JPH0319720B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method and an apparatus for automatically inserting and fixing a coil formed by a winding machine into an insertion hole of a printed circuit board. be.

[Prior Art] Conventionally, a method of inserting and fixing a coil processed and formed using a winding machine or the like into an insertion hole of a printed circuit board has been carried out through steps as shown in FIG. That is, the polyurethane wire 1 is drawn out from the supply section 2 of the reel-wound polyurethane wire 1, processed and formed into an air-core coil 4 of a predetermined shape by the coil winding machines 3, 3, and transferred to the individual solder baths 5. In this individual solder bath 5, the polyurethane coating on the lead wires 6, 6 of the air-core coil 4 is removed while the solder 7 is attached.
Next, the lead wires 6, 6 of the air-core coil 4 are inserted into the insertion holes 9, 9 of the printed circuit board 8 by hand, and components such as the capacitor 10 and the transistor are inserted into predetermined locations on the printed circuit board 8 by hand or by machine. . Next, this printed circuit board 8 is led to an automatic board soldering tank 11, and an air-core coil 4, a capacitor 10,
Lead wires 6, 6, 12, 12 for transistors, etc.
are soldered all at once to the circuit pattern of the printed circuit board 8 to fix the connection.

[Problems to be Solved by the Invention] As described above, in the conventional method of inserting a processed and formed coil into the insertion hole of the printed circuit board, the lead wires 6, 6 of the air-core coil 4 are inserted into the insertion hole of the printed circuit board 8. Since the step of inserting into the holes 9 and 9 was performed manually, there was a problem that this inserting operation took too much time and it was not possible to shorten the process time of the entire assembly line.

The present invention was made in view of the above-mentioned problems.
The purpose is to automatically insert and fix the lead wire of the coil processed and formed using a winding machine into the insertion hole of the printed circuit board, thereby shortening the coil insertion time and thereby reducing the overall process time of assembly line work. That is.

[Means for Solving the Problems] The automatic coil insertion method according to the present invention involves transferring the coil onto a printed circuit board on an XY table while removably holding the coil using a coil transfer machine, and inserting the coil into the solder tank during the transfer. The lead wire of the coil is immersed in the solder bath, the film of the lead wire is removed and the solder is attached, and the XY table is moved for positioning at the end of the transfer, and the XY The lead wire of the coil is inserted into the insertion hole of the printed circuit board by the relative movement of the table and the coil transfer device, and the coil is fixed to the printed circuit board by curing of the adhesive. It is characterized by the fact that

The automatic coil insertion device according to the present invention includes a coil transfer means that transfers the coil onto a printed circuit board on an XY table while removably holding the coil, and a coil transfer means that transfers the coil onto a printed circuit board on an XY table, and a coil transfer means that transfers the coil onto a printed circuit board on an XY table. Immersing the coil lead wire in the solder bath,
By means of a solder adhesion means for removing the film of the lead wire and adhering the solder, movement of the XY table for positioning, and relative movement of the XY table and the coil transfer machine toward each other, The method includes an insertion means for inserting a lead wire of the coil into an insertion hole of the printed circuit board, and a fixing means for fixing the coil to the printed circuit board by curing an adhesive applied to the printed circuit board. The coil transfer means transfers the coil using a holder that removably holds the coil with the lead wire of the coil protruding outside, and the solder tank is provided on the transfer path. a first coil transfer machine that receives the coil transferred by the first coil transfer machine, and a second coil transfer machine that detachably holds the lead wire and relays the coil; The present invention is characterized by comprising a third coil transfer machine that receives the coil, detachably holds the side surface of the coil with a chuck, and transfers the coil onto the printed circuit board.

[Operation] The first coil transfer machine transfers the coil to the second coil transfer machine using a holder that removably holds the coil with the lead wire of the coil protruding outside. The second coil transfer machine detachably holds the lead wire of the received coil and relays it to the third coil transfer machine. The third coil transfer machine removably holds the side of the received coil with a chuck and transfers it onto the printed circuit board on the XY table. The solder attachment means moves a solder bath provided in the middle of the transfer of the first coil transfer machine, immerses the coil lead wire in the solder bath, removes the film of the lead wire, and attaches the solder. The insertion means inserts the coil lead wire into the insertion hole of the printed circuit board by moving the XY table for positioning and moving the XY table and the coil transfer device relatively toward each other. The fixing means fixes the coil to the printed circuit board by curing adhesive applied to the printed circuit board.

