JPH031959A - Manufacture of thick film thermal head - Google Patents
Manufacture of thick film thermal headInfo
- Publication number
- JPH031959A JPH031959A JP13642289A JP13642289A JPH031959A JP H031959 A JPH031959 A JP H031959A JP 13642289 A JP13642289 A JP 13642289A JP 13642289 A JP13642289 A JP 13642289A JP H031959 A JPH031959 A JP H031959A
- Authority
- JP
- Japan
- Prior art keywords
- heating resistor
- printed
- thermal head
- resistant layer
- resistance value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 238000005299 abrasion Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000005338 heat storage Methods 0.000 claims description 11
- 238000010304 firing Methods 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 5
- 239000010931 gold Substances 0.000 abstract description 5
- 229910052737 gold Inorganic materials 0.000 abstract description 5
- 238000009966 trimming Methods 0.000 abstract description 5
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 4
- 239000000377 silicon dioxide Substances 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 3
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 238000009825 accumulation Methods 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241000772415 Neovison vison Species 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、厚膜サーマルヘッドの製造方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a thick film thermal head.
従来の技術
第１図に厚膜サーマルヘッドの構造を示す。従来の厚膜
サーマルヘッドは、図の１に示すアルミナなどの絶縁性
基板上に、二酸化ケイ素などからなる蓄熱層２を設け、
次にこの蓄熱層２の上面に金などの金属材料を含む導電
性ペーストをスクリーン印刷し、乾燥し、焼成すること
により電極３を設け、次に共通電極部の配線抵抗を下げ
るために、金などの金属材料を含む導電性ペーストを用
いて共通電極θを上記と同様の方法で設ける。次にこの
電極３間に酸化ルテニウムなどを含む抵抗ペーストを用
いて１発熱抵抗体４を電極３と同様な方法によって設け
、次に耐磨耗層６を、二酸化ケイ素などを含む誘電体ペ
ーストを用いて、上記発熱抵抗体４と同様な方法で設け
るものである。Prior Art FIG. 1 shows the structure of a thick film thermal head. In a conventional thick film thermal head, a heat storage layer 2 made of silicon dioxide or the like is provided on an insulating substrate such as alumina as shown in FIG.
Next, a conductive paste containing a metal material such as gold is screen printed on the upper surface of this heat storage layer 2, dried, and fired to form an electrode 3. A common electrode θ is provided in the same manner as above using a conductive paste containing a metal material such as. Next, a heating resistor 4 is provided between the electrodes 3 using a resistance paste containing ruthenium oxide or the like in the same manner as for the electrodes 3, and then a wear-resistant layer 6 is formed using a dielectric paste containing silicon dioxide or the like. It is provided in the same manner as the heating resistor 4 described above.
ここで、上記のような成膜方法において、電極３と蓄熱
層２との間の密着力は、両層間の相互拡散により得られ
るものであり、また発熱抵抗体４は蓄熱層２及び電極３
との相互拡散により、耐磨耗層５は蓄勢層２及び電極３
及び発熱抵抗体４との相互拡散により密着力が得らｎる
ものである。Here, in the film forming method as described above, the adhesion between the electrode 3 and the heat storage layer 2 is obtained by mutual diffusion between both layers, and the heating resistor 4 is bonded to the heat storage layer 2 and the electrode 3.
Due to mutual diffusion with the wear-resistant layer 5, the energy storage layer 2 and the electrode 3
Adhesion is obtained by mutual diffusion with the heating resistor 4.
発明が解決しようとする課題
ところで、上記の厚膜サーマルヘッドにおいては、発熱
抵抗体４は、膜厚の不均一さや、蓄熱層２及び耐磨耗層
６との間の相互拡散により、抵抗値のばらつきが大きか
った。そこで従来は、パルストリミングという方法を用
いることにより、抵抗値をそろえることが出来た。この
方法は高電圧のパルスを発熱抵抗体４に加えることによ
り、目的の抵抗値より高い抵抗値を持つ発熱抵抗体４の
抵抗値を、目的の抵抗値にまで下げるものであった。し
かし、発熱抵抗体４は、構成直後の発熱抵抗体４の抵抗
値と、耐磨耗膜構成後の抵抗値との比は、焼成時の雰囲
気の違い等により、必ず１−も一定ではないため、高い
歩留りを得るためには、目的の抵抗値よりも高い抵抗値
を目標にせねばならない。このためパルス） ＩＪミン
クにおいて、かなシの高電圧でパルスをかけるので、発
熱抵抗体４にかなりのストレスがかかり、この結果１発
熱抵抗体、しいてはサーマルヘッドそのものの寿命を劣
下させるものであった。Problems to be Solved by the Invention By the way, in the thick film thermal head described above, the resistance value of the heat generating resistor 4 varies due to non-uniform film thickness and mutual diffusion between the heat storage layer 2 and the wear-resistant layer 6. There was a large variation in Conventionally, the resistance values could be made uniform by using a method called pulse trimming. In this method, by applying a high voltage pulse to the heating resistor 4, the resistance value of the heating resistor 4, which has a resistance value higher than the target resistance value, is lowered to the target resistance value. However, in the heating resistor 4, the ratio of the resistance value of the heating resistor 4 immediately after its construction to the resistance value after the construction of the wear-resistant film is not always constant by 1-1, due to differences in the atmosphere during firing, etc. Therefore, in order to obtain a high yield, it is necessary to aim for a resistance value higher than the target resistance value. For this reason, in the IJ mink, a pulse is applied at a high voltage of Kanasi, which puts considerable stress on the heating resistor 4, which reduces the lifespan of the heating resistor 1 and the thermal head itself. Met.
