JPH03184831A - Manufacture of porous body sheet formed of sintered plastic powder - Google Patents
Manufacture of porous body sheet formed of sintered plastic powderInfo
- Publication number
- JPH03184831A JPH03184831A JP32648989A JP32648989A JPH03184831A JP H03184831 A JPH03184831 A JP H03184831A JP 32648989 A JP32648989 A JP 32648989A JP 32648989 A JP32648989 A JP 32648989A JP H03184831 A JPH03184831 A JP H03184831A
- Authority
- JP
- Japan
- Prior art keywords
- heating
- sintering
- powder
- infrared rays
- plastic powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 27
- 229920003023 plastic Polymers 0.000 title claims abstract description 21
- 239000004033 plastic Substances 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 230000001678 irradiating effect Effects 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 8
- -1 polyethylene Polymers 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003348 petrochemical agent Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 235000011888 snacks Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、焼結十分なプラスナック粉末焼結多孔質体シ
ート０−）製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for producing a sintered porous sheet of sintered plastic snack powder.
プラスチック粉末焼結多孔質体には棟々〜拐質、形状０
もＯｊがあり、そＯ」用途も色々と開発される趨勢にあ
る。内部り気孔を独立とすることも連通とすることも容
易であるが、断熱胴として０）利用も多く、又％に連通
気孔としてフィルターｖｃ使用する例も多い。Plastic powder sintered porous body has ridges to grains, shape 0
There is also a tendency for various applications to be developed. Although it is easy to make the internal pores independent or communicated, it is often used as a heat insulating shell, and there are also many examples in which a filter VC is used as a continuous vent.
最近は、多孔質であるがために低＠電率であることに看
目して回路用基ｆ２σ」絶縁体層として使用することも
検討されている。特願昭６１−２０４０６２及び％顛昭
６１−２０４０＜５４によれば、例えばマイクロストリ
ップアンテナ″′Ｃは電力を効率良く伝送放射するため
に比誘１１Ｌ率（εｒ）、誘電正接（ｔａｎδ）が低い
ことを要する。そりため。Recently, since it is porous and has a low electrical conductivity, its use as an insulating layer for circuit boards is also being considered. According to Japanese patent application No. 61-204062 and %Sho 61-2040<54, for example, a microstrip antenna "'C has a dielectric constant of 11L (εr) and a dielectric loss tangent (tan δ) in order to transmit and radiate power efficiently. Needs to be low.For sledding.
ポリオレフィン糸の低ｔｒ 、低ｔａｎδり粉末鳩結多
孔質体シートヲ絶縁体層（誘電体）として使用するスト
リップアンテナ用基板が検討されている。A substrate for a strip antenna using a porous sheet of powder dovetailing with low tr and low tan δ of polyolefin thread as an insulator layer (dielectric) is being considered.
従来、この多孔質体シー１ｆ［遺するＫは、先ずプラス
チック粉末を金属ベルト上υ基羽上に散布し、ナイフコ
ータなどによって一定厚みに賦形した後、連続的に熱風
炉中ｔ−通して焼結する方法がある。こσ〕方法は、生
産効率は非常に良いが、熱風利用のため表層部の焼結は
逸むが内部には熱が伝わり難くて焼結が遅い。表層と内
部り焼結が大きく異なるが、こカ問題はシートが厚い程
如者である。又、熱風焼結であるために、焼結σノ初期
段階で粉末が飛散する問題もある。Conventionally, this porous material sheet 1f [K] was prepared by first scattering plastic powder onto a metal belt, shaping it to a certain thickness using a knife coater, etc., and then continuously passing it through a hot air oven. There is a method of sintering. This method has very good production efficiency, but since it uses hot air, the sintering of the surface layer is missed, but the heat is difficult to transfer to the inside, so sintering is slow. There is a big difference between the surface layer and internal sintering, but the problem becomes more pronounced as the sheet gets thicker. Furthermore, since hot air sintering is used, there is also the problem that powder is scattered during the initial stage of sintering σ.
本発明は、以上り問題点がなく、焼結十分なプラスチッ
ク粉末焼結多孔室体シートり製造方法を提供することを
目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for producing a porous chamber sheet made of sintered plastic powder, which is free from the above-mentioned problems and can be sintered satisfactorily.