[Example] Fig. 1 shows an embodiment of a device for carrying out the automatic coil insertion method according to the present invention. This is an automatic coil winding machine that automatically processes and shapes the air-core coil 4 and sends it out one after another. The air-core coil 4 sent out from the automatic coil winding machine 20 is transferred to the first, second and third coil transfer means.
The coils are sequentially transferred onto the printed circuit boards 8 to 8 placed on the XY cable 60 by the coil transfer machines 30, 40, and 50, and then inserted into the insertion holes 9 and 9 of the printed circuit boards 8 and 8 by the insertion means. inserted into. Prior to this insertion, adhesives 21 to 21 such as ultraviolet curing resin or thermosetting resin are automatically applied between the insertion holes 9 to 9 of the printed circuit boards 8 to 8.
The printed circuit board 8 into which a predetermined number of air core coils 4 to 4 have been inserted is pushed onto the belt conveyor 70,
The belt conveyor 70 then transports the hardening furnace 80 for a certain period of time (for example, 30 seconds).
Adhesive 2 by UV irradiation or heating
1 to 21 are cured, and the lower sides of the air core coils 4 to 4 are fixed onto the printed circuit board 8. The automatic coil winding machine 20, the first, second, and third coil transfer machines 3
0, 40, 50, the XY cable 60, the belt conveyor 70, and the curing furnace 80 are configured to be controlled in a predetermined manner by a control circuit (not shown) (CPU (including a central processing unit)).

The first coil transfer device 30 includes a turntable 32 that rotates together with a rotating shaft 31, and a base that is disposed on the upper surface of the turntable 32 at predetermined pitches (for example, 60 degrees) along the rotational circumferential direction. 3
3 to 33, abutments 34 to 34 planted on these bases 33 to 33, arms 35 to 35 connected to these abutments 34 to 34 so as to be rotatable by 90 degrees, and these arms 35 to 33. Retainer 36 provided at the tip of 35 ~
It consists of 36. The cages 36 to 36
As shown in FIG. 2, it consists of a casing 37 with an open top and one side, and a holding shaft 38 protruding into the casing 37, and between the holding shaft 38 and the inner wall of the casing 37 The air-core coil 4 sent out from the automatic coil winding machine 20 is housed and held, with its lead wires 6, 6 protruding outside. Reference numeral 15 denotes a suction-type individual solder tank provided in the middle of the transfer path of the air-core coil 4 by the first coil transfer device 30, and this individual solder tank 15 sucks up solder 16 from a solder tank (not shown). As shown in FIG.
The lead wires 6, 6 are immersed so as to reach a predetermined position, and the film of the lead wires 6, 6 is removed to form a solder adhering means for adhering solder.

The second coil transfer device 40 includes a rod 42 that rotates by 180 degrees in the direction of the arrow by a rotating shaft 41, and heads 43, 43 fixed to both ends of the rod 42.
and lead chucks 44, 44 provided on the heads 43, 43, which are connected to the lead wires 6, 44 of the air-core coil 4.
6 can be held and removed.

The third coil transfer device 50 includes a turntable 52 that rotates together with a rotating shaft 51, and a turntable 52 that is disposed on the lower surface of the turntable 52 at a predetermined pitch (for example, 60 degrees) along the circumferential direction of the rotation. A chuck 5 is provided on the lower surface of the bases 53 to 53 so that one side can slide in one direction, as shown in FIG.
4 and 54, and coil chucks 55a and 55b which are detachably held on the chucks 54 and 54, and the air cores are provided on opposing surfaces of the coil chucks 55a and 55b, as shown in FIGS. 5a and 5b. Coil holding grooves 56a and 56b are formed to engage and hold the wire portions on both sides of the coil 4.

Next, the operation of the above embodiment will be explained with reference to the process diagram of FIG. 6.

(a) The polyurethane wire 1 drawn out from the supply section 2 of the polyurethane wire 1 wound on a reel is sequentially processed and formed into an air-core coil 4 having a predetermined shape by an automatic coil winding machine 20, as shown in FIGS. 1 and 2. As shown, the retainer 36 of the first coil transfer machine 30
sent within.

(b) Next, when the turntable 32 of the first coil transfer device 30 rotates 60 degrees in the direction of the arrow to transfer the air-core coil 4, the arm 35 rotates 90 degrees outward, and the open side of the retainer 36 moves downward. Turn. When the turntable 32 further rotates by 60 degrees, the retainer 36 reaches the upper part of the individual solder tank 15, and the individual solder tank 15 sucks up the solder 16 and moves upward, as shown in FIG. Predetermined portions of the lead wires 6, 6 of the coil 4 are dipped into the solder 16. As a result, the polyurethane coating on the lead wires 6, 6 is removed and the solder is attached.