課題を解決するための手段
本発明は１発熱抵抗体を印刷、乾燥した後、焼成せず、
その上面に耐磨耗層を印刷、乾燥した後、発熱抵抗体と
耐磨耗層を同時に焼成することにより、前記の問題点を
解決するものである。Means for Solving the Problems The present invention provides a method for printing and drying a heating resistor without firing it.
The above-mentioned problem is solved by printing and drying an abrasion-resistant layer on the upper surface and then firing the heat-generating resistor and the abrasion-resistant layer at the same time.
作用
本発明によれば、焼成回数を１回にすることにより１発
熱抵抗体の出現抵抗値を、目的の抵抗値に近づけること
が可能となり、パルストリミング時において低電圧で抵
抗値を下げるため１発熱抵抗体にかかるストレスが小さ
くなり、サーマルヘッドの寿命の劣下を押えることが可
能となる。According to the present invention, by reducing the number of times of firing to one, it is possible to bring the appearance resistance value of one heating resistor closer to the target resistance value, and in order to lower the resistance value with a low voltage during pulse trimming. The stress applied to the heating resistor is reduced, making it possible to prevent the lifespan of the thermal head from deteriorating.
実施例 以下に本発明の一実施例を示す。Example An example of the present invention is shown below.
第１図の蓄熱層２としてグレーズをアルミナの基板１上
に設け、この蓄熱層２の上面に金のメタルオルガニック
ペーストをスクリーン印刷、乾燥。A glaze is provided on the alumina substrate 1 as the heat storage layer 2 shown in FIG. 1, and a gold metal organic paste is screen printed on the top surface of the heat storage layer 2 and dried.
焼成し、その後、フォトリソ−エツチングにより、金の
電極３のパターンを形成する。次に、金ペーストをスク
リーン印刷、乾燥、焼成し、共通電極θを形成する。After firing, a pattern of gold electrodes 3 is formed by photolithography and etching. Next, the gold paste is screen printed, dried, and fired to form the common electrode θ.
次に、酸イしルテニウムからなる目標抵抗値を得るのに
適当な比抵抗を持った発熱抵抗体４のペーストをスクリ
ーン印刷で印刷した後、１０分以上放置し充分にレベリ
ングさせた後、１２０℃で１６分間乾燥させる。その後
、主に二酸化ケイ素からなるガラスペーストを、ペース
トに合った有機溶剤を用いて、固形分率がペースト原液
の半分近くなるまで希釈する。これは、印字効率を良く
するために耐磨耗層６の膜厚を約６μｍにするためと、
ガラスペーストを印刷する時、乾燥している発熱抵抗体
４部に溶剤がしみ込み、焼成後の耐磨耗層６の表面状態
が悪くならないようにするためである。次に、この充分
希釈したガラスペーストを３２６メツシユ程度の細かい
スクリーンを用いてスクリーン印刷した後、無風状態で
かつ平坦な所で、１５分以上放置しレベリングする。次
に、発熱抵抗体４のペーストと同じ条件で乾燥させる。Next, a paste of the heating resistor 4 made of ruthenium oxide and having a specific resistance appropriate to obtain the target resistance value was printed by screen printing, and after being left for more than 10 minutes to sufficiently level the paste, Dry for 16 minutes at °C. Thereafter, the glass paste, which is mainly composed of silicon dioxide, is diluted using an organic solvent suitable for the paste until the solid content is approximately half of the paste stock solution. This is because the thickness of the wear-resistant layer 6 is about 6 μm in order to improve printing efficiency.
