JPH03176957A - Secondary ion analyzer - Google Patents

Secondary ion analyzer

Info

Publication number
JPH03176957A
JPH03176957A JP1315950A JP31595089A JPH03176957A JP H03176957 A JPH03176957 A JP H03176957A JP 1315950 A JP1315950 A JP 1315950A JP 31595089 A JP31595089 A JP 31595089A JP H03176957 A JPH03176957 A JP H03176957A
Authority
JP
Japan
Prior art keywords
sample
electron beam
ion
electron
generating means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1315950A
Other languages
Japanese (ja)
Inventor
Masato Kudou
政都 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jeol Ltd
Original Assignee
Jeol Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeol Ltd filed Critical Jeol Ltd
Priority to JP1315950A priority Critical patent/JPH03176957A/en
Publication of JPH03176957A publication Critical patent/JPH03176957A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a sufficient neutralizing effect without providing an electron beam generating means in an analyzing means by radiating an electron beam to a sample holder or a secondary electron emitting member to generate secondary electrons during the ion radiation of a sample, and neutralizing the static electricity of the insulating sample. CONSTITUTION:An electron beam E and a secondary ion beam I pass passing holes 11, 12 of an electrode 10 respectively, the secondary ions generated from a sample 3 by the radiation of the beam I pass the electrode 10 and are analyzed by a secondary ion analyzing means. The electron beam E is deflected by a deflecting system incorporated in an electron beam generating means 7 to radiate a secondary electron emitting member 6, a large quantity of secondary electrons are generated by the member 6 and used to neutralize the charged sample 3. For Auger analysis, the electrode 10 is separated from the sample 3, the sample 3 is inclined clockwise, the angle between the normal line on the sample surface and the electron beam E is set to about 75 deg., for example, thus the quantity of secondary electrons is made equal to the quantity of the incident electron beam, and the static electricity on the sample 3 is prevented.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は絶縁性試料の分析に適した二次イオン分析装置
に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a secondary ion analyzer suitable for analyzing insulating samples.

[従来の技術] 近時、−次イオンを試料に照射して二次イオンを発生さ
せ、この二次イオンを質量分析系にて分析することによ
り試料表面の組成を分析可能にした二次イオン分析装置
が実用に供されている。この装置において、絶縁物性試
料の分析を行う場合には、イオン照射により試料が帯電
し、正確なマススペクトルを得ることができなくなる。
[Prior Art] Recently, secondary ions have been developed which have made it possible to analyze the composition of the sample surface by irradiating a sample with -order ions to generate secondary ions, and analyzing these secondary ions with a mass spectrometry system. Analyzers are in practical use. When using this apparatus to analyze an insulating material sample, the sample becomes charged due to ion irradiation, making it impossible to obtain an accurate mass spectrum.

そこで、かかる帯電を防止するために、次のような方式
が用いられている。
Therefore, in order to prevent such charging, the following method is used.

■ 中和用の電子線発生手段を用意し、イオン照射とは
別の方向から試料表面に低速の電子線を照射する方式。
■ A method in which a means for generating an electron beam for neutralization is prepared and the sample surface is irradiated with a low-speed electron beam from a direction different from that of ion irradiation.

■ 中和用の電子線発生手段を二次イオン分析手段内に
組み込み、イオン照射と同一の方向から低速の電子線を
照射する方式。
■ A method in which a neutralizing electron beam generation means is built into the secondary ion analysis means, and a low-speed electron beam is irradiated from the same direction as the ion irradiation.

ここで、上述のように電子線を照射してイオン照射に基
づく帯電部分を中和する際、理想的には極めて低速度で
、かつ十分な量の電子が試料表面を漂っているような状
況をつくりだすことが必要である。
When irradiating electron beams to neutralize charged parts caused by ion irradiation as described above, ideally a sufficient amount of electrons are floating on the sample surface at extremely low speeds. It is necessary to create

[発明が解決しようとする課題] 上記■の方式では、電子線発生手段と帯電している試料
表面との間に一定の距離が必要なため、電子線は発散し
た状態、即ち帯電部分の近傍では十分な量の電子が存在
しない状態となる。また、低速度の電子線を電子源から
引き出すときの効率が原理的に悪く、十分な量の電子線
を得ることは難しい。従って、この方式による帯電の中
和は十分な効果を得ることができない。
[Problems to be Solved by the Invention] In the above method (■), since a certain distance is required between the electron beam generating means and the charged sample surface, the electron beam is in a divergent state, that is, in the vicinity of the charged part. In this case, there are not enough electrons. Furthermore, the efficiency of extracting low-velocity electron beams from an electron source is theoretically poor, and it is difficult to obtain a sufficient amount of electron beams. Therefore, neutralization of charge using this method cannot obtain a sufficient effect.

