JPH03196656A - Cooling structure of test head for ic tester - Google Patents
Cooling structure of test head for ic testerInfo
- Publication number
- JPH03196656A JPH03196656A JP1337921A JP33792189A JPH03196656A JP H03196656 A JPH03196656 A JP H03196656A JP 1337921 A JP1337921 A JP 1337921A JP 33792189 A JP33792189 A JP 33792189A JP H03196656 A JPH03196656 A JP H03196656A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- cooling
- conduction plate
- printed board
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 38
- 239000012530 fluid Substances 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract 2
- 238000003780 insertion Methods 0.000 abstract 1
- 230000037431 insertion Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000012809 cooling fluid Substances 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 235000011962 puddings Nutrition 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野Ｊ
この発明は、ＩＣテスタ用テストヘッドの冷却ＪＭ造に
ついてのものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application J] This invention relates to a cooling JM construction of a test head for an IC tester.
［従来の技術］
次に、従来技術によるＩｃテスタ用テストヘッドの冷却
構造を第４図によりｍ明する。[Prior Art] Next, the cooling structure of a test head for an IC tester according to the prior art will be explained with reference to FIG.
第４図の１１はテストヘッドの中央部に設けられた中空
の管、１３は管１１を中心に放射状に配置されたプリン
ト板、１４はテストヘッドの四隅に設けられた送風機、
１５はテストヘッドの四隅に設けられた通風孔、１６は
ケースである。In FIG. 4, 11 is a hollow tube provided in the center of the test head, 13 is a printed board arranged radially around the tube 11, and 14 is a blower provided at the four corners of the test head.
15 is a ventilation hole provided at the four corners of the test head, and 16 is a case.
プリント板１３には、ＩＣが実装される。An IC is mounted on the printed board 13.
通常、テストヘッドの中央部に測定されるＩＣを載せる
。Usually, the IC to be measured is placed in the center of the test head.
測定されるＩＣの各ビンと各プリント板１３に実装され
たＩＣとの距離をなるべく短くし、かつ等距離にするた
め、プリント板１３は管１１を中心に放射状に配置され
る。In order to make the distance between each bin of ICs to be measured and the IC mounted on each printed board 13 as short as possible and to make them equidistant, the printed boards 13 are arranged radially around the tube 11.
次に、第４図の主要部の断面図を第５図によりｉｉｌを
明する。Next, the sectional view of the main part of FIG. 4 will be explained with reference to FIG. 5.
第５図の１７は管１１に設けられた通風孔であり、送風
ｆｉｌｌｌは空気をゲース１６の外に吹き出すように回
転するので、管１１の上側または下側から吸い込まれた
空気は、管１１の通風孔１７からプリン１−板１３の間
を通ってゲース１６の外へ出ていく。Reference numeral 17 in FIG. 5 is a ventilation hole provided in the tube 11. Since the ventilation fill rotates so as to blow air out of the gate 16, the air sucked in from the upper or lower side of the tube 11 is removed from the tube 11. It passes through the ventilation hole 17 between the pudding 1 and the plate 13 and exits the gate 16.
プリント板１３の間を空気が通過することにより、プリ
ント板１３に実装されているＩＣは冷却される。As air passes between the printed boards 13, the ICs mounted on the printed boards 13 are cooled.
［発明が解決しようとする課題］
第４図では、送風機１４による空冷を採用しているが、
最近はプリンＩ・板１３の実装数が増え、さらにプリン
ト板１３も高密度に実装されるようになってきている。[Problems to be Solved by the Invention] In FIG. 4, air cooling using the blower 14 is used, but
Recently, the number of printed circuit boards 13 has increased, and printed circuit boards 13 have also been mounted with high density.
このため、第４図のような冷却構造では空気の流通が悪
くなり、冷却効率が上がらなくなってきている。For this reason, in the cooling structure as shown in FIG. 4, air circulation becomes poor and cooling efficiency is no longer improved.
また、送風機１４による騒音、振動、はこり等の問題も
使用環境によっては制限される場合があり、送風機１４
を使わない冷却方法が必要になっている。In addition, problems such as noise, vibration, and lumps caused by the blower 14 may be restricted depending on the usage environment.
There is a need for a cooling method that does not require
この発明は、管１１を中心に配置されたプリント板１３
の内層に第１の熱伝導板を挿入し、第１の熱伝導板と熱
的に導通する第２の熱伝導板をプリント板の表面に取り
付け、プリント板に装着されたＩＣと第２の熱伝導板に
接触する形で構成された冷却板に流路管を取り付け、流
路管内に例えば水などの比熱の大きい流体を流すことに
より、プリント板１３に実装されたＩＣを冷却するよう
にし、冷却効率の高いＩＣテスタ用テストヘッドの冷却
構造の提供を目的とする。This invention has a printed board 13 arranged around the tube 11.
