JPH03189623A - Sealing medium composition for liquid crystal cell - Google Patents
Sealing medium composition for liquid crystal cellInfo
- Publication number
- JPH03189623A JPH03189623A JP32814289A JP32814289A JPH03189623A JP H03189623 A JPH03189623 A JP H03189623A JP 32814289 A JP32814289 A JP 32814289A JP 32814289 A JP32814289 A JP 32814289A JP H03189623 A JPH03189623 A JP H03189623A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- weight
- parts
- epoxy resin
- pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 20
- 238000007789 sealing Methods 0.000 title claims abstract description 9
- 210000002858 crystal cell Anatomy 0.000 title claims description 12
- 239000013028 medium composition Substances 0.000 title 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 8
- 229920006295 polythiol Polymers 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 5
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- 239000000565 sealant Substances 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 150000003839 salts Chemical group 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 125000002270 phosphoric acid ester group Chemical group 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 229910019142 PO4 Inorganic materials 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 239000010452 phosphate Substances 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract 2
- 230000002411 adverse Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 150000003014 phosphoric acid esters Chemical class 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229940071127 thioglycolate Drugs 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 phosphate ester Chemical class 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000006222 dimethylaminomethyl group Chemical group [H]C([H])([H])N(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は液晶表示素子に用いられ結晶セル製造に際して
用いられシール剤組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a sealant composition used in liquid crystal display elements and used in the production of crystal cells.
（従来の技術）
従来、液晶表示素子に用いられている液晶セルの透明導
電基板としては、ガラス上に酸化スズや酸化インジウム
等を蒸着やスパッタリングにより形成したものが用いら
れてきた。しかしガラス基板は割れやすいという欠点を
有しているため、薄型化、軽量化、大面積化など近年液
晶表示素子に要求される特徴を十分に満たすことは難し
かった。(Prior Art) Conventionally, transparent conductive substrates for liquid crystal cells used in liquid crystal display devices have been made by forming tin oxide, indium oxide, or the like on glass by vapor deposition or sputtering. However, since glass substrates have the disadvantage of being easily broken, it has been difficult to fully satisfy the characteristics required of liquid crystal display elements in recent years, such as thinner, lighter weight, and larger area.
そこで、ガラス基板の代わりに透明性を有する高分子フ
ィルム上に透明導電膜を形成したものを液晶表示素子の
基板として採用することが検討されてきている。Therefore, instead of a glass substrate, consideration has been given to using a transparent conductive film formed on a transparent polymer film as a substrate for a liquid crystal display element.
このような状況においてシール剤組成物に係る要求もガ
ラス基板を用いる場合とは様相を異にしており、具体的
には以下のことが要求されている。Under such circumstances, the requirements regarding the sealant composition are different from those when using a glass substrate, and specifically, the following are required.
（１）プラスチックフィルム基板、透明導電膜、透明導
電膜の密着性を向上させるために設けられた下地層等と
の密着性に優れていること。(1) It has excellent adhesion to a plastic film substrate, a transparent conductive film, and a base layer provided to improve the adhesion of the transparent conductive film.
（２） プラスチックフィルム基板の採用のため、製
造工程、液晶セルの使用環境の変化などから、酸化物層
が適度の可とう性を有すること。(2) Because a plastic film substrate is used, the oxide layer must have appropriate flexibility due to changes in the manufacturing process and the environment in which the liquid crystal cell is used.
（３）量産化及び作業性の観点から適当な長さのポット
ライフを有し、また低温速硬化可能であること。(3) It should have an appropriate pot life from the standpoint of mass production and workability, and be capable of rapid curing at low temperatures.
（４） スクリーン印刷性に優れていること。(4) Excellent screen printing properties.
（５）耐液晶性に優れていること。(5) Excellent liquid crystal resistance.
（６）水蒸気、酸素等が液晶中に侵入することを防止で
きること。(6) It must be possible to prevent water vapor, oxygen, etc. from entering the liquid crystal.
（７）液晶の作動に関して電流値増大の原因になるイオ
ン性不純物を含まない硬化物層であること。(7) The cured layer does not contain ionic impurities that cause an increase in current value regarding the operation of the liquid crystal.
（８） シール剤硬化物層に、にじみ出しや気泡残り
がないこと。(8) There should be no oozing or residual air bubbles in the cured sealant layer.