一方、■の方式によれば、二次イオン収集効率を最大限
まで高めるうえで試料に極めて接近して配置された二次
イオン分析手段内に電子線発生手段が置かれるため、電
子線の発散が少なくてすみ、■の方式に比べかなり良い
効果を発揮できるが、構成が複雑になると共に、調整が
非常に難しい欠点を有している。
On the other hand, according to method (2), in order to maximize secondary ion collection efficiency, the electron beam generation means is placed within the secondary ion analysis means placed extremely close to the sample, so the electron beam diverges. Although this method requires less and has a much better effect than the method (2), it has the disadvantage that the configuration is complicated and adjustment is extremely difficult.

そこで、本発明はかかる点に鑑みてなされたものであり
、二次イオン分析手段内部に電子線発生手段を設けるこ
となく、十分に中和効果を得ることができる装置を提供
することを目的とするものである。
Therefore, the present invention has been made in view of this point, and an object of the present invention is to provide an apparatus that can obtain a sufficient neutralizing effect without providing an electron beam generating means inside the secondary ion analysis means. It is something to do.

[課題を解決するための手段] 上記目的を達成するため、本発明の二次イオン分析装置
は、イオン源から発生した一次イオンを絶縁性試料に照
射し、該試料から発生する二次イオンを分析する装置に
おいて、中和用電子線発生手段を設け、前記試料へのイ
オン照射中に該電子線発生手段からの電子線を試料ホル
ダあるいは専用の二次電子放出部材に照射して二次電子
を発生させ、この発生した二次電子によりイオン照射に
基づく絶縁性試料の帯電を中和させるように構成したこ
とを特徴とするものである。
[Means for Solving the Problems] In order to achieve the above object, the secondary ion analyzer of the present invention irradiates an insulating sample with primary ions generated from an ion source, and collects secondary ions generated from the sample. In the analysis apparatus, a neutralizing electron beam generating means is provided, and during ion irradiation of the sample, the electron beam from the electron beam generating means is irradiated onto the sample holder or a dedicated secondary electron emitting member to generate secondary electrons. is generated, and the generated secondary electrons neutralize the charging of the insulating sample due to ion irradiation.

以下、本発明の実施例を図面に基づいて詳説する。Hereinafter, embodiments of the present invention will be explained in detail based on the drawings.

[実施例コ 第1図は本発明に係る二次イオン分析装置の一例を示す
構成略図、第2図はその動作を説明するための要部拡大
図である。
[Embodiment] FIG. 1 is a schematic diagram showing the configuration of an example of a secondary ion analyzer according to the present invention, and FIG. 2 is an enlarged view of the main parts for explaining its operation.

同図において、1は高真空に置かれたステージ、2はこ
のステージ上に載置されたホルダで、絶縁物性試料3を
保持している。4は前記試料3上に−次イオンビーム■
を照射するための一次イオン発生手段、5はこの一次イ
オンビーム■の照射によって試料表面から発生した二次
イオンを分析するための例えば四重栓型質量分析装置の
如く二次イオン分析手段で、該分析手段は発生した二次
イオンを効率良く収集するために試料表面にできるだけ
接近して配置されている。
In the figure, 1 is a stage placed in a high vacuum, and 2 is a holder placed on this stage, which holds an insulating material sample 3. 4 is the second ion beam ■
5 is a secondary ion analysis means, such as a quadruple plug mass spectrometer, for analyzing secondary ions generated from the sample surface by irradiation with the primary ion beam (1); The analysis means is placed as close as possible to the sample surface in order to efficiently collect the generated secondary ions.

6は電子線照射によって二次電子を発生するための例え
ば酸化物の如く二次電子放出部材で、ステージ1に固定
されている。この部材の電子線が照射される部分Aは試
料3表面上の一次イオンビーム照射領域にできるだけ接
近させると共に、二次イオン分析手段5への二次イオン
の収集を妨げないような位置に配置される。7はこの部
材の部分Aに細く集束した電子ビームEを照射するため
の電子線発生手段である。
Reference numeral 6 denotes a secondary electron emitting member such as an oxide for generating secondary electrons by electron beam irradiation, and is fixed to the stage 1. The part A of this member that is irradiated with the electron beam is placed as close as possible to the primary ion beam irradiation area on the surface of the sample 3, and at a position that does not interfere with the collection of secondary ions into the secondary ion analysis means 5. Ru. Reference numeral 7 denotes an electron beam generating means for irradiating a narrowly focused electron beam E onto a portion A of this member.