A first heat conductive plate is inserted into the inner layer of the printed board, a second heat conductive plate that is thermally conductive with the first heat conductive plate is attached to the surface of the printed board, and the IC mounted on the printed board and the second The IC mounted on the printed board 13 is cooled by attaching a flow pipe to a cooling plate configured to be in contact with a heat conduction plate and flowing a fluid with a large specific heat, such as water, into the flow pipe. The purpose of the present invention is to provide a cooling structure for a test head for an IC tester with high cooling efficiency.
［課題を解決するための手段］
この目的を達成するために、この発明では、中央部に配
置される管１１と、管１１の周囲に放射状に配置され、
ＩＣ１２Ａとチップ部品１２Ｂが取り付けられた複数の
プリント板１３とで構成されるＩＣテスタのテストヘッ
ドに対し、プリントＷ、１３の内層に挿入される第１の
熱伝導板１と、プリント板１３の表面に取り付けられ、
第１の熱「云導板ｌと熱的に導通する第２の熱伝導板２
と、第２の熱伝導板２と熱的に導通し、ＩＣ１２Ａに接
触する形に構成される冷却板３と、冷却板３に取り付け
た流路管４とを備え、流路管４に比熱の大きい流体を流
すことによりＩＣ１２Ａとチップ部品１２Ｂを冷却する
。[Means for Solving the Problem] In order to achieve this object, the present invention includes a tube 11 arranged in the center, a tube 11 arranged radially around the tube 11,
For a test head of an IC tester that is composed of a plurality of printed boards 13 to which ICs 12A and chip components 12B are attached, a first thermally conductive plate 1 inserted into the inner layer of the printed boards 13 and attached to the surface,
A second heat conductive plate 2 that is thermally connected to the first heat conductive plate 1.
, a cooling plate 3 configured to be in thermal conduction with the second heat conduction plate 2 and in contact with the IC 12A, and a flow pipe 4 attached to the cooling plate 3. The IC 12A and the chip component 12B are cooled by flowing a fluid with a large amount of water.
次に、この発明によるＩＣテスタ用テスｊ・ヘッドの冷
却構造を第１図により説明する。Next, a cooling structure for a test head for an IC tester according to the present invention will be explained with reference to FIG.
第１図の２は熱伝導板、３は冷却板、１２Ａは冷却され
るＩＣ１１２Ｂはチップ部品、４は冷却板３に取り付け
られた流路管、５Ａと５Ｂはカップラ、７Ａと７Ｂはパ
イプ、８Ａは冷却用流体の入口、８Ｂは冷却用流体の出
口である。In FIG. 1, 2 is a heat conduction plate, 3 is a cooling plate, 12A is a cooled IC 112B is a chip component, 4 is a flow pipe attached to the cooling plate 3, 5A and 5B are couplers, 7A and 7B are pipes, 8A is a cooling fluid inlet, and 8B is a cooling fluid outlet.
管１１とプリント板１３の関係は、第４図と同じである
。The relationship between the tube 11 and the printed board 13 is the same as that shown in FIG.
次に、カップラ５Ａ−Ｂの接続関係を第２図により説明
する。Next, the connection relationship between the couplers 5A and 5B will be explained with reference to FIG.
冷却板３には、それぞれ流路管４が取り付けられる。A flow path pipe 4 is attached to each cooling plate 3 .
流路管４には、第１図のパイプ７Ａから例えば水などの
ように比熱の大きい流体が流される。A fluid having a large specific heat, such as water, flows into the flow path pipe 4 from the pipe 7A in FIG.
第２図の６Ａはカッグラ５Ａに連結される力・ソブラ、
６Ｂはカップラ５Ｂに連結されるカップラである。6A in Figure 2 is the force/sobra connected to Kagura 5A,
6B is a coupler connected to coupler 5B.
第２図のカップラ６Ａは、第１図のパイプ７Ａに連結さ
れ、カップラ６Ｂは、第１図のパイプ７Ｂに連結される
。The coupler 6A in FIG. 2 is connected to the pipe 7A in FIG. 1, and the coupler 6B is connected to the pipe 7B in FIG.
カッ１う５Ａ・５Ｂをカップラ６Ａ・６Ｂから外すこと
により、プリント板１３をテストヘッドから分離するこ
とができる。By removing the cups 5A and 5B from the couplers 6A and 6B, the printed board 13 can be separated from the test head.
次に、第１図のプリント板１３に関連した要部断面図を
第３図により説明する。Next, a sectional view of a main part related to the printed board 13 shown in FIG. 1 will be explained with reference to FIG. 3.
