JPH03192301A - Substrate for light transmission body array - Google Patents
Substrate for light transmission body arrayInfo
- Publication number
- JPH03192301A JPH03192301A JP1331014A JP33101489A JPH03192301A JP H03192301 A JPH03192301 A JP H03192301A JP 1331014 A JP1331014 A JP 1331014A JP 33101489 A JP33101489 A JP 33101489A JP H03192301 A JPH03192301 A JP H03192301A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resin
- array
- light transmission
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 230000005540 biological transmission Effects 0.000 title abstract description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 5
- 230000003287 optical effect Effects 0.000 claims description 21
- 239000011342 resin composition Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 8
- 238000001746 injection moulding Methods 0.000 abstract description 7
- 238000001125 extrusion Methods 0.000 abstract description 6
- 239000003063 flame retardant Substances 0.000 abstract description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract description 4
- 239000000843 powder Substances 0.000 abstract description 4
- 239000004417 polycarbonate Substances 0.000 abstract description 3
- 229920000515 polycarbonate Polymers 0.000 abstract description 3
- 239000004952 Polyamide Substances 0.000 abstract description 2
- 239000006229 carbon black Substances 0.000 abstract description 2
- 229920001577 copolymer Polymers 0.000 abstract description 2
- 229920006332 epoxy adhesive Polymers 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 abstract description 2
- 229920002647 polyamide Polymers 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 239000004926 polymethyl methacrylate Substances 0.000 abstract description 2
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000002788 crimping Methods 0.000 abstract 1
- 238000003491 array Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 phosphorus compounds Chemical compound 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 101100136092 Drosophila melanogaster peng gene Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
- Facsimile Heads (AREA)
- Light Guides In General And Applications Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は光伝送体アレイ用基板、特に加工性に優れた熱
可塑性樹脂を用いた光伝送体アレイ用基板に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a substrate for an optical transmitter array, and particularly to a substrate for an optical transmitter array using a thermoplastic resin with excellent workability.
[従来の技術]
光伝送体、とくに光ファイバや屈折率分布型棒状レンズ
の配列体よりなる光伝送体アレイは光通信分野、或いは
複写機用センサ、電子黒板用センサ、ファクシミリ用セ
ンサとして近年大きくその用途を広げてきている。これ
らの用途に使われる光伝送体アレイのうち、屈折率分布
型棒状レンズの配列体は画像伝送用装置のセンサとして
特に有用であるが、従来用いられてきた屈折率分布型光
伝送体は、無機ガラスをイオン交換法にて処理すること
により作られているため、その製造コストが高いばかり
でなく、もろいという難点もあり、光伝送体アレイへの
加工が極めて難しいため高価になるためその用途拡大の
ネックとなっている。[Prior Art] Optical transmitters, especially optical transmitter arrays consisting of optical fibers and gradient index rod-shaped lenses, have been widely used in the field of optical communications, as well as sensors for copiers, electronic blackboards, and facsimile machines in recent years. Its uses are expanding. Among the optical transmission body arrays used for these applications, arrays of gradient index rod-shaped lenses are particularly useful as sensors for image transmission devices, but the gradient index optical transmission bodies that have been used in the past are Since it is made by processing inorganic glass using an ion exchange method, it is not only expensive to manufacture, but also has the disadvantage of being brittle, and it is extremely difficult to process into optical transmitter arrays, making it expensive. This has become a bottleneck for expansion.
[発明が解決しようとする課題]
近年になり、無機ガラス系の屈折率分布型棒状レンズに
代え、プラスチック製屈折率分布型棒状レンズの開発が
進められており、その加工性の良さ、比較的低コストで
作り得るという利点が注目され、その用途開発が急展開
しようとしている。[Problem to be solved by the invention] In recent years, instead of inorganic glass-based gradient index rod lenses, development of plastic gradient index rod lenses has been progressing, and their workability is relatively high. The advantage of being able to produce it at low cost has attracted attention, and the development of its applications is rapidly expanding.
従来、開発されてきた光伝送体アレイの基板は、これら
アレイが60℃以上の熱が加わる雰囲気下で使われるた
め、アレイの長手方向への熱膨張を極力抑える必要のた
め、ガラス繊維強化樹脂や炭素繊維強化樹脂にて作られ
ており、アレイの共役長をそろえるための切削加工が極
めて難しいという難点があった。Conventionally, the substrates for optical transmitter arrays that have been developed are made of glass fiber-reinforced resin because these arrays are used in an atmosphere where heat of 60°C or higher is applied, and it is necessary to suppress thermal expansion in the longitudinal direction of the array as much as possible. They are made of carbon fiber-reinforced resin and have the disadvantage that cutting to align the conjugate lengths of the arrays is extremely difficult.