かかる構成において、−次イオン発生手段4により一次
イオンビームIを絶縁物性試料3上に照射すると同時に
、電子線発生手段7から電子ビームEを発生させて二次
電子放出部材6のA部分に照射すると、試料が一次イオ
ンにて帯電するのを防止することができる。つまり、第
2図にその状態を示すように二次電子放出部材6のA部
分に電子線発生手段7から発生した細い電子ビームEを
照射すると、A部分から発生した多量の二次電子E2が
試料3の一次イオン照射領域上に浮遊する。
In this configuration, the primary ion beam I is irradiated onto the insulating material sample 3 by the negative ion generating means 4, and at the same time, the electron beam E is generated from the electron beam generating means 7 and is irradiated onto the portion A of the secondary electron emitting member 6. This can prevent the sample from being charged with primary ions. In other words, as shown in FIG. 2, when part A of the secondary electron emitting member 6 is irradiated with a thin electron beam E generated from the electron beam generating means 7, a large amount of secondary electrons E2 generated from the part A are emitted. It floats above the primary ion irradiation area of sample 3.

そこで、帯電が生じて試料表面の電位が正の値になると
、直ちに電子がその41)型部分に引き込まれ、結果と
して帯電が中和されるわけである。ここで、電子ビーム
Eとしては一次イオンビームIよりもその絶対値におい
て多く、かつ二次電子放出部材6にこの電子ビームを照
射させたときに、最も多くの二次電子を放出するような
条件に設定する必要がある。具体的には、どのような金
属種であっても、最大二次電子放出量が得られるのは電
子の加速電圧が5KVの近傍である。さらに、必要あら
ば電位設定手段8を設けて、二次電子放出部材6に電位
を与え、より効率の良い中和を行うようにしても良い。
Therefore, when charging occurs and the potential on the surface of the sample becomes a positive value, electrons are immediately drawn into the 41) type portion, and as a result, the charging is neutralized. Here, the electron beam E is larger in absolute value than the primary ion beam I, and conditions are such that when the secondary electron emitting member 6 is irradiated with this electron beam, it emits the largest number of secondary electrons. It is necessary to set it to . Specifically, regardless of the type of metal, the maximum amount of secondary electron emission is obtained when the electron acceleration voltage is around 5 KV. Furthermore, if necessary, a potential setting means 8 may be provided to apply a potential to the secondary electron emitting member 6 for more efficient neutralization.

第3図は本発明に係る二次イオン分析装置の他の例を示
す概略図であり、第1図と同一番号のものは同一構成要
素を示す。
FIG. 3 is a schematic diagram showing another example of the secondary ion analyzer according to the present invention, and the same numbers as in FIG. 1 indicate the same components.

本太施例では、二次イオン分析装置の他にオージェ電子
分光装置9を組み込んだことを特徴とするものである。
This embodiment is characterized by incorporating an Auger electron spectrometer 9 in addition to the secondary ion analyzer.

同図において、電子線発生手段7は(1シ電した試料3
の中和のためと試料からオージェ電子を発生させるため
に使用される。また、次イオン発生手段4も二次イオン
発生と試料表面をエツチングするために使用される。さ
らに、オージェ電子分光装置9を組み込む関係上、二次
イオン分析手段を試料表面に接近させることができない
ため、セカンダリ−コーン電極10を前方に設置するこ
とによりできるだけイオンの引き込み効率を高めるよう
にしである。この電極10の先端には電子ビームEとイ
オンビームエとを通過させるための通過穴11.12が
夫々形成してあり、電極10より一層試料3表面に接近
させるように工夫しである。
In the same figure, the electron beam generating means 7 is
and to generate Auger electrons from the sample. Further, the secondary ion generating means 4 is also used for generating secondary ions and etching the sample surface. Furthermore, because the Auger electron spectrometer 9 is installed, the secondary ion analysis means cannot be brought close to the sample surface, so the secondary cone electrode 10 is installed in front to increase the ion attraction efficiency as much as possible. be. Passage holes 11 and 12 for passing the electron beam E and the ion beam E are formed at the tip of the electrode 10, respectively, and are designed to bring the electron beam E and the ion beam E closer to the surface of the sample 3 than the electrode 10.

