JPH03195066A - Method of coupling photorelay - Google Patents
Method of coupling photorelayInfo
- Publication number
- JPH03195066A JPH03195066A JP1335445A JP33544589A JPH03195066A JP H03195066 A JPH03195066 A JP H03195066A JP 1335445 A JP1335445 A JP 1335445A JP 33544589 A JP33544589 A JP 33544589A JP H03195066 A JPH03195066 A JP H03195066A
- Authority
- JP
- Japan
- Prior art keywords
- transparent resin
- devices
- emitting device
- light
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 6
- 238000010168 coupling process Methods 0.000 title claims description 11
- 230000008878 coupling Effects 0.000 title description 6
- 238000005859 coupling reaction Methods 0.000 title description 6
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 abstract description 16
- 230000007547 defect Effects 0.000 abstract description 3
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Electronic Switches (AREA)
Abstract
Description
本発明はフォトリレー、殊にフォトＭＯＳリレーのカプ
リング方法に関する。The present invention relates to a method for coupling photorelays, particularly photoMOS relays.
フ才）ＭＯＳリレーは、第５図に示すように、端子１．
１に取り付けられた発光デバイス２と、端子３に取り付
けられた受光デバイス４とを相対させるとともに、両デ
バイス２，４間がシリコン透明樹脂５でカプリングされ
たものとして形成されているのであるが、このカプリン
グは、従来、第６図及び第７図に示すように、両デバイ
ス２゜４を対向させた状態で、発光デバイス２側の端子
１．１間の隙間のＡ点からシリコン透明樹脂５を注入す
ることで行っていた。As shown in FIG. 5, the MOS relay has terminals 1.
The light emitting device 2 attached to the terminal 1 and the light receiving device 4 attached to the terminal 3 are made to face each other, and the devices 2 and 4 are coupled with a silicon transparent resin 5. Conventionally, as shown in FIGS. 6 and 7, this coupling has been carried out with the devices 2.4 facing each other, and the silicon transparent resin 5. This was done by injecting.
この場合、端子１が端子３との間に所定の空間を確保す
るために屈曲されていることもあって、第８図に示すよ
うに、シリコン透明樹脂５はどうしても端子１に添って
広がってしまうものであり、このために封止用エポキシ
樹脂と端子との密着性が低下し、初期時の特性不良が生
じやすく、耐湿性の点でも問題が生じている。
本発明はこのような点に鑑み為されたものであり、その
目的とするところはシリコン透明樹脂に無用な広がりを
生じることがないフォトリレーのカプリング方法を提供
するにある。In this case, since the terminal 1 is bent to ensure a predetermined space between the terminal 3 and the terminal 3, the silicon transparent resin 5 inevitably spreads along the terminal 1, as shown in FIG. For this reason, the adhesion between the sealing epoxy resin and the terminal is reduced, and initial characteristics are likely to be poor, which also causes problems in terms of moisture resistance. The present invention has been devised in view of these points, and its purpose is to provide a photorelay coupling method that does not cause unnecessary spreading of the silicon transparent resin.
