタ
ルアミド、N、 N’−ビス(3−カルボキシプロピル
)テレフタルアミド、N、N’ −ビス(2−ヒドロキ
シエチル)イソフタルアミド、N、N’−ビス−(2−
ヒドロキシプロピル〉イソフタルアミド、N、 N’−
ビス−(2−ヒドロキシエチル)テレフタルアミド、N
、 N’−ビス(2−ヒドロキシプロピル)テレフタル
アミドである。Among these compounds, N, N'bis(2-carboxyethyl)isophthalamide, N, N
'-Bis(3-carboxypropyl)isophthalamide, N,N'-bis-(2-carboxyethyl)terephthalamide, N,N'-bis(3-carboxypropyl)terephthalamide, N,N'-bis( 2-hydroxyethyl)isophthalamide, N,N'-bis-(2-
Hydroxypropyl〉Isophthalamide, N, N'-
Bis-(2-hydroxyethyl)terephthalamide, N
, N'-bis(2-hydroxypropyl)terephthalamide.
アミド系化合物(B)の添加量はポリエステル樹脂(^
)100重量部に対し、0.005〜lO重量部であり
、好ましくは0.01〜5重量%である。アミド系化合
物は、化合物同志あるいはポリエステル樹脂との水素結
合に基づく親和力が強いため、昇華性はほとんどなく、
加熱時の揮散がないので、極めて少量の添加で効果を発
揮するという特徴を有するが、0.005重量%未満で
は効果は小さい、また、多すぎると、ポリエステル樹脂
の優れた物性を低下させる弊害を生じる。The amount of amide compound (B) added is based on the polyester resin (^
) 0.005 to 10 parts by weight, preferably 0.01 to 5 parts by weight, per 100 parts by weight. Amide compounds have a strong affinity based on hydrogen bonds with each other or with polyester resin, so they have almost no sublimation property.
Since there is no volatilization during heating, it has the characteristic that it is effective when added in a very small amount, but if it is less than 0.005% by weight, the effect is small, and if it is too much, it has the disadvantage of reducing the excellent physical properties of polyester resin. occurs.
本発明の組成物は更に必須ではないが、ヒンダードフェ
ノール系、リン系、チオエーテル系等の酸化防止剤を一
種以上併用することにより、更に一層の効果を得ること
ができる。Although the composition of the present invention is not essential, further effects can be obtained by using in combination one or more types of antioxidants such as hindered phenol type, phosphorus type, and thioether type antioxidants.
ここで、ヒンダードフェノール系酸化防止剤としては、
2.2’−メチレンビス(4−メチル−6−1−ブチル
フェノール)、ヘキサメチレングリコールビス(3,5
−ジ−t−ブチル−4−ヒドロキシヒドロシンナメート
)、テトラキス〔メチレン(3,5−ジ−t−ブチル−
4−ヒドロキシヒドロシンナメート)〕メタン、トリエ
チレングリコールビス−3−(3−t−ブチル−4−ヒ
ドロキシ−5−メチルフェニル)プロピオネート、 1
.3.5− )リメチル−2,4,6−)リス(3,5
ジーt−ブチル−4−ヒドロキシベンジル)ベンゼン、
n−オクタデシル−3−(4’−ヒFロキンー3’、
5’−ジ−t−ブチルフェノール)プロピオネート、4
.4’−メチレンビス(2,6−ジt−ブチルフェノー
ル) 、4.4°−ブチリデンビス(6−t−ブチル−
3−メチルフェノール)、2.2゛−チオジエチルビス
[3−(3,5−ジーを一ブチルー4−ヒドロキシフェ
ニル)プロピオネート、ジステアリル−3,5−ジ−t
−ブチル−4−ヒドロキシベンジルホスホネート、2−
tブチル−6−(3−t−ブチル−5−メチル−2−ヒ
ドロキシベンジル)−4−メチルフェニルアクリレート
等が挙げられる。Here, as hindered phenol antioxidants,
2.2'-methylenebis(4-methyl-6-1-butylphenol), hexamethylene glycolbis(3,5
-di-t-butyl-4-hydroxyhydrocinnamate), tetrakis[methylene (3,5-di-t-butyl-
4-hydroxyhydrocinnamate)] methane, triethylene glycol bis-3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionate, 1
.. 3.5-)limethyl-2,4,6-)lis(3,5-)
di-t-butyl-4-hydroxybenzyl)benzene,
n-octadecyl-3-(4'-hyFroquin-3',
5'-di-t-butylphenol) propionate, 4
.. 4'-methylenebis(2,6-di-t-butylphenol), 4.4°-butylidenebis(6-t-butyl-
3-methylphenol), 2.2'-thiodiethylbis[3-(3,5-di-butyl-4-hydroxyphenyl)propionate, distearyl-3,5-di-t
-butyl-4-hydroxybenzylphosphonate, 2-
Examples include t-butyl-6-(3-t-butyl-5-methyl-2-hydroxybenzyl)-4-methylphenylacrylate.
