JPH031765U - - Google Patents

Info

Publication number
JPH031765U
JPH031765U JP6355489U JP6355489U JPH031765U JP H031765 U JPH031765 U JP H031765U JP 6355489 U JP6355489 U JP 6355489U JP 6355489 U JP6355489 U JP 6355489U JP H031765 U JPH031765 U JP H031765U
Authority
JP
Japan
Prior art keywords
dicer blade
grooves
dicer
outer peripheral
larger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6355489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6355489U priority Critical patent/JPH031765U/ja
Publication of JPH031765U publication Critical patent/JPH031765U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,bは本考案の一実施例のダイサーブ
レードの平面図及び断面図、第2図及び第3図は
従来のダイサーブレードを示す動作時の要部側面
図及び−線に沿う断面図、第4図は他の従来
のダイサーを示す動作時の要部側面図である。 18……ダイサーブレード、19,19……凹
部、20,20……凹部。
Figures 1a and b are a plan view and a sectional view of a dicer blade according to an embodiment of the present invention, and Figures 2 and 3 are side views of main parts of a conventional dicer blade during operation and a cross-section taken along the - line. 4 are side views of main parts of another conventional dicer during operation. 18... Dicer blade, 19, 19... Recess, 20, 20... Recess.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウエーハの表面の各半導体素子間に溝を
切削加工するダイサーブレードの外周側側面に、
少なくとも切削深さより大きい複数条の溝を放射
状に形成したことを特徴とするダイサーブレード
On the outer peripheral side of the dicer blade that cuts grooves between each semiconductor element on the surface of a semiconductor wafer,
A dicer blade characterized by having a plurality of radially formed grooves that are larger than at least the cutting depth.
JP6355489U 1989-05-31 1989-05-31 Pending JPH031765U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6355489U JPH031765U (en) 1989-05-31 1989-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6355489U JPH031765U (en) 1989-05-31 1989-05-31

Publications (1)

Publication Number Publication Date
JPH031765U true JPH031765U (en) 1991-01-09

Family

ID=31593710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6355489U Pending JPH031765U (en) 1989-05-31 1989-05-31

Country Status (1)

Country Link
JP (1) JPH031765U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013047459A1 (en) 2011-09-26 2013-04-04 富士フイルム株式会社 Variable color display method using phase difference film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013047459A1 (en) 2011-09-26 2013-04-04 富士フイルム株式会社 Variable color display method using phase difference film

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