第３図の１は熱伝導板であり、プリント板１３の内層に
挿入され、熱伝導板ｌと熱伝導板２は熱的に導通される
。Reference numeral 1 in FIG. 3 is a heat conduction plate, which is inserted into the inner layer of the printed board 13, so that the heat conduction plate 1 and the heat conduction plate 2 are thermally connected.
チ・ツブ部品１２Ｂの発熱は、熱伝導板１から熱伝導板
２を経て、冷却板３に伝えられる。The heat generated by the chip part 12B is transmitted from the heat conduction plate 1 to the cooling plate 3 via the heat conduction plate 2.
冷却板３は例えばＨＩＣなどのＩ Ｃ１２Ａに接触する
ようにコ字状に形成され、端部を熱伝導板２に接触させ
る形に構成される。The cooling plate 3 is formed in a U-shape so as to be in contact with an IC 12A such as a HIC, and its end portion is in contact with the heat conductive plate 2.
ＩＣ１２Ａの容量は２Ｗ〜６Ｗであり、チップ部品１２
Ｂの容量は０．１Ｗ程度である。The capacity of IC12A is 2W to 6W, and the chip component 12
The capacity of B is about 0.1W.
［Ｃｌ２Ａとチップ部品１２Ｂが発熱すると、ＩＣ１２
Ａの熱は直接冷却板３に伝わり、チップ部品１２Ｂの熱
はプリント板１３の内層の熱伝導板１から熱伝導板２、
冷却板３へ順次伝わる。[When Cl2A and chip component 12B generate heat, IC12
The heat of A is directly transmitted to the cooling plate 3, and the heat of the chip component 12B is transferred from the heat conduction plate 1 on the inner layer of the printed board 13 to the heat conduction plate 2,
It is sequentially transmitted to the cooling plate 3.
冷却板３、熱伝導板１・２には、例えば、銅等の熱伝導
率がよい材質を採用する。The cooling plate 3 and the heat conductive plates 1 and 2 are made of a material with good thermal conductivity, such as copper.
また、接触熱抵抗を減らずため、冷却板３とＩＣｌ２Ａ
の間に熱伝導率の高いシリコングリースを塗っておく。In addition, in order not to reduce the contact thermal resistance, the cooling plate 3 and ICl2A
Apply silicone grease with high thermal conductivity in between.
一方、水などの比熱の高い冷却用流体は、第１図の入口
８Ａからバイブ７Ａ、第２図のカップラ６Ａからカップ
ラ５Ａを通り、流路管４で冷却板３を冷却する。On the other hand, a cooling fluid such as water having a high specific heat passes through the inlet 8A in FIG. 1 to the vibrator 7A, and from the coupler 6A to the coupler 5A in FIG.
冷却板３を通過した冷却用流体は、第２図のカップラ６
Ｂからカップラ５Ｂを通り、第１図のバイブ７Ｂから出
口８Ｂに出ていく。The cooling fluid that has passed through the cooling plate 3 is transferred to the coupler 6 in FIG.
B, passes through the coupler 5B, and exits from the vibrator 7B in FIG. 1 to the exit 8B.
［発明の効果］
この発明によれば、管を中心に配置されたプリント板の
内層に第１の熱伝導板を挿入し、第１の熱伝導板と熱的
に導通する第２の熱伝導板をプリント板の表面に取り付
け、プリント
たＩＣと第２の熱伝導板に接触する形で構成された冷却
板に流路管を取り付け，流路管内に比熱の大きい流体を
流しているので，プリント板に実装されたＩＣとチップ
部品を冷却することができ、空冷式に比べて冷却効率の
高いＩＣテスタ用テストヘッドの冷却構造を提供するこ
とができる。[Effects of the Invention] According to the present invention, the first heat conduction plate is inserted into the inner layer of the printed board arranged around the tube, and the second heat conduction plate is thermally connected to the first heat conduction plate. A board is attached to the surface of the printed board, a flow pipe is attached to the cooling plate configured to contact the printed IC and the second heat conduction plate, and a fluid with a large specific heat is flowed inside the flow pipe. It is possible to provide a cooling structure for a test head for an IC tester that can cool ICs and chip components mounted on a printed board and has higher cooling efficiency than an air-cooled type.