以上σノ目的を達成するために、本発明は薄い層を形成
するプラスチック粉末を遠赤外巌で照射加熱するプラス
チック粉末焼結多孔装体ンートり製造方法である。In order to achieve the above object, the present invention is a method for producing a porous sintered plastic powder packaging in which plastic powder forming a thin layer is irradiated and heated with far-infrared light.
プラスチックは、近赤外線ヲはとんど吸収しないが、遠
赤外ｍを照射すると良く吸収して内部から加熱される○
したがって、内部Ｏ粉末相互り融着も表面と１ｍ時に進
み強靭な焼結体を形成することができる。遠赤外ｍ〜放
散剤としては、セラミックスが一般的であり、１ｈｏｓ
、５ｉ０２− ＳｉＣなど各種類を使用することがで
きる。Plastics hardly absorb near-infrared rays, but when irradiated with far-infrared rays, they absorb well and are heated from within.
Therefore, the internal O powder can be fused to the surface within 1 m to form a strong sintered body. Ceramics are commonly used as far-infrared m~ diffusing agents, and 1hos
, 5i02-SiC, etc. can be used.
使用する熱源は、電気ヒータ及び過熱蒸気が一般的であ
る。The heat sources used are generally electric heaters and superheated steam.
プラスチック粉末には熱可そ性柄脂、熱硬化性樹脂σ）
何れも使用することができる０使用できる樹脂を次に例
示すると、ポリエチレン、ポリプロピレン、ポリ−１−
ブテン、ポリ−４メチル−１−ペンテン、エチレン−プ
ロピレン共ｎｔｅ体、 プロピレン−１−ブテン共重合
体、エチレン−酢酸ビニル共重合体、ポリテトラフルオ
ロエチレン。Plastic powder includes thermoplastic resin and thermosetting resin σ)
Examples of resins that can be used include polyethylene, polypropylene, poly-1-
Butene, poly-4 methyl-1-pentene, ethylene-propylene copolymer, propylene-1-butene copolymer, ethylene-vinyl acetate copolymer, polytetrafluoroethylene.
テトラフルオロエチレン−へキサフルオロエチレン共重
合体、テトラフルオロエテレンーパーフルオロアルコキ
シエテレン共Ｎ合体、トリフルオロクロルエチレン、テ
トラフルオロエチレン−エａｙレン共重合体、ポリスチ
レン、アクリロニトリル−スチレン共重合体、アクリロ
ニトリル−ブタジェン−スチレン共重合体、ポリカーボ
ネート、ポリメチルメタアクリレート、ポリビニルブチ
ラール、ポリビニルホルマールポリイミド、ポリアミド
、ボリアくトイミド、ポリフェニレンサルファイド、ポ
リエーテルサルホン、ポリサルホン、ボリアリレート、
ポリエーテルエーテルケトン、ポリフェニレンオキサイ
ド、ポリエーテルアミド。Tetrafluoroethylene-hexafluoroethylene copolymer, tetrafluoroethylene-perfluoroalkoxyethene co-N polymer, trifluorochloroethylene, tetrafluoroethylene-hexafluoroethylene copolymer, polystyrene, acrylonitrile-styrene copolymer, Acrylonitrile-butadiene-styrene copolymer, polycarbonate, polymethyl methacrylate, polyvinyl butyral, polyvinyl formal polyimide, polyamide, polyamide, polyphenylene sulfide, polyether sulfone, polysulfone, polyarylate,
Polyetheretherketone, polyphenylene oxide, polyetheramide.
ポリエーテルイミド、ポリイソブチレン、ポリメキシベ
ンジレン、ポリブチレンテレフタレート。Polyetherimide, polyisobutylene, polymexybenzylene, polybutylene terephthalate.
ポリブタジェン、ポリエステル、ポリ塩化ビニル。Polybutadiene, polyester, polyvinyl chloride.
ポリ塩化ビニリデン、尿素樹脂、メラミン樹脂。Polyvinylidene chloride, urea resin, melamine resin.