かかる構成において、同図の状態は二次イオンを分析す
る場合を示すもので、電極10の通過穴1112を夫々
電子ビームEと一層イオンビーム■とが通過するため、
−次イオンビーム■の照射により試料から発生する二次
イオンが電極]0内を通過して二次イオン分析手段によ
り分析される。それと同時に、電子線発生手段7内に組
み込んだ偏向系(図示せず)により電子ビームEが二次
電子放出部材6を照射するように偏向されるため、この
部材から多量の二次電子が発生され、帯電された試料3
の中和に使用される。一方、オジェ分析を行う場合には
、電極10を試料から遠ざけると共に、試料3を時計方
向に傾け、試料表面に立てた法線と電子ビームとのなす
角度を例えば75度程度に設定する。このようにすれば
、試料から発生する二次電子の量が入射電子線と同等の
量になり、試料の帯電を実質的に防止することができる
わけである。そして、電子ビームEを点線E′で示すよ
うに偏向せずに二次電子放出部材6にu<t a=tす
ることなく試料3に照射させ、試料からオージェ電子を
発生させる。発生したオージェ電子はオージェ電子分光
装置9に入射し分析される。ここで、試料3に一層電子
ビームE′と一層イオン発生手段4からの一層イオンI
とを交合に照射すれば、試料表面がエツチングされるた
め、試料表面の深さ方向に対する元素組成の分析を行う
ことができる。この場合、試料を一層イオンでエツチン
グしているときには、−次電子ビームを二次電子放出部
材6に照射し二次電子を発生して試料の帯電を中和する
必要がある。
In such a configuration, the state shown in the figure shows the case where secondary ions are analyzed, and since the electron beam E and the ion beam ■ pass through the passage hole 1112 of the electrode 10, respectively,
-Secondary ions generated from the sample by irradiation with the secondary ion beam (2) pass through the electrode [0] and are analyzed by the secondary ion analysis means. At the same time, the electron beam E is deflected by a deflection system (not shown) built into the electron beam generating means 7 so as to irradiate the secondary electron emitting member 6, so a large amount of secondary electrons are generated from this member. and charged sample 3
used for neutralization. On the other hand, when performing Auger analysis, the electrode 10 is moved away from the sample, the sample 3 is tilted clockwise, and the angle between the normal to the sample surface and the electron beam is set to, for example, about 75 degrees. In this way, the amount of secondary electrons generated from the sample becomes equal to the amount of the incident electron beam, and charging of the sample can be substantially prevented. Then, the electron beam E is irradiated onto the sample 3 without being deflected as shown by the dotted line E' and onto the secondary electron emitting member 6 without u<t a=t, thereby generating Auger electrons from the sample. The generated Auger electrons enter an Auger electron spectrometer 9 and are analyzed. Here, one more electron beam E' and one more ion I from the ion generating means 4 are applied to the sample 3.
Since the surface of the sample is etched by irradiating the two in parallel, it is possible to analyze the elemental composition in the depth direction of the surface of the sample. In this case, when the sample is further etched with ions, it is necessary to irradiate the secondary electron emitting member 6 with a negative electron beam to generate secondary electrons and neutralize the charge on the sample.

尚、前述の説明は本発明の一例であり、実施にあたって
は幾多の変形がイえられる。例えば上記実施例ではイオ
ン照射領域に接近して二次電子放出部材を設置させたが
、これに限定されることなく、試料を保持するホルダ2
の全部あるいは一部を二次電子の放出しやすい物質で形
成し、電子線をホルダに照射させるように構成しても良
い。
It should be noted that the above description is an example of the present invention, and many modifications can be made in implementation. For example, in the above embodiment, the secondary electron emitting member was installed close to the ion irradiation area, but the holder 2 for holding the sample is not limited to this.
All or part of the holder may be made of a material that easily emits secondary electrons, and the holder may be configured to be irradiated with an electron beam.

[効果] 以上詳述した本発明によれば、絶縁物性試料のイオン照
射部分に多量の二次電子を浮遊させることができるため
、従来のように二次イオン分析手段内部に電子線発生手
段を設けることなく、効率良く試料の帯電を中和させる
ことができる。
[Effect] According to the present invention described in detail above, a large amount of secondary electrons can be suspended in the ion-irradiated portion of the insulating material sample, so unlike the conventional method, an electron beam generating means is not provided inside the secondary ion analysis means. It is possible to efficiently neutralize the charge on the sample without providing any.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係る二次イオン分析装置の一例を示す
構成略図、第2図はその動作を説明するための要部拡大
図、第3図は本発明に係る二次イオン分析装置の他の例
を示す概略図である。 1:ステージ 2:ホルダ 3:絶縁物性試料 4ニ一次イオン発生手段 5:二次イオン分析手段 6:二次電子放出部材 7:電子線発生手段 8:電位設定手段 9:オージェ電子分光装置 Eニー次電子ビーム ■=−次イオンビーム
FIG. 1 is a schematic configuration diagram showing an example of the secondary ion analyzer according to the present invention, FIG. 2 is an enlarged view of the main parts to explain its operation, and FIG. 3 is a diagram of the secondary ion analyzer according to the present invention. It is a schematic diagram showing another example. 1: Stage 2: Holder 3: Insulating material sample 4 Primary ion generation means 5: Secondary ion analysis means 6: Secondary electron emitting member 7: Electron beam generation means 8: Potential setting means 9: Auger electron spectrometer E knee Next electron beam ■=-Next ion beam