第１図はこの発明によるＩＣテスタ用テストヘッドの冷
却構造図、第２図はカップラ５Ａ−Ｂの接続関係説明図
、第３図は第１図のプリント板１３に関連した要部断面
図、第４図は従来技術によるＩＣテスタ用テストヘッド
の冷却構造図、第５図は第４図の主要部の断面図である
。
ｌ・・・・・・熱伝導板、２・・・・・・熱伝導板、３
・・・・・・冷却板、４・・・・・・流路管、５Ａ・５
Ｂ・・・・・・カップラ、６Ａ・６Ｂ・・・・・・カッ
プラ、７Ａ・７Ｂ・・・・・・バイブ、８Ａ・・・・・
・入口、８Ｂ・・・・・・川口、１１・・・・・・管、
１２Ａ・・・・・・ＩＣ、１２Ｂ・・・・・・チップ部
品、１３・・・・・・プリン１〜板。1 is a diagram of the cooling structure of a test head for an IC tester according to the present invention, FIG. 2 is an explanatory diagram of the connection relationship between couplers 5A-B, and FIG. 3 is a sectional view of essential parts related to the printed board 13 of FIG. FIG. 4 is a diagram of a cooling structure of a test head for an IC tester according to the prior art, and FIG. 5 is a sectional view of the main part of FIG. 4. l...Heat conduction plate, 2...Heat conduction plate, 3
・・・・・・Cooling plate, 4・・・Flow pipe, 5A・5
B...Coupler, 6A/6B...Coupler, 7A/7B...Vibe, 8A...
・Entrance, 8B...Kawaguchi, 11...Tube,
12A...IC, 12B...chip parts, 13...pudding 1 to board.
Claims (1)
囲に放射状に配置され、ＩＣ（１２Ａ）とチップ部品（
１２Ｂ）が取り付けられた複数のプリント板（１３）と
で構成されるＩＣテスタのテストヘッドに対し、 プリント板（１３）の内層に挿入される第１の熱伝導板
（１）と、 プリント板（１３）の表面に取り付けられ、第１の熱伝
導板（１）と熱的に導通する第２の熱伝導板（２）と、 第２の熱伝導板（２）と熱的に導通し、ＩＣ（１２Ａ）
に接触する形に構成される冷却板（３）と、 冷却板（３）に取り付けた流路管（４）とを備え、 流路管（４）に比熱の大きい流体を流すことによりＩＣ
（１２Ａ）とチップ部品（１２Ｂ）を冷却することを特
徴とするＩＣテスタ用テストヘッドの冷却構造。[Claims] 1. A tube (11) disposed in the center, and ICs (12A) and chip components (12A) disposed radially around the tube (11).
A first thermally conductive plate (1) inserted into the inner layer of the printed board (13); (13), a second heat conductive plate (2) that is thermally connected to the first heat conductive plate (1); and a second heat conductive plate (2) that is thermally connected to the first heat conductive plate (1). , IC (12A)
A cooling plate (3) configured to be in contact with the cooling plate (3) and a flow pipe (4) attached to the cooling plate (3), and by flowing a fluid with a large specific heat through the flow pipe (4), the IC
A cooling structure for a test head for an IC tester, characterized by cooling (12A) and a chip component (12B).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1337921A JPH03196656A (en) | 1989-12-26 | 1989-12-26 | Cooling structure of test head for ic tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1337921A JPH03196656A (en) | 1989-12-26 | 1989-12-26 | Cooling structure of test head for ic tester |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03196656A true JPH03196656A (en) | 1991-08-28 |
Family
ID=18313252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1337921A Pending JPH03196656A (en) | 1989-12-26 | 1989-12-26 | Cooling structure of test head for ic tester |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03196656A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007057959A1 (en) * | 2005-11-17 | 2007-05-24 | Advantest Corporation | Device-mounted apparatus, test head, and electronic component testing apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6271299A (en) * | 1985-09-25 | 1987-04-01 | 日本電信電話株式会社 | Cooling structure for electronic device |
| JPH01157596A (en) * | 1987-09-10 | 1989-06-20 | Nec Corp | Data processing device |
| JPH01193667A (en) * | 1988-01-28 | 1989-08-03 | Toshiba Corp | Ic tester |
| JPH01267472A (en) * | 1988-04-19 | 1989-10-25 | Nec Kyushu Ltd | Cooling system for semiconductor test system |
-
1989
- 1989-12-26 JP JP1337921A patent/JPH03196656A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6271299A (en) * | 1985-09-25 | 1987-04-01 | 日本電信電話株式会社 | Cooling structure for electronic device |
| JPH01157596A (en) * | 1987-09-10 | 1989-06-20 | Nec Corp | Data processing device |
| JPH01193667A (en) * | 1988-01-28 | 1989-08-03 | Toshiba Corp | Ic tester |
| JPH01267472A (en) * | 1988-04-19 | 1989-10-25 | Nec Kyushu Ltd | Cooling system for semiconductor test system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007057959A1 (en) * | 2005-11-17 | 2007-05-24 | Advantest Corporation | Device-mounted apparatus, test head, and electronic component testing apparatus |
| US7863916B2 (en) | 2005-11-17 | 2011-01-04 | Advantest Corporation | Device mounted apparatus, test head, and electronic device test system |
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