JPH03196599A - Heat conductor for cooling - Google Patents
Heat conductor for coolingInfo
- Publication number
- JPH03196599A JPH03196599A JP33758189A JP33758189A JPH03196599A JP H03196599 A JPH03196599 A JP H03196599A JP 33758189 A JP33758189 A JP 33758189A JP 33758189 A JP33758189 A JP 33758189A JP H03196599 A JPH03196599 A JP H03196599A
- Authority
- JP
- Japan
- Prior art keywords
- copper plate
- cooler
- cooling
- heat
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 38
- 239000004020 conductor Substances 0.000 title description 8
- 239000002470 thermal conductor Substances 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 55
- 229910052802 copper Inorganic materials 0.000 abstract description 55
- 239000010949 copper Substances 0.000 abstract description 55
- 238000005476 soldering Methods 0.000 abstract description 6
- 238000010276 construction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
〔産業上の利用分野〕
本発明は冷却用熱伝導体に係り、特に赤外線検知素子の
冷却器と、該検知素子を搭載するコールドステージとの
冷却効率を高めた冷却用熱伝導体に関する。[Detailed Description of the Invention] [Overview] [Industrial Application Field] The present invention relates to a thermal conductor for cooling, and in particular to cooling efficiency of a cooler for an infrared sensing element and a cold stage on which the sensing element is mounted. This invention relates to a cooling thermal conductor with increased
赤外線検知素子を使用する場合、熱的な雑音を除くため
に該素子の冷却が必要であり、その冷却のため第3図の
断面図に示すような小型で軽量なヘリウム循環式冷却器
が、用いられている。When using an infrared sensing element, it is necessary to cool the element to remove thermal noise, and for this purpose, a small and lightweight helium circulating cooler as shown in the cross-sectional view of Figure 3 is used. It is used.
第3図で1は冷却器で、内部にピストンが配置されてお
り、またフレキシブルチューブ2を用いてコンプレッサ
3と接続されている。冷却器1の先端部の第1の銅板1
1は冷却用熱伝導体4を介してコールドステージ5に設
置された第2の銅板12に熱的に接触されており、該コ
ールドステージ5には冷却すべき赤外線検知素子(半導
体素子)6が固定されている。In FIG. 3, reference numeral 1 denotes a cooler, in which a piston is arranged, and is connected to a compressor 3 using a flexible tube 2. First copper plate 1 at the tip of cooler 1
1 is in thermal contact with a second copper plate 12 installed on a cold stage 5 via a cooling heat conductor 4, and an infrared sensing element (semiconductor element) 6 to be cooled is on the cold stage 5. Fixed.
また7は真空容器で赤外線検知素子6の周囲を真空状態
に保っている。該真空容器7内には更に冷却器Iの要部
と冷却用熱伝導体4とを囲むガラス管8が設けられ、ガ
ラス管8と冷却器1の要部および冷却用熱伝導体4との
間も真空に保たれている。また9は真空容器7の赤外線
検知素子6に対向する位置に設けられた開口部を覆う窓
で、外部からの赤外線を通過させる材質で形成されてお
り、10は真空容器7内を排気するための排気バルブで
ある。Further, 7 is a vacuum container that maintains the area around the infrared detecting element 6 in a vacuum state. A glass tube 8 is further provided in the vacuum container 7 to surround the main parts of the cooler I and the cooling heat conductor 4. The space is also maintained in a vacuum. Further, 9 is a window covering an opening provided in a position facing the infrared detecting element 6 of the vacuum container 7, and is made of a material that allows infrared rays from the outside to pass through, and 10 is a window for evacuating the inside of the vacuum container 7. This is the exhaust valve.
冷却器1は、その内部のピストンがその先端部の位置か
ら下方に移動すると、それに伴って生じた空間内にコン
プレッサ3より高圧で送られる冷却用ヘリウム(He)
ガスを吸入して赤外線検知素子6の熱を吸収し、ピスト
ンが最下位位置より先端部方向へ上がると、それに伴っ
て空間部が狭められ、内部のHeガスをコンプレッサー
3に戻す。以下、ピストンの上下方向の往復運動に対応
して上記の動作が繰り返される。When the piston inside the cooler 1 moves downward from the position of its tip, helium (He) for cooling is sent at high pressure from the compressor 3 into the space created accordingly.
When the gas is sucked in and the heat of the infrared detection element 6 is absorbed, and the piston rises from the lowest position toward the tip, the space is narrowed accordingly and the He gas inside is returned to the compressor 3. Thereafter, the above operation is repeated in response to the reciprocating movement of the piston in the vertical direction.