ベンゾグアナミン樹脂、フェノール梱脂、エポキシ樹脂
、シリコーン樹脂、ホルマリン樹脂、キシレン樹脂、フ
ラン樹脂、ジアリルフタレート樹脂、ポリイソシアネー
ト樹脂、フェノキシ樹脂等であるＯ
これら樹脂を適宜変性しても良く、又これらσノ混合物
を使用することもできる。樹脂によって架橋剤、硬化剤
を使用する。These resins such as benzoguanamine resin, phenol buffing fat, epoxy resin, silicone resin, formalin resin, xylene resin, furan resin, diallyl phthalate resin, polyisocyanate resin, and phenoxy resin may be modified as appropriate. Mixtures can also be used. Crosslinking agents and curing agents are used depending on the resin.
これらプラスチック粉末を他力樹脂℃被覆して使用する
方法もある。There is also a method in which these plastic powders are coated with external resin at °C.
熱硬化性樹脂は、＠接粒子間り融層に支障がない程度の
硬化度とする。The thermosetting resin has a degree of curing that does not interfere with the interparticle melting layer.
熱司そ性樹脂は、隣接粉末粒子間の＃層をおこし易く、
本発明には最も通切な樹脂である。Heat-susceptible resins tend to form #layers between adjacent powder particles,
This is the most suitable resin for the present invention.
回路用基板り絶縁体層に使用する場合は、極性基が少な
く比誘電率及び誘電正接が低いポリオレフィン樹脂が良
く、例えはポリエチレン、ポリプロピレン成るいはそσ
」架橋物、変性物、共電合物などが好ましい。When used in the insulator layer of circuit boards, polyolefin resins with few polar groups and low dielectric constant and dielectric loss tangent are preferred, such as polyethylene, polypropylene, or σ.
''Crosslinked products, modified products, co-electric compounds, etc. are preferred.
５−
〔作用〕
本発明σＪ遠赤外線照豹によると、プラスチック粉末層
の表面層のみたらず、深部までも加熱融着して十分に焼
結する。5- [Function] According to the σJ far-infrared irradiator of the present invention, not only the surface layer of the plastic powder layer but also the deep part is heat-fused and sintered sufficiently.
又、従来の熱風加熱が加熱初期に粉末を飛散させる欠点
があるが、本発明Ｏ方法ではそσ〕様なことなく融着す
る０したがって、本発明り実施例に示すように先ず遠赤
外線照射をし、次いで熱風加熱をすると、深部まで焼結
しかつ焼結Ｄライン速度を早くすることができる。In addition, conventional hot air heating has the disadvantage of scattering the powder at the initial stage of heating, but the method of the present invention fuses the powder without such a problem.Therefore, as shown in the embodiments of the present invention, far infrared irradiation is first performed. If this is followed by hot air heating, it is possible to sinter deeply and increase the sintering D-line speed.
〔実施例〕
本発明実施例の装置例を第１図に示す０遠赤外線ヒータ
１食設けた加熱シー７２に隣接して、熱風供給ダクト３
を設けた熱風ゾーン４、さらに隣接して冷風ダクト５會
設けた冷却ゾーン６があるＯ水平に動く搬送ベル）８に
、プラスチック粉末供給装置７でプラスチック粉末が供
給され、加熱シー７２で水平に配列したヒータ１から散
剤する遠赤外線０照剖を受けて加熱され、次いで熱ｊ虱
ゾーン４で熱風を受け、さらに冷却ゾーン６で冷風を６
−
受は冷却さｎる〇
すなわち、こυ装置は遠赤外線加熱と熱風吹きつけとを
併用する構造である。本実施例Ｏ併用桐造で実施する時
、焼結０初期段階における粉末り飛散は全くない。かつ
、併用で運転するときは。[Embodiment] An example of an apparatus according to an embodiment of the present invention is shown in FIG.
Plastic powder is supplied by a plastic powder supply device 7 to a horizontally moving conveyor belt 8, which has a hot air zone 4 with a hot air zone 4 and a cooling zone 6 with an adjacent cold air duct 5, and is horizontally moved by a heating seam 72. It is heated by receiving far infrared radiation from the arrayed heaters 1, then receives hot air in the heat zone 4, and then receives cold air in the cooling zone 6.
- The receiver is cooled. In other words, this device uses both far-infrared heating and hot air blowing. When this Example O is used in combination with paulownia wood, there is no powder scattering at the initial stage of sintering. And when driving in combination.