これらの要求に対して従来用いられてきたエポキシ〜ポ
リアミン、エポキシ−ポリアミド系のシール剤では満足
な結果は得られていなかった。To meet these requirements, the epoxy-polyamine and epoxy-polyamide sealants conventionally used have not provided satisfactory results.
（発明が解決しようとする課題）
本願発明者は、これらの諸要求を満足するため、鋭意研
究を行い、ポリチオール−エポキシ系の組成物の優れて
いることを見いだした。しかしながら、シール剤硬化工
程の加熱によるシール剤の粘度低下の結果起こるにじみ
出しや気泡残りのない良好な硬化物層を得るため、加圧
硬化に先立って行われるプリベータを厳密に管理する必
要があるという点で若干難点があるため、鋭意この点に
ついての改良検討を行い、酸化チタンとして硫酸法酸化
チタンを使用すると優れた改良効果があることを見いだ
し、本発明を完成するに至ったものである。(Problems to be Solved by the Invention) In order to satisfy these various demands, the inventors of the present application conducted extensive research and discovered that polythiol-epoxy compositions are superior. However, in order to obtain a good cured layer without any oozing or bubbles that occur as a result of the viscosity of the sealant decreasing due to heating during the sealant curing process, it is necessary to strictly control the pre-baking process that is performed prior to pressure curing. Since there are some difficulties in this respect, we conducted an earnest study to improve this point and found that using sulfuric acid method titanium oxide as the titanium oxide has an excellent improvement effect, and we have completed the present invention. .
（課題を解決するための手段）
本発明は、液晶セルの製造に用いられるシール剤であっ
て、その組成がエポキシ樹脂骨格中にリン酸エステル基
が含まれている液状エポキシ樹脂１００重量部に対して
、ポリチオール系化合物８０〜１２０重量部、硬化促進
剤０．１〜１０重量部、無機充填剤１０〜３００重量部
であることを特徴とする液晶セル用シール剤組成物に関
するものである。(Means for Solving the Problems) The present invention provides a sealant used for manufacturing liquid crystal cells, the composition of which is 100 parts by weight of a liquid epoxy resin containing a phosphate group in the epoxy resin skeleton. On the other hand, the present invention relates to a sealant composition for a liquid crystal cell characterized by containing 80 to 120 parts by weight of a polythiol compound, 0.1 to 10 parts by weight of a curing accelerator, and 10 to 300 parts by weight of an inorganic filler.
通常の液晶セルにおいて、シール面は、用いる基板ある
いは透明導電膜の密着性を向上するために設けられた層
、及び透明導電膜（以下ＩＴＯ膜と略記する）であるが
、ＩＴＯ膜面が親水性表面のため、リン酸エステル基の
ないエポキシ系では密着性とゆう点で若干問題があった
。リン酸エステル基はＩＴＯ膜との密着性に寄与するた
め、リン酸エステルを含有する液状エポキシ樹脂を使用
することにより、シール層の密着安定性が著しく向上す
る。In a normal liquid crystal cell, the sealing surface is a layer provided to improve the adhesion of the substrate or transparent conductive film used, and a transparent conductive film (hereinafter abbreviated as ITO film), but the ITO film surface is hydrophilic. Because of its flexible surface, epoxy systems without phosphate ester groups had some problems in terms of adhesion. Since the phosphate ester group contributes to the adhesion with the ITO film, the use of a liquid epoxy resin containing the phosphate ester significantly improves the adhesion stability of the sealing layer.
また本発明においてポリチオール化合物としてはエポキ
シ樹脂との相溶性の良好な２個以上の一３Ｈ基を含有す
る化合物はすべて使用可能である。Further, as the polythiol compound in the present invention, any compound containing two or more 13H groups that has good compatibility with the epoxy resin can be used.
具体的には以下のごとき化合物が単独もしくは併用して
用いられる。即ち２，２゛−ジメチルメルカプトジエチ
ルエーテル、ペンタエリスリトールβ−チオグリコレー
ト、グリセリンβ−チオグルコレート、ソルビトールβ
−チオグリコレート、トリスヒドロキンエチル（βチオ
ゲルコール）イソシアヌレート、トリスヒドロキシエチ
ル（メルカプトプロピル）イソシアヌレート等である。Specifically, the following compounds are used alone or in combination. Namely, 2,2'-dimethylmercapto diethyl ether, pentaerythritol β-thioglycolate, glycerin β-thioglycolate, sorbitol β
-thioglycolate, trishydroquinethyl (β-thiogelcol) isocyanurate, trishydroxyethyl (mercaptopropyl) isocyanurate, and the like.