従って、冷却効果を得るには、上記ピストンの上下方向
の往復運動が必要であるが、それによって発生する機械
的振動を吸収するとともに、冷却器lによる冷却効果を
伝達するために冷却用熱伝導体4が用いられている。Therefore, in order to obtain a cooling effect, the piston needs to reciprocate in the vertical direction, and in addition to absorbing the mechanical vibrations generated by this movement, heat conduction for cooling is also required to transmit the cooling effect of the cooler l. Body 4 is used.
従って、この冷却器lの冷却効果を充分に発揮するため
に、冷却器lとコールドステージ5との間の熱抵抗を小
さくした冷却用熱伝導体が必要となる。Therefore, in order to fully exhibit the cooling effect of the cooler 1, a cooling thermal conductor with low thermal resistance between the cooler 1 and the cold stage 5 is required.
第4図は従来の冷却用熱伝導体の一例の構造図を示す。 FIG. 4 shows a structural diagram of an example of a conventional cooling heat conductor.
第4図で第3図と同一構成部分には、同一符号を付す。Components in FIG. 4 that are the same as those in FIG. 3 are given the same reference numerals.
第4図に於いて、冷却用熱伝導体4は冷却器1の先端部
に固定された第1の銅板11と、コールドステージ5に
取りつけられた第2の銅板12と、これらの銅板IL
12間に設けられた筒状の圧縮されたコイルバネ13と
、該コイルバネ13内の空間にあり、一端が第1の銅板
11に接触固定され、他端が第2の銅板12に接触固定
された多層薄FyA銅板14とからなる。In FIG. 4, the cooling thermal conductor 4 includes a first copper plate 11 fixed to the tip of the cooler 1, a second copper plate 12 attached to the cold stage 5, and these copper plates IL.
A cylindrical compressed coil spring 13 is provided between the coil springs 12 and 12, and a coil spring 13 is located in a space within the coil spring 13, and one end is fixed in contact with the first copper plate 11, and the other end is fixed in contact with the second copper plate 12. It consists of a multilayer thin FyA copper plate 14.
かかる構造の冷却用熱伝導体4は、冷却器1内にlle
Heガス入される期間内に、赤外線検知素子6の熱を第
2の銅板I2より多層薄膜銅板14に、次いで多層薄膜
銅板14より第1の銅板11に、更に第1の銅板より冷
却器1に到る経路で流し、Heガスに吸収されるように
している。The cooling heat conductor 4 having such a structure is installed inside the cooler 1.
During the period in which He gas is supplied, the heat of the infrared sensing element 6 is transferred from the second copper plate I2 to the multilayer thin film copper plate 14, then from the multilayer thin film copper plate 14 to the first copper plate 11, and then from the first copper plate to the cooler 1. It is made to flow through a route that leads to He gas so that it is absorbed by He gas.
また冷却器1内のピストンの往復運動に起因する冷却器
1の機械的振動は、圧縮されたコイルバネ13により吸
収され、赤外線検知素子6に伝達されることは無い。Furthermore, mechanical vibrations of the cooler 1 caused by the reciprocating movement of the piston within the cooler 1 are absorbed by the compressed coil spring 13 and are not transmitted to the infrared sensing element 6.
然るに、従来の冷却用熱伝導体は、平板状の第2の銅板
12の下面に接触固定されている多層薄膜銅板14の第
2の銅板に接触する領域は一箇所であり、第2の銅板1
2の全領域にわたって均等に接触していない。However, in the conventional cooling heat conductor, there is only one region in contact with the second copper plate of the multilayer thin film copper plate 14 that is fixed in contact with the lower surface of the flat second copper plate 12; 1
2 is not evenly contacted over the entire area.
そのため、その接触面積は第2の銅板12の上面や下面
の面積に比してかなり小さいために熱の流れが部分的に
集中し、そのため、第2の銅板の全面にわたって均等に
冷却されず、従ってコールドステージ5の冷却効率が悪
いといった問題がある。Therefore, since the contact area is considerably smaller than the area of the top and bottom surfaces of the second copper plate 12, the flow of heat is concentrated locally, and as a result, the entire surface of the second copper plate is not cooled evenly. Therefore, there is a problem that the cooling efficiency of the cold stage 5 is poor.
そのため、本出願人は以前に特願平1−58656号に
於いて、前記第1および第2の銅板11.12をそれぞ
れ多角錐状に形成し、該多角錐面に前記多層薄膜銅板1
4が接触するようにして熱の流れが該銅板11.12の
全領域に均等に流れるようにして冷却効果を高めた冷却
用熱伝導体を提案したが、この構造では前記銅板11.