(c) Next, the turntable 32 of the first coil transfer device 30 rotates 60 degrees to transfer the air-core coil 4,
Next, the lead wires 6, 6 of the air-core coil 4 are held by the lead chucks 44, 44 of the second coil transfer device 40, and the air-core coil 4 is transferred to the holder 36.
pulled out from within.

(d) Next, unnecessary portions of the lead wires 6, 6 of the air-core coil 4 are cut by a cutter (not shown), and the air-core coil 4 is moved to the second position by rotating the rod 42 of the second coil transfer device 40 by 180 degrees. The coils are relayed and transferred to the 3-coil transfer machine 50 side. In addition, the lead wire 6 of the air-core coil 4,
If the length 6 is adjusted to a predetermined length, cutting with a cutter may be omitted.

(e) The third coil transfer machine 50
4 and 54 in the direction of the arrow, the both side line portions of the air-core coil 4 are aligned with the coil engaging grooves 56a and 56b of the coil chucks 55a and 55b.
The air-core coil 4 is transferred by rotating the turntable 52 by 60 degrees in the direction of the arrow while engaging and holding the turntable 52 . The bases 53 to 53 of the third coil transfer device 50 are rotated by a predetermined angle with respect to the turntable 52 at a position rotated by 60° or 120° from the position where both side wire portions of the air-core coil 4 are received and engaged. Then, the X and Y directions are adjusted.

(F) The air-core coil 4 is transferred by the third coil transfer device 50.
is transferred to the upper part of the XY table 60, and then the XY table 60 is moved a predetermined distance in the X and Y directions to perform positioning. As shown in FIG. It comes to a position that matches the insertion holes 9, 9 of the printed circuit board 8.

(G) Then, by moving the base 53 and/or the XY table 60 in the vertical direction, the air-core coil 4
When the lead wires 6, 6 are inserted into the insertion holes 9, 9 of the printed circuit board 8, the chucks 54, 54 are opened and the air core coil 4 is removed. Then, the adhesive 21 previously applied on the printed circuit board 8
contacts the lower surface side of the air-core coil 4 and the upper surface of the printed circuit board 8. Next, bend cut part 1
The air-core coil 4 is fixed to the printed circuit board 8 by bending the lead wires 6, 6 which protrude from the lower surface of the printed circuit board 8 by means of 8, 18.

(H) When the predetermined number of air core coils 4 to 4 have been inserted and fixed onto the printed circuit board 8, the printed circuit board 8 is transferred from the XY table 60 to the belt conveyor 7.
0 and then onto the belt conveyor 70
It is conveyed to the curing furnace 80 by. When UV irradiation or heating is performed in the curing furnace 80 for a predetermined time (for example, 30 seconds), the adhesive 21 hardens and fixes the lower side of the air-core coil 4 and the upper surface of the printed circuit board 8.

(li) In (h) above, if the intended number of air-core coils 4-4 are not inserted and fixed on the printed circuit board 8 due to an insertion error, etc., the belt conveyor is removed from the XY table 60. 7
Before the printed circuit board 8 is pushed out to 0, an insufficient number of lead wires protruding from the bottom surface of the printed circuit board 8 is detected, and the control circuit operates the XY table 60 to return the printed circuit board 8 to the third coil transfer machine 50 side, and automatically transfers the coil. Predetermined air-core coils transferred from the winding machine 20 via the first, second, and third coil transfer devices 30, 40, and 50 are inserted and fixed to correct insertion errors.

(J) Next, parts other than the coil, such as the capacitor 10 and the transistor, are inserted by hand or by machine, and then sent to the automatic board soldering bath 11, where they are soldered all at once, and the parts such as the air-core coil 4 and the capacitor 10 are inserted. The lead wires 6, 6, 12, 12 are connected and fixed to the circuit pattern of the printed circuit board 8. Note that the inductance of the air-core coil 4 is adjusted by opening and closing the upper coil wire interval.

In the embodiment described above, insertion of an air-core coil with one type of inner diameter (for example, 3.5 mmφ) is described, but the invention is not limited to this. For example, when inserting two types of air-core coils with different inner diameters into a printed circuit board, As shown in FIG. 7, the first coil transfer machine 30
Two types of abutments 34a and 34b are installed on each of the bases 33a to 33a of a, and these abutments 34a,
Arms 35a and 35b are attached at 90° to each of 34b.
The arms 35a and 35b may be provided with retainers 36a and 36b for storing and holding air-core coils having different inner diameters. At this time, 2
The different types of retainers 36a and 36b are arranged along the rotational circumferential direction of the turntable 32.