リン酸エステルを含有する液状エポキシ樹脂１００重量
部に対するポリチオール化合物の添加量は８０〜１２０
重量部（好ましくは９０〜１１０重量部）であり、８０
重量部未満では硬化物層の可とう性が低下し、１２０重
量部以上では耐液晶性が低下する。The amount of polythiol compound added to 100 parts by weight of liquid epoxy resin containing phosphoric acid ester is 80 to 120 parts by weight.
parts by weight (preferably 90 to 110 parts by weight), and 80 parts by weight.
If it is less than 120 parts by weight, the flexibility of the cured material layer will decrease, and if it is 120 parts by weight or more, liquid crystal resistance will decrease.
次に本発明で用いられる硬化促進剤は酸無水物系エポキ
シ樹脂の硬化に際して用いられる促進剤はすべて使用で
きるが、２．４．６ トリ（ジメチルアミノメチル）
フェノールと分子内にエチレン性２重結合を有し且つ−
ＣＯＯＨ基を有している化合物との塩が好ましい、シー
ル剤のポットライフと速硬化性は相反する特性であるが
、２，４．６ １−リ（ジメチルアミノメチル）フェノ
ールと分子内にエチレン性２重結合を有し且つ−ＣＯＯ
Ｈ基を有している化合物との塩を使用することにより、
適当な長さのポットライフを保持しつつ、低温速硬化性
も実現できる。リン酸エステルを含有する液状エポキシ
樹脂１００重量部に対する硬化促進剤の添加量は０．１
〜１０重量部（好ましくは０．３〜５重量部）であり、
０．１重量部未満では速硬化性が著しく低下し、１０重
量部以上では適当なポットライフが得られない。Next, as the curing accelerator used in the present invention, any accelerator used for curing acid anhydride epoxy resins can be used, but 2.4.6 Tri(dimethylaminomethyl)
It has an ethylenic double bond in the molecule and -
A salt with a compound having a COOH group is preferable.The pot life and fast curing properties of the sealant have contradictory properties, but 2,4.6 1-ly(dimethylaminomethyl)phenol and ethylene in the molecule has a double bond and -COO
By using a salt with a compound having an H group,
It is possible to achieve low-temperature, rapid curing while maintaining an appropriate length of pot life. The amount of curing accelerator added to 100 parts by weight of liquid epoxy resin containing phosphoric acid ester is 0.1
~10 parts by weight (preferably 0.3 to 5 parts by weight),
If it is less than 0.1 parts by weight, the rapid curing properties will be significantly reduced, and if it is more than 10 parts by weight, an appropriate pot life will not be obtained.
また印刷性、印刷時のにじみ防止とゆう観点から無機充
填剤の配合は不可欠であり、特に酸化チタン及びシリカ
が好ましい。酸化チタンとして、硫酸法酸化チタンを用
いると加圧硬化に先立って行われるプリベーク工程を厳
密に管理することなく、容易にシャープな直線性を有す
るにじみ出しや気泡残りのない良好な硬化物層を得るこ
とができる。リン酸エステルを含有する液状エポキシ樹
脂１００重量部に対する無機充填剤の添加量は１０〜３
００重量部（好ましくは５０〜２００重量部）であり、
１０重量部未満ではスクリーン印刷性が著しく低下し、
３００重量部以上では接着性が著しく低下する。Further, from the viewpoint of printability and prevention of bleeding during printing, it is essential to incorporate an inorganic filler, and titanium oxide and silica are particularly preferred. When using sulfuric acid method titanium oxide as titanium oxide, it is possible to easily create a good cured product layer with sharp linearity and no oozing or bubbles, without having to strictly control the pre-bake process that is performed prior to pressure curing. Obtainable. The amount of inorganic filler added to 100 parts by weight of liquid epoxy resin containing phosphoric acid ester is 10 to 3
00 parts by weight (preferably 50 to 200 parts by weight),
If it is less than 10 parts by weight, screen printability will be significantly reduced,
If the amount exceeds 300 parts by weight, the adhesiveness will be significantly reduced.