[課題を解決すべき手段1
そこで本発明者等は加工性に優れ耐熱性の良好な光伝送
体アレイ用基板を得るべく鋭意検討した結果、基板素材
として熱可塑性樹脂と光遮断材とを用いたものを用いる
ことによりその目的を達成しうることを見出し本発明を
完成した。[Means to Solve the Problem 1] Therefore, the inventors of the present invention conducted intensive studies to obtain a substrate for an optical transmitter array with excellent workability and good heat resistance, and as a result, they decided to use a thermoplastic resin and a light shielding material as the substrate material. The present invention was completed based on the discovery that the object could be achieved by using the same method.
本発明の要旨とするところは、熱可塑性樹脂と光遮断性
粒子とよりなる樹脂組成物から作られた矩形状板状体で
あり、その−面に光伝送体担持用溝を備えたことを特徴
とする光伝送体アレイ用基板にある。The gist of the present invention is to provide a rectangular plate-like body made from a resin composition comprising a thermoplastic resin and light-shielding particles, and a rectangular plate-like body provided with a groove for supporting a light transmitting body on its negative side. This is a characteristic feature of a substrate for an optical transmitter array.
本発明を実施するに際して用いる熱可塑性樹脂としては
80°Cに加熱されても変形せず、難燃性を備えたもの
であり、例えば、ポリアミド、ポリエステル、ポリカー
ボネート、ABS 、αメチル化スチレン/ANコポリ
マー、^^S1^ES。The thermoplastic resin used in carrying out the present invention is one that does not deform even when heated to 80°C and is flame retardant, such as polyamide, polyester, polycarbonate, ABS, α-methylated styrene/AN Copolymer, ^^S1^ES.
ポリメチルメタクリレートなどをその具体例として挙げ
ることができるが、基板を押出成形により成形した際の
成形性、形態保持性、該成形体への押出成形法による光
伝送体挟持用溝の賦形性、接着剤による光伝送体アレイ
への接合性、及びアレイ組立体の共役長を設定するため
の切削加工性を考慮すると、とくに、^BS、^AS、
AESより選ばれた熱可塑性樹脂であることが好まし
い。Specific examples include polymethyl methacrylate, but the moldability and shape retention when the substrate is molded by extrusion molding, and the ability to form grooves for holding the optical transmitter into the molded body by extrusion molding. , considering bondability to the optical transmitter array with adhesive and machinability for setting the conjugate length of the array assembly, especially ^BS, ^AS,
Preferably, it is a thermoplastic resin selected from AES.
また、本発明の基板は、60°C以上の熱雰囲気下で使
われることもあるため難燃化しておくことが必要な場合
もある。この難燃剤としては水酸化アルミニウム、水酸
化マグネシウム、三酸化アンチモン、五酸化アンチモン
、リン系化合物等の無機系難燃剤、ハロゲン化ポリスチ
レン、ハロゲン化ポリカーボネーI・オリゴマーハロゲ
ン化エポキシ、ポリ塩化ビニル、ハロゲン化ポリエチレ
ンの有機系難燃剤を単独で或いは併用した型で用いるこ
とが可能である。Further, since the substrate of the present invention is sometimes used in a hot atmosphere of 60° C. or higher, it may be necessary to make it flame retardant. Examples of the flame retardant include aluminum hydroxide, magnesium hydroxide, antimony trioxide, antimony pentoxide, inorganic flame retardants such as phosphorus compounds, halogenated polystyrene, halogenated polycarbonate I/oligomer halogenated epoxy, polyvinyl chloride, It is possible to use organic flame retardants such as halogenated polyethylene alone or in combination.
また光遮断材としてはカーボンブラック、酸化鉄粉や黒
色化樹脂粉末などを用いることができるが、出来るだけ
軽い光遮断材を用いるのがよい。Further, as the light blocking material, carbon black, iron oxide powder, blackened resin powder, etc. can be used, but it is preferable to use a light blocking material that is as light as possible.