又、リン系酸化防止剤とは、下記−形式(2)で示され
るものであり、式中R+、Rtはアルキlし基、置換ア
ルキル基、アリール基、置換アリール基、アルコキシ基
より選ばれ、それぞれ同一であっても異なっていても良
い、中でもRI R1は炭素数6以上のアルキル基、置
換アルキル基、アルコキシ基か、或いはアリール基又は
置換了り−ル基が加工中の安定性の見地から好ましい。In addition, the phosphorus antioxidant is represented by the following formula (2), where R+ and Rt are selected from an alkyl group, a substituted alkyl group, an aryl group, a substituted aryl group, and an alkoxy group. , each of which may be the same or different, among which RI R1 is an alkyl group having 6 or more carbon atoms, a substituted alkyl group, an alkoxy group, or an aryl group or a substituted aryl group that has stability during processing. Favorable from this point of view.
特に好ましいのはR8R1がアリール基又は置換アリー
ル基の場合である。これらの例を示せば、フェニル基、
ナフチル基、ジフェニル基等或いはこれらのアルキル、
ヒドロキシ及び/又はアルコキシ置換体等である。具体
的な化合物の一例を示せば、ビス(2,4−ジ−t−ブ
チルフェニル)ペンタエリスリトールジホスファイト、
ビス(ノニルフェニル)ペンタエリスリトールジホスフ
ァイト、4−フェノキシ−9−α−(4−ヒドロキシフ
ェニル)−p−クメニルオキシー3.5,8.10−テ
トラオキサ−4,9−ジホスファスピロ(5,5)ウン
デカン等が挙げられる。Particularly preferred is the case where R8R1 is an aryl group or a substituted aryl group. Examples of these include phenyl group,
Naphthyl group, diphenyl group, etc. or alkyl thereof,
These include hydroxy and/or alkoxy substituted products. Examples of specific compounds include bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite,
Bis(nonylphenyl)pentaerythritol diphosphite, 4-phenoxy-9-α-(4-hydroxyphenyl)-p-cumenyloxy-3.5,8.10-tetraoxa-4,9-diphosphaspiro(5,5)undecane etc.
又、チオエーテル系酸化防止剤としては、ジラウリルチ
オジプロピオネート、シミリスチルチオジプロピオネー
ト、ジステアリルチオジプロピオネート、ラウリルステ
アリルチオジプロピオネート、テトラキス〔メチレン−
3−(ドデシルチオ)プロピオネートコメタン、ジアル
キル(C1,〜+5)−3,3−チオジプロピオネート
などが挙げられる。In addition, examples of thioether antioxidants include dilauryl thiodipropionate, simiristyl thiodipropionate, distearyl thiodipropionate, laurylstearyl thiodipropionate, and tetrakis[methylene-
Examples include 3-(dodecylthio)propionate comethane and dialkyl(C1,~+5)-3,3-thiodipropionate.
これらの酸化防止剤の添加量は0.05〜5重量%(組
成物中)、好ましくは0.1〜3重量%である。The amount of these antioxidants added is 0.05 to 5% by weight (in the composition), preferably 0.1 to 3% by weight.
本発明の樹脂組成物は、その目的を阻害しない範囲で他
の熱可塑性樹脂を補助的に少量併用ることも可能である
。ここで用いられる他の熱可塑性樹脂としては高温にお
いて安定な熱可塑性樹脂であればいずれのものでもよい
。The resin composition of the present invention may also be supplemented with a small amount of other thermoplastic resin as long as the purpose is not impaired. The other thermoplastic resin used here may be any thermoplastic resin that is stable at high temperatures.
例えば、ボリアくド、ABS、ポリフェニレンオキサイ
ド、ポリアルキルアクリレート、ポリアセタール、ポリ
スルホン、ポリエーテルスルホン、ポリエーテルイミド
、ポリエーテルケトン、フッ素樹脂などを挙げることが
できる。Examples include boria chloride, ABS, polyphenylene oxide, polyalkyl acrylate, polyacetal, polysulfone, polyethersulfone, polyetherimide, polyetherketone, and fluororesin.