（実施例）
溶融押し出し法により製膜したポリエーテルスルホン（
以下ＰＥＳと略記する）フィルムにアンダーコート処理
を施し、高周波マグネトロンスパッタリング装置を用い
て約３００オングストロームの厚さにＩＴＯ膜を形成し
、透明導電基板を作成した。該透明導電膜を６Ｎ−ＨＣ
Ｉでエツチングし、ＩＴＯ膜のパターニングを行った０
次に、イミド系樹脂により配向膜を形成し、ラビング法
により配向処理を行った。(Example) Polyether sulfone (
The film (hereinafter abbreviated as PES) was subjected to an undercoat treatment, and an ITO film with a thickness of about 300 angstroms was formed using a high-frequency magnetron sputtering device to create a transparent conductive substrate. The transparent conductive film was coated with 6N-HC.
The ITO film was patterned by etching with I
Next, an alignment film was formed using an imide resin, and alignment treatment was performed using a rubbing method.
一方、以下の配合にしたがい、シール剤の主剤及び硬化
剤を３本インクロールを用い混練して得た。On the other hand, a sealant main ingredient and a curing agent were kneaded using three ink rolls according to the following formulation.
（実施例１）
主剤（１）配合組成
硬化剤（１）配合組成
（実施例２）
実施例１において、硬化剤（１）配合組成中のポリチオ
ール化合物を２．２゛−ジメチルメルカプトジエチルエ
ーテルからトリスヒドロキシエチルイソシアヌレートβ
マーキ＋ブトプロピオネートに変更した硬化剤（２）を
作成した。(Example 1) Base agent (1) Compound composition Curing agent (1) Compound composition (Example 2) In Example 1, the polythiol compound in the curing agent (1) compound was changed from 2.2'-dimethylmercapto diethyl ether. Trishydroxyethyl isocyanurate β
A curing agent (2) was prepared in which the curing agent was changed to marqui+butopropionate.
（比較例１）
実施例１において、硫酸法酸化チタンを塩素性酸化チタ
ンに変更した主剤（２）及び硬化剤（３）を作成した。(Comparative Example 1) In Example 1, a base material (2) and a curing agent (3) were prepared by changing the sulfuric acid method titanium oxide to chlorinated titanium oxide.
上記、主剤（１）〜（２）及び硬化剤（１）〜（３）を
１００：９０の割合で配合しスクリーン印刷により、印
刷幅０．５ｍｍ、印刷厚み２０μｍになるように、上部
フィルム基板に塗布した。これを、９０℃、１０〜２０
分プリベークし、１０μｍ径のギャップ剤（ポリマービ
ーズ）を散布した下部基板と重ね合わせ０．５ｇ／ｄで
押圧して１５０℃、３時間加圧硬化して得たセルのシー
ル仕上がりについて表１に示す。The above-mentioned main ingredients (1) to (2) and curing agents (1) to (3) are mixed in a ratio of 100:90, and screen printing is performed on the upper film substrate so that the printing width is 0.5 mm and the printing thickness is 20 μm. It was applied to. This was heated to 90℃ for 10 to 20 minutes.
Table 1 shows the seal finish of the cell obtained by pre-baking for 30 minutes, stacking it with the lower substrate on which gap agent (polymer beads) with a diameter of 10 μm was sprinkled, pressing it at 0.5 g/d, and curing under pressure at 150°C for 3 hours. show.
表 １ 表示体として有用な液晶セルであった。table 1 It was a liquid crystal cell useful as a display.
（発明の効果）
得られたシール剤組成物は、加圧硬化に先立って行われ
るブリベーク工程を厳密に管理することなく、前記諸用
件を完全にクリヤーする優れた硬化シール層を形成する
ことができ好ましい。(Effect of the invention) The obtained sealant composition forms an excellent cured sealing layer that completely satisfies the above requirements without strictly controlling the pre-baking process that is performed prior to pressure curing. This is preferable.
Claims (3)
その組成がエポキシ樹脂骨格中にリン酸エステル基が含
まれている液状エポキシ樹脂１００重量部に対して、ポ
リチオール系化合物８０〜１２０重量部、硬化促進剤０
．１〜１０重量部、無機充填剤１０〜３００重量部であ
ることを特徴とする液晶セル用シール剤組成物。(1) A sealant used in manufacturing liquid crystal cells,
Its composition is 100 parts by weight of a liquid epoxy resin containing phosphoric acid ester groups in the epoxy resin skeleton, 80 to 120 parts by weight of a polythiol compound, and 0 parts by weight of a curing accelerator.