12を多角錐状に加工する必要があり、加工に要する工
数が大となる問題がある。Therefore, in Japanese Patent Application No. 1-58656, the present applicant previously formed the first and second copper plates 11 and 12 into polygonal pyramid shapes, and formed the multilayer thin film copper plate 1 on the polygonal pyramidal surface.
A cooling thermal conductor has been proposed in which the cooling effect is enhanced by making the heat flow evenly over the entire area of the copper plates 11.12 so that the copper plates 11.
12 needs to be processed into a polygonal pyramid shape, which poses a problem in that the number of man-hours required for processing is large.
本発明は上記した従来の問題点を解決するもので、取り
つけが容易で、冷却器とコールドステージ間の熱抵抗が
小さ(保たれ、冷却器の冷却効率が大になるようにした
冷却用熱伝導体を目的とする。The present invention solves the above-mentioned conventional problems, and provides a cooling heat source that is easy to install, maintains low thermal resistance between the cooler and the cold stage, and increases the cooling efficiency of the cooler. Intended as a conductor.
上記目的を達成する本発明の冷却用熱伝導体21は、第
1図および第2図に示すように、低温部に接触する第1
の金属平板11と、高温部に接触する第2の金属平板1
2との間に薄板を多層に積層した熱良導性部材22を接
続し、かつ前記第1と第2の金属平板ICl3間にコイ
ルバネ23を設けた冷却用熱伝導体21であって、
前記熱良導性部材22を円形、または多角形状に形成し
た中央部22Aと、該中央部より放射状に延びる放射状
延長部22Bとで構成し、前記中央部の底面を前記第1
の金属平板11に接続するとともに、前記放射状延長部
の先端部を前記第2の金属平板12に接続するように設
ける。As shown in FIGS. 1 and 2, the cooling thermal conductor 21 of the present invention that achieves the above object has a first
a metal flat plate 11 and a second metal flat plate 1 that contacts the high temperature part.
2, a thermally conductive member 22 formed by laminating thin plates in multiple layers is connected between the cooling thermal conductor 21, and a coil spring 23 is provided between the first and second metal flat plates ICl3, the cooling thermal conductor 21 comprising: The thermally conductive member 22 is composed of a central portion 22A formed in a circular or polygonal shape, and radial extension portions 22B extending radially from the central portion, and the bottom surface of the central portion is connected to the first
The second flat metal plate 11 is connected to the second flat metal plate 11, and the tip of the radial extension is connected to the second flat metal plate 12.
本発明の冷却用熱伝導体に依ると、第1図および第2図
に示すように、前記熱良導性部材22と、冷却器の先端
部に取りつけられた第1の銅板11と、コールドステー
ジに取りつけられた第2の銅板12とに接触する領域が
、均等に分散して形成されるために、熱の流れが第2の
銅板より第1の銅板を通じて均等に流れるようになり、
該両者の銅板に熱の集中が無くなって均一に分散するた
め、冷却効率が大になる。According to the cooling thermal conductor of the present invention, as shown in FIGS. 1 and 2, the thermally conductive member 22, the first copper plate 11 attached to the tip of the cooler, and the cold Since the areas in contact with the second copper plate 12 attached to the stage are formed to be evenly distributed, heat flows more evenly through the first copper plate than through the second copper plate,
Since heat is no longer concentrated on the two copper plates and is evenly distributed, cooling efficiency is increased.
そして前記熱良導性部材22を囲むように第1、および
第2の銅板11.12間に筒状の弾力性のコイルバネ2
3を設けることで冷却器の機械的振動を第2の銅板12
に接触固定されているコールドステージに伝達しないよ
うになり、従って赤外線検知素子の接続リード線が断線
したりする事故が生じない状態で検知素子が効率良く冷
却される。A cylindrical elastic coil spring 2 is arranged between the first and second copper plates 11 and 12 so as to surround the thermally conductive member 22.
By providing the second copper plate 12, the mechanical vibration of the cooler is
Therefore, the sensing element is efficiently cooled without any accident such as disconnection of the connecting lead wire of the infrared sensing element.
第1図は本発明の冷却用熱伝導体の構造を示す平面図、
第2図は第1図のI−I’線断面図である。FIG. 1 is a plan view showing the structure of the cooling thermal conductor of the present invention;
FIG. 2 is a sectional view taken along line II' in FIG. 1.