また、これらの熱可塑性樹脂は2種以上混合して使用す
ることもできる。Moreover, these thermoplastic resins can also be used in combination of two or more types.
本発明組成物には更にその目的に応じ所望の特性を付与
するため、一般に熱可塑性樹脂及び熱硬化性樹脂等に添
加される公知の物質、すなわち、紫外線吸収剤等の安定
剤、帯電防止剤、難燃剤、難燃助剤、染料や顔料等の着
色剤、潤滑剤、可塑剤及び結晶化促進剤、結晶核剤、無
機充填剤等を配合することも勿論可能である。In order to impart desired characteristics to the composition of the present invention according to its purpose, known substances generally added to thermoplastic resins, thermosetting resins, etc., such as stabilizers such as ultraviolet absorbers, antistatic agents, etc. Of course, it is also possible to incorporate flame retardants, flame retardant aids, colorants such as dyes and pigments, lubricants, plasticizers, crystallization promoters, crystal nucleating agents, inorganic fillers, and the like.
無機充填剤としては、ガラス繊維、炭素繊維、セラ旦ツ
ク繊維、ボロン繊維、チタン酸カリウム繊維、アスベス
ト等の一般無機繊維、炭酸カルシウム、高分散性珪酸塩
、アルξす、水酸化アルミニウム、タルク、クレー、マ
イカ、ガラスフレーク、ガラス粉、ガラスピーズ、石英
粉、珪砂、ウオラストナイト、カーボンブラック、硫酸
バリウム、焼石膏、炭化珪素、アルミナ、ボロンナイト
ライドや窒化珪素等の粉粒状物質、板状の無機化合物、
ウィスカー等が含まれる。Examples of inorganic fillers include glass fiber, carbon fiber, ceramic fiber, boron fiber, potassium titanate fiber, general inorganic fiber such as asbestos, calcium carbonate, highly dispersed silicate, aluminum, aluminum hydroxide, and talc. , clay, mica, glass flakes, glass powder, glass peas, quartz powder, silica sand, wollastonite, carbon black, barium sulfate, calcined gypsum, silicon carbide, alumina, boron nitride, silicon nitride, etc. powder and granular materials, plates inorganic compounds,
Includes whiskers, etc.
これらの無機充填剤は、必要に応じ1種又は2種以−ヒ
を併用混合使用できる。These inorganic fillers can be used singly or in combination of two or more, if necessary.
本発明の組成物の調製は特に制限がなく、従来の樹脂組
底物調製法として一般に用いられている公知の設備と方
法により容易に調製される。There are no particular restrictions on the preparation of the composition of the present invention, and it can be easily prepared using known equipment and methods that are generally used for the preparation of conventional resin bottoms.
例えば、i)各酸分を混合した後、押出機により練込押
出してペレットを調製し、しかる後成形する方法、10
−旦組成の異なるペレットを調製し、そのペレットを所
定量混合して底形に供し成形後に目的組成の成形品を得
る方法、ii)成形機に各成分の1または2以上を直接
仕込む方法等、何れも使用できる。また、樹脂成分の一
部を細かい粉体としてこれ以外の酸分と混合し添加する
ことは、これらの成分の均一配合を行う上で好ましい方
法である。For example, i) a method of mixing each acid component, then kneading and extruding it using an extruder to prepare pellets, and then molding;
- A method of first preparing pellets with different compositions, mixing a predetermined amount of the pellets, applying the mixture to a bottom shape, and obtaining a molded product with the desired composition after molding; ii) A method of directly charging one or more of each component into a molding machine, etc. , any of them can be used. Further, adding a part of the resin component as a fine powder by mixing it with other acid components is a preferable method for uniformly blending these components.
以下、実施例により本発明を更に具体的に説明するが、
本発明はこれらに限定されるものではない。Hereinafter, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited to these.
尚、以下の例に示した物性評価の測定法は次の通りであ
る。The measurement method for evaluating physical properties shown in the following examples is as follows.
■ 引張り強伸度
^ST?I 0−638 (試験片^STM タイ
プ■型:厚み1 vw)に準拠して、初期の強伸度、及
び120℃で500時間加熱後の伸びを測定した。■ Tensile strength and elongation ^ST? The initial strength and elongation and the elongation after heating at 120° C. for 500 hours were measured according to I 0-638 (test piece ^ STM type ■ type: thickness 1 vw).