しかして本発明は、発光デバイスが取り付けられている
端子と、発光デバイスに相対する受光デバイスが取り付
けられている端子との間のカプリング方法であって、発
光デバイスと受光デバイスとの両者のうちの少なくとも
受光デバイスの表面にシリコン透明樹脂を塗布し、しか
る後に両デバイス間に発光デバイスが取り付けられた端
子側からシリコン透明樹脂を注入することに特徴を有し
ている。
［作用］
本発明によれば、両デバイスのうちの少なくとも受光デ
バイス側に塗布されているシリコン透明樹脂と、注入さ
れるシリコン透明樹脂との間の濡れ性がよいことから、
注入されるシリコン透明樹脂は、無用な広がりを生じる
ことなく、両デバイス間に充填される。
［実施例〕
以下本発明を図示の実施例に基づいて詳述すると、第１
図において、先端同士が所定の空間を介して相対してい
る端子１．３のうち、一方の端子１には発光ダイオード
チップからなる発光デバイス２が取り付けられており、
他方の端子３には受光素子と処理回路とが１チツプ化さ
れた受光デバイス４が取り付けられて、両デバイス２，
４が相対している。
この両デバイス２．４をシリコン透明樹脂５でカプリン
グするにあたっては、まず両デバイス２゜４の各表面に
予めシリコン透明樹脂５を塗布しておく、第２図に示す
ように、受光デバイス４側の表面にのみシリコン透明樹
脂５を塗布するようにしてもよい。
この後、両デバイス２．４を対向させ、そして発光デバ
イス２側の端子１．１間の隙間からシリコン透明樹脂５
を注入するのである。こうして注入されたシリコン透明
樹脂５は、既に両デバイス２．４の表面もしくは受光デ
バイス４の表面に塗布されているシリコン透明樹脂５と
の間の濡れ性が、端子１表面との間の濡れ性よりも良好
であるために、広がることなく両デバイス２．４間を埋
めていくものであり、このために第４図に示すように、
最小限の量のシリコン透明樹脂５でカプリングがなされ
るものである。
上記注入に際しては、第３図にも示すように、端子１の
先端側の図中Ｂ点、つまり端子１の屈曲部から離れたと
ころから注入すれば、更に確実に端子１表面に添ったシ
リコン透明樹脂５の広がりを抑えることができる。
尚、発光デバイス２と一方の端子１との間は別途ワイヤ
ボンディング等の手法で接続される。Therefore, the present invention provides a coupling method between a terminal to which a light-emitting device is attached and a terminal to which a light-receiving device opposite the light-emitting device is attached. The method is characterized in that a transparent silicone resin is applied to at least the surface of the light-receiving device, and then the transparent silicone resin is injected from the terminal side where the light-emitting device is attached between both devices. [Function] According to the present invention, since the wettability between the silicone transparent resin coated on at least the light-receiving device side of both devices and the injected silicone transparent resin is good,
The injected silicone transparent resin is filled between both devices without unnecessary spreading. [Example] The present invention will be described in detail below based on the illustrated example.
In the figure, among the terminals 1.3 whose tips face each other with a predetermined space in between, a light-emitting device 2 made of a light-emitting diode chip is attached to one terminal 1.
A light receiving device 4 in which a light receiving element and a processing circuit are integrated into one chip is attached to the other terminal 3, and both devices 2,
4 is opposite. In order to couple these two devices 2.4 with silicon transparent resin 5, first apply silicon transparent resin 5 to each surface of both devices 2.4 in advance.As shown in FIG. The transparent silicone resin 5 may be applied only to the surface of the substrate. After this, both devices 2.4 are placed facing each other, and the silicon transparent resin 5 is inserted through the gap between the terminals 1.1 on the light emitting device 2 side.
It is injected with. The silicone transparent resin 5 injected in this way has a wettability with the silicone transparent resin 5 already coated on the surface of both devices 2.4 or a surface of the light receiving device 4, and a wettability with the surface of the terminal 1. Since it is better than 2.4, it fills the space between both devices 2.4 without spreading, and for this purpose, as shown in Figure 4,
Coupling is performed using a minimum amount of silicone transparent resin 5. In the above injection, as shown in Fig. 3, if the injection is made from point B in the figure on the tip side of the terminal 1, that is, from a place away from the bent part of the terminal 1, the silicon will be more securely attached to the surface of the terminal 1. Spreading of the transparent resin 5 can be suppressed. Note that the light emitting device 2 and one terminal 1 are connected separately by a method such as wire bonding.