第1図、および第2図に示すように、本発明の冷却用熱
伝導体21は、多層に積層された薄板状の銅よりなる熱
良導性部材22で形成され、この熱良導性部材22は、
冷却器の先端部に設けられた第1の銅板11と、赤外線
検知素子を搭載するコールドステージに取りつけられた
第2の銅板12との間に半田付は等を用いて固定されて
いる。As shown in FIGS. 1 and 2, the cooling thermal conductor 21 of the present invention is formed of a thermally conductive member 22 made of thin plate-shaped copper laminated in multiple layers. The member 22 is
A first copper plate 11 provided at the tip of the cooler and a second copper plate 12 attached to a cold stage on which an infrared detection element is mounted are fixed using soldering or the like.
この該熱良導性部材22は円形に形成された中央部22
Aと、該中央部より放射状に延びる放射状延長部22B
のような形に成形され、前記熱良導性部材の中央部22
Aと、放射状延長部22Bの一部が前記冷却器の先端に
設けられた第1の銅板11に半田付は等で固定されてい
る。This thermally conductive member 22 has a central portion 22 formed in a circular shape.
A, and a radial extension portion 22B extending radially from the central portion.
The central portion 22 of the thermally conductive member is shaped like this.
A and a part of the radial extension 22B are fixed by soldering or the like to the first copper plate 11 provided at the tip of the cooler.
なお、中央部22Aは多角形状としても良い。Note that the central portion 22A may have a polygonal shape.
更に該中央部22Aを延長した放射状延長部22BをS
字状になるように屈曲させて、第2の銅板12に接触さ
せ、半田付は等で該第2の銅板に固定している。Furthermore, the radial extension part 22B which is an extension of the central part 22A is S.
It is bent into a letter shape, brought into contact with the second copper plate 12, and fixed to the second copper plate by soldering or the like.
このように前記した熱良導性部材をS字状に成形するこ
とで冷却器の振動がコールドシールド側により伝達し難
くなる。By forming the thermally conductive member into an S-shape as described above, vibrations of the cooler are less likely to be transmitted to the cold shield side.
更に、上記した形状の熱良導性部材22を囲むようにし
て第1の銅板11と第2の銅板12間に弾力性の金属材
料で形成された筒状のコイルバネ23を設ける。Further, a cylindrical coil spring 23 made of an elastic metal material is provided between the first copper plate 11 and the second copper plate 12 so as to surround the thermally conductive member 22 having the above-described shape.
このようにすると、前記熱良導性部材22が、冷却器の
先端に取りつけられた第1の銅板11、およびコールド
ステージに取りつけられた第2の銅板12に接触する領
域が均等に分散して拡がるために、熱の流れがコールド
ステージより冷却器の先端部の第1の銅板を通じて均等
に流れるようになり、これらの両者の銅板に熱の集中が
無くなって熱が均一に分散するため、冷却効率が大にな
る。In this way, the areas where the thermally conductive member 22 contacts the first copper plate 11 attached to the tip of the cooler and the second copper plate 12 attached to the cold stage are evenly distributed. Because of the expansion, the heat flow is evenly distributed from the cold stage through the first copper plate at the tip of the cooler, and there is no concentration of heat between these two copper plates and the heat is evenly distributed, resulting in cooling. Greater efficiency.
そして第1、および第2の銅板11.12間にコイルバ
ネを設けることで、前記熱良導性部材をS字状に屈曲さ
せた事項とが重なって冷却器の機械的振動がコールドス
テージに伝達しないようになり、該コールドステージ上
の赤外線検知素子の接続リード線が、冷却器の機械的振
動で外れて接触不良となるような事故が無い状態で、高
い冷却効率で冷却される。By providing a coil spring between the first and second copper plates 11 and 12, the mechanical vibration of the cooler is transmitted to the cold stage due to the S-shaped bending of the thermally conductive member. This allows the infrared sensing element on the cold stage to be cooled with high cooling efficiency without accidents such as connection lead wires coming off due to mechanical vibration of the cooler and poor contact.
また本実施例の他に、第2の実施例として前記熱良導性
部材22を銅板を積層して予かしめ、中央部22Aと放
射状延長部22Bを有する構造に積層して形成した後、
中央部22Aを冷却器の先端部の第1の銅板11にネジ
24を用いてネジ止めして固定した後、更に中央部から
延長した放射状延長部22BをS字状に屈曲させて、第
2の銅vi12に半田付は等で固定すると、熱良導性部
材の取りつけが簡単に行い得る。In addition to this embodiment, as a second embodiment, the thermally conductive member 22 is formed by laminating copper plates and caulking them in advance to form a structure having a central portion 22A and radial extension portions 22B.
After fixing the central part 22A to the first copper plate 11 at the tip of the cooler using screws 24, the radial extension part 22B extending from the central part is further bent into an S-shape to form the second copper plate 11. If it is fixed to the copper VI12 by soldering or the like, the thermally conductive member can be easily attached.