本発明の光伝送体アレイ基板を作るには上述した樹脂と
光遮断材、必要により難燃材を加えた樹脂組成物を射出
成形法、押出成形法等によりアレイ基板に加工すること
ができる。アレイ基板に光伝送体を配設するために光伝
送体配設用溝を形成することが非常に有効となる。本発
明のアレイ基板は熱可塑性樹脂にて作られていることか
ら、この光伝送体配設用溝を容易に加工することが可能
である。この光伝送体配役用溝は半球状、U型、V型等
の形状のものが用いられる。To make the optical transmitter array substrate of the present invention, a resin composition containing the above-mentioned resin, a light shielding material, and, if necessary, a flame retardant added thereto, can be processed into an array substrate by injection molding, extrusion molding, or the like. It is very effective to form a groove for arranging an optical transmitter in order to arrange the optical transmitter on the array substrate. Since the array substrate of the present invention is made of thermoplastic resin, it is possible to easily process the groove for arranging the optical transmission body. The groove for arranging the optical transmission body is hemispherical, U-shaped, V-shaped, or the like.
射出成型法によってこの基板を形成するには溝付きの金
型を用いるのがよい。この金型の精度によって得られる
基板の溝ピッチの精度がでてくるために、精度の高い金
型を用いることにより基板の溝ピッチの精度のよい基板
が容易に得られてくる。但しこの射出成型法ではランナ
ーの部分を充填するための樹脂が余計に必要となりコス
トアップにつながってくるという問題がある。A grooved mold is preferably used to form this substrate by injection molding. Since the precision of the groove pitch of the substrate is determined by the precision of the mold, a substrate with a high precision of the groove pitch of the substrate can be easily obtained by using a highly accurate mold. However, this injection molding method has the problem that extra resin is required to fill the runner portion, leading to an increase in cost.
一方、押出成型法では、一方のロールが半球柱状体又は
V型柱状体を多数設けたロールを用いたニップロールに
より溝付は加工することができる。この方法では余分な
樹脂の使用を極力押えることができコストメリットがあ
る。また連続的に製造が可能である。On the other hand, in the extrusion molding method, grooves can be formed using a nip roll using a roll in which one roll has a large number of hemispherical columns or V-shaped columns. This method can minimize the use of excess resin and has cost advantages. Moreover, continuous production is possible.
本発明のアレイ基板は熱可塑性樹脂にて作られており、
特にファクシミリや複写機等の短尺型光伝送体アレイ基
板として用いた場合、アレイの伸びやソリによる伝送画
像のいずれを生ずることな(利用することができる。The array substrate of the present invention is made of thermoplastic resin,
In particular, when used as a short optical transmitter array substrate for facsimiles, copying machines, etc., the array can be used without causing any of the transmitted images due to elongation or warping of the array.
特にイメージセンサ−ユニットに組み込み、他の部品と
一体となったときはまったく問題を生じない。Especially when it is incorporated into an image sensor unit and integrated with other parts, no problems arise.
以下実施例により本発明を更に詳細に説明する。The present invention will be explained in more detail with reference to Examples below.
実施例1
射出成形機に長さ228mm、幅12mm、厚さ0、7
tramで表面に曲率半径0.475mmの半円柱状
凸部を0.95mmピッチで240本設けた金型を取り
付け、スクリュ一部温度250°C1金型温度50°C
、サイクルタイム60秒に設定した後、黒色へBS樹脂
を投入し基板を得た。Example 1 An injection molding machine with a length of 228 mm, a width of 12 mm, and a thickness of 0.7
Attach a mold with 240 semi-cylindrical convex parts with a radius of curvature of 0.475 mm at a pitch of 0.95 mm on the surface using a tram, and set the screw temperature at 250°C and the mold temperature at 50°C.
After setting the cycle time to 60 seconds, BS resin was added to the black color to obtain a substrate.
得られた成形基板よりランナーの部分をとり、長さ22
8m、幅12鴫、厚さ0.7園、溝ピッチ0.95mm
、溝の深さ0.3鵬なる基板を得た。Take the runner part from the obtained molded substrate and measure it to a length of 22 mm.
8m, width 12mm, thickness 0.7mm, groove pitch 0.95mm
A substrate with a groove depth of 0.3 mm was obtained.