以上のように本発明においては、発光デバイスと受光デ
バイスとの両者のうちの少なくとも受光デバイスの表面
にシリコン透明樹脂を塗布し、しかる後に両デバイス間
に発光デバイスが取り付けられた端子側からシリコン透
明樹脂を注入するものであり、両デバイスのうちの少な
くとも受光デバイス側に塗布されているシリコン透明樹
脂と、注入されるシリコン透明樹脂との間の濡れ性がよ
いことから、注入されるシリコン透明樹脂は、無用な広
がりを生じることなく、両デバイス問に充填されてカプ
リングがなされるものであり、このために耐湿性の向上
や初期特性不良の低減を得られる上に、シリコン透明樹
脂量の削減による光伝達効率の向上でリレー感度の向上
も得ることができる。As described above, in the present invention, silicon transparent resin is applied to the surface of at least the light receiving device of both the light emitting device and the light receiving device, and then the silicon transparent resin is applied from the terminal side where the light emitting device is attached between both devices. The silicone transparent resin that is injected has good wettability between the silicone transparent resin coated on at least the light-receiving device side of both devices and the injected silicone transparent resin. is filled and coupled between both devices without causing any unnecessary spreading, which not only improves moisture resistance and reduces initial characteristic defects, but also reduces the amount of transparent silicone resin. By improving the light transmission efficiency, it is possible to improve the relay sensitivity.
第１図は本発明にかかるカプリング方法の初期状態を示
す側面図、第２図は他の初期状態を示す側面図、第３図
は同上の平面図、第４図はカプリング後の側面図、第５
図は従来方法によるカプリング後の側面図、第６図は従
来の初期状態を示す側面図、第７図は同上の平面図、第
８図は従来方法で問題が生じた時の側面図であって、１
．３は端子、２は発光デバイス、４は受光デバイス、５
はシリコン透明樹脂を示す。FIG. 1 is a side view showing an initial state of the coupling method according to the present invention, FIG. 2 is a side view showing another initial state, FIG. 3 is a plan view of the same, and FIG. 4 is a side view after coupling. Fifth
The figure is a side view after coupling by the conventional method, FIG. 6 is a side view showing the initial state of the conventional method, FIG. 7 is a plan view of the same as above, and FIG. 8 is a side view when a problem occurs with the conventional method. te, 1
．． 3 is a terminal, 2 is a light emitting device, 4 is a light receiving device, 5
indicates silicone transparent resin.
Claims (1)
デバイスに相対する受光デバイスが取り付けられている
端子との間のカプリング方法であって、発光デバイスと
受光デバイスとの両者のうちの少なくとも受光デバイス
の表面にシリコン透明樹脂を塗布し、しかる後に両デバ
イス間に発光デバイスが取り付けられた端子側からシリ
コン透明樹脂を注入することを特徴とするフォトリレー
のカプリング方法。(1) A coupling method between a terminal to which a light-emitting device is attached and a terminal to which a light-receiving device opposite to the light-emitting device is attached, the method comprising at least the light-receiving device of both the light-emitting device and the light-receiving device. A photorelay coupling method characterized in that a silicon transparent resin is applied to the surface of the photorelay, and then the silicon transparent resin is injected from the terminal side where a light emitting device is attached between both devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1335445A JPH03195066A (en) | 1989-12-25 | 1989-12-25 | Method of coupling photorelay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1335445A JPH03195066A (en) | 1989-12-25 | 1989-12-25 | Method of coupling photorelay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03195066A true JPH03195066A (en) | 1991-08-26 |
Family
ID=18288641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1335445A Pending JPH03195066A (en) | 1989-12-25 | 1989-12-25 | Method of coupling photorelay |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03195066A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582059U (en) * | 1992-04-07 | 1993-11-05 | シャープ株式会社 | Optical coupling device |
| US5304819A (en) * | 1992-06-29 | 1994-04-19 | Oki Electric Industry Co., Ltd. | Light-activated semiconductor device having light-emitting elements, light-receiving elements and output elements |
-
1989
- 1989-12-25 JP JP1335445A patent/JPH03195066A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582059U (en) * | 1992-04-07 | 1993-11-05 | シャープ株式会社 | Optical coupling device |
| US5304819A (en) * | 1992-06-29 | 1994-04-19 | Oki Electric Industry Co., Ltd. | Light-activated semiconductor device having light-emitting elements, light-receiving elements and output elements |
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