In the embodiments described above, insertion of an air-core coil has been described, but the present invention is not limited to this, and can also be applied to a coil having an iron core.

[Effects of the Invention] As described above, the coil automatic insertion method according to the present invention uses a coil transfer machine to transfer the coil onto a printed circuit board, and during the transfer, the coil lead wire is immersed in a solder bath to remove the lead wire. Remove the wire film, apply solder, align at the end of the transfer, and insert the coil lead wire into the insertion hole of the printed circuit board.
Since the coil is fixed to the printed circuit board by curing the adhesive, it is possible to automate coil insertion, and there is no waste in the operation of inserting the coil lead wire into the insertion hole of the printed circuit board, making it more efficient. And labor saving can be achieved.

Further, the automatic coil insertion device according to the present invention, as described above, has coil transfer means in the first, second and third positions.
The first coil transfer machine is configured with a coil transfer machine, and this first coil transfer machine transfers the coil with the lead wire of the coil protruding outside by a holder, thereby smoothing the adhesion of solder to the lead wire by moving the solder bath. , the third coil transfer machine holds the side of the coil with a chuck to facilitate insertion of the lead wire into the printed circuit board, and the second coil transfer machine transfers the coil from the first coil transfer machine to the third coil transfer machine. This makes it possible to automate coil insertion with a simple configuration, and there is no waste in the operation of inserting the coil lead wire into the insertion hole of the printed circuit board, making it possible to improve efficiency and save labor.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing an embodiment of a device for carrying out the automatic coil insertion method according to the present invention, Figs. 2 to 5 show the main parts of Fig. 1, and Fig. 2 shows an air-core coil. Fig. 3 is a partially cross-sectional front view showing how the lead wire of the air-core coil is coated with solder after the lead wire of the air-core coil is removed by the solder bath. Fig. 4 is a partially sectional front view showing a state where the side surface of the air-core coil is held, Figs. 5 a and b are partial side views of Fig. 4, and Fig. 6 shows the operating steps of the present invention. FIG. 7 is a plan view of a portion showing another embodiment, and FIG. 8 is a process chart showing the operating steps in a conventional method. 4... air core coil, 5... solder bath, 6... lead wire of air core coil 4, 8... printed circuit board, 9...
...insertion hole of printed circuit board 8, 20...coil automatic winder, 21...adhesive, 30...first coil transfer machine, 36, 36a, 36b...retainer, 40...
Second coil transfer machine, 50...Third coil transfer machine,
54...chuck, 55a, 55b...coil chuck, 60...XY table.

Claims (1)

[Claims] 1. Transfer the coil onto a printed circuit board on an XY table while detachably holding the coil with a coil transfer machine, and move the lead wire of the coil to the solder bath by moving the solder bath during this transfer. to remove the film of the lead wire and attach solder, move the XY table for positioning at the end of the transfer, and bring the XY table and the coil transfer machine into relative proximity. An automatic coil insertion method comprising: inserting the lead wire of the coil into an insertion hole of the printed circuit board by moving the coil, and fixing the coil to the printed circuit board by curing an adhesive. 2. A coil transfer means that removably holds the coil and transfers it onto a printed circuit board on an XY table, and a solder bath provided in the middle of transferring the coil moves the lead wire of the coil to the solder bath. a solder adhering means for removing the film of the lead wire and adhering the solder; moving the XY table for positioning; and moving the XY table and the coil transfer device relative to each other. an insertion means for inserting the lead wire of the coil into an insertion hole of the printed circuit board; and a fixing means for fixing the coil to the printed circuit board by curing an adhesive applied on the printed circuit board. The coil transfer means transfers the coil using a holder that removably holds the coil with the lead wire of the coil protruding to the outside, and the coil transfer means includes a holder that removably holds the coil with the lead wire of the coil protruding to the outside, and a transfer path that includes the solder. A first coil transfer machine in which a tank is temporarily installed, a second coil transfer machine that receives the coil transferred by the first coil transfer machine, detachably holds the lead wire and relays the coil, and this second coil. An automatic coil insertion device comprising a third coil transfer device that receives the coil transferred by the transfer device, detachably holds the side surface of the coil with a chuck, and transfers the coil onto the printed circuit board.