この基板2枚間に直径920−1屈折率分布定数g値が
0.54mm−’、中心屈折率1.515であるレンズ
長20閣の屈折率分布型円柱状レンズ240本配列し、
二液混合型エポキシ系接着剤を塗布した状態で挟持し、
アレイ形状を形成した。このアレイを基板側からプレス
(2kgf/cffl)して60″Cに10分間放置し
た。その後このアレイのレンズの突出している面を切削
してレンズ長7. Otmのアレイとした。更にこのア
レイをジペンタエリスリトールへキサアクリレート、ト
リメチロールプロパントリアクリレート20重量部、2
−プロパツール60重量部、1−ヒドロキシシクロへキ
シルフェニルケトン3重量部、光重合開始剤1重量部と
からなる光重合性組成物中に浸漬し、その後2−プロパ
ツールを揮散させた後に40−ケミカルランプで光硬化
し、平滑な面を形成した。このレンズアレイはレンズ長
が7.0−で共役長14.4閣であった。Between these two substrates, 240 gradient index cylindrical lenses with a diameter of 920-1, a refractive index distribution constant g value of 0.54 mm, a center refractive index of 1.515, and a lens length of 20 mm are arranged,
Clamp with a two-component mixed epoxy adhesive applied,
An array shape was formed. This array was pressed from the substrate side (2 kgf/cffl) and left at 60''C for 10 minutes.Then, the protruding surface of the lens of this array was cut to obtain an array with a lens length of 7.0m. to dipentaerythritol, 20 parts by weight of hexaacrylate, trimethylolpropane triacrylate, 2
- Immersion in a photopolymerizable composition consisting of 60 parts by weight of propatool, 3 parts by weight of 1-hydroxycyclohexyl phenyl ketone, and 1 part by weight of a photopolymerization initiator, and then volatilizing the 2-propatool; - Photocured with a chemical lamp to form a smooth surface. This lens array had a lens length of 7.0 mm and a conjugate length of 14.4 mm.
又、解像度(MTF)は41P/mの空間周波数で0°
Cで61%、25°Cで63%、60″Cで62%と使
用温度による解像度の変化はなかった。Also, the resolution (MTF) is 0° at a spatial frequency of 41P/m.
There was no change in resolution depending on the operating temperature: 61% at C, 63% at 25°C, and 62% at 60''C.
又、特に熱膨張等で問題をおこすことはなかった。これ
を実際のイメージセンサ−ユニットに組み込んだ結果、
画像伝送に充分用いることができた。Furthermore, no problems were caused by thermal expansion or the like. As a result of incorporating this into an actual image sensor unit,
It could be used satisfactorily for image transmission.
実施例2
黒色ABS樹脂をバレル部220°C1ダイス部190
″Cに加熱した一軸押出機(バレル30mnφX800
m、ダイススリット10閣×1閤)に投入し、毎分90
0mmの速度で連続的に幅11論、厚さ0.9mのシー
ト状物を得た。このシート状物を半円柱状凸部を0.9
5mピッチで表面に有する直径100請の金属加熱ロー
ルと直径100薗の金属製平ロールとの間にはさみ込み
、毎分1000−の速度で連続的に移送し、幅11.5
mm、厚さ0.6 amの溝付シート状物を得、このシ
ート状物を3.4秒間隔で連続的にカットしアレイ基板
を得た。Example 2 Black ABS resin barrel part 220°C1 die part 190
Single screw extruder heated to ``C'' (barrel 30mmφX800
m, dice slit 10 times x 1), 90 per minute
A sheet-like material having a width of 11 mm and a thickness of 0.9 m was continuously obtained at a speed of 0 mm. This sheet-like material has a semi-cylindrical convex portion of 0.9
It was sandwiched between a metal heating roll with a diameter of 100 mm and a metal flat roll with a diameter of 100 mm, which had a pitch of 5 m on the surface, and was continuously transferred at a speed of 1,000 mm per minute.
A grooved sheet having a diameter of 0.6 mm and a thickness of 0.6 am was obtained, and this sheet was continuously cut at intervals of 3.4 seconds to obtain an array substrate.
基板の形状は長さ296鵬、幅11.5閣、厚さ0.6
皿、溝ピッチ0.96mm、溝の深さ0.19胴であっ
た。この基板を用い、実施例1と同じレンズを用い実施
例1と同様にしてレンズアレイを得た。このレンズアレ
イでは押出し成形によって溝ピッチのフレがあるために
実施例1のレンズアレイより若干解像度が悪<1!P/
閣の空間周波数での解像度(MTF)は25°Cで58
%、0°Cで57%、60℃で57%であり、使用温度
による解像度の変化はなかった。これを実際のイメージ
センサ−ユニットに組み込んだ結果、画像伝送に充分用
いることができた。The shape of the board is 296 mm long, 11.5 mm wide, and 0.6 mm thick.