．． 1. A sealing agent composition for a liquid crystal cell, comprising 1 to 10 parts by weight of an inorganic filler and 10 to 300 parts by weight of an inorganic filler.
チル）フェノールと分子内にエチレン性２重結合を有し
且つ−ＣＯＯＨ基を有している化合物との塩である特許
請求の範囲第１項記載の液晶セル用シール剤組成物。(2) Claims in which the curing accelerator is a salt of 2,4,6 tri(dimethylaminomethyl)phenol and a compound having an ethylenic double bond and a -COOH group in the molecule. 2. The sealant composition for liquid crystal cells according to item 1.
化チタンが硫酸法酸化チタンである特許請求の範囲第１
項記載の液晶セル用シール剤組成物。(3) Claim 1, in which the inorganic filler is made of titanium oxide and silica, and the titanium oxide is titanium oxide processed using sulfuric acid.
A sealing agent composition for liquid crystal cells as described in 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1328142A JP2801708B2 (en) | 1989-12-20 | 1989-12-20 | Liquid crystal cell sealant composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1328142A JP2801708B2 (en) | 1989-12-20 | 1989-12-20 | Liquid crystal cell sealant composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03189623A true JPH03189623A (en) | 1991-08-19 |
| JP2801708B2 JP2801708B2 (en) | 1998-09-21 |
Family
ID=18206967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1328142A Expired - Lifetime JP2801708B2 (en) | 1989-12-20 | 1989-12-20 | Liquid crystal cell sealant composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2801708B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999040142A1 (en) * | 1998-02-04 | 1999-08-12 | Lord Corporation | Thiol-cured epoxy composition |
| EP1666526A1 (en) * | 2003-07-24 | 2006-06-07 | Nitto Denko Corporation | Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate with dielectric layer, and substrate with dielectric layer |
| US8048482B2 (en) | 2003-08-14 | 2011-11-01 | Akzo Nobel Coatings International B.V. | Paint comprising a liquid phase and an active powder phase |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61138232A (en) * | 1984-12-10 | 1986-06-25 | Sumitomo Bakelite Co Ltd | Liquid crystal cell having flexibility |
| JPS62133425A (en) * | 1985-12-06 | 1987-06-16 | Sumitomo Bakelite Co Ltd | Composition of sealing material for liquid crystal cell |
| JPS6310131A (en) * | 1986-07-02 | 1988-01-16 | Sumitomo Bakelite Co Ltd | Sealing composition for liquid crystal cell |
-
1989
- 1989-12-20 JP JP1328142A patent/JP2801708B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61138232A (en) * | 1984-12-10 | 1986-06-25 | Sumitomo Bakelite Co Ltd | Liquid crystal cell having flexibility |
| JPS62133425A (en) * | 1985-12-06 | 1987-06-16 | Sumitomo Bakelite Co Ltd | Composition of sealing material for liquid crystal cell |
| JPS6310131A (en) * | 1986-07-02 | 1988-01-16 | Sumitomo Bakelite Co Ltd | Sealing composition for liquid crystal cell |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999040142A1 (en) * | 1998-02-04 | 1999-08-12 | Lord Corporation | Thiol-cured epoxy composition |
| US6153719A (en) * | 1998-02-04 | 2000-11-28 | Lord Corporation | Thiol-cured epoxy composition |
| EP1666526A1 (en) * | 2003-07-24 | 2006-06-07 | Nitto Denko Corporation | Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate with dielectric layer, and substrate with dielectric layer |
| EP1666526A4 (en) * | 2003-07-24 | 2006-12-06 | Nitto Denko Corp | Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate with dielectric layer, and substrate with dielectric layer |
| US7585907B2 (en) | 2003-07-24 | 2009-09-08 | Nitto Denko Corporation | Inorganic powder-containing resin composition, a film-forming material layer, a transfer sheet, method of producing a substrate having a dielectric layer formed thereon, and a substrate having a dielectric layer formed thereon |
| US8048482B2 (en) | 2003-08-14 | 2011-11-01 | Akzo Nobel Coatings International B.V. | Paint comprising a liquid phase and an active powder phase |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2801708B2 (en) | 1998-09-21 |
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