■ アイゾツト衝撃強度
^STM D−256に準拠して、ノツチ付きアイゾツ
ト衝wi度を測定した。■ Izot impact strength ^ Notched izot impact strength was measured in accordance with STM D-256.
実施例1〜7及び比較例1〜2
熱可塑性ポリエステル(A)として、固有粘度0.8の
ポリブチレンテレフタレート(A−1)に(B)酸分と
して、表1に示す各種アよド系化合物を表1に示す割合
で添加混合し、押出機にてペレット状の&l威物を得た
0次いでこのペレットを用い、射出成形により試験片を
作製し、上記物性の評価を行った。比較の為、ポリブチ
レンテレフタレート(A−1)に(B)酸分を加えない
もの、及び(8)成分の代わりにエポキシ化合物を添加
混合したものについて、実施例と同様にペレットを調製
し、前記の評価を行った。Examples 1 to 7 and Comparative Examples 1 to 2 As the thermoplastic polyester (A), polybutylene terephthalate (A-1) with an intrinsic viscosity of 0.8 and (B) as the acid content, various aido-based compounds shown in Table 1 were used. The compounds were added and mixed in the proportions shown in Table 1, and pellets were obtained using an extruder.The pellets were then used to prepare test pieces by injection molding, and the above-mentioned physical properties were evaluated. For comparison, pellets were prepared in the same manner as in the example for polybutylene terephthalate (A-1) without adding the acid component (B) and with an epoxy compound added and mixed in place of component (8). The above evaluation was performed.
結果を併せて表1に示す。The results are also shown in Table 1.
実施例8及び比較例3
熱可塑性ポリエステル(A)として固有粘度1.0のポ
リブチレンテレフタレート(A−2)を用いる他は、実
施例2と同様に特性を評価した。比較例として(B)
I′li、分を省略したものについても評価した。結果
を表1に示す。Example 8 and Comparative Example 3 Characteristics were evaluated in the same manner as in Example 2, except that polybutylene terephthalate (A-2) with an intrinsic viscosity of 1.0 was used as the thermoplastic polyester (A). As a comparative example (B)
I'li, with minutes omitted, was also evaluated. The results are shown in Table 1.
実施例9及び比較例4
実施例2の(A)成分をポリブチレンテレフタレートと
ポリエチレンテレフタレートとの混合ポリマー(A−3
)に変更した以外は実施例2と同様に試験し評価した。Example 9 and Comparative Example 4 Component (A) of Example 2 was replaced with a mixed polymer of polybutylene terephthalate and polyethylene terephthalate (A-3
) was tested and evaluated in the same manner as in Example 2, except that
結果を表1に示す。The results are shown in Table 1.
一方、比較例として(B)成分を省略したものについて
実施例と同様に試験し評価した。結果を併せて表1に示
す。On the other hand, as a comparative example, a product in which component (B) was omitted was tested and evaluated in the same manner as in the example. The results are also shown in Table 1.
表1の注;
固有粘度0.8のポリブチレンチ
レフタレート
固有粘度1.0のポリブチレンチ
レフタレート
ポリブチレンテレフタレート(A
−1)75重量部とポリエチレンテ
レフタレート25重量部(固有粘
度0.7〉の混合ポリマー
N、 N’−ビス(2−ヒドロキシエチル)イソフタル
アミド
N、 N’−ビス(2−ヒドロキシプロピル)イソフタ
ルアミド
N、 N’−ビス(2−ヒドロキシエチル)テレフタル
アミド
N、N’−ビス(2−カルボキシエチ
ル)イソフタルアミド
ビスフェノール^型ジェポキシ
化合物
〔発明の効果〕
以上の説明及び実施例により明らかな如く、本発明のポ
リエステル樹脂は従来のポリエステル樹脂に比べて耐熱
安定性、特に高温下での耐久性が顕著に改善され長時間
、高温下に置かれても、引張伸びの低下が少ない樹脂を
提供するものである。Notes to Table 1: Polybutylene terephthalate with an intrinsic viscosity of 0.8 Polybutylene terephthalate with an intrinsic viscosity of 1.0 75 parts by weight of polybutylene terephthalate (A-1) and 25 parts by weight of polyethylene terephthalate (with an intrinsic viscosity of 0.7) Mixed polymer N, N'-bis(2-hydroxyethyl)isophthalamide N, N'-bis(2-hydroxypropyl)isophthalamide N, N'-bis(2-hydroxyethyl)terephthalamide N, N'-bis (2-carboxyethyl)isophthalamide bisphenol^ type jepoxy compound [Effects of the invention] As is clear from the above explanation and examples, the polyester resin of the present invention has better heat resistance stability than conventional polyester resins, especially under high temperatures. The object of the present invention is to provide a resin that has significantly improved durability and exhibits little decrease in tensile elongation even when placed under high temperatures for long periods of time.