The plate had a groove pitch of 0.96 mm and a groove depth of 0.19 mm. Using this substrate and using the same lenses as in Example 1, a lens array was obtained in the same manner as in Example 1. In this lens array, the resolution is slightly worse than the lens array of Example 1 because the groove pitch fluctuates due to extrusion molding <1! P/
The spatial frequency resolution (MTF) of the cabinet is 58 at 25°C.
%, 57% at 0°C and 57% at 60°C, and there was no change in resolution depending on the operating temperature. As a result of incorporating this into an actual image sensor unit, it was able to be used satisfactorily for image transmission.
実施例3
黒色アクリル系樹脂を用い、実施例1と同様にして同じ
金型を用いて射出成型によって基板を得た。その基板の
形状は長さ301mm、幅12閣、厚さ0.7薗、溝ピ
ッチ0.95m、溝の深さ0.3−であった。この基板
を用い実施例1と同じレンズを用い、実施例1と同様に
してレンズアレイを得た。このレンズアレイは共役長1
4.4鵬で解像度(MTF)は41P/IIIIlの空
間周波数で0℃で62%、25°Cで64%、70°C
で63%と使用温度による解像度の変化はなかった。、
これを実際のイメージセンサ−ユニットに組み込んだ結
果、画像伝送に用いることができた。Example 3 A substrate was obtained by injection molding using the same mold as in Example 1 using black acrylic resin. The substrate had a length of 301 mm, a width of 12 mm, a thickness of 0.7 mm, a groove pitch of 0.95 m, and a groove depth of 0.3 mm. Using this substrate and using the same lenses as in Example 1, a lens array was obtained in the same manner as in Example 1. This lens array has a conjugate length of 1
At 4.4 Peng, the resolution (MTF) is 62% at 0°C, 64% at 25°C, and 70°C at a spatial frequency of 41P/IIIl.
The resolution was 63%, and there was no change in resolution depending on the operating temperature. ,
As a result of incorporating this into an actual image sensor unit, it was possible to use it for image transmission.
比較例1
ガラス繊維強化ABSを用い、実施例1と同様にして同
じ金型を用いて射出成型によって基板を得た。その基板
の形状は長さ301M、幅12■、厚さ0.7m、溝ピ
ッチ0.95m、溝の深さ0、3 mであった。この基
板を用いて実施例1と同じレンズを用い、実施例1と同
様にしてレンズアレイを作成した。Comparative Example 1 A substrate was obtained by injection molding using the same mold as in Example 1 using glass fiber reinforced ABS. The shape of the substrate was 301 m long, 12 mm wide, 0.7 m thick, groove pitch 0.95 m, and groove depth 0.3 m. Using this substrate and using the same lenses as in Example 1, a lens array was created in the same manner as in Example 1.
その時レンズ長7.0 mのアレイに切削する工程で切
削する刃の消耗が非常に早いという問題点がでてきた。At that time, a problem arose in that the cutting blades were worn out very quickly in the process of cutting into an array with a lens length of 7.0 m.
Claims (1)
た矩形状板状体であり、その片面に光伝送体挟持用溝を
設けたことを特徴とする光伝送体アレイ用基板。1. A substrate for an optical transmitter array, characterized in that it is a rectangular plate made of a resin composition of a thermoplastic resin and light-blocking particles, and has grooves for holding the optical transmitter provided on one side thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1331014A JPH03192301A (en) | 1989-12-22 | 1989-12-22 | Substrate for light transmission body array |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1331014A JPH03192301A (en) | 1989-12-22 | 1989-12-22 | Substrate for light transmission body array |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03192301A true JPH03192301A (en) | 1991-08-22 |
Family
ID=18238863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1331014A Pending JPH03192301A (en) | 1989-12-22 | 1989-12-22 | Substrate for light transmission body array |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03192301A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016132913A1 (en) * | 2015-02-16 | 2016-08-25 | コニカミノルタ株式会社 | Optical element and method for manufacturing optical element |
-
1989
- 1989-12-22 JP JP1331014A patent/JPH03192301A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016132913A1 (en) * | 2015-02-16 | 2016-08-25 | コニカミノルタ株式会社 | Optical element and method for manufacturing optical element |
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