This is to prevent the solvent from seeping into the dry heating resistor 4 portion when printing the glass paste, thereby preventing the surface condition of the abrasion resistant layer 6 from worsening after firing. Next, this sufficiently diluted glass paste is screen printed using a fine screen of about 326 meshes, and then left in a flat place with no wind for 15 minutes or more for leveling. Next, it is dried under the same conditions as the paste for the heating resistor 4.
次にこの２層を同時に焼成する。その時、ピーク温度は
８００℃で１６分間保持する。昇降温は６０℃／ｗｉｎ
以下にするか、あるいは、５０’Ｃ／ｍｉｎ以上で、か
つ３００’Ｃ付近で１０分間温度を保持させる。これは
、発熱抵抗体４のペーストを充分に熱分解させるためで
ある。Next, these two layers are fired simultaneously. At that time, the peak temperature is maintained at 800° C. for 16 minutes. Temperature rise/fall is 60℃/win
or the temperature is maintained at 50'C/min or more and around 300'C for 10 minutes. This is to sufficiently thermally decompose the paste of the heating resistor 4.
最後に、パルストリミング法を用いて抵抗値をそろえる
。Finally, the resistance values are made uniform using the pulse trimming method.
なお、上記実施例では、ガラスペーストを有機溶剤を用
いて希釈したが、もともと固形分率の小さいペーストを
用いてもよい。In the above embodiment, the glass paste was diluted with an organic solvent, but a paste originally having a small solid content may also be used.
発明の効果
本発明の製造方法によれば、このサーマルヘッドの発熱
抵抗体層及び耐磨耗層を焼成した後の抵抗値の目的の抵
抗値との差が従来のサーマルヘッドにより小さくするこ
とが可能なため、パルストリミングにおける電圧が低く
でき、寿命の劣化を下げることが出来る。Effects of the Invention According to the manufacturing method of the present invention, the difference between the resistance value of the thermal head after firing the heating resistor layer and the wear-resistant layer and the target resistance value can be made smaller than that of the conventional thermal head. Since this is possible, the voltage for pulse trimming can be lowered and the deterioration of life can be reduced.
また、耐磨耗層の焼成条件が常にほぼ同じであるため、
耐磨耗層の表面状態をほぼ一定にすることができる。In addition, since the firing conditions for the wear-resistant layer are always almost the same,
The surface condition of the wear-resistant layer can be made almost constant.
さらに、高温焼成の回数を減らすことにより、蓄熱層の
グレーズの軟化を小さくできると同時に２工数低減によ
るコストアップが可能である。Furthermore, by reducing the number of high-temperature firings, it is possible to reduce the softening of the glaze in the heat storage layer, and at the same time, it is possible to increase costs by reducing the number of man-hours by two.
第１図はサーマルヘッドの断面図である。
１・・−・・・基板、２・・・・・・蓄熱層、３・・・
・・・電極、４・・・・・・発熱抵抗体、６・・・・・
・耐磨耗層、６・・・・・・共通電極。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名＼１FIG. 1 is a sectional view of the thermal head. 1...Substrate, 2...Heat storage layer, 3...
...Electrode, 4...Heating resistor, 6...
・Abrasion resistant layer, 6...Common electrode. Name of agent: Patent attorney Shigetaka Awano and 1 other person\1
Claims (1)
隔をおいて電極を設け、次にこの電極間に発熱抵抗体を
印刷後乾燥だけにとどめ、その後、この発熱抵抗体と電
極の上面を覆うように耐磨耗層を印刷、乾燥させ、次に
この耐磨耗層を前記発熱抵抗体と同時に焼成する厚膜サ
ーマルヘッドの製造方法。A heat storage layer is provided on the substrate, then electrodes are provided at a predetermined interval on the top surface of this heat storage layer, a heat generating resistor is printed between these electrodes and only dried, and then this heat generating resistor and electrodes are printed. A method for manufacturing a thick film thermal head, which comprises printing and drying an abrasion resistant layer so as to cover the upper surface thereof, and then firing this abrasion resistant layer at the same time as the heating resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13642289A JPH031959A (en) | 1989-05-30 | 1989-05-30 | Manufacture of thick film thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13642289A JPH031959A (en) | 1989-05-30 | 1989-05-30 | Manufacture of thick film thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031959A true JPH031959A (en) | 1991-01-08 |
Family
ID=15174785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13642289A Pending JPH031959A (en) | 1989-05-30 | 1989-05-30 | Manufacture of thick film thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031959A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61283868A (en) * | 1985-06-10 | 1986-12-13 | Teijin Ltd | Measurement of monoclonal antibody and human protein c |
-
1989
- 1989-05-30 JP JP13642289A patent/JPH031959A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61283868A (en) * | 1985-06-10 | 1986-12-13 | Teijin Ltd | Measurement of monoclonal antibody and human protein c |
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