また本実施例では熱良導性部材の中央部より放射状延長
部を4本張り出した構造を採ったが、この放射状延長部
は適宜設けて良い。Furthermore, although this embodiment adopts a structure in which four radial extensions are extended from the center of the thermally conductive member, these radial extensions may be provided as appropriate.
以上の説明から明らかなように本発明の冷却用熱伝導体
によれば、冷却器とコールドステージとの間で熱の伝達
が効率良く行い得るので、動作中の赤外線検知素子が充
分冷却されるので、熱雑音の発生の少ない高信頼度の赤
外線検知装置が得られる。As is clear from the above description, according to the cooling thermal conductor of the present invention, heat can be efficiently transferred between the cooler and the cold stage, so that the infrared sensing element in operation is sufficiently cooled. Therefore, a highly reliable infrared detection device that generates little thermal noise can be obtained.
第1図は本発明の冷却用熱伝導体の平面図、第2図は第
1図のI−I ’線断面図、第3図はヘリウム循環式冷
却器の構造説明図、第4図は従来の冷却用熱伝導体の一
例の構造図である。
図において、
1は冷却器、2はフレキシブルチューブ、3はコンプレ
ッサー、4,21は冷却用熱伝導体、5はコールドステ
ージ、6は赤外線検知素子(半導体素子)、7は真空容
器、8はガラス管、9は窓、10は排気バルブ、11は
第1の金属平板(第1の銅板)、12は第2の金属平板
(第2の銅板)、22は熱良導性部材、22Aは中央部
、22Bは放射状延長部、23はコイルバネ、24はネ
ジを示す。
1≦、肩号ドロす5q ンダ\ffクツ瞥5イ之4tう
ζすyim第1図
第1 mn I−1’ヰ村面図
第2図Fig. 1 is a plan view of the cooling heat conductor of the present invention, Fig. 2 is a sectional view taken along the line I-I' in Fig. 1, Fig. 3 is a structural explanatory diagram of a helium circulation type cooler, and Fig. 4 is FIG. 2 is a structural diagram of an example of a conventional cooling thermal conductor. In the figure, 1 is a cooler, 2 is a flexible tube, 3 is a compressor, 4 and 21 are thermal conductors for cooling, 5 is a cold stage, 6 is an infrared detection element (semiconductor element), 7 is a vacuum container, and 8 is glass 9 is a window, 10 is an exhaust valve, 11 is a first metal flat plate (first copper plate), 12 is a second metal flat plate (second copper plate), 22 is a thermally conductive member, 22A is the center 22B is a radial extension, 23 is a coil spring, and 24 is a screw. 1≦, title dorosu 5q da\ff kutsubetsu 5i no 4t uze yim Figure 1 Figure 1 mn I-1'ヰ Village view Figure 2
Claims (1)
に接触する第2の金属平板(12)との間に、薄板を多
層に積層した熱良導性部材(22)を接続し、かつ、前
記第1と第2の金属平板(11,12)間にコイルバネ
を設けた冷却用熱伝導体(21)であって、前記熱良導
性部材(22)を円形、または多角形状に形成した中央
部(22A)と、該中央部より放射状に延びる放射状延
長部(22B)とで構成し、前記中央部の底面を前記第
1の金属平板(11)に接続するとともに、前記放射状
延長部の先端部を前記第2の金属平板(12)に接続す
るように設けたことを特徴とする冷却用熱伝導体。A thermally conductive member (22) made of multiple layers of thin plates is connected between a first flat metal plate (11) that contacts the low temperature part and a second flat metal plate (12) that contacts the high temperature part. and a cooling thermal conductor (21) in which a coil spring is provided between the first and second metal flat plates (11, 12), the thermally conductive member (22) having a circular or polygonal shape. It consists of a central portion (22A) formed in A cooling thermal conductor, characterized in that the tip of the extension is connected to the second flat metal plate (12).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33758189A JPH03196599A (en) | 1989-12-25 | 1989-12-25 | Heat conductor for cooling |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33758189A JPH03196599A (en) | 1989-12-25 | 1989-12-25 | Heat conductor for cooling |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03196599A true JPH03196599A (en) | 1991-08-28 |
Family
ID=18309999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33758189A Pending JPH03196599A (en) | 1989-12-25 | 1989-12-25 | Heat conductor for cooling |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03196599A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010177697A (en) * | 2005-03-08 | 2010-08-12 | Toshiba Corp | Heat conductive part |
-
1989
- 1989-12-25 JP JP33758189A patent/JPH03196599A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010177697A (en) * | 2005-03-08 | 2010-08-12 | Toshiba Corp | Heat conductive part |
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