同じ見掛は比重とするとして、遠赤外線加熱又は熱風加
熱り何れか単独に比べて２倍σ〕ライン速度で良い。Assuming the same appearance and specific gravity, the line speed may be twice that of far-infrared heating or hot air heating alone.
（比較試験）第１図の装置によって、遠赤外線加熱ゾー
ン２と冷却ゾーン６を便用する場合と、熱風加熱シー７
４と冷却シー７６とを使用する試験を行なって、同じ見
掛は比重σ〕プラスチック粉末焼結体を昨成し、そ０引
裂き強さを測定した０そＯ結果を表ＩＶＣ，示す。プラ
スチック粉末には、ポリオレフィンパウダー（ハイゼッ
クスミリオン２４０Ｍ、三井石油化学）を使用し、見掛
は比重り調整はライン速度を変えて行なった０
表
〔発明σつ効果〕
衣・１に示すように、遠赤外ｔ３１によると、焼結多孔
質シートσ」見掛は比Ｍは熱風式と同じであっても、引
裂き強さは熱風加熱に比べて約２倍℃ある○すたわち、
遠赤外樹で照剰すると、熱風加熱より深い層まで加熱し
て粉末粒千金半溶融結合することにμる。(Comparative test) Using the device shown in Figure 1, there is a case where the far infrared heating zone 2 and a cooling zone 6 are conveniently used, and a case where the hot air heating zone 7 is used conveniently.
4 and a cooling seam 76, a plastic powder sintered body having the same apparent specific gravity σ was formed, and its tear strength was measured. Table IVC shows the results. Polyolefin powder (Hyzex Million 240M, Mitsui Petrochemicals) was used as the plastic powder, and the apparent specific gravity was adjusted by changing the line speed. According to far-infrared t31, even though the apparent ratio M of the sintered porous sheet σ is the same as that of the hot air method, the tear strength is approximately twice that of the hot air method.
Excessive irradiation with far-infrared rays heats the layer deeper than hot air heating, resulting in semi-molten bonding of powder grains.
第１図は本発明σノ実施例である。
１・・・・・・遠赤外線加熱パネル型ヒータ、２・・・
・・・遠赤外線加熱ゾーン、
３・・・・・・熱風供給ダクト、
４・・・・・・熱風加熱ゾーン、
５°°°°°゛冷風ダクト、
６・・・・・・冷却ゾーン、
７・・・・・・粉末供給装置。
８・・・・・・搬送用ベルト。
９−FIG. 1 shows an embodiment of the present invention. 1...Far-infrared heating panel type heater, 2...
...Far-infrared heating zone, 3...Hot air supply duct, 4...Hot air heating zone, 5°°°°°゛Cold air duct, 6... Cooling zone, 7...Powder supply device. 8... Conveyance belt. 9-
Claims (1)
末を遠赤外線で照射加熱することを特徴とするプラスチ
ック粉末焼結多孔質体シートの製造方法。1. A method for producing a porous sintered plastic powder sheet, which comprises heating the plastic powder formed in a thin layer on a sheet-like base material by irradiating it with far infrared rays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32648989A JPH03184831A (en) | 1989-12-15 | 1989-12-15 | Manufacture of porous body sheet formed of sintered plastic powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32648989A JPH03184831A (en) | 1989-12-15 | 1989-12-15 | Manufacture of porous body sheet formed of sintered plastic powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03184831A true JPH03184831A (en) | 1991-08-12 |
Family
ID=18188395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32648989A Pending JPH03184831A (en) | 1989-12-15 | 1989-12-15 | Manufacture of porous body sheet formed of sintered plastic powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03184831A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2422344A (en) * | 2005-01-24 | 2006-07-26 | Univ Montfort | Rapid prototyping using infrared sintering |
-
1989
- 1989-12-15 JP JP32648989A patent/JPH03184831A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2422344A (en) * | 2005-01-24 | 2006-07-26 | Univ Montfort | Rapid prototyping using infrared sintering |
| GB2422344B (en) * | 2005-01-24 | 2008-08-20 | Univ Montfort | Rapid prototyping method using infrared sintering |
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