上記のように、本発明のポリエステル樹脂は熱履歴によ
る靭性の低下が少ないため、自動車、電気機器等で高温
の環境下で長期にわたって使用される機械材料、部品、
例えばコネクター、コイルボビン、スイッチ、リレー等
に好適に用いられる。As mentioned above, the polyester resin of the present invention has little deterioration in toughness due to thermal history, so it is suitable for mechanical materials and parts used for long periods in high-temperature environments in automobiles, electrical equipment, etc.
For example, it is suitably used for connectors, coil bobbins, switches, relays, etc.
Claims (1)
し、 (B)下記一般式( I ) ▲数式、化学式、表等があります▼( I ) Rはn価の有機基を示し、XはC_2〜C_1_0のア
ルキレン基又はその置換体、Yは−COOH,−OH,
−SH,−H,−NH_2の何れか1種、nは2〜4の
整数を示す。 で示されるアミド系化合物0.005〜10重量部を添
加配合してなるポリエステル樹脂組成物。 2 (B)アミド系化合物を示す( I )式のRが芳香
族基を含むものである請求項1記載のポリエステル樹脂
組成物。 3 (B)アミド系化合物を示す( I )式のXがエチ
レン又はプロピレン又はそれらの置換体である請求項1
又は2記載のポリエステル樹脂組成物。 4 (B)アミド系化合物を示す( I )式のYが−C
OOHである請求項1〜3の何れか1項記載のポリエス
テル樹脂組成物。 5 (B)アミド系化合物を示す( I )式のYが−O
Hである請求項1〜3の何れか1項記載のポリエステル
樹脂組成物。 6 熱可塑性ポリエステル樹脂(A)がポリブチレンテ
レフタレート及びこれを主体とする共重合体又は混合物
である請求項1〜5の何れか1項記載のポリエステル樹
脂組成物。[Claims] 1 (A) For 100 parts by weight of thermoplastic polyester resin, (B) The following general formula (I) ▲There are numerical formulas, chemical formulas, tables, etc.▼ (I) R represents an n-valent organic group , X is an alkylene group of C_2 to C_1_0 or a substituted product thereof, Y is -COOH, -OH,
-SH, -H, -NH_2, and n represents an integer of 2 to 4. A polyester resin composition containing 0.005 to 10 parts by weight of an amide compound represented by: 2. The polyester resin composition according to claim 1, wherein R in the formula (I) representing the amide compound (B) contains an aromatic group. 3 (B) Claim 1 in which X in formula (I) representing an amide compound is ethylene or propylene or a substituted product thereof.
Or the polyester resin composition according to 2. 4 (B) Y in formula (I) representing an amide compound is -C
The polyester resin composition according to any one of claims 1 to 3, which is OOH. 5 (B) Y in formula (I) representing an amide compound is -O
The polyester resin composition according to any one of claims 1 to 3, which is H. 6. The polyester resin composition according to any one of claims 1 to 5, wherein the thermoplastic polyester resin (A) is polybutylene terephthalate and a copolymer or mixture mainly composed of polybutylene terephthalate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34468789A JPH03199253A (en) | 1989-12-27 | 1989-12-27 | Polyester resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34468789A JPH03199253A (en) | 1989-12-27 | 1989-12-27 | Polyester resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03199253A true JPH03199253A (en) | 1991-08-30 |
Family
ID=18371204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34468789A Pending JPH03199253A (en) | 1989-12-27 | 1989-12-27 | Polyester resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03199253A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006225644A (en) * | 2005-01-19 | 2006-08-31 | New Japan Chem Co Ltd | Melt viscosity decreasing agent for polyester resin, polyester resin composition containing the same, molded article obtained from the resin composition, and method for decreasing melt viscosity |
-
1989
- 1989-12-27 JP JP34468789A patent/JPH03199253A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006225644A (en) * | 2005-01-19 | 2006-08-31 | New Japan Chem Co Ltd | Melt viscosity decreasing agent for polyester resin, polyester resin composition containing the same, molded article obtained from the resin composition, and method for decreasing melt viscosity |
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