Claims (1)

【特許請求の範囲】[Claims]  イオン源から発生した一次イオンを絶縁性試料に照射
し、該試料から発生する二次イオンを分析する装置にお
いて、中和用電子線発生手段を設け、前記試料へのイオ
ン照射中に該電子線発生手段からの電子線を試料ホルダ
あるいは専用の二次電子放出部材に照射して二次電子を
発生させ、この発生した二次電子によりイオン照射に基
づく絶縁性試料の帯電を中和させるように構成したこと
を特徴とする二次イオン分析装置。
In an apparatus that irradiates an insulating sample with primary ions generated from an ion source and analyzes secondary ions generated from the sample, a neutralizing electron beam generating means is provided, and the electron beam is generated during ion irradiation of the sample. The electron beam from the generating means is irradiated onto a sample holder or a dedicated secondary electron emitting member to generate secondary electrons, and the generated secondary electrons neutralize the charge on the insulating sample due to ion irradiation. A secondary ion analyzer characterized by comprising:
JP1315950A 1989-12-05 1989-12-05 Secondary ion analyzer Pending JPH03176957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1315950A JPH03176957A (en) 1989-12-05 1989-12-05 Secondary ion analyzer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1315950A JPH03176957A (en) 1989-12-05 1989-12-05 Secondary ion analyzer

Publications (1)

Publication Number Publication Date
JPH03176957A true JPH03176957A (en) 1991-07-31

Family

ID=18071551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1315950A Pending JPH03176957A (en) 1989-12-05 1989-12-05 Secondary ion analyzer

Country Status (1)

Country Link
JP (1) JPH03176957A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352894A (en) * 1992-10-19 1994-10-04 Sharp Kabushiki Kaisha Electron spectroscopy analyzer and a method of correcting a shift of spectral line in electron spectroscopy
JP6667741B1 (en) * 2019-06-11 2020-03-18 三菱電機株式会社 Sample holder and X-ray photoelectron spectrometer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352894A (en) * 1992-10-19 1994-10-04 Sharp Kabushiki Kaisha Electron spectroscopy analyzer and a method of correcting a shift of spectral line in electron spectroscopy
JP6667741B1 (en) * 2019-06-11 2020-03-18 三菱電機株式会社 Sample holder and X-ray photoelectron spectrometer
WO2020250307A1 (en) * 2019-06-11 2020-12-17 三菱電機株式会社 Sample holder and x-ray photoelectron spectroscope

Similar Documents

Publication Publication Date Title
EP0084850B1 (en) Apparatus for irradiation with charged particle beams
JPS5958749A (en) Composite objective and radiation lens
US7875857B2 (en) X-ray photoelectron spectroscopy analysis system for surface analysis and method therefor
US4841143A (en) Charged particle beam apparatus
JPH03176957A (en) Secondary ion analyzer
US9754772B2 (en) Charged particle image measuring device and imaging mass spectrometry apparatus
JP2002025492A (en) Method and apparatus for imaging sample using low profile electron detector for charged particle beam imaging system containing electrostatic mirror
JP3155570B2 (en) Focused ion beam mass analysis method and combined ion beam mass spectrometry device
JPS61114453A (en) Charged particle ray device
JPH02112140A (en) Low speed ion gun
JPH01186745A (en) Ion source for mass spectrometer
JP2018010766A (en) Time-of-flight mass spectrometer
JPH11154485A (en) Mass spectrograph and ion implantation device equipped with it
EP0190251B1 (en) Method and apparatus for the micro-analysis or imaging of samples
JPH11176372A (en) Ion irradiation device
JP3105931B2 (en) Electron beam irradiation apparatus and electron beam irradiation method
JPH03155029A (en) X-ray gun
JPH0539555Y2 (en)
JPH0668832A (en) Scanning electron microscope
JPH059899B2 (en)
JPH0622109B2 (en) Secondary ion mass spectrometer
JPH05251035A (en) Spatter neutral particle mass spectrometry device
JPH0697601B2 (en) Cylindrical mirror energy analyzer
JPS61263039A (en) Mass spectrometer
JPH0429439Y2 (en)